Philips NE8392CN, NE8392CA Datasheet

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Philips Semiconductors

Product specification

 

 

 

 

Coaxial transceiver interface for Ethernet/Thin Ethernet

NE8392C

 

 

 

 

DESCRIPTION

The NE8392C Coaxial Transceiver Interface (CTI) is a bipolar coaxial line driver/receiver for Ethernet (10base5) and Thin Ethernet (10base2) local area networks. The CTI is connected between the coaxial cable and the Data Terminal Equipment (DTE) and consists of a receiver, transmitter, receive-mode collision detector, heartbeat generator and jabber timer (see Block Diagram). The transmitter output connects directly to a doubly terminated 50Ω cable, while the receiver output, collision detector output and transmitter input are connected to the DTE through isolation transformers. Isolation between the CTI and the DTE is an IEEE 802.3 requirement that can be met on signal lines by using a set of pulse transformers normally available in a standard 16-pin DIP. Power isolation for the CTI is achieved using DC-to-DC conversion through a power transformer (see Figure 1, Connection Diagram).

During transmission the jabber timer is initiated to disable the CTI transmitter in the event of a longer than legal length data packet.

Receive-mode collision detection circuitry monitors the signals on the coaxial cable to determine the presence of colliding packets and signals the DTE in the event of a collision. At the end of every transmission the heartbeat generator creates a pseudo collision for a short time to ensure that the collision circuitry is functioning correctly. The heartbeat function can be disabled for repeater applications.

The CTI is normally part of a three chip set that implements a complete Ethernet/ Thin Ethernet network interface for a DTE (see

Figure 2, Interface Diagram). The other chips are a Serial Network

Interface (SNI) and a Network Interface Controller (NIC). The SNI provides Manchester Encoding and Decoding while the NIC handles the media access protocol and buffer management tasks.

FEATURES

Compatible with Ethernet II IEEE 802.3 10base5 and 10base2, and ISO 8802/3 interface specifications

100% drop-in compatible with industry standard 8392 sockets

Integrates all transceiver electronics except signal and power isolation

Only one external resistor required for setting coaxial signaling current

Jabber timer function integrated on chip

Heartbeat generator can be externally disabled for operation as

IEEE 802.3 compatible repeaters

PIN CONFIGURATION

N PACKAGE

 

 

 

 

 

 

 

CD+

1

 

 

 

16

CDS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CD±

2

 

 

 

15

TXO

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RX+

3

 

 

 

14

RXI

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VEE

4

 

 

 

13

VEE

VEE

 

 

 

 

 

 

5

 

 

 

12

RR±

 

 

 

 

 

 

 

RX±

6

 

 

 

11

RR+

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TX+

7

 

 

 

10

GND

 

 

 

 

 

 

 

TX±

8

 

 

 

9

HBE

 

 

 

 

 

 

 

A PACKAGE

 

 

 

 

RX+

CD±

CD+

CDS

TXO

N/C

RXI

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4

 

3

 

2

 

1

 

28

 

27

 

26

 

 

 

VEE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

25

V

VEE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EE

6

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

24

V

VEE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EE

7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

23

V

VEE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EE

8

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

22

V

VEE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EE

9

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

21

V

VEE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EE

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

V

VEE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

11

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

19

RR±

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

12

 

13

 

14

 

15

 

16

 

17

 

18

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RX±

TX+

TX±

HBE

GND

GND

RR+

SD00283

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

On-chip precision voltage reference for receive mode collision detection

Squelch circuitry on all signal inputs rejects noise

Full ESD protection

Standard 16-pin DIP and 28-pin PLCC packages

Power-on reset prevents glitches on coaxial cable during power up.

Also available in advanced low-power BiCMOS technology. (See selection chart and data sheets for the NE83C92, NE83Q92 or NE83Q93 for appropriate optimal usages)

ORDERING INFORMATION

DESCRIPTION

TEMPERATURE RANGE

ORDER CODE

DWG #

 

 

 

 

16-Pin Plastic Dual In-Line Package (DIP)

0 to +70°C

NE8392CN

SOT28-4

 

 

 

 

28-Pin Plastic Lead Chip Carrier (PLCC)

0 to +70°C

NE8392CA

SOT261-3

1995 May 1

1

853-1693 15180

Philips Semiconductors

Product specification

 

 

 

Coaxial transceiver interface for Ethernet/Thin Ethernet

NE8392C

 

 

 

PIN DESCRIPTIONS

PIN NO.

PIN NO.

SYMBOL

DESCRIPTION

N PKG

PLCC

 

 

 

 

 

 

1

2

CD+

Collision Outputs. Balanced differential line driver outputs which send a 10MHz oscillation signal to

2

3

CD±

the DTE in the event of a collision, jabber interrupt or heartbeat test.

 

 

 

 

3

4

RX+

Receiver Outputs. Balanced differential line driver outputs which send the received signal to the

6

12

RX±

DTE.

 

 

 

 

7

13

TX+

Transmitter Inputs. Balanced differential line receiver inputs which accept the transmission signal

8

14

TX±

from the DTE and apply it to the coaxial cable at TXO once it meets Tx squelch threshold.

 

 

 

 

9

15

HBE

Heartbeat Enable. The heartbeat function is disabled when this pin is connected to VEE and enabled

 

 

 

when connected to GND or left floating.

 

 

 

 

11

18

RR+

External Resistor. A 1kΩ (1%) resistor connected between these pins establishes the signaling

12

19

RR±

current at TXO. RR± is internally connected to VEE.

14

26

RXI

Receiver Input. This pin is connected directly to the coaxial cable. Received signals are equalized,

amplified, and sent to the DTE through the RX+ pins once it meets Rx squelch threshold.

 

 

 

 

 

 

 

15

28

TXO

Transmitter Output. This pin is connected directly (Thin Ethernet) or through an external isolating

diode (Ethernet) to the coaxial cable.

 

 

 

 

 

 

 

 

 

 

Collision Detect Sense. Ground sense connection for the collision detection circuitry. This pin

16

1

CDS

should be directly connected to the coaxial cable shield to prevent ground drops affecting the

 

 

 

collision threshold voltage.

 

 

 

 

10

16

GND

Positive Supply Pin.

17

 

 

 

 

 

 

 

4

5 to 11

 

Negative supply pins. These pins also serve as a low thermal resistance path for extracting heat

5

 

20 to 25

VEE

from the die. They should, therefore, be connected to a large metal area on the PC board.

13

NOTE:

1. The IEEE 802.3 name for CD is CI; for RX is DI; for TX is DO.

ABSOLUTE MAXIMUM RATINGS

SYMBOL

PARAMETER

RATING

UNIT

 

 

 

 

V

Supply voltage1

±12

V

EE

 

 

 

VIN

Voltage at any input1

0 to ±12

V

TSTG

Storage temperature range

±65 to +150

°C

TSOLD

Lead soldering temperature (10sec.)

+300

°C

T

Recommended max junction temperature2

+130

°C

J

 

 

 

θJA

Thermal impedance (N and A packages)

60

°C/W

NOTE:

1.100% measured in production.

2.The junction temperature is calculated from the following expression:

TJ = TA + θJA [VEE (0.08 + n x 0.05/100) + 8(VEE ±2) / R] where

TA

=

Ambient temperature in °C.

θJA

=

Thermal resistance of package.

VEE =

Normal operating supply voltage in volts.

n

=

Percentage transmitter duty cycle.

R

=

Pull down resistors on the RX and CD pins in Ω.

The N package is specially designed to have a low θJA by directly connecting the four center Pins 4, 5, 12, and 13 to the die attachment area. These four pins then provide a conductive heat flow path from the die to the PCB where they should be soldered to a large area VEE track. For the A package, Pins 5 to 11 and 19 to 25 should similarly be soldered to a large area VEE and rack.

1995 May 1

2

Philips NE8392CN, NE8392CA Datasheet

Philips Semiconductors

Product specification

 

 

 

Coaxial transceiver interface for Ethernet/Thin Ethernet

NE8392C

 

 

 

BLOCK DIAGRAM

COAX

 

 

 

DTE

 

 

 

INTERFACE

CABLE

 

 

 

 

 

 

 

RXI

BUFFER

 

LINE

 

 

RECEIVER

 

DRIVER

RECEIVE

 

 

 

PAIR

 

EQUALIZER

 

 

 

 

 

(RX+, RX±)

 

 

 

 

 

4±POLE BESSEL

 

RECEIVER

 

 

LOW PASS FILTER

 

AC±DC SQUELCH

 

 

TXO

 

 

TRANSMIT

 

TRANSMITTER

PAIR

 

 

 

 

(TX+, TX±)

 

CDS

 

 

 

 

 

 

 

SENSE

 

 

 

 

BUFFER

 

 

 

 

 

TRANSMITTER

 

 

 

SQUELCH

 

 

 

COLLISION

 

 

 

COMPARATOR

 

 

HEARTBEAT ENABLE

&

 

 

 

HEARTBEAT

 

 

 

 

 

 

GENERATOR

 

 

 

 

10MHz

COLLISION

 

 

 

PAIR

 

 

 

OSC

 

 

 

(CD+, CD±)

 

 

 

 

 

 

JABBER

 

LINE

 

 

TIMER

 

DRIVER

 

 

 

 

SD00274

1995 May 1

3

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