Motorola MPX5050GVSX, MPX5050GVP, MPX5050GS, MPX5050D, MPX5050GP Datasheet

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Motorola MPX5050GVSX, MPX5050GVP, MPX5050GS, MPX5050D, MPX5050GP Datasheet

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MPX5050/D

 

MPX5050

Integrated Silicon Pressure Sensor

SERIES

On-Chip Signal Conditioned,

 

Temperature Compensated

OPERATING OVERVIEW

and Calibrated

INTEGRATED

 

 

PRESSURE SENSOR

The MPX5050 series piezoresistive transducer is a state±of±the±art monolithic silicon

0 to 50 kPa (0 to 7.25 psi)

pressure sensor designed for a wide range of applications, but particularly those

0.2 to 4.7 Volts Output

employing a microcontroller or microprocessor with A/D inputs. This patented, single

 

element transducer combines advanced micromachining techniques, thin±film metalliza-

 

tion, and bipolar processing to provide an accurate, high level analog output signal that

 

is proportional to the applied pressure.

 

Features

 

2.5% Maximum Error over 0° to 85°C

 

Ideally suited for Microprocessor or Microcontroller±Based Systems

 

Temperature Compensated Over ± 40° to +125°C

BASIC CHIP CARRIER

Patented Silicon Shear Stress Strain Gauge

ELEMENT

CASE 867±08, STYLE 1

 

Durable Epoxy Unibody Element

 

Easy±to±Use Chip Carrier Option

 

 

VS

 

 

 

 

3

 

 

 

 

THIN FILM

GAIN STAGE #2

 

 

X±ducer

TEMPERATURE

AND

1

 

SENSING

COMPENSATION

GROUND

V

 

 

 

 

out

ELEMENT

AND

REFERENCE

 

DIFFERENTIAL PORT OPTION

 

GAIN STAGE #1

SHIFT CIRCUITRY

 

CASE 867C±05, STYLE 1

2

NOTE: Pin 1 is the notched pin.

PINS 4, 5 AND 6 ARE NO CONNECTS

 

GND

 

PIN NUMBER

 

 

 

 

 

 

Figure 1. Fully Integrated Pressure Sensor Schematic

1

Vout

4

 

N/C

2

Grd

5

 

N/C

 

 

 

 

 

 

 

 

 

3

VS

6

 

N/C

MAXIMUM RATINGS(1)

Parametrics

Symbol

Value

Unit

 

 

 

 

Overpressure(2) (P1 > P2)

Pmax

200

kPa

Burst Pressure(2) (P1 > P2)

P

700

kPa

 

burst

 

 

Storage Temperature

Tstg

± 40° to +125°

°C

Operating Temperature

TA

± 40° to +125°

°C

1.TC = 25°C unless otherwise noted.

2.Exposure beyond the specified limits may cause permanent damage or degradation to the device.

NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground.

Senseon and X±ducer are trademarks of Motorola, Inc.

REV 3

Motorola Sensor Device Data

1

Motorola, Inc. 1997

 

MPX5050 SERIES

OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

Characteristic

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

Pressure Range(1)

 

P

0

Ð

50

kPa

 

 

OP

 

 

 

 

Supply Voltage(2)

 

VS

4.75

5.0

5.25

Vdc

Supply Current

 

Io

Ð

7.0

10.0

mAdc

Minimum Pressure Offset(3)

(0 to 85°C)

V

0.088

0.20

0.313

Vdc

@ VS = 5.0 Volts

 

off

 

 

 

 

 

 

 

 

 

 

Full Scale Output(4)

(0 to 85°C)

V

4.587

4.70

4.813

Vdc

@ VS = 5.0 Volts

 

FSO

 

 

 

 

 

 

 

 

 

 

Full Scale Span(5)

(0 to 85°C)

V

Ð

4.50

Ð

Vdc

@ VS = 5.0 Volts

 

FSS

 

 

 

 

 

 

 

 

 

 

Accuracy(6)

 

Ð

Ð

Ð

"2.5

%V

 

 

 

 

 

 

FSS

Sensitivity

 

V/P

Ð

90

Ð

mV/kPa

 

 

 

 

 

 

 

Response Time(7)

 

tR

Ð

1.0

Ð

mS

Output Source Current at Full Scale Output

Io+

Ð

0.1

Ð

mAdc

Warm±Up Time(8)

 

Ð

Ð

20

Ð

mSec

Offset Stability(9)

 

Ð

Ð

"0.5

Ð

%VFSS

Decoupling circuit shown in Figure 4 required to meet electrical specifications.

MECHANICAL CHARACTERISTICS

Characteristic

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

Weight, Basic Element (Case 867)

Ð

Ð

4.0

Ð

Grams

 

 

 

 

 

 

Common Mode Line Pressure(10)

Ð

Ð

Ð

690

kPa

NOTES:

1.1.0kPa (kiloPascal) equals 0.145 psi.

2.Device is ratiometric within this specified excitation range.

3.Offset (Voff) is defined as the output voltage at the minimum rated pressure.

4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.

5.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.

6.Accuracy (error budget) consists of the following:

Linearity:

Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature Hysteresis:

Output deviation at any temperature within the operating temperature range, after the temperature is

 

 

cycled to and from the minimum or maximum operating temperature points, with zero differential pressure

 

 

applied.

Pressure Hysteresis:

Output deviation at any pressure within the specified range, when this pressure is cycled to and from

 

 

minimum or maximum rated pressure at 25°C.

TcSpan:

Output deviation over the temperature range of 0° to 85°C, relative to 25°C.

TcOffset:

Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative

 

 

to 25°C.

Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.

7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.

8.Warm±up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.

9.Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

10.Common mode pressures beyond what is specified may result in leakage at the case±to±lead interface.

2

Motorola Sensor Device Data

Figure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.

The MPX5050 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long±term reliability. Contact the factory for in-

MPX5050 SERIES

formation regarding media compatibility in your application. Figure 4 shows a typical decoupling circuit for interfacing

the integrated sensor to the A/D input of a microprocessor. Proper decoupling of the power supply is recommended.

Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit below. (The output will saturate outside of the specified pressure range.)

 

5.0

TRANSFER FUNCTION:

 

 

 

 

 

 

 

 

4.5

 

 

 

 

 

 

 

 

V

 

= V

*(0.018*P+0.04)

± ERROR

 

 

 

 

 

 

 

out

 

S

 

 

 

 

 

 

 

 

 

 

4.0

VS = 5.0 Vdc

 

 

 

 

 

 

 

 

 

 

3.5

TEMP = 0 to 85°C

 

 

 

 

 

 

 

 

(V)

 

 

 

 

 

 

 

 

 

 

 

 

 

3.0

 

 

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

TYPICAL

 

 

 

2.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MIN

 

 

 

 

 

 

1.5

 

MAX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

5

10

15

20

25

30

35

40

45

50

55

 

0

 

 

DIFFERENTIAL PRESSURE (kPa)

Figure 2. Output versus Pressure Differential

FLUORO SILICONE

 

STAINLESS STEEL

MPX5050

 

A/D

DIE

OUPUT

 

GEL DIE COAT

P1

METAL COVER

(PIN 1)

 

 

 

EPOXY

 

 

WIRE BOND

 

50 pF

51 k

 

 

PLASTIC

μ PROCESSOR

 

 

 

 

 

 

CASE

 

 

 

 

 

 

 

LEAD FRAME

 

DIE

 

 

 

DIFFERENTIAL/GAUGE ELEMENT

BOND

 

 

 

 

 

 

 

 

P2

 

 

 

 

Figure 3. Cross±Sectional Diagram

Figure 4. Typical Decoupling Filter for Sensor to

 

(Not to Scale)

 

 

Microprocessor Interface

Motorola Sensor Device Data

3

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