FS0802.H
SENSITIVEGATESCR
TO220-AB |
On-State Current |
Gate Trigger Current |
|
||
|
8 Amp |
< 200 µA |
A |
Off-State Voltage |
|
|
|
|
|
200 V ÷ 600 V |
|
|
These series of Silicon Controlled |
|
|
||
|
|
R ectifier use a high performance |
|
|
||
K |
|
PNPN technology. |
|
|
|
|
|
These parts are intended for general |
|
||||
A |
|
|
||||
G |
|
purpose applications where high gate |
|
|||
|
|
sensitivity is required using surface |
|
|||
|
|
mount technology. |
|
|
|
|
Absolute Maximum Ratings, according to IEC publication No. 134 |
|
|
|
|
||
SYMBOL |
PARAMETER |
CONDITIONS |
|
Min. |
Max. |
Unit |
IT(RMS) |
On-state Current |
180º Conduction Angle, Tc = 110 ºC |
|
8 |
A |
|
IT(AV) |
Average On-state Current |
Half Cycle, Θ = 180 º, TC = 110 ºC |
|
5 |
A |
|
ITSM |
Non-repetitive On-State Current |
Half Cycle, 60 Hz |
|
|
73 |
A |
ITSM |
Non-repetitive On-State Current |
Half Cycle, 50 Hz |
|
|
70 |
A |
I2t |
Fusing Current |
tp = 10ms, Half Cycle |
|
|
24.5 |
A2s |
VGRM |
Peak Reverse Gate Voltage |
IGR = 10 µA |
|
|
8 |
V |
IGM |
Peak Gate Current |
20 µs max. |
|
|
4 |
A |
PGM |
Peak Gate Dissipation |
20 µs max. |
|
|
5 |
W |
PG(AV) |
Gate Dissipation |
20ms max. |
|
|
1 |
W |
Tj |
Operating Temperature |
|
|
-40 |
+125 |
ºC |
Tstg |
Storage Temperature |
|
|
-40 |
+150 |
ºC |
Tsld |
Soldering Temperature |
10s max. |
|
|
260 |
ºC |
SYMBOL |
PARAMETER |
CONDITIONS |
|
VOLTAGE |
|
Unit |
|
|
|
B |
D |
M |
|
VDRM |
Repetitive Peak Off State |
RGK = 1 KΩ |
200 |
400 |
600 |
V |
VRRM |
Voltage |
|
|
|
|
|
Apr - 03
FS0802.H
SENSITIVEGATESCR
Electrical Characteristics
SYMBOL |
PARAMETER |
|
CONDITIONS |
|
SENSITIVITY |
Unit |
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
02 |
|
IGT |
Gate Trigger Current |
|
Ω |
. Tj = 25 ºC |
MAX |
200 |
µA |
|
VD = 12 VDC , RL = 140 |
|
|
|
|||||
IDRM / IRRM |
|
|
|
|
mA |
|||
Off-State Leakage Current |
VD = VDRM , RGK = 220Ω |
Tj = 125 ºC |
MAX |
1 |
||||
|
|
VR = VRRM , |
|
|
Tj = 25 ºC |
MAX |
5 |
µA |
VTM |
On-state Voltage |
at IT = 16 Amp, tp = 380 µs, Tj = 25 ºC |
MAX |
1.6 |
V |
|||
VGT |
Gate Trigger Voltage |
|
Ω |
, Tj = 25 ºC |
MAX |
0.8 |
V |
|
VD = 12 VDC , RL = 140 |
|
|
||||||
VGD |
Gate Non Trigger Voltage |
VD = VDRM , RL = 3.3KΩ, |
|
RGK = 220Ω |
MIN |
0.1 |
V |
|
|
|
Tj = 125 ºC |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
IH |
Holding Current |
IT = 50 mA, |
RGK = 1KΩ |
|
Tj = 25 ºC |
MAX |
5 |
mA |
IL |
Latching Current |
IG = 1 mA, |
RGK = 1 KΩ |
MAX |
6 |
mA |
||
dv / dt |
Critical Rate of Voltage Rise |
VD = 0.67 x VDRM , RGK = 220Ω, |
MIN |
5 |
V/µs |
|||
|
|
Tj = 125 ºC |
|
|
|
|
|
|
di / dt |
Critical Rate of Current Rise |
IG = 2 x IGT Tr ≤ 100 ns, F = 60 Hz, |
MIN |
50 |
A/µs |
|||
|
|
|
Tj = 125 ºC |
|
|
|
||
Rth(j-c) |
Thermal Resistance |
|
|
|
|
|
20 |
ºC/W |
|
Junction-Case for DC |
|
|
|
|
|
|
|
Rth(j-a) |
Thermal Resistance |
|
|
|
|
|
60 |
ºC/W |
|
Junction-Amb for DC |
|
|
|
|
|
|
|
Vt0 |
Threshold Voltage |
Tj = 125 ºC |
|
|
|
MAX |
0.85 |
V |
Rd |
Dynamic resistance |
Tj = 125 ºC |
|
|
|
MAX |
46 |
mΩ |
|
|
|
|
|
|
|
|
|
PARTNUMBERINFORMATION
|
|
F S 08 |
02 B H 00 TR |
||||||||||||
FAGOR |
|
|
|
|
|
|
|
|
|
|
|
|
|
PACKAGING |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SCR |
|
|
|
|
|
|
|
|
|
|
|
|
|
FORMING |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
CASE |
||||
|
|
|
|
|
|
|
|
|
|||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
CURRENT |
|
|
|
|
|
|
|
|
|
VOLTAGE |
|||||
|
|
|
|
|
|
|
|
|
|||||||
|
|
|
|
|
SENSITIVITY |
||||||||||
|
|
|
|
||||||||||||
|
|
|
|
|
|
|
|
|
|||||||
|
|
|
|
|
|
|
|
|
Apr - 03