Texas Instruments LM358PSR, LM358PSLE, LM358PWR, LM358PWLE, LM358AP Datasheet

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LM158, LM158A, LM258, LM258A

LM358, LM358A, LM358Y, LM2904, LM2904Q

DUAL OPERATIONAL AMPLIFIERS

SLOS068C ± JUNE 1976 ± REVISED JULY 1998

D Wide Range of Supply Voltages:

D, JG, P, OR PW PACKAGE

± Single Supply . . . 3 V to 30 V

 

 

 

(TOP VIEW)

 

(LM2904 and LM2904Q . . . 3 V to 26 V) or

1OUT

 

 

 

 

 

VCC

 

 

1

8

 

± Dual Supplies

 

 

 

D Low Supply-Current Drain Independent of

1IN±

 

 

2

7

 

2OUT

1IN+

 

 

3

6

 

2IN±

Supply Voltage . . . 0.7 mA Typ

 

 

GND

 

 

4

5

 

2IN+

D Common-Mode Input Voltage Range

 

 

 

 

 

 

 

 

 

Includes Ground, Allowing Direct Sensing

LM158, LM158A . . . FK PACKAGE

Near Ground

 

 

 

 

(TOP VIEW)

 

D Low Input Bias and Offset Parameters:

 

NC

1OUT

NC V

NC

 

 

±

Input Offset Voltage . . . 3 mV Typ

 

 

 

 

CC+

 

 

 

 

A Versions . . . 2 mV Typ

 

 

 

 

 

 

 

 

±

Input Offset Current . . . 2 nA Typ

 

3

2

1

20 19

NC

 

± Input Bias Current . . . 20 nA Typ

NC

 

4

 

 

 

18

 

 

A Versions . . . 15 nA Typ

1IN±

5

 

 

 

17

2OUT

D Differential Input Voltage Range Equal to

NC

6

 

 

 

16

NC

 

Maximum-Rated Supply Voltage . . . ±32 V

1IN+

7

 

 

 

15

2IN±

 

(LM2904 and LM2904Q . . . ±26 V)

NC

8

 

 

 

14

NC

D Open-Loop Differential Voltage

 

9

10 11 12 13

 

 

NC

GND

NC

2IN+

NC

 

 

Amplification . . . 100 V/mV Typ

 

 

 

 

 

 

 

 

 

 

D

Internal Frequency Compensation

 

 

 

 

 

 

 

 

 

 

NC ± No internal connection

 

description

These devices consist of two independent, high-gain, frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3 V to 30 V (3 V to 26 V for the LM2904 and LM2904Q), and VCC is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage.

Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be more easily implemented in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily provides the required interface electronics without additional ±5-V supplies.

The LM2904Q is manufactured to demanding automotive requirements.

The LM158 and LM158A are characterized for operation over the full military temperature range of ±55°C to 125°C. The LM258 and LM258A are characterized for operation from ±25°C to 85°C, the LM358 and LM358A from 0°C to 70°C, and the LM2904 and LM2904Q from ±40°C to 125°C.

logic diagram (each amplifier)

IN+

 

+

 

OUT

 

 

IN±

 

±

 

 

 

 

 

 

 

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1998, Texas Instruments Incorporated

On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

1

LM158, LM158A, LM258, LM258A

LM358, LM358A, LM358Y, LM2904, LM2904Q

DUAL OPERATIONAL AMPLIFIERS

SLOS068C ± JUNE 1976 ± REVISED JULY 1998

AVAILABLE OPTIONS

 

 

 

PACKAGED DEVICES

 

CHIP

 

VIO(max)

 

 

 

 

 

 

SMALL

CHIP

CERAMIC

PLASTIC

 

TA

TSSOP

FORM

AT 25°C

OUTLINE

CARRIER

DIP

DIP

 

(PW)³

(Y)

 

 

(D)²

(FK)

(JG)

(P)

 

 

 

 

0°C to 70°C

7 mV

LM358D

Ð

Ð

LM358P

LM358PW

LM358Y

3 mV

Ð

Ð

Ð

LM358AP

Ð

Ð

 

 

 

 

 

 

 

 

 

±25°C to 85°C

5 mV

LM258D

Ð

Ð

LM258P

Ð

Ð

3 mV

Ð

Ð

Ð

LM258AP

Ð

Ð

 

 

 

 

 

 

 

 

 

±40°C to 125°C

7 mV

LM2904D

Ð

Ð

LM2904P

LM2904PW

Ð

LM2904QD

Ð

Ð

LM2904QP

Ð

Ð

 

 

 

 

 

 

 

 

 

 

±55°C to 125°C

5 mV

LM158D

LM158FK

LM158JG

LM158P

Ð

Ð

2 mV

Ð

LM158AFK

LM158AJG

Ð

Ð

Ð

 

 

 

 

 

 

 

 

 

² The D package is available taped and reeled. Add the suffix R to the device type (e.g., LM358DR). ³ The PW package is only available left-end taped and reeled.

schematic (each amplifier)

VCC+

6-μA

 

6-μA

 

100-μA

 

 

Current

 

Current

 

Current

 

 

Regulator

 

Regulator

 

Regulator

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IN±

OUT

 

IN+

50-μA

 

Current

 

Regulator

GND (or VCC±)

To Other Amplifier

COMPONENT COUNT

Epi-FET 1

Diodes 2

Resistors 7

Transistors 51

Capacitors 2

2

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

Texas Instruments LM358PSR, LM358PSLE, LM358PWR, LM358PWLE, LM358AP Datasheet

LM158, LM158A, LM258, LM258A

LM358, LM358A, LM358Y, LM2904, LM2904Q

DUAL OPERATIONAL AMPLIFIERS

SLOS068C ± JUNE 1976 ± REVISED JULY 1998

LM358Y chip information

These chips, when properly assembled, display characteristics similar to the LM358. Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

 

 

 

 

(7)

(6)

(5)

 

 

 

 

 

 

 

 

 

57

 

(8)

 

(4)

 

 

 

 

 

 

 

 

 

 

 

(1)

(2)

(3)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

47

 

 

 

 

 

 

 

 

 

 

 

VCC+

 

 

 

 

 

 

 

(8)

 

 

1IN+

(3)

 

 

+

 

 

 

(1)

1OUT

 

 

 

 

 

 

 

 

 

 

(2)

 

 

±

 

 

 

 

 

 

 

 

 

 

1IN±

 

 

 

 

 

 

 

(5)

2IN+

 

 

 

 

 

(7)

+

 

 

 

 

 

 

 

 

2OUT

 

 

 

 

 

 

 

(6)

 

 

±

 

 

2IN±

 

 

 

 

 

 

 

 

 

 

(4) VCC±

Chip Thickness: 15 Typical Bonding Pads: 4 ×4 Minimum

TJ(max) = 150°C Tolerances Are ±10%.

All Dimensions Are in Mils.

No Backside Metallization

Pin (4) is Internally Connected to Backside of Chip.

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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