FEATURES
•High Current Transfer Ratio, 800%
•Low Input Current, 0.5mA
•High Output Current, 60mA
•Isolation Test Voltage, 2500 VACRMS
•TTL Compatible Output, VOL=0.1 V
•High Common Mode Rejection, 500V/µsec.
•Adjustable Bandwidth–Access to Base
•Standard Molded Dip Plastic Package
•Underwriters Lab File #E52744
APPLICATIONS
•Logic Ground Isolation–TTL/TTL, TTL/CMOS, CMOS/CMOS, CMOS/TTL
•EIA RS 232C Line Receiver
•Low Input Current Line Receiver–Long Lines, Party Lines
•Telephone Ring Detector
•117 VAC Line Voltage Status Indication–Low Input Power Dissipation
•Low Power Systems–Ground Isolation
DESCRIPTION
High common mode transient immunity and very high current ratio together with 2500 VAC insulation are achieved by coupling an LED with an integrated high gain photo detector in an eight pin dual-in-line package. Separate pins for the photodiode and output stage enable TTL compatible saturation voltages with high speed operation. Photodarlington operation is achieved by tying the VCC and VO terminals together. Access to the base terminal allows adjustment to the gain bandwidth.
The 6N138 is ideal for TTL applications since the 300% minimum current transfer ratio with an LED current of 1.6 mA enables operation with one unit load-in and one unit load-out with a 2.2 KΩ pull-up resistor.
The 6N139 is best suited for low power logic applications involving CMOS and low power TTL. A 400% current transfer ratio with only 0.5 mA of LED current is guaranteed from 0°C to 70°C.
Caution:
Due to the small geometries of this device, it should be handled with Electrostatic Discharge (ESD) precautions. Proper grounding would prevent damage further and/or degradation which may be induced by ESD.
6N138
6N139
LOW INPUT CURRENT, HIGH GAIN OPTOCOUPLER
Dimensions in inches (mm) |
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4 |
3 |
2 |
1 |
Pin |
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One |
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I.D. |
NC |
1 |
8 |
VCC |
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.268 (6.81) |
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Anode |
2 |
7 |
VB |
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.255 (6.48) |
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Cathode |
3 |
6 |
V0 |
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5 |
6 |
7 |
8 |
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NC |
4 |
5 |
GND |
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.390 (9.91) |
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.379 (9.63) |
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.045 (1.14) |
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.305 typ. |
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.030 (.76) |
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(7.75) typ. |
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.150 (3.81) |
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.130 (3.30) |
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4° |
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10° |
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Typ. |
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.135 (3.43) |
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.040 (1.02) |
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Typ. |
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.115 (2.92) |
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.030 (.76 ) |
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3°–9° |
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.022 (.56) |
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.018 (.46) |
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.012 (.30) |
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.100 (2.54) Typ. |
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.008 (.20) |
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Maximum Ratings |
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Reverse Input Voltage .......................................................................... |
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5 V |
Supply and Output Voltage, VCC (pin 8-5), VO (pin 6-5) |
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6N138 ................................................................................... |
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–0.5 to 7 V |
6N139 ................................................................................. |
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–0.5 to 18 V |
Emitter-Base Reverse Voltage (pin 5-7) ............................................ |
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0.5 V |
Average Input Current..................................................................... |
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20 mA |
Peak Input Current (50% Duty Cycle–1 ms pulse width) |
................40 mA |
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Peak Transient Input Current (tp≤1 µsec, 300 pps ........................... |
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1.0 A |
Output Current IO (pin 6)................................................................. |
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60 mA |
Derate linearly above 25°C, free air temperature at 0.7 mA/°C |
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Input Power Dissipation ................................................................. |
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35 mW |
Derate linearly above 50%, free air temperature at 0.7 mW/°C |
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Output Power Dissipation............................................................. |
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100 mW |
Derate linearly above 25°C, free air temperature at 0.2 mA/°C |
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Isolation Test Voltage........................................................... |
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2500 VACRMS |
Isolation Resistance |
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≥1012 Ω |
VIO=500 V, TA=25°C......................................................................... |
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VIO=500 V, TA=100°C....................................................................... |
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≥1011 Ω |
Storage Temperature...................................................... |
–55°C to +125°C |
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Operating Temperature .................................................. |
–55°C to +100°C |
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Lead Soldering Temperature (t=10 sec.) ........................................ |
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260°C |
5–1
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