Mitsubishi M5M51008CVP-70X, M5M51008CVP-70H, M5M51008CVP-55X, M5M51008CKV-70X, M5M51008CKV-70H Datasheet

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MITSUBISHI LSIs
M5M51008CP,FP,VP,RV,KV,KR -55H, -70H,
-55X, -70X
1048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAM
MITSUBISHI
ELECTRIC
NC : NO CONNECTION
FEATURES
Type name
Access
time
(max)
Active
(max)
stand-by
(max)
Power supply current
The M5M51008CP,FP,VP,RV,KV,KR are a 1048576-bit CMOS
static RAM organized as 131072 word by 8-bit which are
fabricated using high-performance quadruple-polysilicon and
double metal CMOS technology. The use of thin film transistor
(TFT) load cells and CMOS periphery result in a high density and
low power static RAM.
They are low standby current and low operation current and ideal
for the battery back-up application.
The M5M51008CVP,RV,KV,KR are packaged in a 32-pin thin
small outline package which is a high reliability and high density
surface mount device(SMD). Two types of devices are available.
M5M51008CVP,KV(normal lead bend type package),
M5M51008CRV,KR(reverse lead bend type package).Using both
types of devices, it becomes very easy to design a printed circuit
board.
Package
APPLICATION
Small capacity memory units
Low stand-by current 0.1µA (typ.)
Directly TTL compatible : All inputs and outputs
Easy memory expansion and power down by S1,S2
Data hold on +2V power supply
Three-state outputs : OR - tie capability
OE prevents data contention in the I/O bus
Common data I/O
M5M51008CP,FP,VP,RV,KV,KR-55H
8µA
55ns
15mA
70ns
55ns
20µA
(1MHz)
M5M51008CP ············ 32pin 600mil DIP
M5M51008CFP ············ 32pin 525mil SOP
M5M51008CVP,RV ············ 32pin 8 X 20 mm TSOP
M5M51008CKV,KR ············ 32pin 8 X 13.4 mm TSOP
1
M5M51008CP,FP,VP,RV,KV,KR-70H
M5M51008CP,FP,VP,RV,KV,KR-55X
2
2
16
15
14
13
1
12
11
10
9
8
7
6
5
4
3
2
PIN CONFIGURATION (TOP VIEW)
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ1
DQ2
DQ3
GND
VCC
A15
S2
W
A13
A8
A9
A11
OE
A10
S1
DQ8
DQ7
DQ6
DQ5
DQ4
A11
A9
A8
A13
W
S2
A15
VCC
NC
A16
A14
A12
A7
A6
A5
A4
OE
A10
S1
DQ8
DQ7
DQ6
DQ5
DQ4
GND
DQ3
DQ2
DQ1
A0
A1
A2
A3
A4
A5
A6
A7
A11
A2
A0
OE
A1
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
17
18
19
20
32
M5M51008CVP,KV
A14
A16
NC
VCC
A15
S2
W
A13
A8
A9
DQ1
DQ2
DQ3
GND
DQ4
DQ5
DQ6
DQ7
DQ8
S1
A10
A12
21
22
23
24
25
26
27
28
29
30
31
Outline 32P4(P), 32P2M-A(FP)
Outline 32P3H-E(VP), 32P3K-B(KV)
ADDRESS
INPUT
CHIP SELECT
INPUT
WRITE CONTROL
INPUT
ADDRESS
INPUTS
OUTPUT ENABLE
INPUT
ADDRESS
INPUT
CHIP SELECT
INPUT
DATA
INPUTS/
OUTPUTS
ADDRESS
INPUTS
DATA
INPUTS/
OUTPUTS
M5M51008CRV,KR
Outline 32P3H-F(RV), 32P3K-C(KR)
70ns
M5M51008CP,FP,VP,RV,KV,KR-70X
(Vcc=5.5V)
(1MHz)
(Vcc=5.5V)
0.1µA
(Vcc=3.0V typ)
MITSUBISHI LSIs
M5M51008CP,FP,VP,RV,KV,KR -55H, -70H,
-55X, -70X
1048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAM
MITSUBISHI
ELECTRIC
FUNCTION
BLOCK DIAGRAM
The operation mode of the M5M51008C series are determined by
a combination of the device control inputs S1,S2,W and OE.
Each mode is summarized in the function table.
A write cycle is executed whenever the low level W overlaps with
the low level S1 and the high level S2. The address must be set up
before the write cycle and must be stable during the entire cycle.
The data is latched into a cell on the trailing edge of W,S1 or S2,
whichever occurs first,requiring the set-up and hold time relative to
these edge to be maintained. The output enable input OE directly
controls the output stage. Setting the OE at a high level, the output
stage is in a high-impedance state, and the data bus contention
problem in the write cycle is eliminated.
A read cycle is executed by setting W at a high level and OE at a
low level while S1 and S2 are in an active state(S1=L,S2=H).
When setting S1 at a high level or S2
at a low level, the chip are in
a non-selectable mode in which both reading and writing are
disabled. In this mode, the output stage is in a high- impedance
state, allowing OR-tie with other chips and memory expansion by
S1 and S2. The power supply current is reduced as low as the
stand-by current which is specified as ICC3 or ICC4, and the memory
data can be held at +2V power supply, enabling battery back-up
operation during power failure or power-down operation in the non-
selected mode.
S1 S2 W OE
Mode DQ ICC
L
L
H
H
H
H
L
H
Non selection
Write
Read
High-impedance
Din
Dout
Active
Stand-by
Non selection High-impedance
High-impedance
Active
Active
Stand-by
FUNCTION TABLE
L H L X
H X X X
X L X X
2
CLOCK
GENERATOR
131072 WORDS
X 8 BITS
(512 ROWS
X128 COLUMNS
X 16BLOCKS)
8
7
6
5
4
3
2
31
28
16
15
14
13
12
11
10
7
4
12
11
10
9
20
19
18
17
27
26
25
3
2
1
21
22
23
25
26
27
28
29
13
14
15
17
18
19
20
21
5
30
6
32
8
29
22
30
24
32
16
24
A4
A5
A6
A7
A12
A14
A16
A15
A13
A0
A1
A2
A3
A8
A9
A11
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
W
S1
S2
OE
VCC
GND
(0V)
* Pin numbers inside dotted line show those of TSOP
*
*
DATA
INPUTS/
OUTPUTS
WRITE
CONTROL
INPUT
CHIP
SELECT
INPUTS
OUTPUT
ENABLE
INPUT
ADDRESS
INPUTS
23
31
A10
MITSUBISHI LSIs
M5M51008CP,FP,VP,RV,KV,KR -55H, -70H,
-55X, -70X
1048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAM
MITSUBISHI
ELECTRIC
ABSOLUTE MAXIMUM RATINGS
CAPACITANCE
Symbol
Parameter
Test conditions
pF
pF
Unit
Max
6
10
Typ
Min
Limits
VI=GND, VI=25mVrms, f=1MHz
VO=GND,VO=25mVrms, f=1MHz
Input capacitance
Output capacitance
CI
CO
Parameter
Supply voltage
Input voltage
Output voltage
Power dissipation
Operating temperature
Storage temperature
Unit
V
V
V
mW
°C
°C
Conditions
With respect to GND
Ta=25°C
700
0~70
– 65~150
Ratings
Symbol
V
cc
V
I
V
O
P
d
T
opr
T
stg
DC ELECTRICAL CHARACTERISTICS
(Ta=0~70°C, Vcc=5V±10%, unless otherwise noted)
Symbol Parameter
V
V
V
MaxTyp
Limits
Min
Test conditions
Unit
V
µA
– 0.3*~7
– 0.3*~Vcc + 0.3
(Ta=0~70°C, Vcc=5V±10% unless otherwise noted)
0~Vcc
* –3.0V in case of AC ( Pulse width 50ns )
Note 1: Direction for current flowing into an IC is positive (no mark).
2: Typical value is Vcc = 5V, Ta = 25°C
mA
* –3.0V in case of AC ( Pulse width 50ns )
µA
µA
mA
V
Vcc + 0.3
0.8
2.2
0.3*
2.4
3
Stand-by current
0.4
±1
Active supply current
(AC, MOS level)
Active supply current
(AC, TTL level)
Vcc – 0.5
±1
80
VIH
VIL
VOH
VOL
II
IO
ICC1
ICC2
ICC3
ICC4
High-level input voltage
Low-level input voltage
High-level output voltage
Low-level output voltage
Input current
Output current in off-state
Stand-by current
IOH= 1.0mA
IOH= 0.1mA
IOL=2mA
VI=0~Vcc
S1=VIH or S2=VIL or OE=VIH
VI/O=0~VCC
S1=VIL,S2=VIH,
other inputs=VIH or VIL
Output-open(duty 100%)
1) S2 0.2V,
other inputs=0~VCC
2) S1 VCC–0.2V,
S2 VCC–0.2V,
other inputs=0~VCC
S1=VIH or S2=VIL,
other inputs=0~VCC
~25°C
3
~40°C
~70°C
~25°C
~40°C
~70°C
-H
-X
2
6
20
1
3
8
mA
151MHz
S1 VCC–0.2V, S2 VCC–0.2V
other inputs 0.2V or VCC–0.2V
Output-open(duty 100%)
85
15
70ns
55ns
70
70
1MHz
70ns
55ns
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