NSC LM360N, LM360MX, LM360MWC, LM360M, LM360H Datasheet

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May 1999

LM160/LM360

High Speed Differential Comparator

General Description

The LM160/LM360 is a very high speed differential input, complementary TTL output voltage comparator with improved characteristics over the µA760/µA760C, for which it is a pin-for-pin replacement. The device has been optimized for greater speed, input impedance and fan-out, and lower input offset voltage. Typically delay varies only 3 ns for overdrive variations of 5 mV to 400 mV.

Complementary outputs having minimum skew are provided. Applications involve high speed analog to digital convertors and zero-crossing detectors in disk file systems.

Features

nGuaranteed high speed: 20 ns max

nTight delay matching on both outputs

nComplementary TTL outputs

nHigh input impedance

nLow speed variation with overdrive variation

nFan-out of 4

nLow input offset voltage

nSeries 74 TTL compatible

Connection Diagrams

Metal Can Package

Dual-In-Line Package

 

DS005707-4

DS005707-5

Order Number LM160H/883 (Note 1) or LM360H

See NS Package Number H08C Order Number LM360M or LM360N See NS Package Number M08A or N08E

Note 1: Also available in SMD# 5962-8767401

Comparator Differential Speed High LM160/LM360

© 1999 National Semiconductor Corporation

DS005707

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Absolute Maximum Ratings (Notes 6, 8)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.

Positive Supply Voltage

+8V

Negative Supply Voltage

−8V

Peak Output Current

20 mA

Differential Input Voltage

±5V

Input Voltage

V+ ³ VIN ³ V

ESD Tolerance (Note 9)

1600V

Operating Temperature Range

 

LM160

−55ÊC to +125ÊC

LM360

0ÊC to +70ÊC

Storage Temperature Range

−65ÊC to +150ÊC

Lead Temperature

 

(Soldering, 10 sec.)

260ÊC

Soldering Information

 

Dual-In-Line Package

 

Soldering (10 seconds)

260ÊC

Small Outline Package

 

Vapor Phase (60 seconds)

215ÊC

Infrared (15 seconds)

220ÊC

See AN-450 ªSurface Mounting Methods and Their Effect on Product Reliabilityº for other methods of soldering surface mount devices.

Electrical Characteristics

(TMIN £ TA £ TMAX)

Parameter

Conditions

Min

Typ

Max

Units

 

 

 

 

 

 

Operating Conditions

 

 

 

 

 

+

 

4.5

5

6.5

V

Supply Voltage VCC

 

 

−4.5

−5

−6.5

V

Supply Voltage VCC

 

Input Offset Voltage

RS £ 200W

 

2

5

mV

Input Offset Current

 

 

0.5

3

µA

 

 

 

 

 

 

Input Bias Current

 

 

5

20

µA

Output Resistance (Either Output)

VOUT = VOH

 

100

 

W

Response Time

TA = 25ÊC, VS = ±5V (Notes 2, 7)

 

13

25

ns

 

TA = 25ÊC, VS = ±5V (Notes 3, 7)

 

12

20

ns

 

TA = 25ÊC, VS = ±5V (Notes 4, 7)

 

14

 

ns

Response Time Difference between Outputs

 

 

 

 

 

(tpd of +VIN1) − (t pd of −V IN2)

TA = 25ÊC (Notes 2, 7)

 

2

 

ns

(tpd of +VIN2) − (t pd of −V IN1)

TA = 25ÊC (Notes 2, 7)

 

2

 

ns

(tpd of +VIN1) − (t pd of +VIN2)

TA = 25ÊC (Notes 2, 7)

 

2

 

ns

(tpd of −V IN1) − (t pd of −V IN2)

TA = 25ÊC (Notes 2, 7)

 

2

 

ns

Input Resistance

f = 1 MHz

 

17

 

kW

 

 

 

 

 

 

Input Capacitance

f = 1 MHz

 

3

 

pF

 

 

 

 

 

 

Average Temperature Coefficient of

RS = 50W

 

8

 

µV/ÊC

Input Offset Voltage

 

 

 

 

 

 

 

 

 

 

 

Average Temperature Coefficient of

 

 

7

 

nA/ÊC

Input Offset Current

 

 

 

 

 

 

 

 

 

 

 

Common Mode Input Voltage Range

VS = ±6.5V

±4

±4.5

 

V

Differential Input Voltage Range

 

±5

 

 

V

 

 

 

 

 

 

Output High Voltage (Either Output)

IOUT = −320 µA, V S = ±4.5V

2.4

3

 

V

Output Low Voltage (Either Output)

ISINK = 6.4 mA

 

0.25

0.4

V

Positive Supply Current

VS = ±6.5V

 

18

32

mA

Negative Supply Current

VS = ±6.5V

 

−9

−16

mA

Note 2: Response time measured from the 50% point of a 30 mVp-p 10 MHz sinusoidal input to the 50% point of the output.

Note 3: Response time measured from the 50% point of a 2 Vp-p 10 MHz sinusoidal input to the 50% point of the output.

Note 4: Response time measured from the start of a 100 mV input step with 5 mV overdrive to the time when the output crosses the logic threshold.

Note 5: Typical thermal impedances are as follows:

Cavity DIP (J):

θjA

135ÊC/W

Header (H)

θjA

165ÊC/W

(Still

Air)

Molded DIP (N):

θjA

130ÊC/W

 

 

67ÊC/W

(400

LF/min Air Flow)

 

 

 

 

θjC

25ÊC/W

 

 

Note 6: The device may be damaged if used beyond the maximum ratings.

Note 7: Measurements are made in AC Test Circuit, Fanout = 1

Note 8: Refer to RETS 160X for LM160H, LM160J-14 and LM160J military specifications.

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NSC LM360N, LM360MX, LM360MWC, LM360M, LM360H Datasheet

Electrical Characteristics (Continued)

Note 9: Human body model, 1.5 kΩ in series with 100 pF.

Typical Performance Characteristics

Offset Voltage

Input Current vs Ambient

Input Characteristics

 

Temperature

 

 

DS005707-8

DS005707-10

 

 

DS005707-9

Supply Current vs Ambient

Propagation Delay vs

Delay of Output 1 With

Temperature

Ambient Temperature

Respect to Output 2 vs

 

 

Ambient Temperature

DS005707-11

DS005707-12

DS005707-13

Common-Mode

Pulse Response

DS005707-14

3

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