DYNEX MP04TT600-16, MP04TT600-17, MP04TT600-18, MP04TT600-15 Datasheet

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DYNEX MP04TT600-16, MP04TT600-17, MP04TT600-18, MP04TT600-15 Datasheet

MP04TT600

MP04TT600

Dual Thyristor Water Cooled Module

Preliminary Information

DS5466-1.1 June 2001

FEATURES

Dual Device Module

Electrically Isolated Package

Pressure Contact Construction

International Standard Footprint

Alumina (Non Toxic) Isolation Medium

Integral Water Cooled Heatsink

APPLICATIONS

Motor Control

Controlled Rectifier Bridges

Heater Control

AC Phase Control

VOLTAGE RATINGS

Type Number

Repetitive Peak

Conditions

 

Voltages

 

 

VDRM VRRM

 

 

V

 

MP04TT600-18

1800

Tvj = 0˚ to 125˚C,

MP04TT600-17

1700

IDRM = IRRM = 50mA

MP04TT600-16

1600

VDSM = VRSM =

MP04TT600-15

1500

 

 

VDRM = VRRM + 100V

 

 

respectively

 

 

 

Lower voltage grades available

 

ORDERING INFORMATION

Order As:

 

 

 

MP04TT600-XX-W2

1/4 - 18

NPT connection

MP04TT600-XX-W3

1/4 - 18

NPT

connection

MP04TT600-XX-W3A

1/4 - 18

NPT

water connection

 

thread

 

 

XX shown in the part number about represents VDRM/100 selection required, eg. MP04TT600-27-W2

Note: When ordering, please use the complete part number.

KEY PARAMETERS

 

VDRM

1800V

IT(AV)

580A

ITSM(per arm)

14000A

IT(RMS)

912A

Visol

3000V

5 (G1)

4 (K1)

 

 

3 (A)

1 (AK)

6 (G2)

7 (K2)

2 (A)

 

Fig. 1 TT Circuit diagram

Module outline type code:

Module outline type code:

MP04-W3

MP04-W3A

Module outline type code: MP04-W2 (See Package Details for further information)

Fig. 2 Module package variants - (not to scale)

1/8

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MP04TT600

ABSOLUTE MAXIMUM RATINGS - PER ARM

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.

Symbol

Parameter

Test Conditions

 

Max.

Units

 

 

 

 

 

 

 

 

IT(AV)

Mean on-state current

Half wave resistive load,

 

 

Twater (in) = 25˚C

650

A

 

 

4.5 Ltr/min

 

 

Twater (in) = 40˚C

580

A

IT(RMS

RMS value

Twater (in) = 25˚C @ 4.5 Ltr/min

 

1020

A

 

 

Twater (in) = 40˚C @ 4.5 Ltr/min

 

912

A

 

 

 

 

 

 

ITSM

Surge (non-repetitive) on-current

10ms half sine, Tj = 125˚C

 

14

kA

I2t

I2t for fusing

 

 

VR = 0

 

0.975x106

A2s

 

 

 

 

 

 

ITSM

Surge (non-repetitive) on-current

10ms half sine, Tj = 125˚C

 

11.2

kA

I2t

I2t for fusing

V

R

= 50% V

 

0.625x106

A2s

 

 

 

DRM

 

 

 

 

 

 

 

 

 

Visol

Isolation voltage

Commoned terminals to base plate.

 

3000

V

 

 

AC RMS, 1 min, 50Hz

 

 

 

 

 

 

 

 

 

 

 

 

 

THERMAL AND MECHANICAL RATINGS

Symbol

Parameter

Test Conditions

Min.

Max.

Units

 

 

 

 

 

 

Rth(j-w)

Thermal resistance - junction to water

dc, 4.5 Ltr/min

-

0.102

˚C/kW

 

(per thyristor)

Half wave, 4.5 Ltr/min

-

0.106

˚C/kW

 

 

 

 

 

 

 

 

3 Phase, 4.5 Ltr/min

-

0.112

˚C/kW

 

 

 

 

 

 

Tvj

Virtual junction temperature

Reverse (blocking)

-

125

˚C

Tstg

Storage temperature range

-

–40

125

˚C

-

Screw torque

Mounting - M6

6(53)

-

Nm (lb.ins)

 

 

 

 

 

 

 

 

Electrical connections - M10

-

12(106)

Nm (lb.ins)

 

 

 

 

 

 

-

Weight (nominal)

-

-

Refer to

g

 

 

 

 

drawings

 

 

 

 

 

 

 

2/10

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MP04TT600

DYNAMIC CHARACTERISTICS

Symbol

Parameter

Test Conditions

Min.

Max.

Units

 

 

 

 

 

 

IRRM/IDRM

Peak reverse and off-state current

At VRRM/VDRM, Tj = 125˚C

-

50

mA

dV/dt

Linear rate of rise of off-state voltage

To 67% VDRM, Tj = 125˚C

-

1000

V/µ

s

 

 

 

 

 

 

 

dI/dt

Rate of rise of on-state current

From 67% VDRM to 500A, gate source 10V, 5Ω

-

500

A/µ

s

 

 

tr = 0.5µ s, Tj = 125˚C

 

 

 

 

 

 

 

 

 

 

 

VT(TO)

Threshold voltage

At Tvj = 125˚C

-

0.85

V

 

rT

On-state slope resistance

At Tvj = 125˚C

-

0.38

mΩ

 

 

 

 

 

 

 

 

Note: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor.

GATE TRIGGER CHARACTERISTICS AND RATINGS

Symbol

Parameter

Test Conditions

Max.

Units

 

 

 

 

 

VGT

Gate trigger voltage

VDRM = 5V, Tcase = 25oC

3.5

V

IGT

Gate trigger current

VDRM = 5V, Tcase = 25oC

200

mA

VGD

Gate non-trigger voltage

At VDRM Tcase = 125oC

0.25

V

VFGM

Peak forward gate voltage

Anode positive with respect to cathode

30

V

VFGN

Peak forward gate voltage

Anode negative with respect to cathode

0.25

V

VRGM

Peak reverse gate voltage

-

5

V

IFGM

Peak forward gate current

Anode positive with respect to cathode

10

A

PGM

Peak gate power

See table fig. 5

150

W

PG(AV)

Mean gate power

-

10

W

3/8

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