Motorola MPX5010GVP, MPX5010DP, MPX5010GP, MPX5010GS, MPX5010GVS Datasheet

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

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		MPX5010
	Integrated Silicon Pressure Sensor	SERIES
	On-Chip Signal Conditioned,
	Temperature Compensated	INTEGRATED
	and Calibrated
		PRESSURE SENSOR
	The MPX5010 series piezoresistive transducer is a state±of±the±art monolithic silicon	0 to 10 kPa (0 to 1.45 psi)
		0.2 to 4.7 V OUTPUT
	pressure sensor designed for a wide range of applications, but particularly those
	employing a microcontroller or microprocessor with A/D inputs. This patented, single
	element transducer combines advanced micromachining techniques, thin±film metalliza-
	tion, and bipolar processing to provide an accurate, high level analog output signal that
	is proportional to the applied pressure.
	Features
	• 5.0% Maximum Error over 0° to 85°C
	• Ideally Suited for Microprocessor or Microcontroller±Based Systems	BASIC CHIP
	• Patented Silicon Shear Stress Strain Gauge
		CARRIER ELEMENT
	• Durable Epoxy Unibody Element	CASE 867±08, STYLE 1

•	Temperature Compensated over		40° to +125°C
			VS
			3
			THIN FILM	GAIN STAGE #2
	X±ducer	TEMPERATURE		AND	1
	SENSING	COMPENSATION		GROUND		V
						out
	ELEMENT		AND	REFERENCE		DIFFERENTIAL
		GAIN STAGE #1		SHIFT CIRCUITRY		PORT OPTION
						CASE 867C±05, STYLE 1
		2	PINS 4, 5 AND 6 ARE NO CONNECTS

GND

Figure 1. Fully Integrated Pressure Sensor Schematic

MAXIMUM RATINGS(1)

Parametrics	Symbol	Value	Unit
Overpressure(2) (P1 > P2)	Pmax	75	kPa
Burst Pressure(2) (P1 > P2)	P	100	kPa
	burst
Storage Temperature	Tstg	± 40 to +125	°C
Operating Temperature	TA	± 40 to +125	°C

1.TC = 25°C unless otherwise noted.

2.Exposure beyond the specified limits may cause permanent damage or degradation to the device.

PIN NUMBER

1	Vout	4	N/C
2	Gnd	5	N/C
3	VS	6	N/C

NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the Lead.

Senseon and X±ducer are trademarks of Motorola, Inc.

REV 2

Motorola Sensor Device Data	1
Motorola, Inc. 1997

MPX5010 SERIES

OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

Characteristic		Symbol	Min	Typ	Max	Unit
Pressure Range(1)		P	0	Ð	10	kPa
		OP
Supply Voltage(2)		VS	4.75	5.0	5.25	Vdc
Supply Current		Io	Ð	7.0	10	mAdc
Minimum Pressure Offset(3)	(0 to 85°C)	V	0	0.2	0.425	Vdc
@ VS = 5.0 Volts		off
Full Scale Output(4)	(0 to 85°C)	VFSO	4.475	4.7	4.925	Vdc
@ VS = 5.0 Volts
Full Scale Span(5)	(0 to 85°C)	V	Ð	4.5	Ð	Vdc
@ VS = 5.0 Volts		FSS
Accuracy(6)	(0 to 85°C)	Ð	Ð	Ð	± 5.0	%V
						FSS
Sensitivity		V/P	Ð	450	Ð	mV/kPa
Response Time(7)		tR	Ð	1.0	Ð	ms
Output Source Current at Full Scale Output		IO+	Ð	0.1	Ð	mAdc
Warm±Up Time(8)		Ð	Ð	20	Ð	ms
Offset Stability(9)		Ð	Ð	± 0.5	Ð	%V
						FSS

MECHANICAL CHARACTERISTICS

Characteristic	Symbol	Min	Typ	Max	Unit
Weight, Basic Element (Case 867)	Ð	Ð	4.0	Ð	Grams
Common Mode Line Pressure(10)	Ð	Ð	Ð	690	kPa

NOTES:

1.1.0 kPa (kiloPascal) equals 0.145 psi.

2.Device is ratiometric within this specified excitation range.

3.Offset (Voff) is defined as the output voltage at the minimum rated pressure.

4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.

5.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.

6.Accuracy (error budget) consists of the following:

•	Linearity:	Output deviation from a straight line relationship with pressure over the specified pressure range.
•	Temperature Hysteresis:	Output deviation at any temperature within the operating temperature range, after the temperature is
		cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
		applied.
•	Pressure Hysteresis:	Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
		minimum or maximum rated pressure, at 25°C.
•	TcSpan:	Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
•	TcOffset:	Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative
		to 25°C.

•Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.

7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.

8.Warm±up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.

9.Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

10.Common mode pressures beyond what is specified may result in leakage at the case±to±lead interface.

2	Motorola Sensor Device Data

MPX5010 SERIES

ON±CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

Figure 2 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.

The MPX5010 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long±term reliability. Contact the factory for information

regarding media compatibility in your application.

Figure 3 shows a typical decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor. Proper decoupling of the power supply is recommended.

Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit below. (The output will saturate outside of the specified pressure range.)

SILICONE	DIE	STAINLESS STEEL	MPX5010
DIE COAT		METAL COVER			A/D
			OUTPUT
		P1	(PIN 1)
WIRE BOND
			50 pF
				51 k	μ PROCESSOR
LEAD FRAME		RTV DIE
		BOND
		P2
EPOXY CASE

Figure 2. Cross±Sectional Diagram	Figure 3. Typical Decoupling Filter for Sensor to
(Not to Scale)	Microprocessor Interface

	5.0	TRANSFER FUNCTION:
	4.5
		V	= V	*(0.09*P+0.04)			± ERROR
		out		S
	4.0	VS = 5.0 Vdc
	3.5	TEMP = 0 to 85°C
(V)
	3.0
OUTPUT
	2.5
	2.0								TYPICAL
		MAX
	1.5
	1.0						MIN
	0.5
	0		1	2	3	4		5	6	7	8	9	10	11
	0
					DIFFERENTIAL PRESSURE (kPa)

Figure 4. Output versus Pressure Differential

Motorola Sensor Device Data

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