ST SPC563M64L5, SPC563M64L7 User Manual

0 (0)

SPC563M64L5, SPC563M64L7

32-bit Power Architecture® based MCU for automotive powertrain applications

Datasheet − production data

Features

■Single issue, 32-bit Power Architecture® Book E compliant e200z335 CPU core complex

–Includes variable length encoding (VLE) enhancements for code size reduction

■32-channel direct memory access controller (DMA)

■Interrupt controller (INTC) capable of handling 364 selectable-priority interrupt sources: 191 peripheral interrupt sources, 8 software interrupts and 165 reserved interrupts.

■Frequency-modulated phase-locked loop (FMPLL)

■Calibration external bus interface (EBI)(a)

■System integration unit (SIU)

■Up to 1.5 Mbyte on-chip Flash with Flash controller

–Fetch Accelerator for single cycle Flash access @80 MHz

■Up to 94 Kbyte on-chip static RAM (including up to 32 Kbyte standby RAM)

■Boot assist module (BAM)

■32-channel second-generation enhanced time processor unit (eTPU)

a.The external bus interface is only accessible when using the calibration tool. It is not available on production packages.

Table 1. Device summary

	144 LQFP	100 LQFP
	20 mm x 20 mm	14 mm x 14 mm
	176 LQFP	LFBGA208
	176 LQFP	17 mm x 17 mm
	24 mm x 24 mm	17 mm x 17 mm
	24 mm x 24 mm	x 1.5 mm
		x 1.5 mm

–32 standard eTPU channels

–Architectural enhancements to improve code efficiency and added flexibility

■16-channels enhanced modular input-output system (eMIOS)

■Enhanced queued analog-to-digital converter (eQADC)

■Decimation filter (part of eQADC)

■Silicon die temperature sensor

■2 deserial serial peripheral interface (DSPI) modules (compatible with Microsecond Bus)

■2 enhanced serial communication interface (eSCI) modules compatible with LIN

■2 controller area network (FlexCAN) modules that support CAN 2.0B

■Nexus port controller (NPC) per IEEE-ISTO 5001-2003 standard

■IEEE 1149.1 (JTAG) support

■Nexus interface

■On-chip voltage regulator controller that provides 1.2 V and 3.3 V internal supplies from a 5 V external source.

■Designed for LQFP100, LQFP144, LQFP176 and LBGA208.

Memory Flash size		Part number

	Package: LQFP100	Package: LQFP144	Package: LQFP176	Package: LBGA208
	Package: LQFP100	Package: LQFP144	Package: LQFP176	Package: LBGA208

1536 Kbyte	—	SPC563M64L5	SPC563M64L7	—

June 2012

Doc ID 14642 Rev 9

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This is information on a product in full production.

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Contents	SPC563M64L5, SPC563M64L7

Contents

1	Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 7
	1.1	Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	7
	1.2	Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	7
2	Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		8
	2.1	Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	10
	2.2	SPC563Mxx features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	12
	2.3	SPC563Mxx feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	20

2.3.1 e200z335 core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.3.2 Crossbar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.3 eDMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.4 Interrupt controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.3.5 FMPLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.3.6 Calibration EBI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.3.7 SIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2.3.8 ECSM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.3.9 Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.3.10 SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2.3.11 BAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2.3.12 eMIOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2.3.13 eTPU2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2.3.14 eQADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 2.3.15 DSPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2.3.16 eSCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2.3.17 FlexCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.3.18 System timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 2.3.19 Software Watchdog Timer (SWT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 2.3.20 Debug features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

2.4 SPC563Mxx series architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

2.4.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 2.4.2 Block summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

3	Pinout and signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		43
	3.1	LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	43

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3.2 LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.3 LQFP176 pinout (SPC563M64) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.4 LQFP176 pinout (SPC563M60) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.5 LBGA208 ballmap (SPC563M64) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 3.6 Signal summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 3.7 Signal details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

4	Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		72
	4.1	Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	72
	4.2	Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	72
	4.3	Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	74

4.3.1General notes for specifications at maximum junction temperature . . . 76

4.4 Electromagnetic Interference (EMI) characteristics . . . . . . . . . . . . . . . . . 79 4.5 Electromagnetic static discharge (ESD) characteristics . . . . . . . . . . . . . . 79

4.6Power Management Control (PMC) and Power On Reset (POR) electrical

	specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		80
	4.6.1	Regulator example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	84
	4.6.2	Recommended power transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	86
4.7	Power up/down sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		86
4.8	DC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		87
4.9	I/O Pad current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		94

4.9.1 I/O pad VRC33 current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 95 4.9.2 LVDS pad specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

4.10 Oscillator and PLLMRFM electrical characteristics . . . . . . . . . . . . . . . . . 97 4.11 Temperature sensor electrical characteristics . . . . . . . . . . . . . . . . . . . . . 99 4.12 eQADC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 4.13 Platform flash controller electrical characteristics . . . . . . . . . . . . . . . . . 102 4.14 Flash memory electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 102 4.15 AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

4.15.1 Pad AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

4.16 AC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

108

4.16.1 IEEE 1149.1 interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 4.16.2 Nexus timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 4.16.3 Calibration bus interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 4.16.4 eMIOS timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

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4.16.5 DSPI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 4.16.6 eQADC SSI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

5	Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		125
	5.1	ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	125
	5.2	Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	126

5.2.1 LQFP100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 5.2.2 LQFP144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 5.2.3 LQFP176 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 5.2.4 LBGA208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

6	Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	134
7	Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	135

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SPC563M64L5, SPC563M64L7	List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. SPC563Mxx family device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 3. SPC563Mxx series block summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 4. SPC563Mx signal properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Table 5. Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Table 6. Signal details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Table 7. SPC563Mx Power/Ground Segmentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Table 8. Parameter classifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table 9. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table 10. Thermal characteristics for 100-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Table 11. Thermal characteristics for 144-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Table 12. Thermal characteristics for 176-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Table 13. Thermal characteristics for 208-pin LBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Table 14. EMI testing specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Table 15. ESD ratings, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Table 16. PMC Operating conditions and external regulators supply voltage . . . . . . . . . . . . . . . . . . 80 Table 17. PMC electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Table 18. Required external PMC component values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Table 19. Network 1 component values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Table 20. Network 2 component values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Table 21. Network 3 component values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Table 22. Recommended operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Table 23. Power sequence pin states for fast pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Table 24. Power sequence pin states for medium, slow and multi-voltage pads . . . . . . . . . . . . . . . . 87 Table 25. DC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

Table 26. I/O pad average IDDE specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Table 27. I/O pad VRC33 average IDDE specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Table 28. VRC33 pad average DC current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Table 29. DSPI LVDS pad specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

Table 30. PLLMRFM electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Table 31. Temperature sensor electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Table 32. eQADC conversion specifications (operating) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Table 33. APC, RWSC, WWSC settings vs. frequency of operation . . . . . . . . . . . . . . . . . . . . . . . . 102 Table 34. Program and erase specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Table 35. Flash module life. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Table 36. Pad AC specifications (5.0 V), . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Table 37. Pad AC specifications (3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Table 38. Pad AC specifications (1.8 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Table 39. JTAG pin AC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Table 40. Nexus debug port timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Table 41. Calibration bus operation timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Table 42. eMIOS timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Table 43. DSPI timing, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

Table 44. eQADC SSI timing characteristics (pads at 3.3 V or at 5.0 V) . . . . . . . . . . . . . . . . . . . . . 123 Table 45. LQFP144 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 Table 46. LQFP176 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Table 47. LBGA208 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 Table 48. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

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List of figures	SPC563M64L5, SPC563M64L7

List of figures

Figure 1. SPC563Mxx series block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 2. 100-pin LQFP pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Figure 3. 144-pin LQFP pinout (top view; all 144-pin devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Figure 4. 176-pin LQFP pinout (SPC563M64; top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Figure 5. 176-pin LQFP pinout (SPC563M60; top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Figure 6. 208-pin LBGA ballmap (SPC563M64; top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Figure 7. Core voltage regulator controller external components preferred configuration . . . . . . . . . 84 Figure 8. Pad output delay. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Figure 9. JTAG test clock input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Figure 10. JTAG test access port timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Figure 11. JTAG JCOMP timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Figure 12. JTAG boundary scan timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Figure 13. Nexus output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Figure 14. Nexus event trigger and test clock timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 Figure 15. Nexus TDI, TMS, TDO timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 Figure 16. CLKOUT timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Figure 17. Synchronous output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Figure 18. Synchronous input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 Figure 19. ALE signal timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 Figure 20. DSPI classic SPI timing – master, CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 Figure 21. DSPI classic SPI timing – master, CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 Figure 22. DSPI classic SPI timing – slave, CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Figure 23. DSPI classic SPI timing – slave, CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Figure 24. DSPI modified transfer format timing – master, CPHA = 0. . . . . . . . . . . . . . . . . . . . . . . . 121 Figure 25. DSPI modified transfer format timing – master, CPHA = 1. . . . . . . . . . . . . . . . . . . . . . . . 121 Figure 26. DSPI modified transfer format timing – slave, CPHA =0 . . . . . . . . . . . . . . . . . . . . . . . . . 122 Figure 27. DSPI modified transfer format timing – slave, CPHA =1 . . . . . . . . . . . . . . . . . . . . . . . . . 122 Figure 28. DSPI PCS strobe (PCSS) timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 Figure 29. eQADC SSI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Figure 30. LQFP100 package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Figure 31. LQFP144 package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 Figure 32. LQFP176 package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 Figure 33. LBGA208 package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 Figure 34. Commercial product code structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

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1 Introduction

1.1Document overview

This document provides an overview and describes the features of the SPC563Mxx series of microcontroller units (MCUs). For functional characteristics, refer to the device reference manual. Electrical specifications and package mechanical drawings are included in this device data sheet. Pin assignments can be found in both the reference manual and data sheet.

1.2Description

These 32-bit automotive microcontrollers are a family of system-on-chip (SoC) devices that contain many new features coupled with high performance 90 nm CMOS technology to provide substantial reduction of cost per feature and significant performance improvement. The advanced and cost-efficient host processor core of this automotive controller family is built on Power Architecture® technology. This family contains enhancements that improve the architecture’s fit in embedded applications, includes additional instruction support for digital signal processing (DSP), integrates technologies—such as an enhanced time processor unit, enhanced queued analog-to-digital converter, Controller Area Network, and an enhanced modular input-output system—that are important for today’s lower-end powertrain applications. The device has a single level of memory hierarchy consisting of up to 94 KB on-chip SRAM and up to 1.5 MB of internal flash memory. The device also has an external bus interface (EBI) for ‘calibration’.

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2 Overview

This document provides electrical specifications, pin assignments, and package diagrams for the SPC563Mxx series of microcontroller units (MCUs). For functional characteristics, refer to the SPC563Mxx Microcontroller Reference Manual.

The SPC563Mxx series microcontrollers are system-on-chip devices that are built on Power Architecture® technology and:

●Are 100% user-mode compatible with the Power Architecture instruction set

●Contain enhancements that improve the architecture’s fit in embedded applications

●Include additional instruction support for digital signal processing (DSP)

●Integrate technologies such as an enhanced time processor unit, enhanced queued analog-to-digital converter, Controller Area Network, and an enhanced modular inputoutput system

●Operating Parameters

–Fully static operation, 0 MHz – 80 MHz (plus 2% frequency modulation - 82 MHz)

––40 °C – 150 °C junction temperature operating range

–Low power design

Less than 400 mW power dissipation (nominal)

Designed for dynamic power management of core and peripherals Software controlled clock gating of peripherals

Low power stop mode, with all clocks stopped

–Fabricated in 90 nm process

–1.2 V internal logic

●High performance e200z335 core processor

●Advanced microcontroller bus architecture (AMBA) crossbar switch (XBAR)

●Enhanced direct memory access (eDMA) controller

●Interrupt controller (INTC)

–191 peripheral interrupt request sources, plus 165 reserved positions

–Low latency—three clocks from receipt of interrupt request from peripheral to interrupt request to processor

●Frequency Modulating Phase-locked loop (FMPLL)

●Calibration bus interface (EBI) (available only in the calibration package)

●System integration unit (SIU) centralizes control of pads, GPIO pins and external interrupts.

●Error correction status module (ECSM) provides configurable error-correcting codes (ECC) reporting

●Up to 1.5 MB on-chip flash memory

●Up to 94 KB on-chip static RAM

●Boot assist module (BAM) enables and manages the transition of MCU from reset to user code execution from internal flash memory, external memory on the calibration bus or download and execution of code via FlexCAN or eSCI.

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●Periodic interrupt timer (PIT)

–32-bit wide down counter with automatic reload

–4 channels clocked by system clock

–1 channel clocked by crystal clock

●System timer module (STM)

–32-bit up counter with 8-bit prescaler

–Clocked from system clock

–4 channel timer compare hardware

●Software watchdog timer (SWT) 32-bit timer

●Enhanced modular I/O system (eMIOS)

–16 standard timer channels (up to 14 channels connected to pins in LQFP144)

–24-bit timer resolution

●Second-generation enhanced time processor unit (eTPU2)

–High level assembler/compiler

–Enhancements to make ‘C’ compiler more efficient

–New ‘engine relative’ addressing mode

●Enhanced queued A/D converter (eQADC)

–2 independent on-chip RSD Cyclic ADCs

–Up to 34 input channels available to the two on-chip ADCs

–4 pairs of differential analog input channels

●2 deserial serial peripheral interface modules (DSPI)

–SPI provides full duplex communication ports with interrupt and DMA request support

–Deserial serial interface (DSI) achieves pin reduction by hardware serialization and deserialization of eTPU, eMIOS channels and GPIO

●2 enhanced serial communication interface (eSCI) modules

●2 FlexCAN modules

●Nexus port controller (NPC) per IEEE-ISTO 5001-2003 standard

●IEEE 1149.1 JTAG controller (JTAGC)

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2.1Device comparison

Table 2.	SPC563Mxx family device summary
	Feature	SPC563M64	SPC563M60P	SPC563M54P

Flash memory size (KB)		1536	1024	768

Total SRAM size (KB)		94	64	48

Standby SRAM size (KB)		32	32	24

		32-bit e200z335	32-bit e200z335	32-bit e200z335
Processor core		with SPE and FPU	with SPE and FPU	with SPE and FPU
		support	support	support

Core frequency (MHz)		64/80	40/64/80	40/64

Calibration bus width(1)		16 bits	16 bits	—
DMA (direct memory access) channels		32	32	32

eMIOS (enhanced modular input-output system)		16	16	16
channels		16	16	16
channels

eQADC (enhanced queued analog-to-digital		Up to 34(2)	Up to 34(2)	Up to 32(2)
converter) channels (on-chip)		Up to 34(2)	Up to 34(2)	Up to 32(2)
converter) channels (on-chip)

eSCI (serial communication interface)		2	2	2

DSPI (deserial serial peripheral interface)		2	2	2

Microsecond Channel compatible interface		2	2	2

eTPU (enhanced time processor unit)		Yes	Yes	Yes

Channels		32	32	32

Code memory (KB)		14	14	14

Parameter RAM (KB)		3	3	3

FlexCAN (controller area network)(3)		2	2	2
FMPLL (frequency-modulated phase-locked loop)		Yes	Yes	Yes

INTC (interrupt controller) channels		364(4)	364(4)	364(4)
JTAG controller		Yes	Yes	Yes

NDI (Nexus development interface) level		Class 2+	Class 2+	Class 2+

Non-maskable interrupt and critical interrupt		Yes	Yes	Yes

PIT (periodic interrupt timers)		5	5	5

Task monitor timer		4 channels	4 channels	4 channels

Temperature sensor		Yes	Yes	Yes

Windowing software watchdog		Yes	Yes	Yes

		LQFP144	LQFP100	LQFP100
Packages		LQFP144	LQFP144	LQFP100
Packages		LQFP176	LQFP144	LQFP144
		LQFP176	LQFP176	LQFP144
			LQFP176

1.Calibration package only.

2.The 176-pin and 208-pin packages have 34 input channels; 144-pin package has 32; 100-pin package has 23.

3.One FlexCAN module has 64 message buffers; the other has 32 message buffers.

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4.165 interrupt channels are reserved for compatibility with future devices. This device has 191 peripheral interrupt sources plus 8 software interrupts available to the user.

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2.2SPC563Mxx features

●Operating Parameters

–Fully static operation, 0 MHz – 80 MHz (plus 2% frequency modulation - 82 MHz)

––40 °C to 150 °C junction temperature operating range

–Low power design

Less than 400 mW power dissipation (nominal)

Designed for dynamic power management of core and peripherals Software controlled clock gating of peripherals

Low power stop mode, with all clocks stopped

–Fabricated in 90 nm process

–1.2 V internal logic

–Single power supply with 5.0 V −10% / +5% (4.5 V to 5.25 V) with internal regulator to provide 3.3 V and 1.2 V for the core

–Input and output pins with 5.0 V −10% / +5% (4.5 V to 5.25 V) range 35%/65% VDDE CMOS switch levels (with hysteresis)

Selectable hysteresis Selectable slew rate control

–Nexus pins powered by 3.3 V supply

–Designed with EMI reduction techniques Phase-locked loop

Frequency modulation of system clock frequency On-chip bypass capacitance

Selectable slew rate and drive strength

●High performance e200z335 core processor

–32-bit Power Architecture Book E programmer’s model

–Variable Length Encoding Enhancements

Allows Power Architecture instruction set to be optionally encoded in a mixed 16 and 32-bit instructions

Results in smaller code size

–Single issue, 32-bit Power Architecture technology compliant CPU

–In-order execution and retirement

–Precise exception handling

–Branch processing unit

Dedicated branch address calculation adder

Branch acceleration using Branch Lookahead Instruction Buffer

–Load/store unit One-cycle load latency Fully pipelined

Big and Little Endian support Misaligned access support

Zero load-to-use pipeline bubbles

–Thirty-two 64-bit general purpose registers (GPRs)

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–Memory management unit (MMU) with 16-entry fully-associative translation lookaside buffer (TLB)

–Separate instruction bus and load/store bus

–Vectored interrupt support

–Interrupt latency < 120 ns @ 80 MHz (measured from interrupt request to execution of first instruction of interrupt exception handler)

–Non-maskable interrupt (NMI) input for handling external events that must produce an immediate response, e.g., power down detection. On this device, the NMI input is connected to the Critical Interrupt Input. (May not be recoverable)

–Critical Interrupt input. For external interrupt sources that are higher priority than provided by the Interrupt Controller. (Always recoverable)

–New ‘Wait for Interrupt’ instruction, to be used with new low power modes

–Reservation instructions for implementing read-modify-write accesses

–Signal processing extension (SPE) APU

Operating on all 32 GPRs that are all extended to 64 bits wide

Provides a full compliment of vector and scalar integer and floating point arithmetic operations (including integer vector MAC and MUL operations) (SIMD)

Provides rich array of extended 64-bit loads and stores to/from extended GPRs Fully code compatible with e200z6 core

–Floating point (FPU)

IEEE 754 compatible with software wrapper

Scalar single precision in hardware, double precision with software library Conversion instructions between single precision floating point and fixed point Fully code compatible with e200z6 core

–Long cycle time instructions, except for guarded loads, do not increase interrupt latency

–Extensive system development support through Nexus debug port

●Advanced microcontroller bus architecture (AMBA) crossbar switch (XBAR)

–Three master ports, four slave ports

Masters: CPU Instruction bus; CPU Load/store bus (Nexus); eDMA Slave: Flash; SRAM; Peripheral Bridge; calibration EBI

–32-bit internal address bus, 64-bit internal data bus

●Enhanced direct memory access (eDMA) controller

–32 channels support independent 8-bit, 16-bit, or 32-bit single value or block transfers

–Supports variable sized queues and circular queues

–Source and destination address registers are independently configured to postincrement or remain constant

–Each transfer is initiated by a peripheral, CPU, or eDMA channel request

–Each eDMA channel can optionally send an interrupt request to the CPU on completion of a single value or block transfer

●Interrupt controller (INTC)

–191 peripheral interrupt request sources

–8 software setable interrupt request sources

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–9-bit vector

Unique vector for each interrupt request source

Provided by hardware connection to processor or read from register

–Each interrupt source can be programmed to one of 16 priorities

–Preemption

Preemptive prioritized interrupt requests to processor

ISR at a higher priority preempts ISRs or tasks at lower priorities Automatic pushing or popping of preempted priority to or from a LIFO

Ability to modify the ISR or task priority. Modifying the priority can be used to implement the Priority Ceiling Protocol for accessing shared resources.

–Low latency—three clocks from receipt of interrupt request from peripheral to interrupt request to processor

●Frequency Modulating Phase-locked loop (FMPLL)

–Reference clock pre-divider (PREDIV) for finer frequency synthesis resolution

–Reduced frequency divider (RFD) for reducing the FMPLL output clock frequency without forcing the FMPLL to re-lock

–System clock divider (SYSDIV) for reducing the system clock frequency in normal or bypass mode

–Input clock frequency range from 4 MHz to 20 MHz before the pre-divider, and from 4 MHz to 16 MHz at the FMPLL input

–Voltage controlled oscillator (VCO) range from 256 MHz to 512 MHz

–VCO free-running frequency range from 25 MHz to 125 MHz

–Four bypass modes: crystal or external reference with PLL on or off

–Two normal modes: crystal or external reference

–Programmable frequency modulation Triangle wave modulation

–Lock detect circuitry reports when the FMPLL has achieved frequency lock and continuously monitors lock status to report loss of lock conditions

User-selectable ability to generate an interrupt request upon loss of lock User-selectable ability to generate a system reset upon loss of lock

–Clock quality monitor (CQM) module provides loss-of-clock detection for the FMPLL reference and output clocks

User-selectable ability to generate an interrupt request upon loss of clock User-selectable ability to generate a system reset upon loss of clock

Backup clock (reference clock or FMPLL free-running) can be applied to the system in case of loss of clock

●Calibration bus interface (EBI)

–Available only in the calibration package (496 CSP package)

–1.8 V to 3.3 V ± 10% I/O (1.6 V to 3.6 V)

–Memory controller with support for various memory types

–16-bit data bus, up to 22-bit address bus

–Selectable drive strength

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–Configurable bus speed modes

–Bus monitor

–Configurable wait states

●System integration unit (SIU)

–Centralized GPIO control of 80 I/O pins

–Centralized pad control on a per-pin basis Pin function selection

Configurable weak pull-up or pull-down Drive strength

Slew rate Hysteresis

–System reset monitoring and generation

–External interrupt inputs, filtering and control

–Critical Interrupt control

–Non-Maskable Interrupt control

–Internal multiplexer subblock (IMUX)

Allows flexible selection of eQADC trigger inputs (eTPU, eMIOS and external signals)

Allows selection of interrupt requests between external pins and DSPI

●Error correction status module (ECSM)

–Configurable error-correcting codes (ECC) reporting

–Single-bit error correction reporting

●On-chip flash memory

–Up to 1.5 MB flash memory, accessed via a 64-bit wide bus interface

–16 KB shadow block

–Fetch Accelerator

Provide single cycle flash access at 80 MHz Quadruple 128-bit wide prefetch/burst buffers

Prefetch buffers can be configured to prefetch code or data or both

–Censorship protection scheme to prevent flash content visibility

–Flash divided into two independent arrays, allowing reading from one array while erasing/programming the other array (used for EEPROM emulation)

–Memory block:

For SPC563M64: 18 blocks (4 × 16 KB, 2 × 32 KB, 2 × 64 KB, 10 × 128 KB) For SPC563M60P: 14 blocks (4 × 16 KB, 2 × 32 KB, 2 × 64 KB, 6 × 128 KB) For SPC563M54P: 12 blocks (4 × 16 KB, 2 × 32 KB, 2 × 64 KB, 4 × 128 KB)

–Hardware programming state machine

●On-chip static RAM

–For SPC563M64: 94 KB general purpose RAM of which 32 KB are on standby power supply

–For SPC563M60P: 64 KB general purpose RAM of which 32 KB are on standby power supply

–For SPC563M54P: 48 KB general purpose RAM of which 24 KB are on standby

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power supply

●Boot assist module (BAM)

–Enables and manages the transition of MCU from reset to user code execution in the following configurations:

Execution from internal flash memory

Execution from external memory on the calibration bus Download and execution of code via FlexCAN or eSCI

●Periodic interrupt timer (PIT)

–32-bit wide down counter with automatic reload

–Four channels clocked by system clock

–One channel clocked by crystal clock

–Each channel can produce periodic software interrupt

–Each channel can produce periodic triggers for eQADC queue triggering

–One channel out of the five can be used as wake-up timer to wake device from low power stop mode

●System timer module (STM)

–32-bit up counter with 8-bit prescaler

–Clocked from system clock

–Four-channel timer compare hardware

–Each channel can generate a unique interrupt request

–Designed to address AUTOSAR task monitor function

●Software watchdog timer (SWT)

–32-bit timer

–Clock by system clock or crystal clock

–Can generate either system reset or non-maskable interrupt followed by system reset

–Enabled out of reset

●Enhanced modular I/O system (eMIOS)

–16 timer channels (up to 14 channels in LQFP144)

–24-bit timer resolution

–3 selectable time bases plus shared time or angle counter bus from eTPU2

–DMA and interrupt request support

–Motor control capability

●Second-generation enhanced time processor unit (eTPU2)

–Object-code compatible with eTPU—no changes are required to hardware or software if only eTPU features are used

–Intelligent co-processor designed for timing control

–High level tools, assembler and compiler available

–32 channels (each channel has dedicated I/O pin in all packages except LQFP100)

–24-bit timer resolution

–14 KB code memory and 3 KB data memory

–Double match and capture on all channels

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–Angle clock hardware support

–Shared time or angle counter bus with eMIOS

–DMA and interrupt request support

–Nexus Class 1 debug support

–eTPU2 enhancements

Counters and channels can run at full system clock speed Software watchdog

Real-time performance monitor

Instruction set enhancements for smaller more flexible code generation Programmable channel mode for customization of channel operation

●Enhanced queued A/D converter (eQADC)

–Two independent on-chip redundant signed digit (RSD) cyclic ADCs 8-, 10-, and 12-bit resolution

Differential conversions

Targets up to 10-bit accuracy at 500 KSample/s (ADC_CLK = 7.5 MHz) and 8-bit accuracy at 1 MSample/s (ADC_CLK = 15 MHz) for differential conversions

Differential channels include variable gain amplifier (VGA) for improved dynamic range (×1; ×2; ×4)

Differential channels include programmable pull-up and pull-down resistors for biasing and sensor diagnostics (200 kΩ; 100 kΩ; low value of 5 kΩ)

Single-ended signal range from 0 to 5 V

Sample times of 2 (default), 8, 64 or 128 ADC clock cycles Provides time stamp information when requested

Parallel interface to eQADC command FIFOs (CFIFOs) and result FIFOs (RFIFOs)

Supports both right-justified unsigned and signed formats for conversion results Temperature sensor to enable measurement of die temperature

Ability to measure all power supply pins directly

–Automatic application of ADC calibration constants

Provision of reference voltages (25% VREF and 75% VREF) for ADC calibration purposes

–Up to 34(b) input channels available to the two on-chip ADCs

–Four pairs of differential analog input channels

–Full duplex synchronous serial interface to an external device Has a free-running clock for use by the external device Supports a 26-bit message length

Transmits a null message when there are no triggered CFIFOs with commands bound for external CBuffers, or when there are triggered CFIFOs with commands bound for external CBuffers but the external CBuffers are full

–Parallel Side Interface to communicate with an on-chip companion module

–Zero jitter triggering for queue 0. (Queue 0 trigger causes current conversion to be

b. 176-pin and 208-pin packages have 34 input channels; 144-pin package has 32; 100-pin package has 23.

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aborted and the queued conversions in the CBUFFER to be bypassed. Delay from Trigger to start of conversion is 13 system clocks + 1 ADC clock.)

–eQADC Result Streaming. Generation of a continuous stream of ADC conversion results from a single eQADC command word. Controlled by two different trigger signals; one to define the rate at which results are generated and the other to define the beginning and ending of the stream. Used to digitize waveforms during specific time/angle windows, e.g., engine knock sensor sampling.

–Angular Decimation. The ability of the eQADC to sample an analog waveform in the time domain, perform Finite Impulse Response (FIR) or Infinite Impulse Response (IIR) filtering also in the time domain, but to down sample the results in the angle domain. Resulting in a time domain filtered result at a given engine angle.

–Priority Based CFIFOs

Supports six CFIFOs with fixed priority. The lower the CFIFO number, the higher its priority. When commands of distinct CFIFOs are bound for the same CBuffer, the higher priority CFIFO is always served first.

Supports software and several hardware trigger modes to arm a particular CFIFO Generates interrupt when command coherency is not achieved

–External Hardware Triggers

Supports rising edge, falling edge, high level and low level triggers Supports configurable digital filter

–Supports four external 8-to-1 muxes which can expand the input channel number from 34(c) to 59

●Two deserial serial peripheral interface modules (DSPI)

–SPI

Full duplex communication ports with interrupt and DMA request support Support for queues in RAM

6 chip selects, expandable to 64 with external demultiplexers

Programmable frame size, baud rate, clock delay and clock phase on a per frame basis

Modified SPI mode for interfacing to peripherals with longer setup time requirements

LVDS option for output clock and data to allow higher speed communication

–Deserial serial interface (DSI)

Pin reduction by hardware serialization and deserialization of eTPU, eMIOS channels and GPIO

32 bits per DSPI module

Triggered transfer control and change in data transfer control (for reduced EMI) Compatible with Microsecond Channel Version 1.0 downstream

c.176-pin and 208-ball packages.

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●Two enhanced serial communication interface (eSCI) modules

–UART mode provides NRZ format and half or full duplex interface

–eSCI bit rate up to 1 Mbps

–Advanced error detection, and optional parity generation and detection

–Word length programmable as 8, 9, 12 or 13 bits

–Separately enabled transmitter and receiver

–LIN support

–DMA support

–Interrupt request support

–Programmable clock source: system clock or oscillator clock

–Support Microsecond Channel (Timed Serial Bus - TSB) upstream Version 1.0

●Two FlexCAN

–One with 32 message buffers; the second with 64 message buffers

–Full implementation of the CAN protocol specification, Version 2.0B

–Programmable acceptance filters

–Short latency time for high priority transmit messages

–Arbitration scheme according to message ID or message buffer number

–Listen only mode capabilities

–Programmable clock source: system clock or oscillator clock

–Message buffers may be configured as mailboxes or as FIFO

●Nexus port controller (NPC)

–Per IEEE-ISTO 5001-2003

–Real time development support for Power Architecture core and eTPU engine through Nexus class 2/1

–Read and write access (Nexus class 3 feature that is supported on this device) Run-time access of entire memory map

Calibration

–Support for data value breakpoints / watchpoints Run-time access of entire memory map Calibration

Table constants calibrated using MMU and internal and external RAM Scalar constants calibrated using cache line locking

–Configured via the IEEE 1149.1 (JTAG) port

●IEEE 1149.1 JTAG controller (JTAGC)

–IEEE 1149.1-2001 Test Access Port (TAP) interface

–5-bit instruction register that supports IEEE 1149.1-2001 defined instructions

–5-bit instruction register that supports additional public instructions

–Three test data registers: a bypass register, a boundary scan register, and a device identification register

–Censorship disable register. By writing the 64-bit serial boot password to this register, Censorship may be disabled until the next reset

–TAP controller state machine that controls the operation of the data registers, instruction register and associated circuitry

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●On-chip Voltage Regulator for single 5 V supply operation

–On-chip regulator 5 V to 3.3 V for internal supplies

–On-chip regulator controller 5 V to 1.2 V (with external bypass transistor) for core logic

●Low-power modes

–SLOW Mode. Allows device to be run at very low speed (approximately 1 MHz), with modules (including the PLL) selectively disabled in software

–STOP Mode. System clock stopped to all modules including the CPU. Wake-up timer used to restart the system clock after a predetermined time

2.3SPC563Mxx feature details

2.3.1e200z335 core

The e200z335 processor utilizes a four stage pipeline for instruction execution. The Instruction Fetch (stage 1), Instruction Decode/Register file Read/Effective Address Calculation (stage 2), Execute/Memory Access (stage 3), and Register Writeback (stage 4) stages operate in an overlapped fashion, allowing single clock instruction execution for most instructions.

The integer execution unit consists of a 32-bit Arithmetic Unit (AU), a Logic Unit (LU), a 32bit Barrel shifter (Shifter), a Mask-Insertion Unit (MIU), a Condition Register manipulation Unit (CRU), a Count-Leading-Zeros unit (CLZ), a 32×32 Hardware Multiplier array, result feed-forward hardware, and support hardware for division.

Most arithmetic and logical operations are executed in a single cycle with the exception of the divide instructions. A Count-Leading-Zeros unit operates in a single clock cycle. The Instruction Unit contains a PC incrementer and a dedicated Branch Address adder to minimize delays during change of flow operations. Sequential prefetching is performed to ensure a supply of instructions into the execution pipeline. Branch target prefetching is performed to accelerate taken branches. Prefetched instructions are placed into an instruction buffer capable of holding six instructions.

Branches can also be decoded at the instruction buffer and branch target addresses calculated prior to the branch reaching the instruction decode stage, allowing the branch target to be prefetched early. When a branch is detected at the instruction buffer, a prediction may be made on whether the branch is taken or not. If the branch is predicted to be taken, a target fetch is initiated and its target instructions are placed in the instruction buffer following the branch instruction. Many branches take zero cycle to execute by using branch folding. Branches are folded out from the instruction execution pipe whenever possible. These include unconditional branches and conditional branches with condition codes that can be resolved early.

Conditional branches which are not taken and not folded execute in a single clock. Branches with successful target prefetching which are not folded have an effective execution time of one clock. All other taken branches have an execution time of two clocks. Memory load and store operations are provided for byte, halfword, and word (32-bit) data with automatic zero or sign extension of byte and halfword load data as well as optional byte reversal of data. These instructions can be pipelined to allow effective single cycle throughput. Load and store multiple word instructions allow low overhead context save and restore operations. The load/store unit contains a dedicated effective address adder to allow effective address

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generation to be optimized. Also, a load-to-use dependency does not incur any pipeline bubbles for most cases.

The Condition Register unit supports the condition register (CR) and condition register operations defined by the Power Architecture. The condition register consists of eight 4-bit fields that reflect the results of certain operations, such as move, integer and floating-point compare, arithmetic, and logical instructions, and provide a mechanism for testing and branching. Vectored and autovectored interrupts are supported by the CPU. Vectored interrupt support is provided to allow multiple interrupt sources to have unique interrupt handlers invoked with no software overhead.

The hardware floating-point unit utilizes the IEEE-754 single-precision floating-point format and supports single-precision floating-point operations in a pipelined fashion. The general purpose register file is used for source and destination operands, thus there is a unified storage model for single-precision floating-point data types of 32 bits and the normal integer type. Single-cycle floating-point add, subtract, multiply, compare, and conversion operations are provided. Divide instructions are multi-cycle and are not pipelined.

The Signal Processing Extension (SPE) Auxiliary Processing Unit (APU) provides hardware SIMD operations and supports a full complement of dual integer arithmetic operation including Multiply Accumulate (MAC) and dual integer multiply (MUL) in a pipelined fashion. The general purpose register file is enhanced such that all 32 of the GPRs are extended to 64 bits wide and are used for source and destination operands, thus there is a unified storage model for 32×32 MAC operations which generate greater than 32-bit results.

The majority of both scalar and vector operations (including MAC and MUL) are executed in a single clock cycle. Both scalar and vector divides take multiple clocks. The SPE APU also provides extended load and store operations to support the transfer of data to and from the extended 64-bit GPRs.

The CPU includes support for Variable Length Encoding (VLE) instruction enhancements. This enables the classic Power Architecture instruction set to be represented by a modified instruction set made up from a mixture of 16and 32-bit instructions. This results in a significantly smaller code size footprint without noticeably affecting performance. The Power Architecture instruction set and VLE instruction set are available concurrently. Regions of the memory map are designated as PPC or VLE using an additional configuration bit in each of Table Look-aside Buffers (TLB) entries in the MMU.

The CPU core is enhanced by the addition of two additional interrupt sources; NonMaskable Interrupt and Critical Interrupt. These two sources are routed directly from package pins, via edge detection logic in the SIU to the CPU, bypassing completely the Interrupt Controller. Once the edge detection logic is programmed, it cannot be disabled, except by reset. The non-maskable Interrupt is, as the name suggests, completely unmaskable and when asserted will always result in the immediate execution of the respective interrupt service routine. The non-maskable interrupt is not guaranteed to be recoverable. The Critical Interrupt is very similar to the non-maskable interrupt, but it can be masked by other exceptional interrupts in the CPU and is guaranteed to be recoverable (code execution may be resumed from where it stopped).

The CPU core has an additional ‘Wait for Interrupt’ instruction that is used in conjunction with low power STOP mode. When Low Power Stop mode is selected, this instruction is executed to allow the system clock to be stopped. An external interrupt source or the system wake-up timer is used to restart the system clock and allow the CPU to service the interrupt.

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2.3.2Crossbar

The XBAR multi-port crossbar switch supports simultaneous connections between three master ports and four slave ports. The crossbar supports a 32-bit address bus width and a 64-bit data bus width.

The crossbar allows three concurrent transactions to occur from the master ports to any slave port; but each master must access a different slave. If a slave port is simultaneously requested by more than one master port, arbitration logic selects the higher priority master and grants it ownership of the slave port. All other masters requesting that slave port are stalled until the higher priority master completes its transactions. Requesting masters are treated with equal priority and are granted access to a slave port in round-robin fashion, based upon the ID of the last master to be granted access. The crossbar provides the following features:

●3 master ports:

–e200z335 core complex Instruction port

–e200z335 core complex Load/Store port

–eDMA

●4 slave ports

–FLASH

–calibration bus

–SRAM

–Peripheral bridge A/B (eTPU2, eMIOS, SIU, DSPI, eSCI, FlexCAN, eQADC, BAM, decimation filter, PIT, STM and SWT)

●32-bit internal address, 64-bit internal data paths

2.3.3eDMA

The enhanced direct memory access (eDMA) controller is a second-generation module capable of performing complex data movements via 32 programmable channels, with minimal intervention from the host processor. The hardware micro architecture includes a DMA engine which performs source and destination address calculations, and the actual data movement operations, along with an SRAM-based memory containing the transfer control descriptors (TCD) for the channels. This implementation is utilized to minimize the overall block size. The eDMA module provides the following features:

●All data movement via dual-address transfers: read from source, write to destination

●Programmable source and destination addresses, transfer size, plus support for enhanced addressing modes

●Transfer control descriptor organized to support two-deep, nested transfer operations

●An inner data transfer loop defined by a “minor” byte transfer count

●An outer data transfer loop defined by a “major” iteration count

●Channel activation via one of three methods:

–Explicit software initiation

–Initiation via a channel-to-channel linking mechanism for continuous transfers

–Peripheral-paced hardware requests (one per channel)

●Support for fixed-priority and round-robin channel arbitration

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●Channel completion reported via optional interrupt requests

●1 interrupt per channel, optionally asserted at completion of major iteration count

●Error termination interrupts are optionally enabled

●Support for scatter/gather DMA processing

●Channel transfers can be suspended by a higher priority channel

2.3.4Interrupt controller

The INTC (interrupt controller) provides priority-based preemptive scheduling of interrupt requests, suitable for statically scheduled hard real-time systems. The INTC allows interrupt request servicing from up to 191 peripheral interrupt request sources, plus 165 sources reserved for compatibility with other family members).

For high priority interrupt requests, the time from the assertion of the interrupt request from the peripheral to when the processor is executing the interrupt service routine (ISR) has been minimized. The INTC provides a unique vector for each interrupt request source for quick determination of which ISR needs to be executed. It also provides an ample number of priorities so that lower priority ISRs do not delay the execution of higher priority ISRs. To allow the appropriate priorities for each source of interrupt request, the priority of each interrupt request is software configurable.

When multiple tasks share a resource, coherent accesses to that resource need to be supported. The INTC supports the priority ceiling protocol for coherent accesses. By providing a modifiable priority mask, the priority can be raised temporarily so that all tasks which share the resource can not preempt each other.

Multiple processors can assert interrupt requests to each other through software setable interrupt requests. These same software setable interrupt requests also can be used to break the work involved in servicing an interrupt request into a high priority portion and a low priority portion. The high priority portion is initiated by a peripheral interrupt request, but then the ISR asserts a software setable interrupt request to finish the servicing in a lower priority ISR. Therefore these software setable interrupt requests can be used instead of the peripheral ISR scheduling a task through the RTOS.

The INTC provides the following features:

●356 peripheral interrupt request sources

●8 software setable interrupt request sources

●9-bit vector addresses

●Unique vector for each interrupt request source

●Hardware connection to processor or read from register

●Each interrupt source can be programmed to one of 16 priorities

●Preemptive prioritized interrupt requests to processor

●ISR at a higher priority preempts executing ISRs or tasks at lower priorities

●Automatic pushing or popping of preempted priority to or from a LIFO

●Ability to modify the ISR or task priority to implement the priority ceiling protocol for accessing shared resources

●Low latency—three clocks from receipt of interrupt request from peripheral to interrupt request to processor

This device also includes a non-maskable interrupt (NMI) pin that bypasses the INTC and multiplexing logic.

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2.3.5FMPLL

The FMPLL allows the user to generate high speed system clocks from a 4 MHz to 20 MHz crystal oscillator or external clock generator. Further, the FMPLL supports programmable frequency modulation of the system clock. The PLL multiplication factor, output clock divider ratio are all software configurable. The PLL has the following major features:

●Input clock frequency from 4 MHz to 20 MHz

●Voltage controlled oscillator (VCO) range from 256 MHz to 512 MHz, resulting in system clock frequencies from 16 MHz to 80 MHz with granularity of 4 MHz or better

●Reduced frequency divider (RFD) for reduced frequency operation without forcing the PLL to relock

●3 modes of operation

–Bypass mode with PLL off

–Bypass mode with PLL running (default mode out of reset)

–PLL normal mode

●Each of the three modes may be run with a crystal oscillator or an external clock reference

●Programmable frequency modulation

–Modulation enabled/disabled through software

–Triangle wave modulation up to 100 kHz modulation frequency

–Programmable modulation depth (0% to 2% modulation depth)

–Programmable modulation frequency dependent on reference frequency

●Lock detect circuitry reports when the PLL has achieved frequency lock and continuously monitors lock status to report loss of lock conditions

●Clock Quality Module

–detects the quality of the crystal clock and cause interrupt request or system reset if error is detected

–detects the quality of the PLL output clock. If an error is detected, causes a system reset or switches the system clock to the crystal clock and causes an interrupt request

●Programmable interrupt request or system reset on loss of lock

2.3.6Calibration EBI

The Calibration EBI controls data transfer across the crossbar switch to/from memories or peripherals attached to the calibration tool connector in the calibration address space. The Calibration EBI is only available in the calibration tool. The Calibration EBI includes a memory controller that generates interface signals to support a variety of external memories. The Calibration EBI memory controller supports legacy flash, SRAM, and asynchronous memories. In addition, the calibration EBI supports up to three regions via chip selects (two chip selects are multiplexed with two address bits), along with programmed region-specific attributes. The calibration EBI supports the following features:

●22-bit address bus (two most significant signals multiplexed with two chip selects)

●16-bit data bus

●Multiplexed mode with addresses and data signals present on the data lines

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Note:	The calibration EBI must be configured in multiplexed mode when the extended Nexus trace
	is used on the calibration tool. This is because Nexus signals and address lines of the
	calibration bus share the same balls in the calibration package.

●Memory controller with support for various memory types:

–Asynchronous/legacy flash and SRAM

●Bus monitor

–User selectable

–Programmable timeout period (with 8 external bus clock resolution)

●Configurable wait states (via chip selects)

●3 chip-select (Cal_CS[0], Cal_CS[2:3]) signals (Multiplexed with 2 most significant address signals)

●2 write/byte enable (WE[0:1]/BE[0:1]) signals

●Configurable bus speed modes

–system frequency

–1/2 of system frequency

–1/4 of system frequency

●Optional automatic CLKOUT gating to save power and reduce EMI

●Selectable drive strengths; 10 pF, 20 pF, 30 pF, 50 pF

2.3.7SIU

The SPC563Mxx SIU controls MCU reset configuration, pad configuration, external interrupt, general purpose I/O (GPIO), internal peripheral multiplexing, and the system reset operation. The reset configuration block contains the external pin boot configuration logic. The pad configuration block controls the static electrical characteristics of I/O pins. The GPIO block provides uniform and discrete input/output control of the I/O pins of the MCU. The reset controller performs reset monitoring of internal and external reset sources, and drives the RSTOUT pin. Communication between the SIU and the e200z335 CPU core is via the crossbar switch. The SIU provides the following features:

●System configuration

–MCU reset configuration via external pins

–Pad configuration control for each pad

–Pad configuration control for virtual I/O via DSPI serialization

●System reset monitoring and generation

–Power-on reset support

–Reset status register provides last reset source to software

–Glitch detection on reset input

–Software controlled reset assertion

●External interrupt

–11 interrupt requests

–Rising or falling edge event detection

–Programmable digital filter for glitch rejection

–Critical Interrupt request

–Non-Maskable Interrupt request

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●GPIO

–GPIO function on 80 I/O pins

–Virtual GPIO on 64 I/O pins via DSPI serialization (requires external deserialization device)

–Dedicated input and output registers for setting each GPIO and Virtual GPIO pin

●Internal multiplexing

–Allows serial and parallel chaining of DSPIs

–Allows flexible selection of eQADC trigger inputs

–Allows selection of interrupt requests between external pins and DSPI

2.3.8ECSM

The error correction status module provides status information regarding platform memory errors reported by error-correcting codes.

2.3.9Flash

Devices in the SPC563Mxx family provide up to 1.5 MB of programmable, non-volatile, flash memory. The non-volatile memory (NVM) can be used for instruction and/or data storage. The flash module includes a Fetch Accelerator, that optimizes the performance of the flash array to match the CPU architecture and provides single cycle random access to the flash @ 80 MHz. The flash module interfaces the system bus to a dedicated flash memory array controller. For CPU ‘loads’, DMA transfers and CPU instruction fetch, it supports a 64-bit data bus width at the system bus port, and a 128-bit read data interface to flash memory. The module contains a four-entry, 128-bit prefetch buffer and a prefetch controller which prefetches sequential lines of data from the flash array into the buffer. Prefetch buffer hits allow no-wait responses. Normal flash array accesses are registered and are forwarded to the system bus on the following cycle, incurring three wait-states. Prefetch operations may be automatically controlled, and are restricted to instruction fetch.

The flash memory provides the following features:

●Supports a 64-bit data bus for instruction fetch, CPU loads and DMA access. Byte, halfword, word and doubleword reads are supported. Only aligned word and doubleword writes are supported.

●Fetch Accelerator

–Architected to optimize the performance of the flash with the CPU to provide single cycle random access to the flash up to 80 MHz system clock speed

–Configurable read buffering and line prefetch support

–Four line read buffers (128 bits wide) and a prefetch controller

●Hardware and software configurable read and write access protections on a per-master basis

●Interface to the flash array controller is pipelined with a depth of one, allowing overlapped accesses to proceed in parallel for interleaved or pipelined flash array designs

●Configurable access timing allowing use in a wide range of system frequencies

●Multiple-mapping support and mapping-based block access timing (0-31 additional cycles) allowing use for emulation of other memory types

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●Software programmable block program/erase restriction control

●Erase of selected block(s)

●Read page size of 128 bits (four words)

●ECC with single-bit correction, double-bit detection

●Program page size of 64 bits (two words)

●ECC single-bit error corrections are visible to software

●Minimum program size is two consecutive 32-bit words, aligned on a 0-modulo-8 byte address, due to ECC

●Embedded hardware program and erase algorithm

●Erase suspend

●Shadow information stored in non-volatile shadow block

●Independent program/erase of the shadow block

2.3.10SRAM

The SPC563Mxx SRAM module provides a general-purpose up to 94 KB memory block. The SRAM controller includes these features:

●Supports read/write accesses mapped to the SRAM memory from any master

●32 KB or 24 KB block powered by separate supply for standby operation

●Byte, halfword, word and doubleword addressable

●ECC performs single-bit correction, double-bit detection on 32-bit data element

2.3.11BAM

The BAM (Boot Assist Module) is a block of read-only memory that is programmed once by ST and is identical for all SPC563Mxx MCUs. The BAM program is executed every time the MCU is powered-on or reset in normal mode. The BAM supports different modes of booting. They are:

●Booting from internal flash memory

●Serial boot loading (A program is downloaded into RAM via eSCI or the FlexCAN and then executed)

●Booting from external memory on calibration bus

The BAM also reads the reset configuration half word (RCHW) from internal flash memory and configures the SPC563Mxx hardware accordingly. The BAM provides the following features:

●Sets up MMU to cover all resources and mapping all physical address to logical addresses with minimum address translation

●Sets up the MMU to allow user boot code to execute as either Power Architecture code (default) or as VLE code

●Detection of user boot code

●Automatic switch to serial boot mode if internal flash is blank or invalid

●Supports user programmable 64-bit password protection for serial boot mode

●Supports serial bootloading via FlexCAN bus and eSCI using fixed baudrate protocol

●Supports serial bootloading via FlexCAN bus and eSCI with auto baud rate sensing

●Supports serial bootloading of either Power Architecture code (default) or VLE code

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●Supports booting from calibration bus interface

●Supports censorship protection for internal flash memory

●Provides an option to enable the core watchdog timer

●Provides an option to disable the software watchdog timer

2.3.12eMIOS

The eMIOS (Enhanced Modular Input Output System) module provides the functionality to generate or measuretime events. The channels on this module provide a range of operating modes including the capability to perform dual input capture or dual output compare as well as PWM output.

The eMIOS provides the following features:

●16 channels (24-bit timer resolution)

●For compatibility with other family members selected channels and timebases are implemented:

–Channels 0 to 6, 8 to 15, and 23

–Timebases A, B and C

●Channels 1, 3, 5 and 6 support modes:

–General Purpose Input/Output (GPIO)

–Single Action Input Capture (SAIC)

–Single Action Output Compare (SAOC)

●Channels 2, 4, 11 and 13 support all the modes above plus:

–Output Pulse Width Modulation Buffered (OPWMB)

●Channels 0, 8, 9, 10, 12, 14, 15, 23 support all the modes above plus:

–Input Period Measurement (IPM)

–Input Pulse Width Measurement (IPWM)

–Double Action Output Compare (set flag on both matches) (DAOC)

–Modulus Counter Buffered (MCB)

–Output Pulse Width and Frequency Modulation Buffered (OPWFMB)

●Three 24-bit wide counter buses

–Counter bus A can be driven by channel 23 or by the eTPU2 and all channels can use it as a reference

–Counter bus B is driven by channel 0 and channels 0 to 6 can use it as a reference

–Counter bus C is driven by channel 8 and channels 8 to 15 can use it as a reference

●Shared time bases with the eTPU2 through the counter buses

●Synchronization among internal and external time bases

2.3.13eTPU2

The eTPU2 is an enhanced co-processor designed for timing control. Operating in parallel with the host CPU, eTPU2 processes instructions and real-time input events, performs output waveform generation, and accesses shared data without host intervention. Consequently, for each timer event, the host CPU setup and service times are minimized or eliminated. A powerful timer subsystem is formed by combining the eTPU2 with its own

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instruction and data RAM. High-level assembler/compiler and documentation allows customers to develop their own functions on the eTPU2.

The eTPU2 includes these distinctive features:

●The Timer Counter (TCR1), channel logic and digital filters (both channel and the external timer clock input [TCRCLK]) now have an option to run at full system clock speed or system clock / 2.

●Channels support unordered transitions: transition 2 can now be detected before transition 1. Related to this enhancement, the transition detection latches (TDL1 and TDL2) can now be independently negated by microcode.

●A new User Programmable Channel Mode has been added: the blocking, enabling, service request and capture characteristics of this channel mode can be programmed via microcode.

●Microinstructions now provide an option to issue Interrupt and Data Transfer requests selected by channel. They can also be requested simultaneously at the same instruction.

●Channel Flags 0 and 1 can now be tested for branching, in addition to selecting the entry point.

●Channel digital filters can be bypassed.

●The Timer Counter (TCR1), channel logic and digital filters (both channel and the external timer clock input [TCRCLK]) now have an option to run at full system clock speed or system clock / 2.

●A new User Programmable Channel Mode has been added: the blocking, enabling, service request and capture characteristics of this channel mode can be programmed via microcode.

●Microinstructions now provide an option to issue Interrupt and Data Transfer requests selected by channel. They can also be requested simultaneously at the same instruction.

●Channel Flags 0 and 1 can now be tested for branching, in addition to selecting the entry point.

●Channel digital filters can be bypassed.

●32 channels, each channel is associated with one input and one output signal

–Enhanced input digital filters on the input pins for improved noise immunity.

–Identical, orthogonal channels: each channel can perform any time function. Each time function can be assigned to more than one channel at a given time, so each signal can have any functionality.

–Each channel has an event mechanism which supports single and double action functionality in various combinations. It includes two 24-bit capture registers, two 24-bit match registers, 24-bit greater-equal and equal-only comparators

–Input and output signal states visible from the host

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●2 independent 24-bit time bases for channel synchronization:

–First time base clocked by system clock with programmable prescale division from 2 to 512 (in steps of 2), or by output of second time base prescaler

–Second time base counter can work as a continuous angle counter, enabling angle based applications to match angle instead of time

–Both time bases can be exported to the eMIOS timer module

–Both time bases visible from the host

●Event-triggered microengine:

–Fixed-length instruction execution in two-system-clock microcycle

–14 KB of code memory (SCM)

–3 KB of parameter (data) RAM (SPRAM)

–Parallel execution of data memory, ALU, channel control and flow control subinstructions in selected combinations

–32-bit microengine registers and 24-bit wide ALU, with 1 microcycle addition and subtraction, absolute value, bitwise logical operations on 24-bit, 16-bit, or byte operands, single-bit manipulation, shift operations, sign extension and conditional execution

–Additional 24-bit Multiply/MAC/Divide unit which supports all signed/unsigned Multiply/MAC combinations, and unsigned 24-bit divide. The MAC/Divide unit works in parallel with the regular microcode commands

●Resource sharing features support channel use of common channel registers, memory and microengine time:

–Hardware scheduler works as a “task management” unit, dispatching event service routines by predefined, host-configured priority

–Automatic channel context switch when a “task switch” occurs, i.e., one function thread ends and another begins to service a request from other channel: channelspecific registers, flags and parameter base address are automatically loaded for the next serviced channel

–SPRAM shared between host CPU and eTPU2, supporting communication either between channels and host or inter-channel

–Dual-parameter coherency hardware support allows atomic access to two parameters by host

●Test and development support features:

–Nexus Class 1 debug, supporting single-step execution, arbitrary microinstruction execution, hardware breakpoints and watchpoints on several conditions

–Software breakpoints

–SCM continuous signature-check built-in self test (MISC — multiple input signature calculator), runs concurrently with eTPU2 normal operation

●System enhancements

–Software watchdog with programmable timeout

–Real-time performance information

●Channel enhancements

–Channels 1 and 2 can optionally drive angle clock hardware

●Programming enhancements

–Engine relative addressing mode

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