DYNEX MP03-260-10, MP03-260-12, MP03-260-14, MP03-260-16 Datasheet

0 (0)
DYNEX MP03-260-10, MP03-260-12, MP03-260-14, MP03-260-16 Datasheet

MP03 XX 260 Series

MP03 XX 260 Series

Dual Diode Modules

Replaces December 1998 version, DS5104-2.0

DS5104-3.0 January 2000

FEATURES

Dual Device Module

Electrically Isolated Package

Pressure Contact Construction

International Standard Footprint

Alumina (non-toxic) Isolation Medium

APPLICATIONS

Rectifier Bridges

DC Power Bridges

Plating Rectifiers

Traction Systems

VOLTAGE RATINGS

Type

Repetitive

Conditions

Number

Peak

 

 

 

 

Voltages

 

 

 

 

VRRM

 

 

 

MP03/260-16

1600

T = 150oC

 

 

 

 

MP03/260-14

1400

vj

 

 

IRM = 30mA

 

MP03/260-12

1200

 

VRSM

= VRRM

+ 100V

MP03/260-10

1000

 

 

 

Lower voltage grades available. For full description of part numbers see "Ordering instructions" on page 3.

 

KEY PARAMETERS

VRRM

 

1600V

IFSM

 

8100A

IF(AV) (per arm)

267A

Visol

 

2500V

 

CIRCUIT OPTIONS

Code

Circuit

 

HB

 

 

G

GN

PACKAGE OUTLINE

Module outline type code: MP03.

See Package Details for further information.

CURRENT RATINGS - PER ARM

Symbol

Parameter

Conditions

 

Max.

Units

 

 

 

 

 

 

 

 

 

Tcase = 75oC

267

A

 

 

 

 

 

 

IF(AV)

Mean forward current

Halfwave, resistive load

Tcase = 85oC

240

A

 

 

 

 

T

= 75oC

235

A

 

 

 

heatsink

 

 

 

 

 

 

 

 

 

 

 

 

Theatsink = 85oC

211

A

 

 

 

 

 

 

 

I

RMS value

T = 75oC

 

420

A

F(RMS)

 

case

 

 

 

 

 

 

 

 

 

 

1/9

MP03 XX 260 Series

SURGE RATINGS - PER ARM

Symbol

Parameter

 

Conditions

 

Max.

Units

 

 

 

 

 

 

 

 

IFSM

Surge (non-repetitive) forward current

10ms half sine;

VR = 0

 

8100

A

 

 

 

 

 

 

 

 

 

 

 

 

Tj

= 150˚C

V

= 50% V

RRM

6500

A

 

 

 

 

R

 

 

 

 

 

 

 

V

= 0

 

328000

A2s

 

I2t for fusing

10ms half sine;

R

 

 

 

 

I2t

 

 

 

 

 

 

 

 

 

 

 

 

Tj

= 150˚C

V

= 50% V

RRM

211000

A2s

 

 

 

 

R

 

 

 

THERMAL & MECHANICAL RATINGS

Symbol

Parameter

Conditions

Max.

Units

 

 

 

 

 

 

 

dc

0.21

oC/W

 

Thermal resistance - junction to case

 

 

 

Rth(j-c)

halfwave

0.22

oC/W

 

per Diode

 

 

 

 

3 phase

0.23

oC/W

 

 

 

 

 

 

 

R

Thermal resistance - case to heatsink

Mounting torque = 5Nm

0.05

oC/W

per Diode

with mounting compound

th(c-hs)

 

 

 

 

 

 

 

 

 

 

 

T

Virtual junction temperature

 

150

oC

vj

 

 

 

 

T

Storage temperature range

 

-40 to 150

oC

sto

 

 

 

 

Visol

Isolation voltage

Commoned terminals to base plate

2.5

kV

AC RMS, 1min, 50Hz

 

 

 

 

 

 

 

 

 

CHARACTERISTICS

Symbol

Parameter

 

 

 

Conditions

Max.

Units

 

 

 

 

 

 

 

V

Forward voltage

At 600A, T

case

= 25oC

1.3

V

 

FM

 

 

 

 

 

 

I

RM

Peak reverse current

At V

, T

= 150oC

30

mA

 

 

RRM

j

 

 

 

 

VTO

Threshold voltage

At Tvj = 150oC

 

0.84

V

rT

On-state slope resistance

At Tvj = 150oC

 

0.667

mΩ

2/9

MP03 XX 260 Series

ORDERING INSTRUCTIONS

Part number is made up as follows:

 

MP03 HB 260 - 16

MP

= Pressure contact module

03

= Outline type

HB

= Circuit configuration code (see "circuit options" - front page)

260

= Nominal average current rating at T = 75oC

 

case

16

= VRRM/100

Examples:

MP03 HB260-10

MP03 G260-14 MP023GN260-12

Note: Preferred type is HB configuration. G & GN types are available for specific applications, only when requested.

MOUNTING RECOMMENDATIONS

Adequate heatsinking is required to maintain the base temperature at 75oC if full rated current is to be achieved. Power dissipation may be calculated by use of VTO and rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required.

The heatsink surface must be smooth and flat; a surface finish of N6 (32μin) and a flatness within 0.05mm (0.002") are recommended.

Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain.

An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance.

After application of thermal compound, place the module squarely over the mounting holes, (or 'T' slots) in the heatsink. Using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 5Nm (44lb.ins) is reached at both ends.

It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module.

3/9

Loading...
+ 6 hidden pages