DYNEX MP03HBP360-16, MP03HBP360-18, MP03HBT360-08, MP03HBP360-12, MP03HBN360-14 Datasheet

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DYNEX MP03HBP360-16, MP03HBP360-18, MP03HBT360-08, MP03HBP360-12, MP03HBN360-14 Datasheet

MP03XXX360

MP03XXX360

Dual Thyristor, Thyristor/Diode Module

Replaces January 2000 version, DS4484-5.0

DS4484-6.1 June 2001

FEATURES

Dual Device Module

Electrically Isolated Package

Pressure Contact Construction

International Standard Footprint

Alumina (Non Toxic) Isolation Medium

APPLICATIONS

Motor Control

Controlled Rectifier Bridges

Heater Control

AC Phase Control

VOLTAGE RATINGS

Type Number

Repetitive Peak

Conditions

 

Voltages

 

 

VDRM VRRM

 

 

V

 

MP03XXX360-18

1800

Tvj = 0˚ to 125˚C,

MP03XXX360-16

1600

IDRM = IRRM = 30mA

MP03XXX360-14

1400

VDSM = VRSM =

MP03XXX360-12

1200

MP03XXX360-10

1000

VDRM = VRRM + 100V

MP03XXX360-08

800

respectively

 

 

 

 

 

Lower voltage grades available.

XXX shown in the part number above represents the circuit configuration required.

ORDERING INFORMATION

Order As:

MP03HBT360-XX

MP03HBN360-XX

MP03HBP360-XX

XX shown in the part number above represents the VRRM/100 slection required, e.g. MP03HBT360-17

Note: When ordering, please use the complete part number.

KEY PARAMETERS

 

VDRM

1800V

IT(AV)

355A

ITSM(per arm)

8100A

Visol

3000V

G1 K1 K2 G2

12 3

Circuit type code: HBT

G1 K1

12 3

Circuit type code: HBP

 

 

 

K2 G2

 

1

 

 

2

 

 

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Circuit type code: HBN

Fig. 1 Circuit diagrams

 

 

 

K2

1

2

3

G2

 

 

 

G1

 

 

 

K1

Outline type code: MP03

Fig. 2 Electrical connections - (not to scale)

1/9

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MP03XXX360

ABSOLUTE MAXIMUM RATINGS - PER ARM

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.

Symbol

Parameter

Test Conditions

Max.

Units

 

 

 

 

 

 

 

 

IT(AV)

Mean on-state current

Half wave resistive load

 

 

Tcase = 75˚C

355

A

 

 

 

 

 

Tcase = 85˚C

312

A

 

 

 

 

 

 

 

 

 

 

 

 

 

Theatsink = 75˚C

276

A

 

 

 

 

 

Theatsink = 85˚C

242

A

IT(RMS

RMS value

Tcase = 75˚C

 

 

 

560

A

ITSM

Surge (non-repetitive) on-current

10ms half sine, Tj = 130˚C

8.1

kA

I2t

I2t for fusing

 

 

VR = 0

0.33x106

A2s

 

 

 

 

 

 

ITSM

Surge (non-repetitive) on-current

10ms half sine, Tj = 130˚C

6.5

kA

I2t

I2t for fusing

V

R

= 50% V

0.21x106

A2s

 

 

 

DRM

 

 

 

 

 

 

 

Visol

Isolation voltage

Commoned terminals to base plate.

3000

V

 

 

AC RMS, 1 min, 50Hz

 

 

 

 

 

 

 

 

 

 

 

 

 

THERMAL AND MECHANICAL RATINGS

 

Symbol

Parameter

Test Conditions

Min.

Max.

Units

 

 

 

 

 

 

 

 

Rth(j-c)

Thermal resistance - junction to case

dc

-

0.105

˚C/kW

 

 

(per thyristor or diode)

Half wave

-

0.115

˚C/kW

 

 

 

 

 

 

 

 

 

 

3 Phase

-

0.12

˚C/kW

 

 

 

 

 

 

 

 

Rth(c-hs)

Thermal resistance - case to heatsink

Mounting torque = 5Nm

-

0.05

˚C/kW

 

 

(per thyristor or diode)

with mounting compound

 

 

 

 

 

 

 

 

 

 

 

Tvj

Virtual junction temperature

Reverse (blocking)

-

135

˚C

 

Tstg

Storage temperature range

-

–40

135

˚C

 

-

Screw torque

Mounting - M5

-

5(44)

Nm (lb.ins)

 

 

 

 

 

 

 

 

 

 

Electrical connections - M8

-

9(80)

Nm (lb.ins)

 

 

 

 

 

 

 

 

-

Weight (nominal)

-

-

950

g

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2/9

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MP03XXX360

DYNAMIC CHARACTERISTICS - THYRISTOR

Symbol

Parameter

Test Conditions

Min.

Max.

Units

 

 

 

 

 

 

IRRM/IDRM

Peak reverse and off-state current

At VRRM/VDRM, Tj = 130˚C

-

50

mA

dV/dt

Linear rate of rise of off-state voltage

To 67% VDRM, Tj = 130˚C

-

1000

V/µ

s

 

 

 

 

 

 

 

dI/dt

Rate of rise of on-state current

From 67% VDRM to 600A, gate source 10V, 5Ω

-

500

A/µ

s

 

 

tr = 0.5µ s, Tj = 130˚C

 

 

 

 

 

 

 

 

 

 

 

VT(TO)

Threshold voltage

At Tvj = 135˚C. See note 1

-

0.78

V

 

rT

On-state slope resistance

At Tvj = 135˚C. See note 1

-

0.79

mΩ

 

 

 

 

 

 

 

 

Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor.

GATE TRIGGER CHARACTERISTICS AND RATINGS

Symbol

Parameter

 

 

 

 

Test Conditions

Max.

Units

 

 

 

 

 

 

 

 

 

 

 

V

GT

Gate trigger voltage

V

= 5V, T

case

 

= 25oC

3

V

 

 

 

DRM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

GT

Gate trigger current

V

= 5V, T

case

= 25oC

150

mA

 

 

DRM

 

 

 

 

 

 

 

 

 

 

VGD

Gate non-trigger voltage

At VDRM Tcase = 125oC

0.25

V

VFGM

Peak forward gate voltage

Anode positive with respect to cathode

30

V

VFGN

Peak forward gate voltage

Anode negative with respect to cathode

0.25

V

VRGM

Peak reverse gate voltage

 

 

 

 

 

-

5

V

IFGM

Peak forward gate current

Anode positive with respect to cathode

10

A

PGM

Peak gate power

See table fig. 5

 

 

100

W

PG(AV)

Mean gate power

 

 

 

 

 

-

5

W

3/9

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