DYNEX MP02-130-20, MP02-130-22, MP02-130-18 Datasheet

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DYNEX MP02-130-20, MP02-130-22, MP02-130-18 Datasheet

MP02 XX 130 Series

MP02 XX 130 Series

Dual Diode Modules

Replaces December 1998 version, DS5100-3.0

DS5100January 2000

FEATURES

Dual Device Module

Electrically Isolated Package

Pressure Contact Construction

International Standard Footprint

Alumina (non-toxic) Isolation Medium

APPLICATIONS

Rectifier Bridges

DC Power Supplies

Plating Rectifiers

Traction Systems

VOLTAGE RATINGS

Type

Repetitive

Conditions

Number

Peak

 

 

Voltages

 

 

VRRM

 

MP02/130 - 25

2500

T = 150oC

 

 

vj

MP02/130 - 22

2200

IRM = 30mA

MP02/130 - 20

2000

VRSM = VRRM + 100V

MP02/130 - 18

1800

 

 

 

 

Lower voltage grades available. For full description of part number see "Ordering Instructions" on page 3.

 

KEY PARAMETERS

VRRM

 

2500V

IFSM

 

2200A

IF(AV)(per arm)

130A

Visol

 

2500V

 

CIRCUIT OPTIONS

Code

Circuit

 

HB

 

 

G

GN

PACKAGE OUTLINE

Module outline type code: MP02.

See Package Details for further information

CURRENT RATINGS - PER ARM

Symbol

Parameter

Conditions

 

Max.

Units

 

 

 

 

 

 

 

 

 

 

 

Tcase = 75oC

130

A

 

 

 

 

 

 

 

 

IF(AV)

Mean forward current

Halfwave, resistive load

Tcase = 85oC

116

A

 

 

 

 

 

 

T

= 75oC

114

A

 

 

 

 

heatsink

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Theatsink = 85oC

101

A

 

 

 

 

 

 

 

 

I

F(RMS)

RMS value

T = 75oC

 

204

A

 

 

case

 

 

 

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MP02 XX 130 Series

SURGE RATINGS - PER ARM

Symbol

Parameter

 

Conditions

 

Max.

Units

 

 

 

 

 

 

 

I

 

Surge (non-repetitive) on-state current

10ms half sine;

VR = 0

2200

A

FSM

Tj

= 150oC

VR

= 50% VRRM

1760

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I2t

I2t for fusing

10ms half sine;

V

= 0

24200

A2s

R

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Tj

= 150oC

 

 

 

 

 

 

 

V

= 50% V

15490

A2s

 

 

 

 

 

R

RRM

 

 

THERMAL & MECHANICAL RATINGS

Symbol

Parameter

Conditions

Max.

Units

 

 

 

 

 

 

 

dc

0.37

oC/W

 

Thermal resistance - junction to case

 

 

 

 

Rth(j-c)

halfwave

0.38

o

C/W

per Diode

 

 

3 phase

0.39

oC/W

 

 

 

 

 

 

 

 

Rth(c-hs)

Thermal resistance - case to heatsink

Mounting torque = 6Nm

0.07

oC/W

with mounting compound

 

per Diode

 

 

 

T

Virtual junction temperature

 

150

 

oC

vj

 

 

 

 

 

T

Storage temperature range

 

-40 to 150

 

oC

sto

 

 

 

 

 

Visol

Isolation voltage

Commoned terminals to base plate

2.5

 

kV

AC RMS, 1min, 50Hz

 

 

 

 

 

 

 

 

 

 

 

 

CHARACTERISTICS

Symbol

Parameter

 

 

 

Conditions

Max.

Units

 

 

 

 

 

 

 

V

FM

Forward voltage

At 300A , T = 25oC

1.53

V

 

 

 

 

 

 

case

 

 

 

 

 

 

 

 

 

 

 

 

 

I

RM

Peak reverse current

At V

 

, T

= 150oC

30

mA

 

 

 

RRM j

 

 

 

V

TO

Threshold voltage

At T

 

= 150oC

1.10

V

 

 

 

 

vj

 

 

 

 

 

r

T

On-state slope resistance

At T

 

= 150oC

1.30

mΩ

 

 

 

 

vj

 

 

 

 

2/9

MP02 XX 130 Series

ORDERING INSTRUCTIONS

Part number is made up as follows:

MP02 HB 130 - 22

MP

= Pressure contact module

02

= Outline type

HB

= Circuit configuration code (see "circuit options" - front page)

130

= Nominal average current rating at T = 75oC

 

case

22

= VRRM/100

Examples:

MP02HB130 - 20

MP02G130 - 25

MP02GN130 - 18

Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when requested.

MOUNTING RECOMMENDATIONS

Adequate heatsinking is required to maintain the base temperature at 75oC if full rated current is to be achieved. Power dissipation may be calculated by use of VTO and rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required.

The heatsink surface must be smooth and flat; a surface finish of N6 (32μin) and a flatness within 0.05mm (0.002") are recommended.

Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain.

An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance.

After application of thermal compound, place the module squarely over the mounting holes, (or 'T' slots) in the heatsink. Using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 6Nm (55lb.ins) is reached at both ends.

It is not acceptable to fully tighten one fixing bolt before starting to tighten the other. Such action may DAMAGE the module.

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