'97.3.21 |
MITSUBISHI LSIs |
M5M5V208FP,VP,RV,KV,KR |
-70L , -85L, -10L , -12L, |
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-70LL, -85LL, -10LL, -12LL |
2097152-BIT (262144-WORD BY 8-BIT) CMOS STATIC RAM
DESCRIPTION
The M5M5V208 is 2,097,152-bit CMOS static RAM organized as 262,144-words by 8-bit which is fabricated using high-performance quadruple-polysilicon and double metal CMOS technology. The use of thin film transistor(TFT) load cells and CMOS periphery results in a high density and low power static RAM. The M5M5V208 is designed for memory applications where high reliability, large storage, simple interfacing and battery back-up are important design objectives.
The M5M5V208VP,RV,KV,KR are packaged in a 32-pin thin small outline package which is a high reliability and high density surface mount device(SMD).Two types of devices are available.
VP,KV(normal lead bend type package),RV,KR(reverse lead bend type package). Using both types of devices, it becomes very easy to design a printed circuit board.
FEATURE
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Access |
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Power supply current |
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Type |
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time |
Active |
Stand-by |
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(max) |
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(max) |
(max) |
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M5M5V208FP,VP,RV,KV,KR-70L |
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70ns |
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M5M5V208FP,VP,RV,KV,KR-85L |
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85ns |
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60µA |
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M5M5V208FP,VP,RV,KV,KR-10L |
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100ns |
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(Vcc=3.6V) |
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M5M5V208FP,VP,RV,KV,KR-12L |
120ns |
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27mA |
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M5M5V208FP,VP,RV,KV,KR-70LL |
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70ns |
(Vcc=3.6V) |
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M5M5V208FP,VP,RV,KV,KR-85LL |
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85ns |
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10µ A |
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M5M5V208FP,VP,RV,KV,KR-10LL |
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100ns |
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(Vcc=3.6V) |
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M5M5V208FP,VP,RV,KV,KR-12LL |
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120ns |
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• Single 2.7 ~ 3.6V power |
supply |
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• Operating temperature of |
0 to +70°C |
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• No |
clocks, No |
refresh |
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• All |
inputs and |
outputs are TTL |
compatible. |
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•Easy memory expansion and power down by S1 & S2
•Data retention supply voltage=2.0V
• Three-state outputs: OR-tie capability
• OE prevents data contention in the I/O bus
•Common Data I/O
•Battery backup capability
•Small stand-by current · · · · · · · · · · 0.3µA(typ.)
PACKAGE
M5M5V208FP : 32 pin 525 mil SOP |
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M5M5V208VP,RV : 32pin |
8 X |
20 mm2 |
TSOP |
M5M5V208KV,KR : 32pin |
8 X |
13.4 mm2 |
TSOP |
APPLICATION
Small capacity memory units
Battery operating system
Handheld communiation tools
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PIN CONFIGURATION (TOP VIEW) |
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A17 |
1 |
32 |
VCC(3V) |
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A16 |
2 |
31 |
A15 |
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A14 |
3 |
30 |
S2 |
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A12 |
4 |
29 |
W |
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A7 |
5 |
28 |
A13 |
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A6 |
6 |
27 |
A8 |
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A5 |
7 |
26 |
A9 |
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A4 |
8 |
25 |
A11 |
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A3 |
9 |
24 |
OE |
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A2 10 |
23 |
A10 |
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A1 11 |
22 |
S1 |
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A0 12 |
21 |
DQ8 |
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DQ1 13 |
20 |
DQ7 |
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DQ2 14 |
19 |
DQ6 |
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DQ3 15 |
18 |
DQ5 |
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(0V)GND 16 |
17 |
DQ4 |
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Outline 32P2M-A(FP) |
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A11 |
1 |
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32 |
OE |
A9 |
2 |
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31 |
A10 |
A8 |
3 |
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30 |
S1 |
A13 |
4 |
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29 |
DQ8 |
W |
5 |
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28 |
DQ7 |
S2 |
6 |
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27 |
DQ6 |
A15 |
7 |
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26 |
DQ5 |
Vcc 8 |
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M5M5V208VP,KV |
25 |
DQ4 |
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A17 |
9 |
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24 |
GND |
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A16 |
10 |
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23 |
DQ3 |
A14 |
11 |
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22 |
DQ2 |
A12 |
12 |
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21 |
DQ1 |
A7 |
13 |
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20 |
A0 |
A6 |
14 |
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19 |
A1 |
A5 |
15 |
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18 |
A2 |
A4 |
16 |
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17 |
A3 |
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Outline 32P3H-E(VP), 32P3K-B(KV) |
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A4 |
16 |
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17 |
A3 |
A5 |
15 |
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18 |
A2 |
A6 |
14 |
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19 |
A1 |
A7 |
13 |
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20 |
A0 |
A12 |
12 |
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21 |
DQ1 |
A14 |
11 |
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22 |
DQ2 |
A16 |
10 |
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23 |
DQ3 |
A17 |
9 |
M5M5V208RV,KR |
24 |
GND |
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Vcc 8 |
25 |
DQ4 |
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A15 |
7 |
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26 |
DQ5 |
S2 |
6 |
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27 |
DQ6 |
W |
5 |
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28 |
DQ7 |
A13 |
4 |
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29 |
DQ8 |
A8 |
3 |
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30 |
S1 |
A9 |
2 |
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31 |
A10 |
A11 |
1 |
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32 |
OE |
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Outline 32P3H-F(RV), 32P3K-C(KR) |
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MITSUBISHI ELECTRIC
1
'97.3.21 |
MITSUBISHI LSIs |
M5M5V208FP,VP,RV,KV,KR |
-70L , -85L, -10L , -12L, |
|
-70LL, -85LL, -10LL, -12LL |
2097152-BIT (262144-WORD BY 8-BIT) CMOS STATIC RAM
FUNCTION
The operation mode of the M5M5V208 is determined by a combination of the device control inputs S1, S2, W and OE. Each mode is summarized in the function table.
A write cycle is executed whenever the low level W overlaps with the low level S1 and the high level S2. The address must be set up before the write cycle and must be stable during the entire cycle. The data is latched into a cell on the trailing edge of W, S1 or S2, whichever occurs first, requiring the set-up and hold time relative to these edge to be maintained. The output enable OE directly controls the output stage. Setting the OE at a high level,the output stage is in a high-impedance state, and the data bus contention problem in the write cycle is eliminated.
A read cycle is executed by setting W at a high level and OE at a low level while S1 and S2 are in an active state (S1
=L ,S2 = H).
When setting S1 at a high level or S2 at a low level, the
chips are in a non-selectable mode in which both reading and writing are disabled. In this mode, the output stage is in a high-impedance state, allowing OR-tie with other chips and memory expansion by S1 or S2. The power supply current is reduced as low as the stand-by current which is specified as Icc3 or Icc4, and the memory data can be held at +2V power supply, enabling battery back-up operation during power failure or power-down operation in the nonselected mode.
FUNCTION TABLE
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S1 |
S2 |
W |
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OE |
Mode |
DQ |
Icc |
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X |
L |
X |
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X |
Non selection |
High-impedance |
Standby |
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H |
X |
X |
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X |
Non selection |
High-impedance |
Standby |
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L |
H |
L |
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X |
Write |
D IN |
Active |
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L |
H |
H |
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L |
Read |
D OUT |
Active |
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L |
H |
H |
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H |
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High-impedance |
Active |
BLOCK DIAGRAM
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* |
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* |
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A4 |
8 |
16 |
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A5 |
7 |
15 |
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21 |
13 |
DQ1 |
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A6 |
6 |
14 |
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22 |
14 |
DQ2 |
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262144 |
WORDS |
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A7 |
5 |
13 |
23 |
15 |
DQ3 |
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X 8 |
BITS |
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A12 |
4 |
12 |
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512 |
ROWS |
25 |
17 |
DQ4 |
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A14 |
3 |
11 |
X |
128 COLUMNS |
26 |
18 |
DQ5 |
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X |
32 |
BLOCKS |
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A16 |
2 |
10 |
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27 |
19 |
DQ6 |
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A17 |
1 |
9 |
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28 |
20 |
DQ7 |
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A15 |
31 |
7 |
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29 |
21 |
DQ8 |
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A0 |
12 |
20 |
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A1 |
11 |
19 |
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CLOCK |
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A2 |
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10 |
18 |
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GENERATOR |
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A3 |
9 |
17 |
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A10 |
23 |
31 |
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5 |
29 |
W |
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30 |
22 |
S1 |
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A11 |
25 |
1 |
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6 |
30 |
S2 |
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A9 |
26 |
2 |
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32 |
24 |
OE |
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A8 |
27 |
3 |
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A13 |
28 |
4 |
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8 |
32 |
VCC |
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(3V) |
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24 |
16 |
GND |
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(0V) |
*Pin numbers inside dotted line show those of TSOP.
MITSUBISHI
ELECTRIC
2
'97.3.21 |
MITSUBISHI LSIs |
M5M5V208FP,VP,RV,KV,KR |
-70L , -85L, -10L , -12L, |
|
-70LL, -85LL, -10LL, -12LL |
2097152-BIT (262144-WORD BY 8-BIT) CMOS STATIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol |
Parameter |
Conditions |
Ratings |
Unit |
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Vcc |
Supply voltage |
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– 0.5*~4.6 |
V |
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VI |
Input voltage |
With respect to GND |
– 0.5* ~ Vcc + 0.5 |
V |
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(Max |
4.6) |
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VO |
Output voltage |
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0 |
~ Vcc |
V |
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Pd |
Power dissipation |
Ta=25°C |
700 |
mW |
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Topr |
Operating temperature |
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0 |
~ 70 |
°C |
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Tstr |
Storage temperature |
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– 65 ~150 |
°C |
* –3.0V in case of AC ( Pulse width £ 30ns )
DC ELECTRICAL CHARACTERISTICS |
(Ta=0~70°C, Vcc= 2.7 ~ 3.6V, unless otherwise noted) |
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Symbol |
Parameter |
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Test conditions |
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Limits |
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Unit |
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Min Typ |
Max |
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VIH |
High-level input voltage |
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2.0 |
Vcc |
V |
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+0.3V |
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VIL |
Low-level input voltage |
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–0.3* |
0.6 |
V |
VOH1 |
High-level output voltage 1 |
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IOH= –0.5mA |
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2.4 |
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V |
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VOH2 |
High-level output voltage 2 |
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IOH= –0.05mA |
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Vcc |
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V |
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-0.5V |
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VOL |
Low-level output voltage |
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IOL=2mA |
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0.4 |
V |
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II |
Input current |
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VI=0 ~ Vcc |
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±1 |
µA |
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IO |
Output current in off-state |
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S |
1=VIH or S2=VIL or |
OE=VIH |
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±1 |
µA |
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VI/O=0 ~ Vcc |
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Icc1 |
Active supply current |
S1 £ 0.2V, S2³ Vcc-0.2V, |
f= 10MHz |
20 |
25 |
mA |
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(CMOS-level Input) |
other inputs £ 0.2V |
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f= 5MHz |
10 |
13 |
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or ³ Vcc-0.2V,output-open |
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f= 10MHz |
22 |
27 |
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Icc2 |
Active supply current |
S1=VIL,S2=VIH, |
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other inputs=VIH or VIL |
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mA |
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(TTL-level Input) |
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f= 5MHz |
12 |
15 |
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output-open |
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1) S2 £ 0.2V or |
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-L |
-20 ~ +70°C |
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60 |
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-20 ~ +70°C |
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10 |
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Icc3 |
Stand-by current |
2) S1 ³ Vcc-0.2V, |
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µA |
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S2 ³ Vcc-0.2V |
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-LL |
-20 ~ +40°C |
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1 |
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other inputs=0 ~ Vcc |
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+25°C |
0.3 |
0.6 |
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Icc4 |
Stand-by current |
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1=VIH or S2=VIL,other inputs=0 ~ Vcc |
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0.33 |
mA |
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S |
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* –3.0V in case of AC ( Pulse width £ 30ns )
CAPACITANCE |
(Ta=0 ~ 70°C, Vcc= 2.7 ~ 3.6V, unless otherwise noted) |
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Symbol |
Parameter |
Test conditions |
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Limits |
Unit |
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Min |
Typ |
Max |
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CI |
Input capacitance |
VI=GND, VI=25mVrms, f=1MHz |
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7 |
pF |
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CO |
Output capacitance |
VO=GND,VO=25mVrms, f=1MHz |
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9 |
pF |
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Note 1: Direction for current flowing into an IC is positive (no mark). 2: Typical value is for Vcc = 3V, Ta = 25°C
MITSUBISHI
ELECTRIC
3