NSC LMC555CN, LMC555CMX, LMC555CMMX, LMC555CM, LMC555CBPX Datasheet
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February 2000
LMC555
CMOS Timer
General Description
The LMC555 is a CMOS version of the industry standard 555 series general purpose timers. In addition to the standard package (SOIC, MSOP, and MDIP) the LMC555 is also available in a chip sized package (8 Bump micro SMD) using National's micro SMD package technology. The LMC555 offers the same capability of generating accurate time delays and frequencies as the LM555 but with much lower power dissipation and supply current spikes. When operated as a one-shot, the time delay is precisely controlled by a single external resistor and capacitor. In the stable mode the oscillation frequency and duty cycle are accurately set by two external resistors and one capacitor. The use of National Semiconductor's LMCMOS™ process extends both the frequency range and low supply capability.
Features
nLess than 1 mW typical power dissipation at 5V supply
n3 MHz astable frequency capability
n1.5V supply operating voltage guaranteed
nOutput fully compatible with TTL and CMOS logic at 5V supply
nTested to −10 mA, +50 mA output current levels
nReduced supply current spikes during output transitions
nExtremely low reset, trigger, and threshold currents
nExcellent temperature stability
nPin-for-pin compatible with 555 series of timers
nAvailable in 8 pin MSOP Package and 8-Bump micro SMD package
Block and Connection Diagrams
8-Pin SOIC, MSOP, |
8-Bump micro SMD |
and MDIP Packages |
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DS008669-1
Top View
DS008669-9
Top View (bump side down)
LMCMOS™ is a trademark of National Semiconductor Corp.
Timer CMOS LMC555
© 2000 National Semiconductor Corporation |
DS008669 |
www.national.com |
LMC555
Ordering Information
Package |
Temperature Range |
Package Marking |
Transport Media |
NSC |
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Drawing |
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Industrial |
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−40ÊC to +85ÊC |
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8-LeadSmall Outline |
LMC555CM |
LMC555CM |
Rails |
M08A |
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(SO) |
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LMC555CMX |
LMC555CM |
2.5k Units Tape and Reel |
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8-Lead Mini Small |
LMC555CMM |
ZC5 |
1k Units Tape and Reel |
MUA08A |
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Outline (MSOP) |
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LMC555CMMX |
ZC5 |
3.5k Units Tape and Reel |
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8-Lead Molded Dip |
LMC555CN |
LMC555CN |
Rails |
N08E |
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(MDIP) |
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8-Bump micro SMD |
LMC555CBP |
F1 |
250 Units Tape and Reel |
BPA08EFB |
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LMC555CBPX |
F1 |
3k Units Tape and Reel |
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Metronome Circuit |
LMC555CBPEVAL |
N/A |
N/A |
N/A |
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micro SMD Marking Orientation Top View
DS008669-23
Bumps are numbered counter-clockwise
www.national.com |
2 |
Absolute Maximum Ratings (Notes 2, 3)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage, V+ |
15V |
Input Voltages, VTRIG, VRES, VCTRL, |
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VTHRESH |
−0.3V to V S + 0.3V |
Output Voltages, VO, VDIS |
15V |
Output Current IO, IDIS |
100 mA |
Storage Temperature Range |
−65ÊC to +150ÊC |
Soldering Information |
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MDIP Soldering (10 seconds) |
260ÊC |
SOIC, MSOP Vapor Phase (60 |
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sec) |
215ÊC |
SOIC, MSOP Infrared (15 sec) |
220ÊC |
Note: See AN-450 ªSurface Mounting Methods and Their Effect on Product Reliabilityº for other methods of soldering surface mount devices.
Operating Ratings(Notes 2, 3)
Termperature Range |
−40ÊC to +85ÊC |
Thermal Resistance (θJA) (Note 2) |
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SO, 8-lead Small Outline |
169ÊC/W |
MSOP, 8-lead Mini Small |
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Outline |
225ÊC/W |
MDIP, 8-lead Molded Dip |
111ÊC/W |
8-Bump micro SMD |
220ÊC/W |
Maximum Allowable Power |
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Dissipation @25ÊC |
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MDIP-8 |
1126mW |
SO-8 |
740mW |
MSOP-8 |
555mW |
8 Bump micro SMD |
568mW |
Electrical Characteristics (Notes 1, 2)
Test Circuit, T = 25ÊC, all switches open, RESET to VS unless otherwise noted
Symbol |
Parameter |
Conditions |
Min |
Typ |
Max |
Units |
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(Limits) |
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IS |
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Supply Current |
VS = 1.5V |
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50 |
150 |
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VS = 5V |
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100 |
250 |
µA |
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VS = 12V |
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150 |
400 |
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VCTRL |
Control Voltage |
VS = 1.5V |
0.8 |
1.0 |
1.2 |
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VS = 5V |
2.9 |
3.3 |
3.8 |
V |
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VS = 12V |
7.4 |
8.0 |
8.6 |
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VDIS |
Discharge Saturation |
VS = 1.5V, IDIS = 1 mA |
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75 |
150 |
mV |
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Voltage |
VS = 5V, IDIS = 10 mA |
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150 |
300 |
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VOL |
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Output Voltage (Low) |
VS = 1.5V, IO = 1 mA |
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0.2 |
0.4 |
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VS = 5V, IO = 8 mA |
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0.3 |
0.6 |
V |
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VS = 12V, IO = 50 mA |
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1.0 |
2.0 |
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VOH |
Output Voltage |
VS = 1.5V, IO = −0.25 mA |
1.0 |
1.25 |
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(High) |
VS = 5V, IO = −2 mA |
4.4 |
4.7 |
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V |
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VS = 12V, IO = −10 mA |
10.5 |
11.3 |
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VTRIG |
Trigger Voltage |
VS = 1.5V |
0.4 |
0.5 |
0.6 |
V |
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VS = 12V |
3.7 |
4.0 |
4.3 |
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ITRIG |
Trigger Current |
VS = 5V |
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10 |
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pA |
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VRES |
Reset Voltage |
VS = 1.5V (Note 4) |
0.4 |
0.7 |
1.0 |
V |
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VS = 12V |
0.4 |
0.75 |
1.1 |
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IRES |
Reset Current |
VS = 5V |
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10 |
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pA |
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ITHRESH |
Threshold Current |
VS = 5V |
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10 |
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pA |
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IDIS |
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Discharge Leakage |
VS = 12V |
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1.0 |
100 |
nA |
t |
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Timing Accuracy |
SW 2, 4 Closed |
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VS = 1.5V |
0.9 |
1.1 |
1.25 |
ms |
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VS = 5V |
1.0 |
1.1 |
1.20 |
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VS = 12V |
1.0 |
1.1 |
1.25 |
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t/ |
VS |
Timing Shift with Supply |
VS = 5V ± 1V |
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0.3 |
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%/V |
t/ |
T |
Timing Shift with |
VS = 5V |
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75 |
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ppm/ÊC |
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Temperature |
−40ÊC ≤ T ≤ +85ÊC |
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fA |
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Astable Frequency |
SW 1, 3 Closed, VS = 12V |
4.0 |
4.8 |
5.6 |
kHz |
fMAX |
Maximum Frequency |
Max. Freq. Test Circuit, VS = 5V |
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3.0 |
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MHz |
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tR, tF |
Output Rise and |
Max. Freq. Test Circuit |
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15 |
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ns |
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Fall Times |
VS = 5V, CL = 10 pF |
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LMC555
3 |
www.national.com |
LMC555
Electrical Characteristics |
(Notes 1, 2) |
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Test Circuit, T = 25ÊC, all switches open, |
RESET |
to VS unless otherwise noted |
(Continued) |
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Symbol |
Parameter |
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Conditions |
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Min |
Typ |
Max |
Units |
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(Limits) |
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tPD |
Trigger Propagation Delay |
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VS = 5V, Measure Delay |
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100 |
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ns |
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from Trigger to Output |
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Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified. |
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Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance.
Note 3: See AN-450 for other methods of soldering surface mount devices, and also AN-1112 for micro SMD considerations.
Note 4: If the RESET pin is to be used at temperatures of −20ÊC and below V S is required to be 2.0V or greater.
Note 5: For device pinout please refer to table 1
Test Circuit (Note 5) |
Maximum Frequency Test Circuit (Note 5) |
DS008669-3
DS008669-2
TABLE 1. Package Pinout Names vs. Pin Function
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Pin Function |
Package Pin numbers |
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8-Pin SO,MSOP, and MDIP |
8-Bump micro SMD |
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GND |
1 |
7 |
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2 |
6 |
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Trigger |
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Output |
3 |
5 |
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4 |
4 |
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Reset |
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Control Voltage |
5 |
3 |
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Threshold |
6 |
2 |
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Discharge |
7 |
1 |
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V+ |
8 |
8 |
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www.national.com |
4 |
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