Samsung K4S281632C-TP75, K4S281632C-TP1L, K4S281632C-TI75, K4S281632C-TI1L, K4S281632C-TI1H Datasheet

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K4S281632C-TI(P)

CMOS SDRAM

128Mbit SDRAM

2M x 16Bit x 4 Banks Synchronous DRAM LVTTL

Revision 0.1

June 2001

* Samsung Electronics reserves the right to change products or specification without notice.

Rev. 0.1 Jun. 2001

K4S281632C-TI(P)

CMOS SDRAM

Revision History

Revision 0.0 (November 18, 2000)

•First generation.

Revision 0.1 (June 20, 2001)

•Final Specification.

Rev. 0.1 Jun. 2001

Samsung K4S281632C-TP75, K4S281632C-TP1L, K4S281632C-TI75, K4S281632C-TI1L, K4S281632C-TI1H Datasheet

K4S281632C-TI(P)

CMOS SDRAM

2M x 16Bit x 4 Banks Synchronous DRAM

FEATURES

JEDEC standard 3.3V power supply

LVTTL compatible with multiplexed address

Four banks operation

MRS cycle with address key programs

-. CAS latency (2 & 3)

-. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave)

All inputs are sampled at the positive going edge of the system clock.

Burst read single-bit write operation

DQM for masking

Auto & self refresh

64ms refresh period (4K cycle)

Industrial Temperature Operation (- 40 to 85 °C)

GENERAL DESCRIPTION

The K4S281632C is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x 2,097,152 words by 16 bits, fabricated with SAMSUNGs high performance CMOS technology. Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.

ORDERING INFORMATION

Part No.

Max Freq.

Interface

Package

K4S281632C-TI/P75

133MHz(CL=3)

 

54

K4S281632C-TI/P1H

100MHz(CL=2)

LVTTL

TSOP(II)

K4S281632C-TI/P1L

100MHz(CL=3)

 

 

FUNCTIONAL BLOCK DIAGRAM

 

 

 

 

 

 

Data Input Register

 

 

Bank Select

 

 

 

 

 

 

Address

CounterRefresh

BufferRow

DecoderRow

 

 

2M x 16

AMPSense

 

 

 

2M x 16

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2M x 16

 

CLK

 

 

 

 

 

 

2M x 16

 

 

Register

LRAS

LCBR

Buffer.Col

 

 

 

ADD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Column Decoder

 

 

 

 

 

 

Latency & Burst Length

 

LCKE

 

 

 

 

Programming Register

 

 

 

 

 

 

 

LRAS

LCBR

LWE

LCAS

 

LWCBR

 

 

 

 

Timing Register

 

 

 

 

CLK

CKE

CS

RAS

CAS

WE

LDQM

UDQM

 

 

 

 

 

 

 

 

I/O

 

 

 

 

LWE

 

 

 

 

 

 

Control

 

 

 

 

LDQM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Output

 

 

 

 

DQi

 

Buffer

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LDQM

* Samsung Electronics reserves the right to change products or specification without notice.

Rev. 0.1 Jun. 2001

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