Texas Instruments LM324APWLE, LM324ANSR, LM2902DR, LM224DR, LM224ADR Datasheet

DWide Range of Supply Voltages: Single Supply . . . 3 V to 30 V (LM2902 and LM2902Q

3 V to 26 V), or Dual Supplies

DLow Supply Current Drain Independent of Supply Voltage . . . 0.8 mA Typ

DCommon-Mode Input Voltage Range Includes Ground Allowing Direct Sensing Near Ground

DLow Input Bias and Offset Parameters: Input Offset Voltage . . . 3 mV Typ

A Versions . . . 2 mV Typ

Input Offset Current . . . 2 nA Typ Input Bias Current . . . 20 nA Typ A Versions . . . 15 nA Typ

DDifferential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . 32 V (26 V for LM2902 and LM2902Q)

DOpen-Loop Differential Voltage Amplification . . . 100 V/mV Typ

DInternal Frequency Compensation

description

These devices consist of four independent high-gain frequency-compensated operational amplifiers that are designed specifically to operate from a single supply over a wide range of voltages. Operation from split supplies is also possible when the difference between the two supplies is 3 V to 30 V (for the LM2902 and LM2902Q, 3 V to 26 V) and VCC is at least 1.5 V more positive than the input common-mode voltage. The low supply current drain is independent of the magnitude of the supply voltage.

LM124, LM124A, LM224, LM224A LM324, LM324A, LM324Y, LM2902, LM2902Q QUADRUPLE OPERATIONAL AMPLIFIERS

SLOS066E± SEPTEMBER 1975 ± REVISED FEBRUARY1997

LM124, LM124A . . . J OR W PACKAGE ALL OTHERS . . . D, DB, N OR PW PACKAGE

(TOP VIEW)

1OUT		1	14		4OUT
1IN ±		2	13		4IN ±
1IN+		3	12		4IN+
VCC		4	11		GND
2IN+		5	10		3IN+
2IN ±		6	9		3IN ±
2OUT		7	8		3OUT

LM124, LM124A . . . FK PACKAGE

(TOP VIEW)

	1IN ±	1OUT	NC	4OUT	4IN ±
1IN+	3	2	1	20 19		4IN+
	4				18
NC	5				17	NC
VCC	6				16	GND
NC	7				15	NC
2IN+	8				14	3IN+
	9	10 11 12 13
	2IN ±	2OUT	NC	3OUT	3IN ±

NC ± No internal connection

symbol (each amplifier)

IN ±		±		OUT
IN +		+

Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be more easily implemented in single-supply-voltage systems. For example, the LM124 can be operated directly from the standard 5-V supply that is used in digital systems and easily provides the required interface electronics without requiring additional ± 15-V supplies.

The LM2902Q is manufactured to demanding automotive requirements.

The LM124 and LM124A are characterized for operation over the full military temperature range of ±55°C to 125°C. The LM224 and LM224A are characterized for operation from ±25°C to 85°C. The LM324 and LM324A are characterized for operation from 0°C to 70°C. The LM2902 and LM2902Q are characterized for operation from ±40°C to 125°C.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1997, Texas Instruments Incorporated

POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

3±1

LM124, LM124A, LM224, LM224A

LM324, LM324A, LM324Y, LM2902, LM2902Q

QUADRUPLE OPERATIONAL AMPLIFIERS

SLOS066E± SEPTEMBER 1975 ± REVISED FEBRUARY1997

AVAILABLE OPTIONS

					PACKAGED DEVICES
										CHIP
		VIOmax	SMALL	VERY	CHIP	CERAMIC	PLASTIC		FLAT
	TA			SMALL				TSSOP		FORM
		AT 25°C	OUTLINE		CARRIER	DIP	DIP		PACK
				OUTLINE				(PW)³		(Y)
			(D)²		(FK)	(J)	(N)		(W)
				(DB)³
	0°C to	7 mV	LM324D	LM324DBLE	Ð	Ð	LM324N	LM324PWLE	Ð	LM324Y
	70°C	3 mV	LM324AD	Ð	Ð	Ð	LM324AN	LM324APWLE	Ð
	±25°C to	5 mV	LM224D	Ð	Ð	Ð	LM224N	Ð	Ð	Ð
	85°C	3 mV	LM224AD	Ð	Ð	Ð	LM224AN	Ð	Ð
	± 40°C to	7 mV	LM2902D	LM2902DBLE	Ð	Ð	LM2902N	LM2902PWLE	Ð	Ð
	125°C		LM2902QD		Ð	Ð	LM2902QN		Ð
	± 55°C to	5 mV	Ð	Ð	LM124FK	LM124J	Ð	Ð	LM124W	Ð
	125°C	2 mV	Ð	Ð	LM124AFK	LM124AJ	Ð	Ð

² The D package is available taped and reeled. Add the suffix R to the device type (e.g., LM324DR). ³ The DB and PW packages are only available left-end taped and reeled.

schematic (each amplifier)

VCC

≈ 6-μA	≈ 6-μA	≈ 100-μA
Current	Current	Current
Regulator	Regulator	Regulator

OUT

IN ±
IN +	≈ 50-μA
	Current
	Regulator

GND

To Other

Amplifiers

COMPONENT COUNT (total device)

Epi-FET	1
Transistors	95
Diodes	4
Resistors	11
Capacitors	4

3±2	POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

LM124, LM124A, LM224, LM224A

LM324, LM324A, LM324Y, LM2902, LM2902Q

QUADRUPLE OPERATIONAL AMPLIFIERS

SLOS066E± SEPTEMBER 1975 ± REVISED FEBRUARY1997

LM324Y chip information

This chip, when properly assembled, displays characteristics similar to the LM324. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform.

																							BONDING PAD ASSIGNMENTS
																																																																														VCC+
									(1)																													(14)
																																																																										1IN+		(3)					(4)
									(2)																													(13)																																													(1)	1OUT
																																																																												(2)
																																																																										1IN±					(5)
																																																																												(7)								2IN+
																																																																										2OUT
																																																																												(10)		(6)						2IN±
																																																																										3IN+
									(3)																													(12)																																						(9)							(8)	3OUT
																																																																										3IN±
																																																																															(12)
																																																																												(14)								4IN+
																																																																										4OUT
																																																																														(13)						4IN±
																																																																												(11)
				62					(4)																													(11)
																																																																																GND
									(5)																													(10)
																																																																										CHIP THICKNESS: 15 TYPICAL
																																																																										BONDING PADS: 4 × 4 MINIMUM
									(6)																													(9)																																				TJmax = 150°C
									(7)																													(8)																																				TOLERANCES ARE ± 10%.
																																																																										ALL DIMENSIONS ARE IN MILS.
																																						65																																				PIN (11) IS INTERNALLY CONNECTED
																																																																										TO BACKSIDE OF CHIP.

POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

3±3