Motorola MPX200GVSX, MPX200D, MPX200DP, MPX200GP, MPX200GS Datasheet

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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MPX200/D

200 kPa Uncompensated

Silicon Pressure Sensors

The MPX200 series device is a silicon piezoresistive pressure sensors provide a very accurate and linear voltage output Ð directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola's single element strain gauge design.

Features

Low Cost

Patented Silicon Shear Stress Strain Gauge

±0.25% (Max) Linearity

Full Scale Span 60 mV (Typ)

Easy to Use Chip Carrier Package Options

Ratiometric to Supply Voltage

Absolute, Differential and Gauge Options

Application Examples

Pump/Motor Controllers

Robotics

Level Indicators

Medical Diagnostics

Pressure Switching

Barometers

Altimeters

Figure 1 illustrates a schematic of the internal circuitry on the stand±alone pressure sensor chip.

PIN 3 + VS

PIN 2

+ Vout

X±ducer

PIN 4

± Vout

PIN 1

MPX200

SERIES

0 to 200 kPa (0 ± 29 psi)

60 mV FULL SCALE SPAN (TYPICAL)

BASIC CHIP

CARRIER ELEMENT

CASE 344±15, STYLE 1

DIFFERENTIAL

PORT OPTION

CASE 344C±01, STYLE 1

NOTE: Pin 1 is the notched pin.

PIN NUMBER

1

Gnd

3

VS

2

+Vout

4

±Vout

Figure 1. Uncompensated Pressure Sensor Schematic

VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE

The differential voltage output of the X±ducer is directly proportional to the differential pressure applied.

The absolute sensor has a built±in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side.

The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side.

Senseon and X±ducer are trademarks of Motorola, Inc.

REV 7

Motorola Sensor Device Data

1

Motorola, Inc. 1997

 

MPX200 SERIES

MAXIMUM RATINGS

Rating

 

Symbol

 

 

 

Value

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

Overpressure(8) (P1 > P2)

 

Pmax

 

 

400

 

 

kPa

 

Burst Pressure(8) (P1 > P2)

 

P

 

 

2000

 

 

kPa

 

 

 

burst

 

 

 

 

 

 

 

 

 

Storage Temperature

 

Tstg

 

 

± 40 to +125

 

°C

 

Operating Temperature

 

TA

 

 

± 40 to +125

 

°C

 

OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

 

 

 

 

Characteristic

 

Symbol

 

Min

 

Typ

 

Max

 

Unit

 

 

 

 

 

 

 

 

 

 

Pressure Range(1)

 

P

0

 

Ð

 

200

 

kPa

 

 

OP

 

 

 

 

 

 

 

 

 

Supply Voltage(2)

 

VS

Ð

 

3.0

 

6.0

 

Vdc

Supply Current

 

Io

Ð

 

6.0

 

Ð

 

mAdc

Full Scale Span(3)

 

V

45

 

60

 

90

 

mV

 

 

FSS

 

 

 

 

 

 

 

 

 

Offset(4)

 

V

0

 

20

 

35

 

mV

 

 

off

 

 

 

 

 

 

 

 

 

Sensitivity

 

V/ P

Ð

 

0.3

 

Ð

 

mV/kPa

 

 

 

 

 

 

 

 

 

 

Linearity(5)

 

Ð

± 0.25

 

Ð

 

0.25

 

%VFSS

Pressure Hysteresis(5) (0 to 200 kPa)

 

Ð

Ð

 

± 0.1

 

Ð

 

%V

 

 

 

 

 

 

 

 

 

 

 

FSS

Temperature Hysteresis(5) (± 40°C to +125°C)

 

Ð

Ð

 

± 0.5

 

Ð

 

%V

 

 

 

 

 

 

 

 

 

 

 

FSS

Temperature Coefficient of Full Scale Span(5)

 

TCV

± 0.22

 

Ð

 

± 0.16

 

%V

/°C

 

 

FSS

 

 

 

 

 

 

 

FSS

Temperature Coefficient of Offset(5)

 

TCV

Ð

 

±15

 

Ð

 

μV/°C

 

 

off

 

 

 

 

 

 

 

 

 

Temperature Coefficient of Resistance(5)

 

TC

0.21

 

Ð

 

0.27

 

%Z

/°C

 

 

R

 

 

 

 

 

 

 

in

 

Input Impedance

 

Zin

400

 

Ð

 

550

 

Ω

 

Output Impedance

 

Zout

750

 

Ð

 

1800

 

Ω

 

Response Time(6) (10% to 90%)

 

t

Ð

 

1.0

 

Ð

 

ms

 

 

R

 

 

 

 

 

 

 

 

 

Warm±Up

 

Ð

Ð

 

20

 

Ð

 

ms

 

 

 

 

 

 

 

 

 

 

 

Offset Stability(9)

 

Ð

Ð

 

± 0.5

 

Ð

 

%V

 

 

 

 

 

 

 

 

 

 

 

FSS

MECHANICAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Characteristic

 

Symbol

 

Min

 

Typ

 

Max

 

Unit

 

 

 

 

 

 

 

 

 

 

Weight (Basic Element Case 344±15)

 

Ð

Ð

 

2.0

 

Ð

 

Grams

 

 

 

 

 

 

 

 

 

 

Common Mode Line Pressure(7)

 

Ð

Ð

 

Ð

 

690

 

kPa

NOTES:

 

 

 

 

 

 

 

 

 

 

 

1.1.0 kPa (kiloPascal) equals 0.145 psi.

2.Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self±heating.

3.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.

4.Offset (Voff) is defined as the output voltage at the minimum rated pressure.

5.Accuracy (error budget) consists of the following:

Linearity:

Output deviation from a straight line relationship with pressure, using end point method, over the specified

 

 

pressure range.

Temperature Hysteresis:

Output deviation at any temperature within the operating temperature range, after the temperature is

 

 

cycled to and from the minimum or maximum operating temperature points, with zero differential pressure

 

 

applied.

Pressure Hysteresis:

Output deviation at any pressure within the specified range, when this pressure is cycled to and from the

 

 

minimum or maximum rated pressure, at 25°C.

TcSpan:

Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.

TcOffset:

Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative

 

 

to 25°C.

TCR:

Zin deviation with minimum rated pressure applied, over the temperature range of ± 40°C to +125°C,

 

 

relative to 25°C.

6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.

7.Common mode pressures beyond specified may result in leakage at the case±to±lead interface.

8.Exposure beyond these limits may cause permanent damage or degradation to the device.

9.Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

2

Motorola Sensor Device Data

Motorola MPX200GVSX, MPX200D, MPX200DP, MPX200GP, MPX200GS Datasheet

LINEARITY

Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (see Figure 2). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the ªbest caseº linearity error (lower numerical value), the calculations required are burdensome.

Conversely, an end point fit will give the ªworse caseº error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.

TEMPERATURE COMPENSATION

Figure 3 shows the typical output characteristics of the MPX200 series over temperature. The output is directly proportional to the pressure and is essentially a straight line.

The X±ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal

MPX200 SERIES

proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure.

Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range.

Temperature compensation and offset calibration can be achieved rather simply with additional resistive components or by designing your system using the MPX2200 series sensors.

Several approaches to external temperature compensation over both ±40 to +125°C and 0 to +80°C ranges are presented in Motorola Applications Note AN840.

 

70

 

 

 

60

LINEARITY

 

 

 

 

(mVdc)

50

 

 

40

ACTUAL

 

 

SPAN

OUTPUT

 

 

30

(VFSS)

 

 

 

THEORETICAL

 

 

20

 

 

 

 

 

10

OFFSET

 

0

(VOFF)

 

0

MAX

POP

PRESSURE (kPA)

Figure 2. Linearity Specification Comparison

 

70

 

 

 

 

 

 

 

60

V

S

= 3.0 Vdc

± 40°C

°

SPAN

 

 

 

 

+25 C

 

 

 

P1 > P2

 

 

RANGE

(mVdc)

50

 

 

 

 

 

 

 

 

 

+125°C

(TYP)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

40

 

 

 

 

 

 

30

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

10

 

 

 

 

 

OFFSET

 

 

 

 

 

 

(TYP)

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

4.0

 

 

8.0

 

 

 

 

12

 

 

16

 

 

20

 

 

 

 

24

 

 

28

 

 

30

 

 

 

 

 

 

 

 

 

 

 

 

PSI

20

40

60

80

100

120

140

160

180

200

 

 

 

 

 

 

 

 

kPa

PRESSURE DIFFERENTIAL

 

Figure 3. Output versus Pressure Differential

SILICONE GEL

DIFFERENTIAL/GAUGE

STAINLESS STEEL

SILICONE GEL

ABSOLUTE

STAINLESS STEEL

DIE COAT

DIE

METAL COVER

DIE COAT

DIE

METAL COVER

 

P1

 

 

EPOXY

 

P1

EPOXY

WIRE BOND

 

WIRE BOND

 

 

CASE

 

CASE

LEAD FRAME

 

DIE

LEAD FRAME

 

DIE

DIFFERENTIAL/GAUGE ELEMENT

BOND

 

 

 

ABSOLUTE ELEMENT

BOND

 

 

 

P2

 

 

P2

 

Figure 4. Cross±Sectional Diagrams (Not to Scale)

Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344±15). A silicone gel isolates the die surface and wire bond from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX200 series pressure sensor operating

characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.

Motorola Sensor Device Data

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