K4S280432M-TC-L1L
K4S280432M CMOS SDRAM
Rev. 0.0 Aug. 1999
128Mbit SDRAM
Revision 0.0
Aug. 1999
8M x 4Bit x 4 Banks
Synchronous DRAM
LVTTL
Samsung Electronics reserves the right to change products or specification without notice.
K4S280432M CMOS SDRAM
Rev. 0.0 Aug. 1999
The K4S280432M is 134,217,728 bits synchronous high data
rate Dynamic RAM organized as 4 x 8,388,608 words by 4 bits,
fabricated with SAMSUNG′s high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock I/O transactions are possible on every clock
cycle. Range of operating frequencies, programmable burst
length and programmable latencies allow the same device to be
useful for a variety of high bandwidth, high performance mem-
ory system applications.
• JEDEC standard 3.3V power supply
• LVTTL compatible with multiplexed address
• Four banks operation
• MRS cycle with address key programs
-. CAS latency (2 & 3)
-. Burst length (1, 2, 4 & 8 page)
-. Burst type (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system
clock.
• Burst read single-bit write operation
• DQM for masking
• Auto & self refresh
• 64ms refresh period (4K Cycle)
GENERAL DESCRIPTIONFEATURES
FUNCTIONAL BLOCK DIAGRAM
8M x 4Bit x 4 Banks Synchronous DRAM
ORDERING INFORMATION
Part No. Max Freq. Inter- Package
K4S280432M-TC/L80 125MHz(CL=3)
LVTTL
54pin
TSOP(II)
K4S280432M-TC/L1H 100MHz(CL=2)
K4S280432M-TC/L1L 100MHz(CL=3)
K4S280432M-TC/L10 66MHz(CL=2 &3)
Bank Select
Data Input Register
8M x 4
8M x 4
Sense AMP
Output BufferI/O Control
Column Decoder
Latency & Burst Length
Programming Register
Address Register
Row Buffer
Refresh Counter
Row Decoder Col. Buffer
LRAS
LCBR
LCKE
LRAS LCBR LWE LDQM
CLK CKE CS RAS CAS WE DQM
LWE
LDQM
DQi
CLK
ADD
LCAS LWCBR
8M x 4
8M x 4
Timing Register
* Samsung Electronics reserves the right to change products or specification without notice.
K4S280432M CMOS SDRAM
Rev. 0.0 Aug. 1999
VDD
N.C
VDDQ
N.C
DQ0
VSSQ
N.C
N.C
VDDQ
N.C
DQ1
VSSQ
N.C
VDD
N.C
WE
CAS
RAS
CS
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
PIN CONFIGURATION (Top view)
VSS
N.C
VSSQ
N.C
DQ3
VDDQ
N.C
N.C
VSSQ
N.C
DQ2
VDDQ
N.C
VSS
N.C/RFU
DQM
CLK
CKE
N.C
A11
A9
A8
A7
A6
A5
A4
VSS
54Pin TSOP (II)
(400mil x 875mil)
(0.8 mm Pin pitch)
PIN FUNCTION DESCRIPTION
Pin Name Input Function
CLK System clock Active on the positive going edge to sample all inputs.
CS Chip select
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and DQM
CKE Clock enable
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
A0 ~ A11 Address
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA11, Column address : CA0 ~ CA9, CA11
BA0 ~ BA1 Bank select address
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
RAS Row address strobe
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
CAS Column address strobe
Latches column addresses on the positive going edge of the CLK with CAS low.
Enables column access.
WE Write enable
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
DQM Data input/output mask
Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when DQM active.
DQ0 ~ 3 Data input/output Data inputs/outputs are multiplexed on the same pins.
VDD/VSS Power supply/ground Power and ground for the input buffers and the core logic.
VDDQ/VSSQ Data output power/ground
Isolated power supply and ground for the output buffers to provide improved noise
immunity.
N.C/RFU
No connection
/reserved for future use
This pin is recommended to be left No Connection on the device.
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