Vishay IRLZ34S, IRLZ34L, SiHLZ34S, SiHLZ34L Data Sheet

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IRLZ34S, IRLZ34L, SiHLZ34S, SiHLZ34L

www.vishay.com

Vishay Siliconix

 

 

Power MOSFET

PRODUCT SUMMARY

VDS (V)

 

 

60

RDS(on) ( )

 

VGS = 5 V

0.05

Qg max. (nC)

 

 

35

Qgs (nC)

 

 

7.1

Qgd (nC)

 

 

25

Configuration

 

Single

 

 

 

D

I2PAK (TO-262)

 

D2PAK (TO-263)

 

 

 

G

 

 

 

G

 

 

D S

D

 

G

S

 

 

 

 

 

 

 

 

 

S

 

 

 

N-Channel MOSFET

FEATURES

 

• Advanced process technology

 

• Surface mount (IRLZ34S, SiHLZ34S)

 

• Low-profile through-hole (IRLZ34L, SiHLZ34L)

Available

• 175 °C operating temperature

 

• Fast switching

Available

Fully avalanche rated

Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Note

*This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details.

DESCRIPTION

Third generation power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that Power MOSFETs are known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2PAK is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.

The through-hole version (IRLZ34L, SiHLZ34L) is available for low-profile applications.

ORDERING INFORMATION

Package

D2PAK (TO-263)

I2PAK (TO-262)

Lead (Pb)-free and Halogen-free

SiHLZ34S-GE3

-

 

 

 

Lead (Pb)-free

IRLZ34SPbF

IRLZ34LPbF

 

 

 

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER

 

 

SYMBOL

LIMIT

UNIT

 

 

 

 

 

 

Drain-Source Voltage

 

 

VDS

60

V

Gate-Source Voltage

 

 

VGS

± 10

 

 

 

Continuous Drain Current

 

VGS at 5 V

TC = 25 °C

ID

30

 

 

TC = 100 °C

21

A

 

 

 

 

Pulsed Drain Current a

 

 

IDM

110

 

Linear Derating Factor

 

 

 

0.59

W/°C

 

 

 

 

 

 

Single Pulse Avalanche Energy b

 

 

EAS

128

mJ

Maximum Power Dissipation

 

TC = 25 °C

PD

88

W

Maximum Power Dissipation (PCB mount) e

 

TA = 25 °C

3.7

 

 

 

Peak Diode Recovery dV/dt c

 

 

dV/dt

4.5

V/ns

Operating Junction and Storage Temperature Range

 

 

TJ, Tstg

-55 to +175

°C

Soldering Recommendations (Peak temperature) d

 

for 10 s

 

300

 

 

 

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.VDD = 25 V, Starting TJ = 25 °C, L = 285 μH, Rg = 25 , IAS = 30 A (see fig. 12).

c.ISD 30 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C.

d.1.6 mm from case.

e.When mounted on 1" square PCB (FR-4 or G-10 material).

S16-0015-Rev. E, 18-Jan-16

1

Document Number: 90418

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRLZ34S, IRLZ34L, SiHLZ34S, SiHLZ34L

www.vishay.com

 

 

 

 

Vishay Siliconix

 

 

 

 

 

 

 

 

 

 

 

 

THERMAL RESISTANCE RATINGS

 

 

 

 

 

PARAMETER

SYMBOL

MIN.

TYP.

MAX.

 

UNIT

 

 

 

 

 

 

 

Maximum Junction-to-Ambient

RthJA

-

-

40

 

 

(PCB mount) a

 

°C/W

Maximum Junction-to-Case (Drain)

RthJC

-

-

1.7

 

 

Note

a. When mounted on 1" square PCB (FR-4 or G-10 material).

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER

 

SYMBOL

TEST CONDITIONS

 

MIN.

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Static

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Drain-Source Breakdown Voltage

 

VDS

VGS = 0, ID = 250 μA

 

60

-

-

V

VDS Temperature Coefficient

 

VDS/TJ

Reference to 25 °C, ID = 1 mA

 

-

0.07

-

V/°C

Gate-Source Threshold Voltage

 

VGS(th)

VDS = VGS, ID = 250 μA

 

1.0

-

2.0

V

Gate-Source Leakage

 

IGSS

 

VGS = ± 10 V

 

 

 

 

 

 

-

-

± 100

nA

Zero Gate Voltage Drain Current

 

IDSS

VDS = 60 V, VGS = 0 V

 

-

-

25

μA

 

VDS = 48 V, VGS = 0 V, TJ = 150 °C

-

-

250

 

 

 

 

Drain-Source On-State Resistance

 

RDS(on)

VGS = 5 V

 

ID = 18 A b

 

-

-

0.05

 

 

VGS = 4 V

 

ID = 15 A b

 

-

-

0.07

 

 

 

 

 

 

Forward Transconductance

 

gfs

VDS = 25 V, ID = 18 A

 

12

-

-

S

Dynamic

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Capacitance

 

Ciss

 

 

VGS = 0 V,

 

 

 

 

 

 

-

1600

-

 

Output Capacitance

 

Coss

 

 

VDS = 25 V,

 

 

 

 

 

 

-

660

-

pF

 

 

 

f = 1.0 MHz, see fig. 5

 

 

 

 

 

Reverse Transfer Capacitance

 

Crss

 

-

170

-

 

 

 

 

 

 

 

 

 

 

 

 

Total Gate Charge

 

Qg

 

 

ID = 30 A, VDS = 48 V,

-

-

35

 

Gate-Source Charge

 

Qgs

VGS = 5 V

 

-

-

7.1

nC

 

 

see fig. 6 and 13 b

Gate-Drain Charge

 

Qgd

 

 

-

-

25

 

 

 

 

 

 

 

 

 

 

 

 

Turn-On Delay Time

 

td(on)

 

 

 

 

 

 

 

 

 

-

14

-

 

Rise Time

 

tr

VDD = 30 V, ID = 30 A,

 

-

170

-

ns

Turn-Off Delay Time

 

td(off)

Rg = 6 , RD = 1 , see fig. 10 b

 

-

30

-

 

 

 

Fall Time

 

tf

 

 

 

 

 

 

 

 

 

-

56

-

 

Internal Source Inductance

 

LS

 

Between lead,

 

 

 

 

 

 

-

7.5

-

nH

 

and center of die contact

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Drain-Source Body Diode Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Continuous Source-Drain Diode Current

 

IS

MOSFET symbol

 

 

 

 

 

D

-

-

30

 

 

 

 

showing the

 

 

 

 

 

 

 

 

 

 

 

A

Pulsed Diode Forward Current a

 

ISM

integral reverse

G

 

 

 

 

-

-

110

 

 

p - n junction diode

 

 

 

S

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Body Diode Voltage

 

VSD

TJ = 25 °C, IS = 30 A, VGS = 0 V b

-

-

1.6

V

Body Diode Reverse Recovery Time

 

trr

TJ = 25 °C, IF = 30 A, dI/dt = 100 A/μs b

-

120

180

ns

Body Diode Reverse Recovery Charge

 

Qrr

-

700

1300

nC

 

 

 

 

 

 

 

 

 

 

Forward Turn-On Time

 

ton

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.Pulse width 300 μs; duty cycle 2 %.

S16-0015-Rev. E, 18-Jan-16

2

Document Number: 90418

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Vishay IRLZ34S, IRLZ34L, SiHLZ34S, SiHLZ34L Data Sheet

IRLZ34S, IRLZ34L, SiHLZ34S, SiHLZ34L

www.vishay.com

Vishay Siliconix

 

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

 

 

 

Fig. 3 - Typical Transfer Characteristics

 

Fig. 1 - Typical Output Characteristics, TC = 25 °C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Fig. 2 - Typical Output Characteristics, TC = 175 °C

Fig. 4 - Normalized On-Resistance vs. Temperature

S16-0015-Rev. E, 18-Jan-16

3

Document Number: 90418

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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