June 2003
LP3985
Micropower, 150mA Low-Noise Ultra Low-Dropout CMOS
Voltage Regulator
General Description
The LP3985 is designed for portable and wireless applications with demanding performance and space requirements.
The LP3985 is stable with a small 1µF ±30% ceramic or high-quality tantalum output capacitor. The micro SMD requires the smallest possible PC board area - the total application circuit area can be less than 2.0mm x 2.5mm, a fraction of a 1206 case size.
The LP3985’s performance is optimized for battery powered systems to deliver ultra low noise, extremely low dropout voltage and low quiescent current. Regulator ground current increases only slightly in dropout, further prolonging the battery life.
An optional external bypass capacitor reduces the output noise without slowing down the load transient response. Fast start-up time is achieved by utilizing an internal power-on circuit that actively pre-charges the bypass capacitor.
Power supply rejection is better than 50 dB at low frequencies and starts to roll off at 1kHz. High power supply rejection is maintained down to low input voltage levels common to battery operated circuits.
The device is ideal for mobile phone and similar battery powered wireless applications. It provides up to 150 mA, from a 2.5V to 6V input. The LP3985 consumes less than 1.5µA in disable mode and has fast turn-on time less than 200µs.
The LP3985 is available in a 5 bump small bump micro SMD, a 5 bump large bump micro SMD, a 5 bump thin micro SMD and a 5 pin SOT-23 package. Performance is specified for −40˚C to +125˚C temperature range and is available in 2.5V,
2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V. 3.1V, 3.2V, 3.3V, 4.7V, 4.8V and 5.0V output voltages. For other output voltage options between 2.5V to 5.0V or for a dual LP3985, please contact National Semiconductor sales office.
Key Specifications
n2.5 to 6.0V input range
n150mA guaranteed output
n50dB PSRR at 1kHz @ VIN = VOUT + 0.2V
n≤1.5µA quiescent current when shut down
nFast Turn-On time: 200 µs (typ.)
n100mV maximum dropout with 150mA load
n30µVrms output noise (typ) over 10Hz to 100kHz
n−40 to +125˚C junction temperature range for operation
n2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.1V, 3.2V, 3.3V, 4.7V, 4.8V and 5.0V outputs standard
Features
nMiniature 5-I/O micro SMD and SOT-23-5 package
nLogic controlled enable
nStable with ceramic and high quality tantalum capacitors
nFast turn-on
nThermal shutdown and short-circuit current limit
Applications
nCDMA cellular handsets
nWideband CDMA cellular handsets
nGSM cellular handsets
nPortable information appliances
Typical Application Circuit
10136402
Note: Pin Numbers in parenthesis indicate micro SMD package. * Optional Noise Reduction Capacitor.
Regulator Voltage CMOS Dropout-Low Ultra Noise-Low 150mA Micropower, LP3985
© 2003 National Semiconductor Corporation |
DS101364 |
www.national.com |
LP3985
Block Diagram
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10136401 |
Pin Description |
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Name |
* micro SMD |
SOT |
Function |
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VEN |
A1 |
3 |
Enable Input Logic, Enable High |
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GND |
B2 |
2 |
Common Ground |
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VOUT |
C1 |
5 |
Output Voltage of the LDO |
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VIN |
C3 |
1 |
Input Voltage of the LDO |
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BYPASS |
A3 |
4 |
Optional Bypass Capacitor for Noise |
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Reduction |
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* The pin numbering scheme for the micro SMD package was revised in April 2002 to conform to JEDEC standard. Only the pin numbers were revised. No changes to the physical location of the inputs/outputs were made. For reference purposes, the obsolete numbering scheme had VEN as pin 1, GND as pin 2, VOUT as pin 3, VIN as pin 4, and BYPASS as pin 5.
Connection Diagrams
SOT 23-5 Package (MF) |
5 Bump micro SMD Package (BPA05, BLA05, TLA05) |
10136407
Top View
See NS Package Number MF05A
10136470
Top View
See NS Package Number BPA05, BLA05, TLA05
www.national.com |
2 |
Ordering Information
BP refers to 0.170mm bump size, 0.900mm height for micro SMD Package
Output |
Grade |
LP3985 Supplied as 250 |
LP3985 Supplied as 3000 |
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Voltage (V) |
Units, Tape and Reel |
Units, Tape and Reel |
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2.5 |
STD |
LP3985IBP-2.5 |
LP3985IBPX-2.5 |
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2.6 |
STD |
LP3985IBP-2.6 |
LP3985IBPX-2.6 |
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2.7 |
STD |
LP3985IBP-2.7 |
LP3985IBPX-2.7 |
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2.8 |
STD |
LP3985IBP-2.8 |
LP3985IBPX-2.8 |
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2.85 |
STD |
LP3985IBP-285 |
LP3985IBPX-285 |
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2.9 |
STD |
LP3985IBP-2.9 |
LP3985IBPX-2.9 |
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3.0 |
STD |
LP3985IBP-3.0 |
LP3985IBPX-3.0 |
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3.1 |
STD |
LP3985IBP-3.1 |
LP3985IBPX-3.1 |
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3.2 |
STD |
LP3985IBP-3.2 |
LP3985IBPX-3.2 |
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3.3 |
STD |
LP3985IBP-3.3 |
LP3985IBPX-3.3 |
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4.7 |
STD |
LP3985IBP-4.7 |
LP3985IBPX-4.7 |
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5.0 |
STD |
LP3985IBP-5.0 |
LP3985IBPX-5.0 |
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BL refers to 0.300mm bump size, 0.995mm height for micro SMD Package |
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Output |
Grade |
LP3985 Supplied as 250 |
LP3985 Supplied as 3000 |
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Voltage (V) |
Units, Tape and Reel |
Units, Tape and Reel |
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2.5 |
STD |
LP3985IBL-2.5 |
LP3985IBLX-2.5 |
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2.6 |
STD |
LP3985IBL-2.6 |
LP3985IBLX-2.6 |
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2.7 |
STD |
LP3985IBL-2.7 |
LP3985IBLX-2.7 |
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2.8 |
STD |
LP3985IBL-2.8 |
LP3985IBLX-2.8 |
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2.85 |
STD |
LP3985IBL-285 |
LP3985IBLX-285 |
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2.9 |
STD |
LP3985IBL-2.9 |
LP3985IBLX-2.9 |
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3.0 |
STD |
LP3985IBL-3.0 |
LP3985IBLX-3.0 |
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3.1 |
STD |
LP3985IBL-3.1 |
LP3985IBLX-3.1 |
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3.2 |
STD |
LP3985IBL-3.2 |
LP3985IBLX-3.2 |
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3.3 |
STD |
LP3985IBL-3.3 |
LP3985IBLX-3.3 |
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4.8 |
STD |
LP3985IBL-4.8 |
LP3985IBLX-4.8 |
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5.0 |
STD |
LP3985IBL-5.0 |
LP3985IBLX-5.0 |
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TL refers to 0.300mm bump size, 0.600mm height for micro SMD Package |
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Output |
Grade |
LP3985 Supplied as 250 |
LP3985 Supplied as 3000 |
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Voltage (V) |
Units, Tape and Reel |
Units, Tape and Reel |
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2.5 |
STD |
LP3985ITL-2.5 |
LP3985ITLX-2.5 |
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2.6 |
STD |
LP3985ITL-2.6 |
LP3985ITLX-2.6 |
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2.7 |
STD |
LP3985ITL-2.7 |
LP3985ITLX-2.7 |
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2.8 |
STD |
LP3985ITL-2.8 |
LP3985ITLX-2.8 |
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2.85 |
STD |
LP3985ITL-285 |
LP3985ITLX-285 |
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2.9 |
STD |
LP3985ITL-2.9 |
LP3985ITLX-2.9 |
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3.0 |
STD |
LP3985ITL-3.0 |
LP3985ITLX-3.0 |
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3.1 |
STD |
LP3985ITL-3.1 |
LP3985ITLX-3.1 |
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3.2 |
STD |
LP3985ITL-3.2 |
LP3985ITLX-3.2 |
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3.3 |
STD |
LP3985ITL-3.3 |
LP3985ITLX-3.3 |
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4.8 |
STD |
LP3985ITL-4.8 |
LP3985ITLX-4.8 |
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5.0 |
STD |
LP3985ITL-5.0 |
LP3985ITLX-5.0 |
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LP3985
3 |
www.national.com |
LP3985
Ordering Information |
(Continued) |
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For SOT Package |
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Output |
Grade |
LP3985 Supplied as 1000 |
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LP3985 Supplied as 3000 |
Package Marking |
Voltage (V) |
Units, Tape and Reel |
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Units, Tape and Reel |
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2.5 |
STD |
LP3985IM5-2.5 |
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LP3985IM5X-2.5 |
LCSB |
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2.6 |
STD |
LP3985IM5-2.6 |
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LP3985IM5X-2.6 |
LCTB |
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2.7 |
STD |
LP3985IM5-2.7 |
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LP3985IM5X-2.7 |
LCUB |
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2.8 |
STD |
LP3985IM5-2.8 |
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LP3985IM5X-2.8 |
LCJB |
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2.85 |
STD |
LP3985IM5-285 |
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LP3985IM5X-285 |
LCXB |
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2.9 |
STD |
LP3985IM5-2.9 |
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LP3985IM5X-2.9 |
LCYB |
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3.0 |
STD |
LP3985IM5-3.0 |
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LP3985IM5X-3.0 |
LCRB |
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3.1 |
STD |
LP3985IM5-3.1 |
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LP3985IM5X-3.1 |
LCZB |
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3.2 |
STD |
LP3985IM5-3.2 |
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LP3985IM5X-3.2 |
LDPB |
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3.3 |
STD |
LP3985IM5-3.3 |
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LP3985IM5X-3.3 |
LDQB |
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4.7 |
STD |
LP3985IM5-4.7 |
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LP3985IM5X-4.7 |
LDRB |
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5.0 |
STD |
LP3985IM5-5.0 |
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LP3985IM5X-5.0 |
LDSB |
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www.national.com |
4 |
Absolute Maximum Ratings (Notes 1,
2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
VIN, VEN |
−0.3 to 6.5V |
VOUT |
-0.3 to (VIN+0.3) ≤ 6.5V |
Junction Temperature |
150˚C |
Storage Temperature |
−65˚C to +150˚C |
Lead Temp. |
235˚C |
Pad Temp. (Note 3) |
235˚C |
Maximum Power Dissipation |
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SOT23-5 (Note 4) |
364mW |
micro SMD (Note 4) |
355mW |
ESD Rating(Note 5) |
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Human Body Model |
2kV |
Machine Model |
150V |
Operating Ratings (Notes 1, 2)
VIN |
2.5 to 6V |
VEN |
0 to (VIN+0.3) ≤ 6V |
Junction Temperature |
−40˚C to +125˚C |
Thermal Resistance |
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θJA (SOT23-5) |
220˚C/W |
θJA (micro SMD) |
255˚C/W |
Maximum Power Dissipation |
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SOT23-5 (Note 6) |
250mW |
micro SMD (Note 6) |
244mW |
Electrical Characteristics
Unless otherwise specified: VIN = VOUT(nom) + 0.5V, CIN = 1 µF, IOUT = 1mA, COUT = 1 µF, CBYPASS = 0.01µF. Typical values and limits appearing in standard typeface are for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction
temperature range for operation, −40˚C to +125˚C. (Note 7) (Note 8)
Symbol |
Parameter |
Conditions |
Typ |
Limit |
Units |
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Min |
Max |
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Output Voltage |
IOUT = 1mA |
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−2 |
2 |
% of |
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Tolerance |
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−3 |
3 |
VOUT(nom) |
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Line Regulation Error |
VIN = (VOUT(nom) + 0.5V) to 6.0V, |
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∆VOUT |
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For 4.7 to 5.0 options |
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−0.19 |
0.19 |
%/V |
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For all other options |
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−0.1 |
0.1 |
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Load Regulation Error |
IOUT = 1 mA to 150 mA |
0.0025 |
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0.005 |
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(Note 9) |
LP3985IM5 (SOT23-5) |
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%/mA |
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LP3985 (micro SMD) |
0.0004 |
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0.002 |
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Output AC Line Regulation |
VIN = VOUT(nom) + 1V, |
1.5 |
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mVP-P |
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IOUT = 150 mA (Figure 1) |
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VIN = VOUT(nom) + 0.2V, |
50 |
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f = 1 kHz, |
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PSRR |
Power Supply Rejection Ratio |
IOUT = 50 mA (Figure 2) |
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dB |
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VIN = VOUT(nom) + 0.2V, |
40 |
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f = 10 kHz, |
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IOUT = 50 mA (Figure 2) |
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IQ |
Quiescent Current |
VEN = 1.4V, IOUT = 0 mA |
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For 4.7 to 5.0 options |
100 |
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165 |
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For all other options |
85 |
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150 |
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VEN = 1.4V, IOUT = 0 to 150 mA |
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µA |
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For 4.7 to 5.0 options |
155 |
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250 |
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For all other options |
140 |
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200 |
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VEN = 0.4V |
0.003 |
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1.5 |
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Dropout Voltage (Note 10) |
IOUT = 1 mA |
0.4 |
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2 |
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IOUT = 50 mA |
20 |
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35 |
mV |
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IOUT = 100 mA |
45 |
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70 |
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IOUT = 150 mA |
60 |
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100 |
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ISC |
Short Circuit Current Limit |
Output Grounded |
600 |
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mA |
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(Steady State) |
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IOUT(PK) |
Peak Output Current |
VOUT ≥ VOUT(nom) - 5% |
550 |
300 |
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mA |
LP3985
5 |
www.national.com |
LP3985
Electrical Characteristics (Continued)
Unless otherwise specified: VIN = VOUT(nom) + 0.5V, CIN = 1 µF, IOUT = 1mA, COUT = 1 µF, CBYPASS = 0.01µF. Typical values and limits appearing in standard typeface are for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction
temperature range for operation, −40˚C to +125˚C. (Note 7) (Note 8)
Symbol |
Parameter |
Conditions |
Typ |
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Limit |
Units |
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Min |
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Max |
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TON |
Turn-On Time |
CBYPASS = 0.01 µF |
200 |
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µs |
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(Note 11) |
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en |
Output Noise Voltage(Note 12) |
BW = 10 Hz to 100 kHz, |
30 |
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µVrms |
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COUT = 1µF |
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Output Noise Density |
CBP = 0 |
230 |
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nV/ |
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IEN |
Maximum Input Current at EN |
VEN = 0.4 and VIN = 6.0 |
±1 |
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nA |
VIL |
Maximum Low Level Input |
VIN = 2.5 to 6.0V |
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0.4 |
V |
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Voltage at EN |
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VIH |
Minimum High Level Input |
VIN = 2.5 to 6.0V |
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1.4 |
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V |
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Voltage at EN |
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COUT |
Output Capacitor |
Capacitance |
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1 |
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20 |
µF |
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ESR |
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5 |
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500 |
mΩ |
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TSD |
Thermal Shutdown Temperature |
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160 |
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˚C |
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Thermal Shutdown Hysteresis |
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20 |
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˚C |
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Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Additional information on lead temperature and pad temperature can be found in National Semiconductor Application Note (AN-1112).
Note 4: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula: PD = (TJ - TA)/θJA,
where TJ is the junction temperature, TA is the ambient temperature, and θ JA is the junction-to-ambient thermal resistance. The 364mW rating for SOT23-5 appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction temperature, 150˚C, for TJ, 70˚C for TA, and 220˚C/W for θJA. More power can be dissipated safely at ambient temperatures below 70˚C . Less power can be dissipated safely at ambient temperatures above 70˚C. The Absolute Maximum power dissipation can be increased by 4.5mW for each degree below 70˚C, and it must be derated by 4.5mW for each degree above 70˚C.
Note 5: The human body model is 100pF discharged through 1.5kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin.
Note 6: Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 250mW rating for SOT23-5 appearing under Operating Ratings results from substituting the maximum junction temperature for operation, 125˚C, for TJ, 70˚C for TA, and 220˚C/W for θJA into (Note 4) above. More power can be dissipated at ambient temperatures below 70˚C . Less power can be dissipated at ambient temperatures above 70˚C. The maximum power dissipation for operation can be increased by 4.5mW for each degree below 70˚C, and it must be derated by 4.5mW for each degree above 70˚C.
Note 7: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with TJ = 25˚C or correlated using Statistical Quality Control (SQC) methods. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
Note 8: The target output voltage, which is labeled VOUT(nom), is the desired voltage option.
Note 9: An increase in the load current results in a slight decrease in the output voltage and vice versa.
Note 10: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100mV below its nominal value. This specification does not apply for input voltages below 2.5V.
Note 11: Turn-on time is time measured between the enable input just exceeding VIH and the output voltage just reaching 95% of its nominal value.
Note 12: The output noise varies with output voltage option. The 30µVrms is measured with 2.5V voltage option. To calculate an approximated output noise for other options, use the equation: (30µVrms)(X)/2.5, where X is the voltage option value.
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FIGURE 1. Line Transient Input Test Signal
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