K4S641632D |
CMOS SDRAM |
64Mbit SDRAM
1M x 16Bit x 4 Banks Synchronous DRAM LVTTL
Revision 0.3
June 2000
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 0.3 June 2000
K4S641632D |
CMOS SDRAM |
Revision History
Revision 0.1 (May 2000)
• Changed tOH of K4S280432C-TC75/TL75 from 2.7ns to 3.0ns.
Revision 0.2 (May 2000)
• Added -70 (7.0ns) Speed.
Revision 0.3 (June 2000)
• Added -60 (6.0ns) and -55(5.5ns) Speed.
Rev. 0.3 June 2000
K4S641632D |
CMOS SDRAM |
1M x 16Bit x 4 Banks Synchronous DRAM |
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FEATURES |
GENERAL DESCRIPTION |
•JEDEC standard 3.3V power supply
•LVTTL compatible with multiplexed address
•Four banks operation
•MRS cycle with address key programs
-. CAS latency (2 & 3)
-. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave)
•All inputs are sampled at the positive going edge of the system clock
•Burst read single-bit write operation
•DQM for masking
•Auto & self refresh
•64ms refresh period (4K cycle)
FUNCTIONAL BLOCK DIAGRAM
The K4S641632D is 67,108,864 bits synchronous high data rate Dynamic RAM organized as 4 x 1,048,576 words by 16 bits, fabricated with SAMSUNG′s high performance CMOS technology. Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high perfor-
mance memory system applications.
ORDERING INFORMATION
Part No. |
Max Freq. |
Interface |
Package |
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K4S641632D-TC/L55 |
183MHz(CL=3) |
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K4S641632D-TC/L60 |
166MHz(CL=3) |
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K4S641632D-TC/L70 |
143MHz(CL=3) |
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54 |
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K4S641632D-TC/L75 |
133MHz(CL=3) |
LVTTL |
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TSOP(II) |
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K4S641632D-TC/L80 |
125MHz(CL=3) |
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K4S641632D-TC/L1H |
100MHz(CL=2) |
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K4S641632D-TC/L1L |
100MHz(CL=3) |
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Data Input Register |
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Bank Select |
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Address |
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CounterRefresh |
BufferRow |
DecoderRow |
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1M x 16 |
AMPSense |
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1M x 16 |
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1M x 16 |
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CLK |
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1M x 16 |
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Register |
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LRAS |
LCBR |
Buffer.Col |
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ADD |
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Column Decoder |
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Latency & Burst Length |
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LCKE |
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Programming Register |
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LRAS |
LCBR |
LWE |
LCAS |
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LWCBR |
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Timing Register |
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CLK |
CKE |
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CS |
RAS |
CAS |
WE |
L(U)DQM |
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I/O |
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LWE |
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Control |
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LDQM |
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Output |
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DQi |
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Buffer |
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LDQM
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 0.3 June 2000
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K4S641632D |
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CMOS SDRAM |
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PIN CONFIGURATION (Top view) |
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VDD |
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VSS |
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DQ0 |
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DQ15 |
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VDDQ |
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VSSQ |
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DQ1 |
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4 |
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DQ14 |
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DQ2 |
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DQ13 |
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VSSQ |
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VDDQ |
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DQ3 |
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DQ12 |
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DQ4 |
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47 |
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DQ11 |
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VDDQ |
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VSSQ |
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DQ5 |
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10 |
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DQ10 |
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DQ6 |
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DQ9 |
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VSSQ |
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VDDQ |
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DQ7 |
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DQ8 |
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VDD |
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VSS |
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LDQM |
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N.C/RFU |
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WE |
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UDQM |
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CAS |
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CLK |
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RAS |
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CKE |
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CS |
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N.C |
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BA0 |
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A11 |
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BA1 |
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A9 |
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A10/AP |
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A8 |
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A0 |
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A7 |
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A1 |
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A6 |
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A2 |
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A5 |
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A3 |
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A4 |
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VDD |
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VSS |
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(0.8 mm Pin pitch) |
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PIN FUNCTION DESCRIPTION |
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Pin |
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Name |
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Input Function |
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CLK |
System clock |
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Active on the positive going edge to sample all inputs. |
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Disables or enables device operation by masking or enabling all inputs except |
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CS |
Chip select |
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CLK, CKE and L(U)DQM |
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Masks system clock to freeze operation from the next clock cycle. |
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CKE |
Clock enable |
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CKE should be enabled at least one cycle prior to new command. |
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Disable input buffers for power down in standby. |
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A0 ~ A11 |
Address |
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Row/column addresses are multiplexed on the same pins. |
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Row address : RA0 ~ RA11, Column address : CA0 ~ CA7 |
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BA0 ~ BA1 |
Bank select address |
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Selects bank to be activated during row address latch time. |
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Selects bank for read/write during column address latch time. |
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Latches row addresses on the positive going edge of the CLK with RAS low. |
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RAS |
Row address strobe |
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Enables row access & precharge. |
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Latches column addresses on the positive going edge of the CLK with CAS low. |
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CAS |
Column address strobe |
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Enables column access. |
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Enables write operation and row precharge. |
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WE |
Write enable |
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Latches data in starting from CAS, WE active. |
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L(U)DQM |
Data input/output mask |
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Makes data output Hi-Z, tSHZ after the clock and masks the output. |
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Blocks data input when L(U)DQM active. |
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DQ0 ~ 15 |
Data input/output |
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Data inputs/outputs are multiplexed on the same pins. |
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VDD/VSS |
Power supply/ground |
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Power and ground for the input buffers and the core logic. |
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VDDQ/VSSQ |
Data output power/ground |
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Isolated power supply and ground for the output buffers to provide improved noise |
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immunity. |
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N.C/RFU |
No connection |
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This pin is recommended to be left No Connection on the device. |
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/reserved for future use |
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Rev. 0.3 June 2000 |
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