Texas Instruments LM3674MF, LM3674MF-1.2, LM3674MF-1.5, LM3674MF-1.8, LM3674MF-1.875 Schematic [ru]

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LM3674

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SNVS405F –DECEMBER 2005–REVISED MAY 2013

 

LM3674 2MHz, 600mA Step-Down DC-DC Converter in SOT-23

 

 

 

Check for Samples: LM3674

 

 

 

 

 

 

 

 

 

 

FEATURES

DESCRIPTION

 

 

 

 

• 600mA Max Load Current

The LM3674 step-down DC-DC converter is

• Input Voltage Range from 2.7V to 5.5V

optimized for powering low

voltage

circuits from

a

single Li-Ion cell battery and input voltage rails from

• Available in Fixed and Adjustable Output

2.7V to 5.5V. It provides up to 600mA load current,

 

Voltages Ranging from 1.0V to 3.3V

over the entire input voltage range. There are several

• Operates from a Single Li-Ion Cell Battery

fixed output voltages and adjustable output voltage

• Internal Synchronous Rectification for High

versions.

 

 

 

 

The device offers superior features and performance

 

Efficiency

Internal Soft Start

for mobile phones

and similar portable systems.

During PWM mode, the device operates at a fixed-

0.01 µ A Typical Shutdown Current

frequency of 2 MHz (typ). Internal synchronous

• 2 MHz PWM Fixed Switching Frequency (typ)

rectification provides high efficiency during Pulse

5-Pin SOT-23 Package

Width Modulation

(PWM)

mode

operation.

In

shutdown mode, the

device

turns off and reduces

• Current Overload Protection and Thermal

battery consumption to 0.01 µA (typ).

 

 

 

Shutdown Protection

 

 

 

The LM3674 is available in a 5-pin SOT-23 package

 

 

APPLICATIONS

in leaded (PB) and lead-free (NO PB) versions. A

Mobile Phones

high switching frequency of 2 MHz (typ) allows use of

only three tiny external surface-mount components,

PDAs

an inductor and two ceramic capacitors.

 

MP3 Players

Portable Instruments

W-LAN

Digital Still Cameras

Portable Hard Disk Drives

TYPICAL APPLICATION CIRCUITS

VIN

 

 

2.7V to 5.5V

VIN

 

 

1

5

CIN

 

LM3674

4.7 PF

 

GND

 

 

 

 

2

 

 

EN

4

 

3

 

 

L1:2.2 PH

VOUT

SW

COUT

10 PF

FB

Figure 1. Typical Application Circuit

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Copyright © 2005–2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

 

Instruments standard warranty. Production processing does not

 

necessarily include testing of all parameters.

 

LM3674

SNVS405F –DECEMBER 2005–REVISED MAY 2013

 

 

 

 

www.ti.com

VIN

VIN

 

L1: 2.2 PH

 

VOUT

2.7V to 5.5V

 

SW

 

 

1

5

 

 

 

 

 

 

CIN: 4.7 PF

LM3674-

 

 

 

GND

ADJ

 

 

 

 

 

 

 

 

2

 

 

 

 

 

 

 

C1

R1

COUT: 10 PF

 

EN

 

FB

 

 

34

C2 R2

Figure 2. Typical Application Circuit for Adjustable Voltage Option

PIN DIAGRAM

SW

FB

54

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VIN

 

GND

 

EN

 

 

1

2

3

 

Figure 3. Top View

5-Pin SOT-23 Package

See Package Number DBV0005A

Note: The actual physical placement of the package marking will vary from part to part.

 

 

PIN DESCRIPTIONS

Pin Number

Name

Description

 

 

 

1

VIN

Power supply input. Connect to the input filter capacitor ( Figure 1).

2

GND

Ground pin.

 

 

 

3

EN

Enable input. The device is in shutdown mode when voltage to this pin is <0.4V and enable when

>1.0V. Do not leave this pin floating.

 

 

 

 

 

 

 

Feedback analog input. Connect to the output filter capacitor for fixed voltage versions. For adjustable

4

FB

version external resistor dividers are required ( Figure 2). The internal resistor dividers are disabled for

 

 

the adjustable version.

 

 

 

5

SW

Switching node connection to the internal PFET switch and NFET synchronous rectifier.

 

 

 

2

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SNVS405F –DECEMBER 2005–REVISED MAY 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

 

ORDERING INFORMATION(1) (2)

LM3674 (5 Pin SOT-23)

 

 

 

 

 

Ordering Information

 

Voltage Option (V)

 

 

 

LM3674MF-1.2

 

 

 

 

 

LM3674MFX-1.2

 

1.2

 

 

LM3674MF-1.2/NOPB

 

 

 

 

 

 

LM3674MFX-1.2/NOPB

 

 

 

 

 

LM3674MF-1.5

 

 

 

 

 

LM3674MFX-1.5

 

1.5

 

 

LM3674MF-1.5/NOPB

 

 

 

 

 

 

LM3674MFX-1.5/NOPB

 

 

 

 

 

LM3674MF-1.6

 

 

 

 

 

LM3674MFX-1.6

 

1.6

 

 

LM3674MF-1.6/NOPB

 

 

 

 

 

 

LM3674MFX-1.6/NOPB

 

 

 

 

 

LM3674MF-1.8

 

 

 

 

 

LM3674MFX-1.8

 

1.8

 

 

LM3674MF-1.8/NOPB

 

 

 

 

 

 

LM3674MFX-1.8/NOPB

 

 

 

 

 

LM3674MF-1.875

 

 

 

 

 

LM3674MFX-1.875

 

1.875

 

 

LM3674MF-1.875/NOPB

 

 

 

 

 

 

LM3674MFX-1.875/NOPB

 

 

 

 

 

LM3674MF-2.8

 

 

 

 

 

LM3674MFX-2.8

 

2.8

 

 

LM3674MF-2.8/NOPB

 

 

 

 

 

 

LM3674MFX-2.8/NOPB

 

 

 

 

 

LM3674MF-ADJ

 

 

 

 

 

LM3674MFX-ADJ

 

Adjustable

 

 

LM3674MF-ADJ/NOPB

 

 

 

 

 

 

LM3674MFX-ADJ/NOPB

 

 

 

 

 

(1)For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.

(2)Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

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SNVS405F –DECEMBER 2005–REVISED MAY 2013 www.ti.com

Absolute Maximum Ratings(1) (2)

VIN Pin: Voltage to GND

−0.2V to 6.0V

EN, FB, SW Pin:

(GND−0.2V) to

 

(VIN + 0.2V)

Continuous Power Dissipation(3)

Internally Limited

Junction Temperature (TJ-MAX)

+125°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature

260°C

(Soldering, 10 sec.)

 

 

 

ESD Rating(4)

2 kV

Human Body model: All Pins

 

 

 

Machine Model: All Pins

200V

 

 

(1)Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings may not imply performance limits. For performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)In Applications where high power dissipation and /or poor package resistance is present, the maximum ambient temperature may have

to be derated. Maximum ambient temperature (TA-MAX ) is dependent on the maximum operating junction temperature (TJ-MAX ), the maximum power dissipation of the device in the application (PD-MAX ) and the junction to ambient thermal resistance of the package (θJA) in the application, as given by the following equation: TA-MAX = TJ-MAX- (θJA x PD-MAX). Refer to Dissipation ration table for PD-MAX values at different ambient temperatures.

(4)The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin (MIL-STD-883 3015.7). National Semiconductor recommends that all intergrated circuits be handled with appropriate precautions. Failure to observe proper ESD handling techniques can result in damage.

Operating Ratings(1) (2) (3)

Input Voltage Range(4)

2.7V to 5.5V

Recommended Load Current

0A to 600 mA

 

 

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

−30°C to +85°C

(1)In Applications where high power dissipation and /or poor package resistance is present, the maximum ambient temperature may have

to be derated. Maximum ambient temperature (TA-MAX ) is dependent on the maximum operating junction temperature (TJ-MAX ), the maximum power dissipation of the device in the application (PD-MAX ) and the junction to ambient thermal resistance of the package (θJA) in the application, as given by the following equation: TA-MAX = TJ-MAX- (θJA x PD-MAX). Refer to Dissipation ration table for PD-MAX values at different ambient temperatures.

(2)Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings may not imply performance limits. For performance limits and associated test conditions, see the Electrical Characteristics tables.

(3)All voltages are with respect to the potential at the GND pin.

(4)Input voltage range recommended for ideal applications performance for the specified output voltages are given below

VIN = 2.7V to 5.5V for 1.0V ≤ VOUT < 1.8V

VIN = ( VOUT + VDROP OUT) to 5.5V for 1.8 ≤ VOUT≤ 3.3V Where VDROP OUT = ILOAD * (RDSON (P) + RINDUCTOR)

Thermal Properties(1)

over operating free-air temperature range (unless otherwise noted)

Junction-to-Ambient Thermal Resistance (θJA) (SOT-23) for a 2 layer board (2)

250°C/W

Junction-to-Ambient Thermal Resistance (θJA) (SOT-23) for a 4 layer board (2)

130°C/W

(1)Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ = 130°C

(2)Junction to ambient thermal resistance (θJA) is highly application and board layout dependent. In applications where high power dissipation exists, special care must be given to thermal dissipation issues in board design. Value specified here 250°C/W is based on

measurement results using a 2 layer, 4" X 3", 2 oz. Cu board as per JEDEC standards. The θJA is 130°C/W if a 4 layer, 4" X 3", 2/1/1/2 oz. Cu board as per JEDEC standards is used.

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SNVS405F –DECEMBER 2005–REVISED MAY 2013

Electrical Characteristics(1) (2) (3)

Limits in standard typeface are for TJ = 25°C. Limits in boldface type apply over the full operating junction temperature range (−30°C ≤ TJ ≤ 125°C). Unless otherwise noted, specifications apply to the LM3674 with VIN = EN = 3.6V

 

Parameter

Test Condition

Min

Typ

Max

Units

 

 

 

 

 

 

 

V

Feedback Voltage(4)(5)

I = 10mA

-4

 

+4

%

FB

 

O

 

 

 

 

 

Line Regulation

2.7V ≤ VIN ≤ 5.5V

 

0.083

 

%/V

 

 

IO = 100 mA

 

 

 

 

 

Load Regulation

100 mA ≤ IO ≤ 600 mA

 

0.0010

 

%/mA

 

 

VIN = 3.6V

 

 

 

 

V

Internal Reference Voltage

See (6)

 

0.5

 

V

REF

 

 

 

 

 

 

ISHDN

Shutdown Supply Current

EN = 0V

 

0.01

1

µA

IQ

DC Bias Current into VIN

No load, device is not switching

 

300

600

µA

 

 

(FB=0V)

 

 

 

 

RDSON (P)

Pin-Pin Resistance for PFET

ISW = 200mA

 

380

500

mΩ

RDSON (N)

Pin-Pin Resistance for NFET

ISW = 200mA

 

250

400

mΩ

I

Switch Peak Current Limit

Open Loop (7)

830

1020

1200

mA

LIM

 

 

 

 

 

 

VIH

Logic High Input

 

1.0

 

 

V

VIL

Logic Low Input

 

 

 

0.4

V

IEN

Enable (EN) Input Current

 

 

0.01

1

µA

FOSC

Internal Oscillator Frequency

PWM Mode

1.6

2

2.6

MHz

(1)All voltages are with respect to the potential at the GND pin.

(2)Min and Max limits are specified by design, test or statistical analysis. Typical numbers represent the most likely norm.

(3)The parameters in the electrical characteristic table are tested at VIN = 3.6V unless otherwise specified. For performance over the input voltage range refer to datasheet curves.

(4)ADJ configured to 1.5V output.

(5)For VOUT less than 2.5V, VIN = 3.6V, for VOUT greater than or equal to 2.5V, VIN = VOUT +1.

(6)For the ADJ version the resistor dividers should be selected such that at the desired output voltage, the voltage at the FB pin is 0.5V.

(7)Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Electrical Characteristic table reflects open loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated). Closed loop current limit is the peak inductor current measured in the application circuit by increasing output current until output voltage drops by 10%.

Dissipation Rating

over operating free-air temperature range (unless otherwise noted)

θJA

TA ≤ 25°C (Power Rating)

TA = 60°C (Power Rating)

TA = 85°C (Power Rating)

250°C/W (2 layer board)

400mW

260mW

160mW

 

 

 

 

130°C/W (4 layer board)

770mW

500mW

310mW

 

 

 

 

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LM3674

SNVS405F –DECEMBER 2005–REVISED MAY 2013

Block Diagram

 

EN

 

VIN

 

 

 

 

 

 

 

 

 

 

 

 

 

Undervoltage

 

Ramp

 

Soft

 

 

Lockout

 

Generator

 

Start

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Thermal

Bandgap

2 MHz

Shutdown

 

Oscillator

 

 

 

 

 

PWM Comparator

 

 

Error

 

+

 

 

Amp

 

 

 

 

-

Control Logic

 

 

 

 

 

 

 

VREF

 

 

 

 

0.5V +

 

 

 

 

-

 

+ Vcomp

 

 

 

 

 

 

-

1.0V

 

 

 

 

 

Frequency

Compensation

Adjustable Version

Fixed Version

FB

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SW

Current Limit

Comparator

+

 

 

 

Ref1

-

 

 

Driver

GND

Figure 4. Simplified Functional Block Diagram

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SNVS405F –DECEMBER 2005–REVISED MAY 2013

Typical Performance Characteristics

(unless otherwise stated: VIN = 3.6V, VOUT = 1.5V, TA = 25°C)

Quiescent Current vs. Supply Voltage (FB = 0V, No Switching)

IQ Shutdown vs. Temp

0.40

EN = GND

A)(P

0.35

 

 

 

 

 

 

0.30

 

 

 

 

 

 

CURRENT

 

 

 

 

 

 

0.25

 

 

 

 

 

 

0.20

 

 

 

VIN = 5.5V

 

 

SHUTDOWN

 

 

 

 

 

 

0.15

 

 

VIN = 3.6V

 

 

 

 

 

 

 

0.10

 

 

VIN = 2.7V

 

 

0.05

 

 

 

 

 

 

 

 

 

 

 

 

0.00

 

 

 

 

 

 

 

-30

-10

10

30

50

70

90

 

 

 

TEMPERATURE (°C)

 

 

Figure 5.

Figure 6.

Feedback Bias Current vs. Temp

Output Voltage vs. Supply Voltage

Figure 7.

Figure 8.

Output Voltage vs. Temperature

Output Voltage vs. Output Current

Figure 9.

Figure 10.

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Texas Instruments LM3674MF, LM3674MF-1.2, LM3674MF-1.5, LM3674MF-1.8, LM3674MF-1.875 Schematic

LM3674

SNVS405F –DECEMBER 2005–REVISED MAY 2013

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Typical Performance Characteristics (continued)

(unless otherwise stated: VIN = 3.6V, VOUT = 1.5V, TA = 25°C)

RDSON vs. Temperature

 

600

VIN = 2.7V

 

550

 

VIN = 4.5V

 

500

 

VIN = 3.6V

):

450

 

400

PFET

 

m

VIN = 2.7V

(

 

(ON)DS

350

 

300

 

R

 

VIN = 4.5V

 

250

 

200

NFET

 

 

 

150

VIN = 3.6V

 

100

 

 

-30

-10 10 30 50 70 90 110

 

 

TEMPERATURE (°C)

Figure 11.

Efficiency vs. Output Current (VOUT = 1.5V, L = 2.2uH, DCR = 200mΩ)

Efficiency vs. Output Current (VOUT = 1.2V, L = 2.2uH, DCR = 200mΩ)

Figure 12.

Efficiency vs. Output Current (VOUT = 1.8V, L = 2.2uH, DCR = 200mΩ)

Figure 13.

Figure 14.

Efficiency vs. Output Current (VOUT = 3.3V, L = 2.2uH, DCR = 200mΩ)

Switching Frequency vs. Temperature

 

2.00

 

 

 

IOUT = 300 mA

 

 

 

 

 

 

 

 

1.98

VIN = 4.5V

 

 

 

 

 

_

 

 

 

 

 

 

 

1.96

 

 

VIN = 3.6V

 

 

(MHZ)

 

 

 

 

 

 

_

 

 

 

 

 

 

 

 

 

VIN = 2.7V

 

 

FREQUENCY

1.94

 

 

 

 

 

 

 

 

 

 

_

 

 

 

 

 

 

1.92

 

 

 

 

 

 

_

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.90

 

 

 

 

 

 

 

_

 

 

 

 

 

 

 

1.88

-

 

 

 

 

 

 

_-30

10

 

50

70

90

 

10

30

 

 

_

_

 

_

_

_

 

 

TEMPERATURE (°C)

 

 

 

Figure 15.

Figure 16.

 

 

 

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