Mitsubishi M5M5256DVP-70XL, M5M5256DRV-70XL, M5M5256DVP-55XL, M5M5256DVP-55LL, M5M5256DVP-45XL Datasheet

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'97.4.7 MITSUBISHI LSIs

M5M5256DP,FP,VP,RV -45LL,-55LL,-70LL, -45XL,-55XL,-70XL

262144-BIT (32768-WORD BY 8-BIT) CMOS STATIC RAM

DESCRIPTION

The M5M5256DP,FP,VP,RV is 262,144-bit CMOS static RAMs organized as 32,768-words by 8-bits which is fabricated using high-performance 3 polysilicon CMOS technology. The use of resistive load NMOS cells and CMOS periphery results in a high density and low power static RAM. Stand-by current is small enough for battery back-up application. It is ideal for the memory systems which require simple interface.

Especially the M5M5256DVP,RV are packaged in a 28-pin thin small outline package.Two types of devices are available, M5M5256DVP(normal lead bend type package), M5M5256DRV(reverse lead bend type package). Using both types of devices, it becomes very easy to design a printed circuit board.

FEATURE

 

 

Access

Power supply current

Type

 

time

 

 

 

 

 

Active

Stand-by

 

 

(max)

 

 

(max)

(max)

M5M5256DP, FP,VP,RV-45LL

 

45ns

 

 

M5M5256DP, FP,VP,RV-55LL

 

55ns

 

20µA

M5M5256DP, FP,VP,RV-70LL

 

70ns

 

(Vcc=5.5V)

 

55mA

 

 

 

 

 

 

M5M5256DP, FP,VP,RV-45XL

 

45ns

(Vcc=5.5V)

5µA

 

 

 

 

 

 

 

(Vcc=5.5V)

M5M5256DP, FP,VP,RV-55XL

 

55ns

 

0.05µA

 

 

70ns

 

(Vcc=3.0V,

M5M5256DP, FP,VP,RV-70XL

 

 

Typical)

 

 

 

 

 

 

 

 

 

•Single +5V power supply

 

 

 

 

•No clocks, no refresh

 

 

 

 

•Data-Hold on +2.0V power supply

 

 

 

 

•Directly TTL compatible : all inputs and outputs

 

•Three-state outputs : OR-tie capability

 

 

•/OE prevents data contention in the I/O bus

 

•Common Data I/O

 

 

 

 

•Battery backup capability

 

 

 

 

•Low stand-by current··········0.05µA(typ.)

 

PACKAGE

M5M256DP

: 28 pin 600 mil DIP

M5M5256DFP

: 28 pin 450 mil SOP

M5M5256DVP,RV : 28pin 8 X 13.4 mm2 TSOP

APPLICATION

Small capacity memory units

PIN CONFIGURATION (TOP VIEW)

A14

1

 

28

Vcc

A12

2

 

27

/W

A7

3

M5M5256DP,FP

26

A13

A0

10

19

DQ8

A6

4

 

25

A8

A5

5

 

24

A9

A4

6

 

23

A11

A3

7

 

22

/OE

A2

8

 

21

A10

A1

9

 

20

/S

DQ1

11

 

18

DQ7

DQ2

12

 

17

DQ6

DQ3

13

 

16

DQ5

GND

14

 

15

DQ4

 

Outline 28P4 (DP)

 

 

 

 

28P2W-C (DFP)

 

 

 

 

 

 

 

A10

 

 

 

 

 

 

 

 

22

 

 

/OE

 

 

21

 

 

 

 

 

 

A11

 

 

 

 

 

23

 

 

 

 

 

 

 

 

/S

 

 

20

 

 

 

 

A9

DQ8

 

 

 

 

 

 

24

 

 

 

 

 

 

 

 

 

 

 

 

19

 

 

 

 

25

 

 

A8

DQ7

 

 

18

 

 

 

 

 

 

 

A13

DQ6

 

 

 

 

 

 

 

 

26

 

 

 

 

17

 

 

 

 

 

 

 

 

DQ5

 

 

 

 

 

 

 

 

27

 

 

/W

 

 

16

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

28Vcc

DQ415

 

 

 

 

 

 

A14 M5M5256DVP

GND

 

 

 

 

1

 

 

14

 

 

 

 

 

A12

DQ313

 

 

 

 

 

 

2

 

 

 

 

 

A7

DQ212

 

 

3

 

 

 

 

 

 

 

DQ1

 

 

 

 

 

 

 

 

 

 

A6

11

4

 

 

 

 

 

 

 

 

A0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A5

10

5

 

 

 

 

 

 

 

 

 

 

 

 

 

A1

 

 

 

 

 

 

 

 

 

 

A4

9

 

6

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A2

 

 

 

 

 

 

 

 

 

 

 

A3

8

7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Outline 28P2C-A (DVP)

7

A3

 

A2 8

6

A4

 

A1 9

5

A5

 

A0 10

4

A6

 

DQ1 11

3

A7

 

DQ2 12

2

A12

 

DQ3 13

1

A14

M5M5256DRV

GND 14

28 Vcc

 

DQ4 15

27 /W

 

DQ5 16

26 A13

 

DQ6 17

25 A8

 

DQ7 18

24 A9

 

DQ8 19

23

A11

 

/S 20

22 /OE

 

A10 21

 

 

Outline 28P2C-B (DRV)

 

MITSUBISHI ELECTRIC

1

Mitsubishi M5M5256DVP-70XL, M5M5256DRV-70XL, M5M5256DVP-55XL, M5M5256DVP-55LL, M5M5256DVP-45XL Datasheet

'97.4.7 MITSUBISHI LSIs

M5M5256DP,FP,VP,RV -45LL,-55LL,-70LL, -45XL,-55XL,-70XL

262144-BIT (32768-WORD BY 8-BIT) CMOS STATIC RAM

FUNCTION

The operation mode of the M5M5256DP,FP,VP,RV is determined by a combination of the device control inputs /S, /W and /OE. Each mode is summarized in the function table.

A write cycle is executed whenever the low level /W overlaps with the low level /S. The address must be set up before the write cycle and must be stable during the entire cycle. The data is latched into a cell on the trailing edge of /W, /S, whichever occurs first, requiring the set-up and hold time relative to these edge to be maintained. The output enable /OE directly controls the output stage. Setting the /OE at a high level,the output stage is in a high-impedance state, and the data bus contention problem in the write cycle is eliminated.

A read cycle is executed by setting /W at a high level and /OE at a low level while /S are in an active state.

When setting /S at a high level, the chip is in a non-selectable mode in which both reading and writing are disabled. In this mode, the output stage is in a high-impedance state, allowing OR-tie with other chips and memory expansion by /S. The power supply current is reduced as low as the stand-by current which is specified as Icc3 or Icc4, and the memory data can be held at +2V power supply, enabling battery back-up operation during power failure or power-down operation in the non-selected mode.

FUNCTION TABLE

/S

/W

/OE

Mode

DQ

Icc

 

 

 

 

 

 

H

X

X

Non selection

High-impedance

Stand-by

 

 

 

 

 

 

L

L

X

Write

DIN

Active

 

 

 

 

 

 

L

H

L

Read

DOUT

Active

 

 

 

 

 

 

L

H

H

 

High-impedance

Active

BLOCK DIAGRAM

 

 

 

 

 

 

 

 

 

 

A 8

25

 

 

 

 

 

 

 

11

 

 

 

 

 

 

 

 

 

 

DQ1

 

A 13

 

 

 

 

 

32768 WORD

 

 

 

26

 

 

 

 

 

 

12

DQ2

 

 

 

 

 

 

 

 

 

 

A 14

 

 

 

 

 

X 8BIT

 

 

 

1

INPUTADDRESS

BUFFER

DECODERROW

 

ANPLIFIERSENSE

BUFFEROUTPUT

18

DQ7

 

 

 

 

 

 

 

 

 

 

13

DQ3

 

A 12

2

 

 

 

 

 

 

 

 

 

 

2

 

 

 

 

 

 

 

15

DQ4

 

A 7

3

 

 

 

 

 

 

 

16

DATA I/O

 

 

 

 

 

 

 

(512 ROWS X

 

 

DQ5

 

A 6

4

 

 

 

 

 

 

17

DQ6

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A 5

5

 

 

 

 

512 COLUMNS)

 

 

 

 

 

A 4

6

 

 

 

 

 

 

 

19

DQ8

ADDRESS

 

 

 

 

 

 

 

 

 

A 3

7

 

 

 

 

 

 

 

 

 

INPUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A 2

8

 

 

 

 

 

 

 

 

 

 

A 1

9

INPUTADDRESS

BUFFER

COLUMN

DECODER

 

 

INPUTDATA BUFFER

 

 

 

A 0

10

 

 

 

 

 

A 10

21

 

 

 

 

CLOCK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A 11

23

 

 

 

 

GENERATOR

 

 

 

 

 

A 9

24

 

 

 

 

 

 

 

 

 

WRITE CONTROL

 

 

 

 

 

 

 

 

 

 

 

INPUT

/W

27

 

 

 

 

 

 

 

28

VCC

CHIP SELECT

 

 

 

 

 

 

 

 

 

 

(5V)

/S

20

 

 

 

 

 

 

 

 

 

INPUT

 

 

 

 

 

 

 

14

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OUTPUT ENABLE

/OE

22

 

 

 

 

 

 

 

 

(0V)

 

 

 

 

 

 

 

 

 

INPUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MITSUBISHI

 

 

 

 

 

 

 

 

 

 

 

ELECTRIC

 

 

 

 

2

'97.4.7 MITSUBISHI LSIs

M5M5256DP,FP,VP,RV -45LL,-55LL,-70LL, -45XL,-55XL,-70XL

262144-BIT (32768-WORD BY 8-BIT) CMOS STATIC RAM

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Conditions

Ratings

Unit

Vcc

Supply voltage

 

-0.3*~7.0

V

VI

Input voltage

With respect to GND

-0.3*~Vcc+0.3

V

(Max 7.0)

VO

Output voltage

 

0~Vcc

V

Pd

Power dissipation

Ta=25°C

700

mW

Topr

Operating temperature

 

0~70

°C

Tstg

Storage temperature

 

-65~150

°C

* -3.0V in case of AC ( Pulse width 30ns )

DC ELECTRICAL CHARACTERISTICS (Ta=0~70°C, Vcc=5V±10%, unless otherwise noted)

Symbol

Parameter

Test conditions

 

 

Limits

 

Unit

 

 

 

 

 

Min

Typ

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VIH

High-level input voltage

 

 

 

2.2

 

Vcc

V

 

 

 

 

+0.3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VIL

Low-level input voltage

 

 

 

-0.3

 

0.8

V

 

 

 

 

 

 

 

 

 

VOH1

High-level output voltage 1

IOH=-1mA

 

2.4

 

 

V

 

 

 

 

 

 

 

 

 

VOH2

High-level output voltage 2

IOH=-0.1mA

 

Vcc

 

 

V

 

-0.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOL

Low-level output voltage

IOL=2mA

 

 

 

0.4

V

 

 

 

 

 

 

 

 

 

II

Input current

VI=0~Vcc

 

 

 

±1

uA

 

 

 

 

 

 

 

 

 

IO

Output current in off-state

/S=VIH or or /OE=VIH,

 

 

 

±1

uA

VI/O=0~Vcc

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Icc1

Active supply current

/S£0.2V,

45ns

 

35

50

 

Other inputs<0.2V or >Vcc-0.2V

55ns

 

30

45

mA

(AC, MOS level )

 

 

 

Output-open Min. cycle

70ns

 

25

40

 

 

 

 

 

 

 

 

 

 

Active supply current

/S=VIL,

45ns

 

35

55

 

Icc2

other inputs=VIH or VIL

55ns

 

30

50

mA

(AC, TTL level )

 

 

Output-open Min. cycle

70ns

 

25

45

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Icc3

Stand-by current

/S³Vcc-0.2V,

 

-LL

 

 

20

uA

other inputs=0~Vcc

-XL

 

0.1

5

 

 

 

 

 

 

 

 

 

 

 

 

 

Icc4

Stand-by current

/S=VIH,other inputs=0~Vcc

 

 

 

3

mA

 

 

 

 

 

 

 

 

 

* -3.0V in case of AC ( Pulse width 30ns )

CAPACITANCE (Ta=0~70°C, Vcc=5V±10%, unless otherwise noted)

Symbol

Parameter

 

Test conditions

 

Limits

Unit

 

Min

Typ

Max

 

 

 

 

 

CI

Input capacitance

I

I

 

 

6

pF

 

V

=GND, V =25mVrms, f=1MHz

 

 

CO

Output capacitance

VO=GND,VO=25mVrms, f=1MHz

 

 

8

pF

Note 0: Direction for current flowing into an IC is positive (no mark).

1:Typical value is one at Ta = 25°C.

2:CI, CO are periodically sampled and are not 100% tested.

MITSUBISHI

ELECTRIC

3

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