FS0609.H
STANDARDSCR
TO220-AB |
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On-State Current |
Gate Trigger Current |
6 Amp |
> 2 mA to < 15 mA |
Off-State Voltage |
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200 V ÷ 600 V |
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These series of Silicon Controlled |
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R ectifier use a high performance |
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PNPN technology. |
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These parts are intended for general |
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purpose applications where high gate |
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sensitivity is required using surface |
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mount technology. |
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Absolute Maximum Ratings, according to IEC publication No. 134 |
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SYMBOL |
PARAMETER |
CONDITIONS |
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Min. |
Max. |
Unit |
IT(RMS) |
On-state Current |
180º Conduction Angle, Tc = 110 ºC |
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6 |
A |
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IT(AV) |
Average On-state Current |
Half Cycle, Θ = 180 º, TC = 110 ºC |
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3.8 |
A |
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ITSM |
Non-repetitive On-State Current |
Half Cycle, 60 Hz |
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73 |
A |
ITSM |
Non-repetitive On-State Current |
Half Cycle, 50 Hz |
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70 |
A |
I2t |
Fusing Current |
tp = 10ms, Half Cycle |
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24.5 |
A2s |
VGRM |
Peak Reverse Gate Voltage |
IGR = 10 µA |
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5 |
V |
IGM |
Peak Gate Current |
20 µs max. |
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4 |
A |
PGM |
Peak Gate Dissipation |
20 µs max. |
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10 |
W |
PG(AV) |
Gate Dissipation |
20ms max. |
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1 |
W |
Tj |
Operating Temperature |
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-40 |
+125 |
ºC |
Tstg |
Storage Temperature |
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-40 |
+150 |
ºC |
Tsld |
Soldering Temperature |
10s max. |
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260 |
ºC |
SYMBOL |
PARAMETER |
CONDITIONS |
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VOLTAGE |
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Unit |
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B |
D |
M |
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VDRM |
Repetitive Peak Off State |
RGK = 1 KΩ |
200 |
400 |
600 |
V |
VRRM |
Voltage |
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Dec - 02
FS0609.H
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STANDARD |
SCR |
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Electrical Characteristics |
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SYMBOL |
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PARAMETER |
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CONDITIONS |
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SENSITIVITY |
Unit |
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09 |
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IGT |
Gate Trigger Current |
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Ω |
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MIN |
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2 |
mA |
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VD = 12 VDC , RL = 33 . Tj = 25 ºC |
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MAX |
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15 |
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IDRM / IRRM |
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MAX |
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mA |
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Off-State Leakage Current |
VD = VDRM , |
Tj = 25 ºC |
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0.01 |
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VR = VRRM , |
Tj = 110 ºC |
MAX |
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2 |
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VTM |
On-state Voltage |
at IT = 12 Amp, tp = 380 µs, Tj = 25 ºC |
MAX |
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1.6 |
V |
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VGT |
Gate Trigger Voltage |
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Ω |
= 25 ºC |
MAX |
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1.5 |
V |
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VD = 12 VDC , RL = 33 , Tj |
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VGD |
Gate Non Trigger Voltage |
VD = VDRM , RL = 3.3KΩ, |
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MIN |
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0.2 |
V |
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Tj = 125 ºC |
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IH |
Holding Current |
IT = 100 mA , Gate open |
Tj = 25 ºC |
MAX |
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30 |
mA |
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IL |
Latching Current |
IG = 1.2 IGT |
Tj = 25 ºC |
TYP |
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50 |
mA |
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dv / dt |
Critical Rate of Voltage Rise |
VD = 0.67 x VDRM , Gate open Tj = 110 ºC |
MIN |
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200 |
V/µs |
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di / dt |
Critical Rate of Current Rise |
IG = 2 x IGT Tr ≤ 100 ns, F = 60 Hz, |
MIN |
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50 |
A/µs |
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Tj = 125 ºC |
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Rth(j-c) |
Thermal Resistance |
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2.5 |
ºC/W |
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Junction-Case for DC |
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Rth(j-a) |
Thermal Resistance |
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60 |
ºC/W |
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Junction-Amb for DC |
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Vt0 |
Threshold Voltage |
Tj = 125 ºC |
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MAX |
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0.85 |
V |
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Rd |
Dynamic resistance |
Tj = 125 ºC |
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MAX |
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46 |
mΩ |
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PARTNUMBERINFORMATION
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F S 06 |
09 B H 00 TR |
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FAGOR |
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PACKAGING |
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SCR |
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FORMING |
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CASE |
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CURRENT |
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VOLTAGE |
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SENSITIVITY |
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Dec - 02