DYNEX MP02HBN130-16, MP02HBN130-18, MP02HBN130-20, MP02HBT130-20, MP02HBT130-18 Datasheet

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DYNEX MP02HBN130-16, MP02HBN130-18, MP02HBN130-20, MP02HBT130-20, MP02HBT130-18 Datasheet

MP02X130 Series

MP02X130 Series

Phase Control Dual SCR, SCR/Diode Modules

Replaces January 2000 version, DS4477-4.0 DS4477-5.0 August 2001

FEATURES

KEY PARAMETERS

■ Dual Device Module

VDRM

2000V

■ Electrically Isolated Package

ITSM

4000A

■ Pressure Contact Construction

IT(AV)(per arm)

134A

 

■ International Standard Footprint

Visol

3000V

 

■ Alumina (non-toxic) Isolation Medium

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Code

 

 

Circuit

APPLICATIONS

 

 

 

 

 

 

 

 

HBT

 

 

 

 

 

 

 

■ Motor Control

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

■ Controlled Rectifier Bridges

 

 

 

 

 

 

 

 

HBP

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

■ Heater Control

 

 

 

 

 

 

 

 

HBN

 

 

 

 

 

 

 

■ AC Phase Control

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Fig.1 Circuit diagrams

VOLTAGE RATINGS

Type

Repetitive

Conditions

Number

Peak

 

 

Voltages

 

 

VDRM VRRM

 

MP02X130-20

2000

Tvj = 125oC

MP02X130-18

1800

IDRM = IRRM = 30mA

MP02X130-16

1600

VDSM & VRSM =

VDRM & VRRM + 100V

 

 

 

 

respectively

 

 

 

Lower voltage grades available.

 

ORDERING INFORMATION

Order As:

MP02HBT130-20 or MP02HBT130-18 or MP02HBT130-16 MP02HBP130-20 or MP02HBP130-18 or MP02HBP130-16 MP02HBN130-20 or MP02HBN130-18 or MP02HBN130-16

Note: When ordering, please use the complete part number.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

2

3

 

 

 

Module type code: MP02.

For further information see Package Details.

Fig. 2 Electrical connections - (not to scale)

1/8

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MP02X130 Series

ABSOLUTE MAXIMUM RATINGS - PER ARM

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.

Symbol

Parameter

Test Conditions

Max.

Units

 

 

 

 

 

 

 

 

IT(AV)

Mean on-state current

Half wave resistive load

 

 

Tcase = 75˚C

134

A

 

 

 

 

 

Tcase = 85˚C

112

A

 

 

 

 

 

 

 

 

IT(RMS

RMS value

Tcase = 75˚C

 

 

 

210

A

ITSM

Surge (non-repetitive) on-current

10ms half sine, Tj = 125˚C

4.0

kA

I2t

I2t for fusing

 

 

VR = 0

80 x 103

A2s

 

 

 

 

 

 

ITSM

Surge (non-repetitive) on-current

10ms half sine, Tj = 125˚C

3.2

kA

I2t

I2t for fusing

V

R

= 50% V

51.2 x 103

A2s

 

 

 

DRM

 

 

 

 

 

 

 

 

Visol

Isolation voltage

Commoned terminals to base plate.

3000

V

 

 

AC RMS, 1 min, 50Hz

 

 

 

 

 

 

 

 

 

 

 

 

 

THERMAL AND MECHANICAL RATINGS

Symbol

Parameter

Test Conditions

Min.

Max.

Units

 

 

 

 

 

 

Rth(j-c)

Thermal resistance - junction to case

dc

-

0.21

˚C/kW

 

(per thyristor or diode)

Half wave

-

0.22

˚C/kW

 

 

 

 

 

 

 

 

3 Phase

-

0.23

˚C/kW

 

 

 

 

 

 

Rth(c-hs)

Thermal resistance - case to heatsink

Mounting torque = 5Nm

-

0.07

˚C/kW

 

(per thyristor or diode)

with mounting compound

 

 

 

 

 

 

 

 

 

Tvj

Virtual junction temperature

Reverse (blocking)

-

125

˚C

Tstg

Storage temperature range

-

–40

125

˚C

-

Screw torque

Mounting - M6

-

6 (55)

Nm (lb.ins)

 

 

 

 

 

 

 

 

Electrical connections - M6

-

5 (44)

Nm (lb.ins)

 

 

 

 

 

 

-

Weight (nominal)

-

-

350

g

 

 

 

 

 

 

2/8

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MP02X130 Series

DYNAMIC CHARACTERISTICS - THYRISTOR

Symbol

Parameter

Test Conditions

Min.

Max.

Units

 

 

 

 

 

 

 

IRRM/IDRM

Peak reverse and off-state current

At VRRM/VDRM, Tj = 125˚C

 

-

30

mA

dV/dt

Linear rate of rise of off-state voltage

To 67% VDRM, Tj = 125˚C

 

-

1000

V/µ

s

 

 

 

 

 

 

 

 

dI/dt

Rate of rise of on-state current

From 67% VDRM to 400A,

Repetitive 50Hz

-

500

A/µ

s

 

 

gate source 20V, 20Ω ,

 

 

 

 

 

 

 

tr = 0.5µ s, Tj = 125˚C

 

 

 

 

 

 

 

 

 

 

 

 

 

VT(TO)

Threshold voltage

At Tvj = 125˚C. See note 1

 

-

1.25

V

 

rT

On-state slope resistance

At Tvj = 125˚C. See note 1

 

-

1.33

mΩ

 

Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor.

GATE TRIGGER CHARACTERISTICS AND RATINGS

Symbol

Parameter

 

 

 

Test Conditions

Max.

Units

 

 

 

 

 

 

 

 

 

 

V

GT

Gate trigger voltage

V

= 5V, T

case

= 25oC

3.0

V

 

 

 

DRM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

GT

Gate trigger current

V

= 5V, T

case

= 25oC

200

mA

 

 

DRM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

V

GD

Gate non-trigger voltage

V

= 5V, T

case

= 25oC

0.2

V

 

 

 

DRM

 

 

 

 

 

 

 

 

 

 

VFGM

Peak forward gate voltage

Anode positive with respect to cathode

30

V

VFGN

Peak forward gate voltage

Anode negative with respect to cathode

0.25

V

VRGM

Peak reverse gate voltage

 

 

 

 

-

5

V

IFGM

Peak forward gate current

Anode positive with respect to cathode

4

A

PGM

Peak gate power

See table fig. 5

 

16

W

PG(AV)

Mean gate power

 

 

 

 

-

3

W

3/8

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