DYNEX MP03TT580-16, MP03TT580-17, MP03TT580-18 Datasheet

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DYNEX MP03TT580-16, MP03TT580-17, MP03TT580-18 Datasheet

MP03TT580

MP03TT580

Dual Thyristor Water Cooled Welding Module

Preliminary Information

DS5429-1.1 June 2001

FEATURES

KEY PARAMETERS

 

 

Dual Device Module

VDRM

 

 

1800V

 

 

Electrically Isolated Package

ILINE(cont.)

 

 

600A

 

 

ILINE(20cy./50%)

 

 

1008A

 

 

 

 

 

 

 

Pressure Contact Construction

ITSM(per arm)

 

 

6800A

 

 

International Standard Footprint

Visol

 

 

3000V

 

 

Alumina (Non Toxic) Isolation Medium

 

 

 

 

 

 

 

 

 

 

 

G1 K1 K2

G2

 

 

 

 

Integral Water Cooled Heatsink

 

1

2

 

3

APPLICATIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Fig. 1 Circuit diagram

Welding

 

 

 

 

 

 

 

 

VOLTAGE RATINGS

Type Number

Repetitive Peak

Conditions

 

Voltages

 

 

VDRM VRRM

 

 

V

 

MP03TT580-18

1800

Tvj = 0˚ to 125˚C,

MP03TT580-17

1700

IDRM = IRRM = 30mA

MP03TT580-16

1600

VDSM = VRSM =

MP03TT580-15

1500

 

 

VDRM = VRRM + 100V

 

 

respectively

 

 

 

Lower voltage grades available

 

ORDERING INFORMATION

Order As:

MP03TT580-XX W1 With 1/4 BSP connection MP03TT580-XX W2 1/4 – 18 NPT connection MP03TT580-XX W3 1/4 – 18 NPT connection MP03TT580-XX W3A 1/4 – 18 NPT water connection thread MP03TT580-XX W4 With 1/4 BSP connection

XX shown in the part number about represents VDRM/100 selection required, e.g. MP03TT580-16-W3

Note: When ordering, please use the whole part number.

Auxiliary gate and cathode leads can be ordered separately.

Outline type code:

Outline type code:

MP03 - W1 or W2

MP03 - W3 or W4

Outline type code: MP03 - W3A

(See package details for further information)

Fig. 2 Electrical connections - (not to scale)

1/9

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MP03TT580

ABSOLUTE MAXIMUM CURRENT RATINGS

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.

Symbol

Parameter

Test Conditions

Max.

Units

 

 

 

 

 

 

 

 

ILINE

Max. controllable RMS line

Continuous 50/60Hz

 

 

Twater (in) = 25˚C

600

A

 

current - single phase

4.5 Ltr/min

 

 

Twater (in) = 40˚C

530

A

 

 

20 cycles, 50% duty cycle

 

 

Twater (in) = 25˚C

1186

A

 

 

4.5 Ltr/min

 

 

Twater (in) = 40˚C

1008

A

ITSM

Surge (non-repetitive) on-current

10ms half sine, Tj = 125˚C

6.8

kA

I2t

I2t for fusing

 

 

VR = 0

231x103

A2s

 

 

 

 

 

 

ITSM

Surge (non-repetitive) on-current

10ms half sine, Tj = 125˚C

5.5

kA

I2t

I2t for fusing

V

R

= 50% V

150x103

A2s

 

 

 

DRM

 

 

 

 

 

 

 

 

Visol

Isolation voltage

Commoned terminals to base plate.

3000

V

 

 

AC RMS, 1 min, 50Hz

 

 

 

 

 

 

 

 

 

 

 

 

 

THERMAL AND MECHANICAL RATINGS

Symbol

Parameter

Test Conditions

Min.

Max.

Units

 

 

 

 

 

 

Rth(j-w)

Thermal resistance - junction to water

dc, 4.5 Ltr/min

-

0.24

˚C/kW

 

(per thyristor)

Half wave, 4.5 Ltr/min

-

0.25

˚C/kW

 

 

 

 

 

 

 

 

3 Phase, 4.5 Ltr/min

-

0.26

˚C/kW

 

 

 

 

 

 

Tvj

Virtual junction temperature

Reverse (blocking)

-

125

˚C

Tstg

Storage temperature range

-

–40

125

˚C

-

Screw torque

Mounting - M6

5(44)

-

Nm (lb.ins)

 

 

 

 

 

 

 

 

Electrical connections - M4

8(70)

9(80)

Nm (lb.ins)

 

 

 

 

 

 

-

Weight (nominal)

-

-

Refer to

g

 

 

 

 

drawings

 

 

 

 

 

 

 

2/9

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MP03TT580

DYNAMIC CHARACTERISTICS

Symbol

Parameter

Test Conditions

Min.

Max.

Units

 

 

 

 

 

 

IRRM/IDRM

Peak reverse and off-state current

At VRRM/VDRM, Tj = 125˚C

-

300

mA

dV/dt

Linear rate of rise of off-state voltage

To 67% VDRM, Tj = 125˚C

-

1000

V/µ

s

 

 

 

 

 

 

 

dI/dt

Rate of rise of on-state current

From 67% VDRM to 500A, gate source 10V, 5Ω

-

150

A/µ

s

 

 

tr = 0.5µ s, Tj = 125˚C

 

 

 

 

 

 

 

 

 

 

 

VT(TO)

Threshold voltage

At Tvj = 125˚C

-

0.98

V

 

rT

On-state slope resistance

At Tvj = 125˚C

-

0.75

mΩ

 

 

 

 

 

 

 

 

Note : The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor.

GATE TRIGGER CHARACTERISTICS AND RATINGS

Symbol

Parameter

 

 

 

Test Conditions

Max.

Units

 

 

 

 

 

 

 

 

 

 

V

GT

Gate trigger voltage

V

DRM

= 5V, T

 

= 25oC

3

V

 

 

 

 

case

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

GT

Gate trigger current

V

DRM

= 5V, T

 

= 25oC

150

mA

 

 

 

case

 

 

 

 

 

 

 

 

VGD

Gate non-trigger voltage

At VDRM Tcase = 125oC

0.25

V

VFGM

Peak forward gate voltage

Anode positive with respect to cathode

30

V

VFGN

Peak forward gate voltage

Anode negative with respect to cathode

0.25

V

VRGM

Peak reverse gate voltage

 

 

 

 

-

5

V

IFGM

Peak forward gate current

Anode positive with respect to cathode

10

A

PGM

Peak gate power

See table fig. 5

 

 

100

W

PG(AV)

Mean gate power

 

 

 

 

-

5

W

3/9

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