Texas Instruments LP2985AIM5, LP2985AIM5X, LP2985AITL Schematic [ru]

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LP2985-N

SNVS018X –MARCH 2000 –REVISED MAY 2015

LP2985-N Micropower 150-mA Low-Noise Ultra-Low-Dropout Regulator in SOT-23 and DSBGA Packages Designed for Use with Very Low ESR Output Capacitors

1 Features

Input Voltage Range: 2.5 V to 16 V

Ultra Low-Dropout Voltage

Ensured 150 mA Output Current

Smallest Possible Size (SOT-23 and DSBGA 0.5- mm Pitch Packages)

Requires Minimum External Components

Stable With Low-ESR Output Capacitor

< 1 µA Quiescent Current When Shut Down

Low Ground Pin Current at All Loads

Output Voltage Accuracy 1% (A Grade)

High Peak Current Capability

Low ZOUT: 0.3 Ω Typical (10 Hz to 1 MHz)

Overtemperature and Overcurrent Protection

−40°C to 125°C Junction Temperature Range

Custom Voltages Available

3 Description

The LP2985-N low noise linear regulator delivers up to 150-mA output current and only requires 300-mV dropout voltage of input to output. Using an optimized VIP (Vertically Integrated PNP) process, the LP2985- N delivers unequaled performance for all batterypowered designs. The LP2985-N device provides 1% tolerance precision output voltage with only 75 µA quiescent current at 1 mA load and 850 µA at 150 mA load. By adding a 10-nF bypass capacitor, the

output noise can be reduced to 30 µVRMS in a 30-kHz bandwidth.

The LP2985-N is designed to work with a ceramic output capacitor with equivalent series resistance (ESR) as low as 5 mΩ. The devices are available with fixed output voltage from 2.5 V to 6.1 V. Contact Texas Instrument Sales for specific voltage option needs.

The smallest SOT-23 and DSBGA packages are available for absolute minimum board space.

2 Applications

Cellular Phone

Palmtop and Laptop Computer

Personal Digital Assistant (PDA)

Camcorder, Personal Stereo, Camera

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE

 

SOT-23 (5)

2.90 mm x 1.60 mm (NOM)

LP2985-N

DSBGA (5)

1.159 mm x 0.981 mm (MAX)

 

1.464 mm x 1.095 mm (MAX)

 

 

(1)For all available packages, see the orderable addendum at the end of the datasheet.

Simplified Schematic

VIN

IN

 

OUT

VOUT

CIN

 

LP2985

COUT

1 µF

 

2.2

µF

 

 

 

GND

 

 

 

ON/OFF

 

ON/OFF BYPASS

 

CBYPASS

0.01 µF

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

LP2985-N

SNVS018X –MARCH 2000 –REVISED MAY 2015 www.ti.com

Table of Contents

1

Features ..................................................................

1

 

8.4

Device Functional Modes........................................

13

2

Applications ...........................................................

1

9

Application and Implementation ........................

15

3

Description .............................................................

1

 

9.1

Application Information............................................

15

4

Revision History.....................................................

2

 

9.2

Typical Application ..................................................

15

5

Device Comparison Table.....................................

3

10

Power Supply Recommendations .....................

22

6

Pin Configuration and Functions .........................

4

11

Layout...................................................................

22

7

Specifications

5

 

11.1

Layout Guidelines .................................................

22

 

11.2

Layout Example

22

 

7.1

Absolute Maximum Ratings

5

 

 

 

11.3

DSBGA Mounting

22

 

7.2

ESD Ratings

5

 

 

 

11.4

DSBGA Light Sensitivity

23

 

7.3

Recommended Operating Conditions

5

 

 

12 Device and Documentation Support

24

 

7.4

Thermal Information ..................................................

6

 

7.5

Electrical Characteristics

6

 

12.1

Documentation Support ........................................

24

 

 

12.2

Community Resources

24

 

7.6

Typical Characteristics

8

 

 

 

12.3

Trademarks

24

8

Detailed Description

12

 

 

12.4

Electrostatic Discharge Caution

24

 

8.1

Overview

12

 

 

 

12.5

Glossary

24

 

8.2

Functional Block Diagram

12

 

 

13 Mechanical, Packaging, and Orderable

 

 

8.3

Feature Description.................................................

12

24

 

 

 

 

 

Information ...........................................................

 

 

 

 

 

 

 

 

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision W (September 2014) to Revision X

Page

Changed pin names in text and app circuit drawing "VOUT" and "VIN" to "OUT" and "IN"; replace Handling Ratings

 

with ESD Ratings; update Thermal Values ...........................................................................................................................

1

• Changed footnote 1 to Ab Max table per new format ...........................................................................................................

5

Changed location of storage temperature range from Handling Ratings to Ab Max table.....................................................

5

Added required Application Information section ..................................................................................................................

15

Changes from Revision V (April 2013) to Revision W

Page

Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ...................................................................................................................................................................................

1

Changes from Revision U (April 2013) to Revision V

Page

• Changed layout of National Data Sheet to TI format ...........................................................................................................

23

2

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5 Device Comparison Table

 

 

 

 

 

DEVICE NUMBER

PACKAGE

VOLTAGE OPTION (V)

 

 

2.5

 

 

2.6

 

 

2.7

 

 

2.8

 

 

2.9

 

 

3.0

 

 

3.1

 

SOT-23

3.2

 

3.3

 

 

 

 

3.6

 

 

3.8

 

 

4.0

LP2985-N

 

4.5

 

 

5.0

 

 

5.7

 

 

6.1

 

 

2.5

 

 

2.6

 

 

2.7

 

DSBGA (YPB)

2.8

 

2.9

 

 

 

 

3.0

 

 

3.3

 

 

5.0

 

DSBGA (YZR)

3.3

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6 Pin Configuration and Functions

DBV Package

5 Pin SOT-23

Top View

YPB and YZR Packages

5-Pin DSBGA

Top View

 

 

 

Pin Functions

 

PIN

 

TYPE

DESCRIPTION

NAME

SOT-23

DSBGA

 

 

IN

1

C3

I

Input voltage

GND

2

A1

Common ground (device substrate)

ON/OFF

3

A3

I

Logic high enable input

BYPASS

4

B2

I/O

Bypass capacitor for low noise operation

OUT

5

C1

O

Regulated output voltage

4

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7

Specifications

 

 

 

7.1

Absolute Maximum Ratings

 

 

 

over operating free-air temperature range (unless otherwise noted)(1)(2)

 

 

 

 

 

MIN

MAX

UNIT

Operating junction temperature

–40

125

°C

Lead Temp. (Soldering, 5 sec.)

 

260

°C

Power dissipation(3)

Internally Limited

 

Input supply voltage (survival)

–0.3

16

V

Input supply voltage (operating)

2.5

16

V

Shutdown input voltage (survival)

–0.3

16

V

Output voltage (survival, See(4))

–0.3

9

V

IOUT (survival)

Short Circuit Protected

 

Input-output voltage (survival, see(5))

–0.3

16

V

Storage temperature, Tstg

–65

150

°C

(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

(3)The maximum allowable power dissipation is a function of the maximum junction temperature, TJ_MAX, the junction-to-ambient thermal resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using:

TJ _ MAX TA

PMAX

RTJA

Where the value of RθJA for the SOT-23 package is 175.7°C/W in a typical PC board mounting and 180°C/W for YZR type DSBGA package or 178.8°C/W for YPB type DSBGA package.

Exceeding the maximum allowable dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.

(4)For 12V option, output voltage survival: –0.3 to +16 V. If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2985-N output must be diode-clamped to ground.

(5)The output PNP structure contains a diode between the IN to OUT pins that is normally reverse-biased. Reversing the polarity from IN to OUT will turn on this diode.

7.2

ESD Ratings

 

 

 

 

 

 

 

 

VALUE

UNIT

 

 

 

All pins except 3 and 4 (SOT-23)

 

 

 

 

Human-body model (HBM), per

All pins except A3 and B2

±1000

 

V(ESD)

Electrostatic discharge

(DSBGA)

 

V

ANSI/ESDA/JEDEC JS-001(1)

 

 

Pins 1, 2, and 5 (SOT-23)

±2000

 

 

 

Pins A1, C1, and C3 (DSBGA)

 

 

 

 

 

 

(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

 

 

MIN

MAX

UNIT

VIN

Supply input voltage

3.1(1)

16

V

VON/OFF

ON/OFF input voltage

0

VIN

V

IOUT

Output current

 

150

mA

TJ

Operating junction temperature

–40

125

°C

(1)Recommended minimum VIN is the greater of 3.1 V or VOUT(max) + rated dropout voltage (max) for operating load current.

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7.4 Thermal Information

 

 

 

LP2985-N

 

 

 

THERMAL METRIC(1)

SOT-23

DSBGA (YZR)

DSBGA (YPB)

UNIT

 

 

 

5 PINS

 

 

RθJA

Junction-to-ambient thermal resistance

175.7

180

178.8

 

RθJC(top)

Junction-to-case (top) thermal resistance

78

1

2.1

 

RθJB

Junction-to-board thermal resistance

30.8

109.3

146.3

°C/W

ψJT

Junction-to-top characterization parameter

2.8

7.1

1.9

 

ψJB

Junction-to-board characterization parameter

30.3

109.3

146.3

 

(1)For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

Unless otherwise specified: VIN = VO(NOM) + 1 V, IL = 1 mA, CIN = 1 µF, COUT = 4.7 µF, VON/OFF = 2 V, TJ = 25°C.(1)

 

 

PARAMETER

TEST CONDITIONS

TYP

LP2985AI

-X.X(2)

LP2985I-X.X(2)

UNIT

 

 

MIN

MAX

MIN

MAX

 

 

 

 

 

 

 

 

 

 

 

IL = 1 mA

 

−1

1

–1.5

1.5

 

 

 

 

 

1 mA ≤ IL ≤ 50 mA

 

−1.5

1.5

–2.5

2.5

 

VO

 

 

 

1 mA ≤ IL ≤ 50 mA, –40°C ≤ TJ

 

−2.5

2.5

–3.5

3.5

%VNOM

 

 

Output voltage tolerance

≤ 125°C

 

 

 

 

 

 

 

 

 

1 mA ≤ IL ≤ 150 mA

 

−2.5

2.5

–3

3

 

 

 

 

 

1 mA ≤ IL ≤ 150 mA, –40°C ≤

 

−3.5

3.5

–4

4

 

 

 

 

 

TJ ≤ 125°C

 

 

 

 

 

 

VO/

VIN

 

Output voltage

VO(NOM)+1 V ≤ VIN ≤ 16 V

0.007

 

0.014

 

0.014

%/V

 

Line regulation

VO(NOM)+1 V ≤ VIN ≤ 16 V,

 

 

0.032

 

0.032

 

 

 

 

–40°C ≤ TJ ≤ 125°C

 

 

 

 

 

 

 

 

 

 

IL = 0

1

 

3

 

3

 

 

 

 

 

IL = 0, –40°C ≤ TJ ≤ 125°C

 

 

5

 

5

 

 

 

 

 

IL = 1 mA

7

 

10

 

10

 

 

 

 

 

IL = 1 mA, –40°C ≤ TJ ≤ 125°C

 

 

15

 

15

 

 

 

 

 

IL = 10 mA

40

 

60

 

60

 

V –V

 

 

Dropout voltage(3)

IL = 10 mA, –40°C ≤ TJ

 

 

90

 

90

mV

O

 

125°C

 

 

 

 

 

IN

 

 

 

 

 

 

 

 

 

 

 

 

IL = 50 mA

120

 

150

 

150

 

 

 

 

 

IL = 50 mA, –40°C ≤ TJ

 

 

225

 

225

 

 

 

 

 

125°C

 

 

 

 

 

 

 

 

 

 

IL = 150 mA

280

 

350

 

350

 

 

 

 

 

IL = 150 mA, –40°C ≤ TJ

 

 

575

 

575

 

 

 

 

 

125°C

 

 

 

 

 

 

(1)Exposing the DSBGA device to direct sunlight will cause misoperation. See DSBGA Light Sensitivity for additional information.

(2)Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).

(3)Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a 1 V differential.

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Electrical Characteristics (continued)

Unless otherwise specified: VIN = VO(NOM) + 1 V, IL = 1 mA, CIN = 1 µF, COUT = 4.7 µF, VON/OFF = 2 V, TJ = 25°C.(1)

 

PARAMETER

TEST CONDITIONS

TYP

LP2985AI

-X.X(2)

LP2985I-X.X(2)

UNIT

 

MIN

MAX

MIN MAX

 

 

 

 

 

 

 

IL = 0

65

 

95

95

 

 

 

IL = 0, –40°C ≤ TJ ≤ 125°C

 

 

125

125

 

 

 

IL = 1 mA

75

 

110

110

 

 

 

IL = 1 mA, –40°C ≤ TJ ≤ 125°C

 

 

170

170

 

 

 

IL = 10 mA

120

 

220

220

 

 

 

IL = 10 mA, –40°C ≤ TJ

 

 

400

400

 

 

 

125°C

 

 

 

 

 

IGND

Ground pin current

IL = 50 mA

350

 

600

600

µA

IL = 50 mA, –40°C ≤ TJ

 

 

1000

1000

 

 

125°C

 

 

 

 

 

 

 

IL = 150 mA

850

 

1500

1500

 

 

 

IL = 150 mA, –40°C ≤ TJ

 

 

2500

2500

 

 

 

125°C

 

 

 

 

 

 

 

VON/OFF < 0.3 V

0.01

 

0.8

0.8

 

 

 

VON/OFF < 0.15 V, –40°C ≤ TJ

0.05

 

2

2

 

 

 

125°C

 

 

 

 

 

 

 

High = O/P ON

1.4

 

 

 

 

 

 

High = O/P ON, –40°C ≤ TJ

 

1.6

 

1.6

 

V

ON/OFF input voltage(4)

125°C

 

 

 

 

V

 

 

 

 

 

ON/OFF

 

Low = O/P OFF

0.55

 

 

 

 

 

 

 

 

 

 

 

 

Low = O/P OFF, –40°C ≤ TJ

 

 

0.15

0.15

 

 

 

125°C

 

 

 

 

 

 

 

VON/OFF = 0

0.01

 

 

 

 

 

 

VON/OFF = 0, –40°C ≤ TJ

 

 

−2

−2

 

ION/OFF

ON/OFF input current

125°C

 

 

 

 

µA

VON/OFF = 5 V

5

 

 

 

 

 

 

 

 

 

 

 

VON/OFF = 5 V, –40°C ≤ TJ

 

 

15

15

 

 

 

125°C

 

 

 

 

 

 

Output noise voltage

BW = 300 Hz to 50 kHz,

 

 

 

 

 

en

COUT = 10 µF

30

 

 

 

µV

(RMS)

 

 

 

 

CBYPASS = 10 nF

 

 

 

 

 

 

 

 

 

 

 

 

VO/ VIN

Ripple rejection

f = 1 kHz, CBYPASS = 10 nF

45

 

 

 

dB

 

 

COUT = 10 µF

 

 

 

 

 

 

 

 

 

 

IO(SC)

Short circuit current

RL = 0 (Steady State)(5)

400

 

 

 

mA

IO(PK)

Peak output current

VOUT ≥ Vo(NOM) –5%

350

 

 

 

mA

(4)The ON/OFF input must be properly driven to prevent possible misoperation. For details, refer to ON/OFF Input Operation.

(5)The LP2985-N has foldback current limiting which allows a high peak current when VOUT > 0.5 V, and then reduces the maximum output current as VOUT is forced to ground (see Typical Characteristics curves).

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7.6 Typical Characteristics

Unless otherwise specified: CIN = 1 µF, COUT = 4.7 µF, VIN = VOUT(NOM) + 1, TA = 25°C, ON/OFF pin is tied to VIN.

Figure 1. VOUT vs Temperature

Figure 2. Short Circuit Current vs Output Voltage

 

 

Figure 3. Ripple Rejection

Figure 4. Ripple Rejection

 

 

Figure 5. Ripple Rejection

Figure 6. Ripple Rejection

 

 

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Typical Characteristics (continued)

Unless otherwise specified: CIN = 1 µF, COUT = 4.7 µF, VIN = VOUT(NOM) + 1, TA = 25°C, ON/OFF pin is tied to VIN.

Figure 7. Ripple Rejection

Figure 8. Ripple Rejection

 

 

Figure 9. Ripple Rejection

Figure 10. Ripple Rejection

 

 

Figure 11. Ripple Rejection

Figure 12. Output Impedance vs Frequency

 

 

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Typical Characteristics (continued)

Unless otherwise specified: CIN = 1 µF, COUT = 4.7 µF, VIN = VOUT(NOM) + 1, TA = 25°C, ON/OFF pin is tied to VIN.

Figure 13. Output Impedance vs Frequency

Figure 14. Output Noise Density

 

 

Figure 15. Output Noise Density

Figure 16. Ground Pin vs Load Current

 

 

Figure 17. Dropout Voltage vs Temperature

Figure 18. Input Current vs Pin

 

 

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Typical Characteristics (continued)

Unless otherwise specified: CIN = 1 µF, COUT = 4.7 µF, VIN = VOUT(NOM) + 1, TA = 25°C, ON/OFF pin is tied to VIN.

Figure 19. GND Pin Current vs Temperature

Figure 20. Instantaneous Short Circuit Current

 

 

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8 Detailed Description

8.1 Overview

The LP2985-N family of fixed-output, ultra-low-dropout and low-noise regulators offers exceptional, cost-effective performance for battery-powered applications. Available in output voltages from 2.5 V to 5 V, the family has an output tolerance of 1% for the A version (1.5% for the non-A version) and is capable of delivering 150-mA continuous load current. Standard regulator features, such as overcurrent and overtemperature protection, are also included.

Using an optimized Vertically Integrated PNP (VIP) process, the LP2985-N contains several features to facilitate battery powered designs:

Multiple voltage options

Low dropout voltage, typical dropout of 300 mV at 150 mA load current and 7 mV at 1 mA load.

Low quiescent current and low ground current, typically 850-μA at 150 mA load, and 75-μA at 1-mA load.

A shutdown feature is available, allowing the regulator to consume only 0.01-uA typically when the ON/OFF pin is pulled low.

Over Temperature Protection and Over Current Protection circuitry is designed to safeguard the device during unexpected conditions

Enhanced Stability: The LP2985-N is stable with output capacitor ESR as low as 5-mΩ, which allows the use of ceramic capacitors on the output.

Low noise: A BYPASS pin allows for low-noise operation, with a typical output noise of 30 µVRMS, with the use of a 10-nF bypass capacitor.

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Multiple Voltage Options

In order to meet different application’s requirement, the LP2985-N family provide multiple fixed output options from 2.5 V to 6.1 V. Please consult factory for custom voltages.

8.3.2 Output Voltage Accuracy

Output voltage accuracy specifies minimum and maximum output voltage error, relative to the expected nominal output voltage stated as a percent. This accuracy error includes the errors introduced by the internal reference and the load and line regulation across the full range of rated load and line operating conditions over temperature, unless otherwise specified by the Electrical Characteristics. Output voltage accuracy also accounts for all variations between manufacturing lots.

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Feature Description (continued)

8.3.3 Ultra-Low Dropout Voltage

Generally speaking, the dropout voltage often refers to the voltage difference between the input and output

voltage (VDO = VIN – VOUT), where the main current pass-FET is fully on in the ohmic region of operation and is characterized by the classic RDS(ON) of the FET. VDO indirectly specifies a minimum input voltage above the nominal programmed output voltage at which the output voltage is expected to remain within its accuracy

boundary. If the input falls below this VDO limit (VIN < VOUT + VDO), then the output voltage decreases in order to follow the input voltage.

8.3.4 Low Ground Current

LP2985-N uses a vertical PNP process which allows for quiescent currents that are considerably lower than those associated with traditional lateral PNP regulators, typically 850 μA at150 mA load, and 75 μA at 1-mA load.

8.3.5 Sleep Mode

When pull ON/OFF pin to low level, LP2985-N will enter sleep mode, and less than 2-μA quiescent current is consumed. This function is designed for the application which needs a sleep mode to effectively enhance battery life cycle.

8.3.6 Internal Protection Circuitry

8.3.6.1 Short Circuit Protection (Current Limit)

The internal current limit circuit is used to protect the LDO against high-load current faults or shorting events. The LDO is not designed to operate in a steady-state current limit. During a current-limit event, the LDO sources constant current. Therefore, the output voltage falls when load impedance decreases. Note also that if a current limit occurs and the resulting output voltage is low, excessive power may be dissipated across the LDO, resulting in a thermal shutdown of the output.

A fold back feature limits the short-circuit current to protect the regulator from damage under all load conditions. If VOUT is forced below 0 V before EN goes high and the load current required exceeds the fold back current limit, the device may not start up correctly.

8.3.6.2 Thermal Protection

The LP2985-N contains a thermal shutdown protection circuit to turn off the output current when excessive heat is dissipated in the LDO. The thermal time-constant of the semiconductor die is fairly short, and thus the output cycles on and off at a high rate when thermal shutdown is reached until the power dissipation is reduced.

The internal protection circuitry of the LP2985-N is designed to protect against thermal overload conditions. The circuitry is not intended to replace proper heat sinking. Continuously running the device into thermal shutdown degrades its reliability.

8.3.7 Enhanced Stability

The LP2985-N is designed specifically to work with ceramic output capacitors, utilizing circuitry which allows the regulator to be stable across the entire range of output current with an output capacitor whose ESR is as low as 5 mΩ. For output capacitor requirement, please refer to Output Capacitor.

8.3.8 Low Noise

The LP2985-N includes a low-noise reference ensuring minimal noise during operation because the internal reference is normally the dominant term in noise analysis. Further noise reduction can be achieved by adding an external bypass bapacitor between the BYPASS pin and the GND pin.

8.4 Device Functional Modes

8.4.1 Operation with VOUT(TARGET) + 0.6 V ≥ VIN > 16 V

The device operate if the input voltage is equal to, or exceeds VOUT(TARGET) + 0.6 V. At input voltages below the minimum VIN requirement, the devices do not operate correctly and output voltage may not reach target value.

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