Siemens HYS64V16200GU-8B, HYS64V32200GU-8, HYS64V32220GU-8, HYS64V32220GU-8B, HYS64V64220GU-8 Datasheet

3.3 V 16M		× 64/72-Bit SDRAM Modules	HYS 64/72V16200GU
3.3 V	32M	× 64/72-Bit SDRAM Modules	HYS 64/72V32220GU
3.3 V	64M	× 64/72-Bit SDRAM Modules	HYS 64/72V32200GU

HYS 64/72V64220GU

PC100-168 pin unbuffered DIMM Modules

Preliminary Information

•168 Pin unbuffered 8 Byte Dual-In-Line SDRAM Modules for PC main memory applications

•One bank 16M × 64, 16M × 72, 32M × 64 and 32M × 72 organization

•Two bank 32M × 64, 32M × 72, 64M × 64 and 64M × 72 organization

•Optimized for byte-write non-parity or ECC applications

•Fully PC board layout compatible to INTEL’s Rev. 1.0 module specification

•JEDEC standard Synchronous DRAMs (SDRAM)

•SDRAM Performance:

		-8	-8B	Units
fCK	Clock frequency (max.)	100	100	MHz
tAC	Clock access time	6	6	ns

• Programmed Latencies:

	Product Speed		CL	tRCD	tRP
-8		PC100	2	2	2
-8B		PC100	3	2	3

• Single + 3.3 V (± 0.3 V) power supply

• Programmable CAS Latency, Burst Length and Wrap Sequence (Sequential & Interleave)

• Auto Refresh (CBR) and Self Refresh

• Decoupling capacitors mounted on substrate

• All inputs, outputs are LVTTL compatible

• Serial Presence Detect with E2PROM

• Utilizes 32M × 8 SDRAMs in TSOPII-54 packages

• Uses SIEMENS 128Mbit and 256Mbit SDRAM components

• Gold contact pad

• Card Size: 133.35 mm × 31.75 mm × 4.00 mm

Semiconductor Group

1

1998-08-01

HYS 64(72)V16200/3222(0)0/64220GU

SDRAM Modules

The HYS 64/72V1600, HYS 64/72V32220, HYS 64/72V32200 and HYS 64/72V64220 are industry standard 168-pin 8-byte Dual in-line Memory Modules (DIMMs) which are organized as 16M × 64, 16M × 72, 32M × 64 and 32M × 72 in 1 bank and 32M × 64, 32M × 72, 64M × 64 and 64M × 72 in two banks high speed memory arrays designed with 128M and 256M Synchronous DRAMs (SDRAMs) for non-parity and ECC applications. The DIMMs use -8 and -8B speed sort for 16M × 8 and 32M × 8 SDRAM devices in TSOP-54 packages to meet the PC100 requirement. Decoupling capacitors are mounted on the PC board. The PC board design is according to INTEL’s PC 100 module specification.

The DIMMs have a serial presence detect, implemented with a serial E2PROM using the two pin I2C protocol. The first 128 bytes are utilized by the DIMM manufacturer and the second 128 bytes are available to the end user.

All SIEMENS 168-pin DIMMs provide a high performance, flexible 8-byte interface in a 133.35 mm long footprint, with 1.25“ (31.75 mm) height.

Ordering Information

Type	Ordering Code	Package	Descriptions		Module
					Height
HYS 64V16200GU-8	PC100-222-620	L-DIM-168-30	PC100 16M × 64 1 bank		1.25“
			SDRAM module
HYS 72V16200GU-8	PC100-222-620	L-DIM-168-30	PC100 16M × 72 1 bank		1.25“
			SDRAM module
HYS 64V32220GU-8	PC100-222-620	L-DIM-168-30	PC100 32M × 64 2 bank		1.25“
			SDRAM module
HYS 72V32220GU-8	PC100-222-620	L-DIM-168-30	PC100 32M × 72 2 bank		1.25“
			SDRAM module
HYS 64V16200GU-8B	PC100-323-620	L-DIM-168-30	PC100 16M × 64 1 bank		1.25“
			SDRAM module
HYS 72V16200GU-8B	PC100-323-620	L-DIM-168-30	PC100 16M × 72 1 bank		1.25“
			SDRAM module
HYS 64V32220GU-8B	PC100-323-620	L-DIM-168-30	PC100 32M × 64 2 bank		1.25“
			SDRAM module
HYS 72V32220GU-8B	PC100-323-620	L-DIM-168-30	PC100 32M × 72 2 bank		1.25“
			SDRAM module
HYS 64V32200GU-8	PC100-222-620	L-DIM-168-30	PC100 32M × 64 1 bank		1.25“
			SDRAM module
HYS 72V32200GU-8	PC100-222-620	L-DIM-168-30	PC100 32M × 72 1 bank		1.25“
			SDRAM module
HYS 64V64220GU-8	PC100-222-620	L-DIM-168-30	PC100 64M × 64 2 bank		1.25“
			SDRAM module
HYS 72V64220GU-8	PC100-222-620	L-DIM-168-30	PC100 64M × 72 2 bank		1.25“
			SDRAM module
Semiconductor Group		2		1998-08-01

HYS 64(72)V16200/3222(0)0/64220GU

SDRAM Modules

Ordering Information (cont’d)

Type	Ordering Code	Package	Descriptions	Module
				Height
HYS 64V32200GU-8B	PC100-323-620	L-DIM-168-30	PC100 32M × 64 1 bank	1.25“
			SDRAM module
HYS 72V32200GU-8B	PC100-323-620	L-DIM-168-30	PC100 32M × 72 1 bank	1.25“
			SDRAM module
HYS 64V64220GU-8B	PC100-323-620	L-DIM-168-30	PC100 64M × 64 2 bank	1.25“
			SDRAM module
HYS 72V64220GU-8B	PC100-323-620	L-DIM-168-30	PC100 64M × 72 2 bank	1.25“
			SDRAM module

Pin Names

A0-A12

Address Inputs

CLK0 - CLK3

Clock Input

(RA0 ~ RA10/CA0 ~ CA9)

BA0, BA1

Bank Selects

DQMB0 - DQMB7

Data Mask

DQ0 - DQ63

Data Input/Output

-

Chip Select

CS0

CS3

CB0-CB7

Check Bits

VCC

Power (+ 3.3 Volt)

(× 72 organization only)

Row Address Strobe

VSS

Ground

RAS

Column Address Strobe

SCL

Clock for Presence Detect

CAS

Read/Write Input

SDA

Serial Data Out for Presence

WE

Detect

Clock Enable

N.C. / DU

No Connection

CKE0,

CKE1

Address Format

Part Number

Rows

Columns

Bank

Refresh

Period

Interval

Select

16M × 64/72

HYS 64/72V16200GU

12

10

2

4k

64ms

15.6 µ

32M × 64/72

HYS 64/72V32220GU

12

10

2

4k

64ms

15.6 µ

32M × 64/72

HYS 64/72V32220GU

13

10

2

8k

64ms

7.8 µ

64M × 64/72

HYS 64/72V64220GU

13

10

2

8k

64ms

7.8 µ

Semiconductor Group

3

1998-08-01

HYS 64(72)V16200/3222(0)0/64220GU

SDRAM Modules

Pin Configuration

PIN #		Symbol				PIN #		Symbol				PIN #			Symbol				PIN #			Symbol
1		VSS				43	VSS					85		VSS					127		VSS
2		DQ0				44	DU					86		DQ32					128
																					CKE0
3		DQ1			45						87			DQ33				129
								CS2														CS3
4		DQ2			46		DQMB2				88				DQ34			130				DQMB6
5		DQ3			47		DQMB3				89				DQ35			131				DQMB7
6		VCC				48	DU					90		VCC					132		NC
7		DQ4				49	VCC					91		DQ36					133		VCC
8		DQ5			50		NC				92			DQ37				134			NC
9		DQ6			51		NC				93			DQ38				135			NC
10		DQ7			52		NC (CB2)				94				DQ39			136				CB6
11		DQ8			53		NC (CB3)				95				DQ40			137				CB7
12		VSS				54	VSS					96		VSS					138		VSS
13		DQ9			55		DQ16				97				DQ41			139				DQ48
14		DQ10			56			DQ17			98				DQ42			140				DQ49
15		DQ11			57			DQ18			99				DQ43			141				DQ50
16		DQ12			58			DQ19			100				DQ44			142				DQ51
17		DQ13				59	VCC					101		DQ45					143		VCC
18		VCC				60	DQ20					102		VCC					144		DQ52
19		DQ14			61			NC			103				DQ46			145				NC
20		DQ15			62			DU			104				DQ47			146				DU
21		NC (CB0)			63						105			NC (CB4)				147				NC
								CKE1
22		NC (CB1)				64	VSS					106		NC (CB5)					148		VSS
23		VSS				65	DQ21					107		VSS					149		DQ53
24		NC			66		DQ22				108				NC			150				DQ54
25		NC			67		DQ23				109				NC			151				DQ55
26		VCC				68	VSS					110		VCC					152		VSS
27						69	DQ24					111							153		DQ56
		WE													CAS
28		DQMB0			70			DQ25			112				DQMB4			154				DQ57
29		DQMB1			71			DQ26			113				DQMB5			155				DQ58
30					72		DQ27				114							156			DQ59
		CS0													CS1
31		DU				73	VCC					115							157		VCC
														RAS
32		VSS				74	DQ28					116		VSS					158		DQ60
33		A0			75		DQ29				117				A1			159				DQ61
34		A2			76		DQ30				118				A3			160				DQ62
35		A4			77		DQ31				119				A5			161				DQ63
36		A6				78	VSS					120		A7					162		VSS
37		A8			79		CLK2				121				A9			163			CLK3
38		A10			80		NC				122			BA0				164			NC
39		BA1			81		WP				123			A11				165			SA0
40		VCC				82	SDA					124		VCC					166		SA1
41		VCC				83	SCL					125		CLK1					167			SA2
42		CLK0				84	VCC					126		A12					168		VCC
Note: Pinnames in brackets are for the x72 ECC versions
Semiconductor Group											4										1998-08-01

HYS 64(72)V16200/3222(0)0/64220GU

SDRAM Modules

WE

CS0

DQMB0

CS

WE

CS

WE

DQM

DQMB4

DQM

DQ(7:0)

DQ0-DQ7

DQ(39:32)

DQ0-DQ7

D0

D4

DQMB1

CS

WE

DQMB5

CS

WE

DQM

DQM

DQ(15:8)

DQ0-DQ7

DQ(47:40)

DQ0-DQ7

D1

D5

CS

WE

DQM

CB(7:0)

DQ0-DQ7

D8

CS2

DQMB2

CS

WE

DQM

DQ(23:16)

DQ0-DQ7

D2

DQMB3

CS

WE

DQM

DQ(31:24)

DQ0-DQ7

D3

A0-A11, (A12), BA0, BA1

D0-D7, (D8)

VCC

D0-D7, (D8)

C

VSS

D0-D7, (D8)

D0-D7, (D8)

RAS

				CS				WE
DQMB6				DQM
DQ(55:48)				DQ0-DQ7
								D6
					CS			WE
DQMB7				DQM
DQ(63:56)				DQ0-DQ7
								D7

E2PROM (256 word x 8 Bit)

SA0		SA0
SA1		SA1	SDA
SA2		SA2	WP
SCL		SCL

47 kΩ

CAS D0-D7, (D8)

CKE0 D0-D7, (D8)

Note: D8 is only used in the x72 ECC version.

	Clock Wiring
	32 M x 64		32 M x 72
CLK0	4 SDRAM + 3.3 pF		5 SDRAM
CLK1	Termination		Termination
CLK2	4 SDRAM + 3.3 pF		4 SDRAM + 3.3 pF
CLK3	Termination		Termination

SPB03970

Block Diagram for 16M × 64/72 & 32M × 64/72 one bank SDRAM DIMM Modules

(HYS 64/72V16200GU & HYS 64/72V32200GU)

Semiconductor Group

5

1998-08-01

HYS 64(72)V16200/3222(0)0/64220GU

SDRAM Modules

CS1

CS0

CS

CS

CS

CS

DQMB0

DQM

DQM

DQMB4

DQM

DQM

DQ(7:0)

DQ0-DQ7

DQ0-DQ7

DQ(39:32)

DQ0-DQ7

DQ0-DQ7

D0

D8

D4

D12

CS

CS

CS

CS

DQMB1

DQM

DQM

DQMB5

DQM

DQM

DQ(15:8)

DQ0-DQ7

DQ0-DQ7

DQ(47:40)

DQ0-DQ7

DQ0-DQ7

D1

D9

D5

D13

CS

CS

DQM

DQM

CB(7:0)

DQ0-DQ7

DQ0-DQ7

D16

D17

CS3

CS2

CS

CS

CS

CS

DQMB2

DQM

DQM

DQMB6

DQM

DQM

DQ(23:16)

DQ0-DQ7

DQ0-DQ7

DQ(55:48)

DQ0-DQ7

DQ0-DQ7

D2

D10

D6

D14

						CS			CS
DQMB3						DQM			DQM
DQ(31:24)						DQ0-DQ7			DQ0-DQ7
							D3		D11
A0-A12, BA0, BA1							D0-D15, (D16, D17)

VDD D0-D15, (D16, D17)

C0-C31, (C32...C35)

VSS D0-D7, (D8)

RAS, CAS, WE D0-D15, (D16, D17)

				DQM	CS						CS
DQMB7									DQM
DQ(63:56)				DQ0-DQ7					DQ0-DQ7
					D7						D15
		E2PROM (256 word x 8 Bit)
		SA0		SA0
		SA1		SA1	SDA
		SA2		SA2	WP
		SCL		SCL						47 kΩ

CKE0					D0-D7, (D16)		Clock Wiring
			VDD
							64 M x 64		64 M x 72
				10 kΩ		CLK0	4 SDRAM + 3.3 pF		5 SDRAM
CKE1					D9-D15, (D17)	CLK1	4 SDRAM + 3.3 pF		5 SDRAM
						CLK2	4 SDRAM + 3.3 pF		4 SDRAM + 3.3 pF
						CLK3	4 SDRAM + 3.3 pF		4 SDRAM + 3.3 pF
Note: D16 & D17 is only used in the x72 ECC version and all resistor values are 10 Ω except otherwise noted.										SPB03971

Block Diagram for 32M × 64/72 & 64M × 64/72 two bank SDRAM DIMM Modules

Semiconductor Group

6

1998-08-01