Philips NE83Q92A20, NE83Q92N, NE83Q92A, NE83Q92D Datasheet

INTEGRATED CIRCUITS

NE83Q92

Low-power coaxial Ethernet transceiver

Product specification

1995 May 01

IC19 Data Handbook

P s

on o s

Philips Semiconductors	Product specification
Low-power coaxial Ethernet transceiver	NE83Q92

DESCRIPTION

PIN CONFIGURATION

The NE83Q92 is a low power BiCMOS coaxial transceiver interface

(CTI) for Ethernet (10base5) and Thin Ethernet (10base2) local area networks. The CTI is connected between the coaxial cable and the Data Terminal Equipment (DTE) and consists of a receiver, transmitter, receive-mode collision detector, heartbeat generator and jabber timer (see Block Diagram). The transmitter output connects directly to a doubly terminated 50Ω cable, while the receiver output, collision detector output and transmitter input are connected to the

DTE through isolation transformers. Isolation between the CTI and the DTE is an IEEE 802.3 requirement that can be met on signal lines by using a set of pulse transformers. Power isolation for the CTI is achieved using DC-to-DC conversion through a power transformer (see Figure 3, Connection Diagram).

The part is fully pin compatible with the industry standard 8392, but has substantially lower current consumption, is fully compliant with the IEEE802.3 standard, and has additional features such as optional pull-down resistors (Figure 3, Note 4), and automatic selection between AUI and coaxial connections.

The NE83Q92 is manufactured on an advanced BiCMOS process and is available with PLCC and SOL packages which make it ideally suited to lap-top personal computers or systems where low power consumption, limited board space and jumperless design is required. Refer to selection flow chart for optimal apllication.

FEATURES

•Fully compliant with Ethernet II, IEEE 802.3 10BASE-5 and 10BASE-2, and ISO 8802/3 interface specifications

•100% drop-in compatible with industry standard 8392 sockets (N & A options)

•Optimal implementation can use 1 Watt DC-DC converter and reduces external part count by not requiring external pull-down resistors

•High efficiency AUI drivers automatically power-down under idle conditions to minimize current consumption

•Automatically disables AUI drivers when no coaxial cable is connected, allowing hard-wiring of AUI connection and local/integrated CTI connection

•Smart squelch on data inputs eliminates false activations

•Advanced BiCMOS process for extremely low power operation

•Available in 16-pin DIP, 16-pin SOL and both 20and 28-pin

PLCC packages

•Expanded version (NE83Q93) with 5 LED status drivers is available for repeater and advanced system applications

•Full ESD protection

•Power-on reset prevents glitches on coaxial cable

D, N Packages

CD+	1		16	CDS
CD±	2		15	TXO
RX+	3		14	RXI
VEE				VEE
	4		13
VEE
	5		12	RR±
RX±	6		11	RR+
TX+	7		10	GND
TX±	8		9	HBE

A Packages

			CD±		CD+		N/C		CDS		TXO
			3		2		1		20		19
RX+	4												18	RXI
VEE	5												17	VEE
V	6												16	VEE
EE
VEE	7												15	RR±
RX±	8												14	RR+
			9		10		11		12		13
			TX+		TX±		GND		HBE		GND

			RX+		CD±		CD+		CDS		TXO		N/C		RXI
			4		3		2		1		28		27		26
V
	5																25
EE																		VEE
VEE	6																24	V
VEE																		EE
	7																23	V
VEE																		EE
	8																22	V
VEE																		EE
	9																21	V
VEE																		EE
	10																20	V
VEE																		EE
	11																19	RR±
			12		13		14		15		16		17		18
			RX±		TX+		TX±		HBE		GND		GND		RR+
																SD00302

Figure 1. Pin Configurations

ORDERING INFORMATION

DESCRIPTION	TEMPERATURE RANGE	ORDER CODE	DWG #
16-Pin Plastic Dual In-Line Package (DIP)	0 to +70°C	NE83Q92N	SOT38-4
16-Pin Plastic Small Outline Large (SOL) Package	0 to +70°C	NE83Q92D	SOT162-1
20-Pin Plastic Leaded Chip Carrier (PLCC) Package	0 to +70°C	NE83Q92A20	SOT380-1
28-Pin Plastic Leaded Chip Carrier (PLCC) Package	0 to +70°C	NE83Q92A	SOT261-3

1995 May 01

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Philips Semiconductors	Product specification
Low-power coaxial Ethernet transceiver	NE83Q92

PIN DESCRIPTIONS

	PIN NO.	PIN NO.	PIN NO.	SYMBOL	DESCRIPTION
	N PKG	PLCC-20	PLCC-28
	1	2	2	CD+	Collision Outputs. Balanced differential line driver outputs which send a 10MHz signal to the
					DTE in the event of a collision, jabber interrupt or heartbeat test. External pull-down resistors
	2	3	3	CD±
					are optional.
	3	4	4	RX+	Receiver Outputs. Balanced differential line driver outputs which send the received signal to
	6	8	12	RX±	the DTE. External pull-down resistors are optional.
	7	9	13	TX+	Transmitter Inputs. Balanced differential line receiver inputs which accept the transmission
	8	10	14	TX±	signal from the DTE and apply it to the coaxial cable at TXO, if it meets Tx squelch threshold.
	9	12	15	HBE	Heartbeat Enable. The heartbeat function is disabled when this pin is connected to VEE and
					enabled when connected to GND or left floating.
	11	14	18	RR+	External Resistor. A 1kΩ (1%) resistor connected between these pins establishes the
	12	15	19	RR±	signaling current at TXO.
					Receiver Input. This pin is connected directly to the coaxial cable. Received signals are
	14	18	26	RXI	equalized, amplified, and sent to the DTE through the RX± pins, if it meets Rx squelch
					threshold.
	15	19	28	TXO	Transmitter Output. This pin is connected directly (Thin Ethernet) or through an external
					isolating diode (Ethernet) to the coaxial cable.
	16	20	1	CDS	Collision Detect Sense. Ground sense connection for the collision detection circuitry. This
					pin should be connected directly to the coaxial cable shield for standard Ethernet operation.
	10	11	16	GND	Positive Supply Pin.
		13	17
	4	5 ± 7	5 to 11
	5				Negative supply pins.
		16 ± 17	20 to 25	VEE
	13
		1		N/C	Not used.

NOTE:

1. The IEEE 802.3 name for CD is CI; for RX is DI; for TX is DO.

1995 May 01

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Philips Semiconductors	Product specification
Low-power coaxial Ethernet transceiver	NE83Q92

BLOCK DIAGRAM

COAX				DTE
				INTERFACE
CABLE
RXI	BUFFER		LINE
	RECEIVER		DRIVER	RECEIVE
				PAIR
	EQUALIZER
				(RX+, RX±)
	4±POLE BESSEL		RECEIVER
	LOW PASS FILTER		AC±DC SQUELCH
	TXO			TRANSMIT
		TRANSMITTER		PAIR
				(TX+, TX±)
	CDS
	SENSE
	BUFFER
		TRANSMITTER
		SQUELCH
		COLLISION
		COMPARATOR
	HEARTBEAT ENABLE	&
		HEARTBEAT
		GENERATOR
			10MHz	COLLISION
				PAIR
			OSC
				(CD+, CD±)
		JABBER		LINE
		TIMER		DRIVER
				SD00274

Figure 2. Block Diagram

ABSOLUTE MAXIMUM RATINGS

SYMBOL	PARAMETER	RATING	UNIT
V	Supply voltage1	±12	V
EE
V	Voltage at any input1	0 to ±12	V
IN
TSTG	Storage temperature range	±65 to +150	°C
TSOLD	Lead soldering temperature (10sec.)	+300	°C
T	Recommended max junction temperature2	+150	°C
J
θJA	Thermal impedance (N and A packages)	60	°C/W

NOTE:

1.100% measured in production.

2.The junction temperature is calculated from the following expression:

TJ = TA + θJA [(VEE x 0.015 x nIDL) + (VEE x 0.027 x nRX) + (VEE x 0.075 x nTX)] where

TA	=	Ambient temperature in °C.
θJA	=	Thermal resistance of package.
VEE =		Normal operating supply voltage in volts.
nIDL =		Percentage of duty cycle idle
nRX =		Percentage of duty cycle receiving
nTX	=	Percentage of duty cycle transmitting

1995 May 01

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Philips Semiconductors	Product specification
Low-power coaxial Ethernet transceiver	NE83Q92

ELECTRICAL CHARACTERISTICS

V = ±9V ±6%; T = 0°C to +70°C unless otherwise specified1,2. No external isolation
EE	A
				LIMITS
SYMBOL	PARAMETER	TEST CONDITIONS	MIN	TYP	MAX	UNIT
VUVL	Under voltage lockout. Transceiver disabled for			±7.5		V
	|VEE| < |VUVL|
	Supply current idle			±15	±20	mA
IEE
	Supply current transmitting (without collision)	Without external		±80	±90	mA
		pull-down resistors
IRXI	Receive input bias current	VRXI = 0V	±2		+25	μA
ICDS	Cable sense input bias current	VCDS = 0V		+1	+3	μA
VIH	HBE input HIGH voltage		VEE +2.4			V
VIL	HBE input LOW voltage				VEE +1.6	V
IIH	HBE input HIGH current	VHBE = 0V			+10	μA
IIL	HBE input LOW current	VHBE = VEE	±30			μA
I	Transmit output DC current level3		±37		±45	mA
TDC
I	Transmit output AC current level3		±28		±I	mA
TAC					TDC
ITX10	Transmit current	VTXO = ±10V	±250		+250	μA
V	Transmitter output voltage compliance4				±3.7	V
TCOM
	Collision threshold5	Measured by applying
VCD		DC voltage at RXI	±1450	±1530	±1580	mV
		(CDS = 0V)
VDIS	AUI disable voltage at RXI	Measured as DC		±3.5		V
		voltage at RXI
VOD	Differential output voltage ± non idle at RX± and		±600		±1100	mV
	6
	CD±
VOB	Differential output voltage imbalance ± idle at				±40	mV
	7
	RX± and CD±
VOC	Output common mode voltage at RX± and CD±	RXI = 0V	±4.0	±5.5	±7.0	V
VRS	Receiver squelch threshold	VRXI average DC	±150	±250	±350	mV
		(CDS = 0V)
VTS	Transmitter squelch threshold	(VTX+ ± VTX±) peak	±175	±225	±275	mV
RRXI	Shunt resistance at RXI non±transmitting		100			kΩ
CRXI	Input capacitance at RXI8			1	2	pF
RTXO	Shunt resistance at TXO transmitting		7.5	10		kΩ
RAUIZ	Differential impedance at RX± and CD± with no			6		kΩ
	coaxial cable connected
RTX	Differential impedance at TX±			20		kΩ

NOTES:

1.Currents flowing into device pins are positive. All voltages are referenced to ground unless otherwise specified. For ease of interpretation, the parameter limit that appears in the MAX column is the largest value of the parameter, irrespective of sign. Similarly, the value in the MIN column is the smallest value of the parameter, irrespective of sign.

2.All typical values are for VEE = ±9V and TA = 27°C.

3.ITDC is measured as (VMAX + VMIN)/(2 x 25) where VMAX and VMIN are the max and min voltages at TXO with a 25Ω load between TXO and GND. ITAC is measured as (VMAX ± VMIN)/(2 x 25).

4.The TXO pin shall continue to sink at least ITDC min when the idle (no signal) voltage on this pin is ±3.7V.

5.Collision threshold for an AC signal is within 5% of VCD.

6.Measured on secondary side of isolation transformer (see Connection Diagram, Figure 3). The transformer has a 1:1 turns ratio with an inductance between 30 and 100μH at 5MHz.

7.Measured as the voltage difference between the RX pins or the CD pins with the transformer removed.

8.Not 100% tested in production.

1995 May 01

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