INTEGRATED CIRCUITS
DATA SHEET
TDA6108JF
Triple video output amplifier
Product specification |
1999 Oct 29 |
Supersedes data of 1998 Jun 22
File under Integrated Circuits, IC02
Philips Semiconductors |
Product specification |
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Triple video output amplifier |
TDA6108JF |
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∙Typical bandwidth of 9.0 MHz for an output signal of 60 V (p-p)
∙High slew rate of 1850 V/μs
∙No external components required
∙Very simple application
∙Single supply voltage of 200 V
∙Internal reference voltage of 2.5 V
∙Fixed gain of 51
∙Black-Current Stabilization (BCS) circuit
∙Thermal protection.
The TDA6108JF includes three video output amplifiers in one plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package (SOT111-1), using high-voltage DMOS technology, and is intended to drive the three cathodes of a colour CRT directly. To obtain maximum performance, the amplifier should be used with black-current control.
TYPE |
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PACKAGE |
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NUMBER |
NAME |
DESCRIPTION |
VERSION |
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TDA6108JF |
DBS9MPF |
plastic DIL-bent-SIL medium power package with fin; 9 leads |
SOT111-1 |
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VDD
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6 |
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MIRROR 1 |
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MIRROR 5 |
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TDA6108JF |
CASCODE 1 |
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MIRROR 4 |
3× |
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Voc(3), |
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CURRENT |
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1× |
9, 8, 7 |
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SOURCE |
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Voc(2), |
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Voc(1) |
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1× |
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THERMAL |
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Rf |
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PROTECTION |
VIP |
DIFFERENTIAL |
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CIRCUIT |
REFERENCE |
STAGE |
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Vi(1), |
1, 2, 3 |
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5 |
Vi(2), |
MIRROR 3 |
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I |
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Vi(3) |
Ri |
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o(m) |
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Ra |
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3× |
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CASCODE 2 |
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MIRROR 2
4
MGL318
Fig.1 Block diagram (one amplifier shown).
1999 Oct 29 |
2 |
Philips Semiconductors |
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Product specification |
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Triple video output amplifier |
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TDA6108JF |
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PINNING |
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SYMBOL |
PIN |
DESCRIPTION |
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Vi(1) |
1 |
inverting input 1 |
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handbook, halfpage |
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Vi(2) |
2 |
inverting input 2 |
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Vi(1) |
1 |
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Vi(3) |
3 |
inverting input 3 |
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Vi(2) |
2 |
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GND |
4 |
ground (fin) |
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Vi(3) |
3 |
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Iom |
5 |
black current measurement output |
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GND |
4 |
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VDD |
6 |
supply voltage |
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Iom |
5 |
TDA6108JF |
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Voc(3) |
7 |
cathode output 3 |
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VDD |
6 |
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Voc(2) |
8 |
cathode output 2 |
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Voc(3) |
7 |
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Voc(1) |
9 |
cathode output 1 |
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Voc(2) |
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8 |
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Voc(1) |
9 |
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MGL319 |
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Fig.2 |
Pin configuration. |
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In accordance with the Absolute Maximum Rating System (IEC 134); voltages measured with respect to pin 4 (ground); currents as specified in Fig.1; unless otherwise specified.
SYMBOL |
PARAMETER |
MIN. |
MAX. |
UNIT |
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VDD |
supply voltage |
0 |
250 |
V |
Vi |
input voltage |
0 |
12 |
V |
Vom |
measurement output voltage |
0 |
6 |
V |
Voc |
cathode output voltage |
0 |
VDD |
V |
Tstg |
storage temperature |
−55 |
+150 |
°C |
Tj |
junction temperature |
−20 |
+150 |
°C |
Ves |
electrostatic handling |
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human body model (HBM) |
− |
2000 |
V |
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machine model (MM) |
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300 |
V |
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Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
Quality specification “SNW-FQ-611 part D” is applicable.
1999 Oct 29 |
3 |
Philips Semiconductors |
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Product |
specification |
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Triple video output amplifier |
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TDA6108JF |
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THERMAL CHARACTERISTICS |
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SYMBOL |
PARAMETER |
CONDITIONS |
VALUE |
UNIT |
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Rth(j-a) |
thermal resistance from junction to ambient |
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56 |
K/W |
Rth(j-fin) |
thermal resistance from junction to fin |
note 1 |
11 |
K/W |
Rth(h-a) |
thermal resistance from heatsink to ambient |
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10 |
K/W |
Note
1. An external heatsink is necessary.
8 |
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MGL322 |
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handbook, halfpage |
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Ptot |
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(W) |
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(1) |
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4 |
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(2) |
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2 |
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0 |
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−20 |
20 |
60 |
100 |
140 |
180 |
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Tamb (°C) |
(1)Infinite heatsink.
(2)No heatsink.
Thermal protection
The internal thermal protection circuit gives a decrease of the slew rate at high temperatures: 10% decrease at 130 °C and 30% decrease at 145 °C (typical values on the spot of the thermal protection circuit).
handbook, halfpage |
outputs |
5 K/W
thermal protection circuit
6 K/W
fin MGK279
Fig.3 Power derating curves. |
Fig.4 Equivalent thermal resistance network. |
1999 Oct 29 |
4 |
Philips Semiconductors |
Product specification |
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Triple video output amplifier |
TDA6108JF |
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Operating range: Tj = -20 to +150 °C; VDD = 180 to 210 V. Test conditions: Tamb = 25 °C; VDD = 200 V;
Vo(c1) = Vo(c2) = Vo(c3) = 1¤2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W (measured in test circuit of Fig.8); unless otherwise specified.
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
TYP. |
MAX. |
UNIT |
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Iq |
quiescent supply current |
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8.8 |
10.3 |
11.7 |
mA |
Vref(int) |
internal reference voltage |
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2.5 |
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V |
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(input stage) |
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Ri |
input resistance |
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3.2 |
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kW |
G |
gain of amplifier |
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47.5 |
51.0 |
55.0 |
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DG |
gain difference |
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-2.5 |
0 |
+2.5 |
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VO(c) |
nominal output voltage at |
Ii = 0 mA |
116 |
129 |
142 |
V |
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pins 7, 8 and 9 (DC value) |
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DVO(c)(offset) |
differential nominal output |
Ii = 0 mA |
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0 |
5 |
V |
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offset voltage between |
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pins 7 and 8, 8 and 9 and |
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9 and 7 (DC value) |
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DVo(c)(T) |
output voltage temperature |
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-10 |
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mV/K |
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drift at pins 7, 8 and 9 |
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DVo(c)(T)(offset) |
differential output offset |
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0 |
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mV/K |
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voltage temperature drift |
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between pins 7 and 8, |
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8 and 9 and 7 and 9 |
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Io(m)(offset) |
offset current of measurement |
Io(c) = 0 mA; |
-50 |
- |
+50 |
mA |
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output (for 3 channels) |
1.5 V < Vi < 5.5 V; |
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3 V < Vo(m) < 6 V |
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DIo(m)/DIo(c) |
linearity of current transfer |
-100 mA < Io(c) < 100 mA; |
0.9 |
1.0 |
1.1 |
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1.5 V < Vi < 5.5 V; |
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3 V < Vo(m) < 6 V |
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Io(c)(max) |
maximum peak output current |
50 V < Vo(c) < VDD - 50 V |
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28 |
- |
mA |
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(pins 7, 8 and 9) |
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Vo(c)(min) |
minimum output voltage |
Vi = 7.0 V; note 1 |
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10 |
V |
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(pins 7, 8 and 9) |
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Vo(c)(max) |
maximum output voltage |
Vi = 1.0 V; note 1 |
VDD - 15 |
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- |
V |
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(pins 7, 8 and 9) |
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BS |
small signal bandwidth |
Vo(c) = 60 V (p-p) |
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9.0 |
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MHz |
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(pins 7, 8 and 9) |
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BL |
large signal bandwidth |
Vo(c) = 100 V (p-p) |
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8.0 |
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MHz |
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(pins 7, 8 and 9) |
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tPco |
cathode output propagation |
Vo(c) = 100 V (p-p) |
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32 |
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ns |
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time 50% input to 50% output |
square wave; f <1 MHz; |
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(pins 7, 8 and 9) |
tr = tf = 40 ns |
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(pins 1, 2 and 3); |
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see Figs 6 and 7 |
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1999 Oct 29 |
5 |