Sony PDW-700, CBK-SC02, CBK-HD01 User Manual

PROFESSIONAL DISC CAMCORDER

PDW-700

HD/SD SDI INPUT BOARD

CBK-HD01

ANALOG COMPOSITE INPUT BOARD

CBK-SC02

MAINTENANCE MANUAL Volume 1 1st Edition (Revised 2) Serial No. 10001 and Higher

! WARNING

This manual is intended for qualified service personnel only.

To reduce the risk of electric shock, fire or injury, do not perform any servicing other than that contained in the operating instructions unless you are qualified to do so. Refer all servicing to qualified service personnel.

! WARNUNG

Die Anleitung ist nur für qualifiziertes Fachpersonal bestimmt.

Alle Wartungsarbeiten dürfen nur von qualifiziertem Fachpersonal ausgeführt werden. Um die Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung dazu besitzen.

! AVERTISSEMENT

Ce manual est destiné uniquement aux personnes compétentes en charge de l’entretien. Afin de réduire les risques de décharge électrique, d’incendie ou de blessure n’effectuer que les réparations indiquées dans le mode d’emploi à moins d’être qualifié pour en effectuer d’autres. Pour toute réparation faire appel à une personne compétente uniquement.

PDW-700/V1 (E)

CAUTION

Danger of explosion if battery is incorrectly replaced.

Replace only with the same or equivalent type recommended by the manufacturer.

Dispose of used batteries according to the manufacturer’s instructions.

Vorsicht!

Explosionsgefahr bei unsachgemäßem Austausch der Batterie.

Ersatz nur durch denselben oder einen vom Hersteller empfohlenen ähnlichen Typ. Entsorgung gebrauchter Batterien nach Angaben des Herstellers.

ATTENTION

Il y a danger d’explosion s’il y a remplacement incorrect de la batterie.

Remplacer uniquement avec une batterie du même type ou d’un type équivalent recommandé par le constructeur.

Mettre au rebut les batteries usagées conformément aux instructions du fabricant.

PDW-700/V1 (E)

ADVARSEL!

Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.

Udskiftning må kun ske med batteri af samme fabrikat og type.

Levér det brugte batteri tilbage til leverandøren.

ADVARSEL

Lithiumbatteri - Eksplosjonsfare. Ved utskifting benyttes kun batteri som

anbefalt av apparatfabrikanten. Brukt batteri returneres apparatleverandøren.

VARNING

Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en likvärdig typ som rekommenderas av apparattillverkaren. Kassera använt batteri enligt gällande föreskrifter.

VAROITUS

Paristo voi räjähtää jos se on virheellisesti asennettu.

Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.

Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

1 (P)

CLASS 1 LASER PRODUCT

LASER KLASSE 1 PRODUKT

LUOKAN 1 LASERLAITE

KLASS 1 LASER APPARAT

This Professional Disc Camcorder is classified as a CLASS 1 LASER PRODUCT.

Laser Diode Properties

Wavelength: 400 to 410 nm

Emission duration: Continuous

Laser output power: 135 mW (max. of pulse peak),

65 mW (max. of CW)

Standard: IEC60825-1 (2001)

GEFAHR

Bei geöffnetem Laufwerk und beschädigter oder deaktivierter Verriegelung tritt ein unsichtbarer Laserstrahl aus. Direkter Kontakt mit dem Laserstrahl ist unbedingt zu vermeiden.

This label is located insidethe outside panel of the unit.

CAUTION

The use of optical instruments with this product will increase eye hazard.

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

X-RAY RADIATION WARNING

Be sure that parts replacement in the high voltage block and adjustments made to the high voltage circuits are carried out precisely in accordance with the procedures given in this manual.

For safety, do not connect the connector for peripheral device wiring that might have excessive voltage to the following port(s).

: Network connector

Follow the instructions for the above port(s).

2 (P)

PDW-700/V1 (E)

Table of Contents

Manual Structure				1-9. Replacing the Flat Cables, Flexible Card
					Wires/Boards ................................................................		1-45
Purpose of this manual .................................................................			5	1-10. Service Tools/Measuring Equipment List			1-46
Related manuals ...........................................................................			5	1-10-1.		Service Tools .......................................................	1-46
				1-10-2.		Measuring Equipment .........................................	1-47
1.	Service Overview			1-11.	Firmware/Software .......................................................		1-48
				1-11-1.		EEPROM/FRAM List .........................................	1-48
				1-11-2.		Firmware Update Using the USB Memory .........	1-49
1-1. Locations of Main Parts ..................................................			1-1	1-11-3.		Software Option Registration Method
1-1-1.		Locations of the Printed Wiring Boards ................	1-1			by Using USB Memory .......................................	1-51
1-1-2.		Locations of Main Mechanical Parts .....................	1-3	1-12.	Other Overview		1-52
1-2.	Circuit Description ..........................................................		1-4	1-12-1.		Notes on Handling Optical Block Assembly ......	1-52
1-2-1.		Camera System ......................................................	1-4	1-12-2.		Standard Torque for Screws ................................	1-53
1-2-2.		CCD Block ............................................................	1-5	1-12-3.		Stop Washer ........................................................	1-53
1-2-3.		Video Signal System .............................................	1-5	1-12-4.		Description of CCD Block Number ....................	1-54
1-2-4.		System Control ......................................................	1-6	1-12-5.		Memory Backup Battery .....................................	1-54
1-2-5.		Digital Audio System ..........................................	1-12	1-12-6.		IC Link Replacement ..........................................	1-54
1-2-6.		Audio System ......................................................	1-12	1-12-7.		Circuit Protection Element ..................................	1-54
1-2-7.		Audio DSP Operation Processing .......................	1-14	1-12-8.		Precautions for Use of Condensation Sensor ......	1-55
1-2-8.		Optical Drive System ..........................................	1-16	1-12-9.		Precautions for the Battery Connector ................	1-55
1-2-9.		Power Supply Systems ........................................	1-17	1-12-10.		Notes on Repair Parts ..........................................	1-55
1-2-10.		LCD System ........................................................	1-18	1-12-11.		Unleaded Solder ..................................................	1-55
1-2-11.		Others ..................................................................	1-18
1-3.	Matching Connectors ....................................................		1-20
1-4. Signal Inputs and Outputs .............................................			1-20	2.	XDCAM Web Site
1-5.	On-Board Switch and LED Function ...........................		1-24
1-6. How to Take Out a Cartridge Manually			1-34	2-1.	XDCAM Web Site Overview .........................................		2-1
1-6-1.		Taking Out a Cartridge at Power-off ...................	1-34	2-2.	Status Menu ....................................................................		2-3
1-6-2.		When You Cannot Take Out a Cartridge Even		2-2-1.		Device Information ...............................................	2-3
		If Pressing the EJECT Button at Power-on .........	1-34	2-2-2.		Hours Meter ...........................................................	2-4
1-7.	Removing/Installing		1-35	2-2-3.		Software Version ...................................................	2-5
1-7-1.		Removing Outside Panel .....................................	1-35	2-3.	Disc Menu .......................................................................		2-7
1-7-2.		Reinstalling Outside Panel ..................................	1-35	2-3-1.		Disc Properties ......................................................	2-7
1-7-3.		Inside Panel .........................................................	1-35	2-3-2.		Thumbnails ............................................................	2-7
1-7-4.		Handle Assembly ................................................	1-36	2-4.	Maintenance Menu .........................................................		2-8
1-7-5.		Front Panel ..........................................................	1-37	2-4-1.		Software Update ....................................................	2-8
1-7-6.		SW Guard Assembly ...........................................	1-38	2-4-2.		Account ...............................................................	2-13
1-7-7.		Shoulder Pad, Connector Cover ..........................	1-38	2-4-3.		Network ...............................................................	2-14
1-7-8.		Connector Panel Assembly .................................	1-39	2-4-4.		License Registration ............................................	2-15
1-7-9.		Rear Panel Assembly ..........................................	1-40
1-7-10.		Battery Connector ...............................................	1-40
1-8.	Removing/Installing LCD Block ..................................		1-41
1-8-1.		LCD Block ..........................................................	1-41
1-8-2.		LCD Hinge ..........................................................	1-43
1-8-3.		LCD Backlight and LCD Panel ...........................	1-44

PDW-700/V1 (E)

1

3.	Error Messages
3-1.	Error Messages Overview ...............................................		3-1
3-2.	Error Code List ...............................................................		3-2
3-2-1.		Main Code and Sub Code ......................................	3-2
3-2-2.		Error 0X .................................................................	3-3
3-2-3.		Error 20 .................................................................	3-4
3-2-4.		Error 3X .................................................................	3-5
3-2-5.		Error 5X .................................................................	3-5
3-2-6.		Error 6X .................................................................	3-5
3-2-7.		Error 91 .................................................................	3-6
3-2-8.		Error 92 .................................................................	3-7
3-2-9.		Error 95 .................................................................	3-7

4.	Setup Menu
4-1.	Setup Menus ...................................................................		4-1
4-1-1.		Basic Operations of Setup Menus .........................	4-1
4-1-2.		How to Display the SERVICE Menu ....................	4-1
4-2.	TOP Menu ......................................................................		4-2
4-3.	USER Menu ....................................................................		4-3
4-4.	OPERATION Menu .......................................................		4-4
4-5.	PAINT Menu ................................................................		4-27
4-6.	MAINTENANCE Menu ...............................................		4-38
4-7.	FILE Menu ....................................................................		4-56
4-8.	DIAGNOSIS Menu ......................................................		4-65
4-9.	SERVICE Menu ...........................................................		4-69
4-10.	Drive Maintenance ........................................................		4-85
4-10-1.		Basic Operation on Drive Maintenance
		Menus ..................................................................	4-85
4-10-2.		TEMPERATURE SENSOR ...............................	4-85
4-10-3.		DEW SENSOR ...................................................	4-86
4-10-4.		FAN MOTOR .....................................................	4-86
4-10-5.		ACCELERATION SENSOR ..............................	4-87
4-10-6.		LOADER .............................................................	4-88
4-10-7.		SLIDER-AUTO TEST ........................................	4-91
4-10-8.		IN-LIM TEST .....................................................	4-91
4-10-9.		OUT-LIM TEST .................................................	4-92
4-10-10.		SPINDLE MOTOR-AUTO TEST ......................	4-92
4-10-11.		FOCUS ACTUATOR .........................................	4-93
4-10-12.		TRACKING ACTUATOR .................................	4-94
4-10-13.		SA ACTUATOR .................................................	4-94
4-10-14.		LASER ................................................................	4-95
4-10-15.		ND FILTER .........................................................	4-95
4-10-16.		SKEW ..................................................................	4-96
4-10-17.		LENS CLEANING .............................................	4-97
4-10-18.		SERVO_1 ............................................................	4-97

4-10-19. SKEW ..................................................................			4-97
4-10-20. SERVO_2 ............................................................			4-97
4-10-21.		ACCELERATION OFFSET ...............................	4-98
4-10-22.		ERROR LOGGER ..............................................	4-99
4-10-23. VERSION ..........................................................			4-100
4-10-24.		SERIAL NO ......................................................	4-100
4-10-25.		CLEAR MEDIA LOG ......................................	4-100
4-10-26. UPLOAD TO EEPROM ...................................			4-100
4-11. AUDIO A/D Error Correction ....................................			4-101
4-12. AUDIO D/A Error Correction ....................................			4-102
4-13.	AUDIO LEVEL Volume Compensation ....................		4-102
4-14.	Adjusting Battery End Detection Voltage ..................		4-103
4-15.	SERVICE SUPPORT Menu .......................................		4-104
4-16.	Setup Menu List ..........................................................		4-105

5.	File System
5-1. Structure of File System .................................................			5-1
5-2.	Data Structure .................................................................		5-2
5-3.	Operating the Files and the Data Flow ...........................		5-3
5-3-1.		USER FILE ...........................................................	5-3
5-3-2.		ALL FILE ..............................................................	5-5
5-3-3.		REFERENCE FILE ...............................................	5-7
5-3-4.		Other FILE (SCENE FILE and LENS FILE) .......	5-9
5-3-5.		SERVICE FILE ...................................................	5-10
5-3-6.		Other RESET .......................................................	5-11
5-4.	Special Items to Save ....................................................		5-12
5-4-1.		White Gain ..........................................................	5-12
5-4-2.		Master Gain .........................................................	5-13
5-4-3.		Shutter .................................................................	5-13

6. Periodic Maintenance and Inspection

6-1. Periodic Check/Replacement Parts List ..........................			6-1
6-2.	Cleaning ..........................................................................		6-2
6-2-1.		General Information for the Use of Cleaning
		Cloth ......................................................................	6-2
6-2-2.		Cleaning Loader Assembly ...................................	6-2
6-2-3.		Cleaning Spindle Motor ........................................	6-3
6-2-4.		Cleaning Pickup Lens ............................................	6-3
6-3. Cares after Using under Special Environment ................			6-4
6-4.	Digital Hours Meter ........................................................		6-5
6-4-1.		Display Method and Reset Methods .....................	6-5
6-5.	Recommended Replacement Parts .................................		6-6
6-6. Precautions for the Battery Connector ............................			6-8
6-7.	Precaution on Hanging Bracket of Handle .....................		6-8

2	PDW-700/V1 (E)

7.	Replacement of Main Parts			7-8. Service Action After Replacing or Repairing
					the Board .......................................................................		7-39
7-1.	Optical Drive Assembly .................................................		7-1	7-8-1.		Optical Block Assembly ......................................	7-39
7-1-1.		Removing/Reinstalling Loader Assembly ............	7-1	7-8-2.		AT-177 Board .....................................................	7-39
7-1-2.		Removing/Reinstalling Drive Sub Assembly .......	7-5	7-8-3.		CN-3005 Board ...................................................	7-39
7-1-3.		Replacing Cleaner Assembly ................................	7-7	7-8-4.		DCP-44 Board .....................................................	7-39
7-1-4.		Replacing Loading Motor Assembly ....................	7-8	7-8-5.		SY-355 Board ......................................................	7-40
7-1-5.		Replacing Optical Block Assembly ......................	7-9	7-8-6.		FP-157 Board ......................................................	7-40
7-1-6.		Replacing No.2/No.3 Gear Assemblies ...............	7-12	7-8-7.		DR-606 Board .....................................................	7-40
7-1-7.		Replacing Seek Motor Assembly ........................	7-14	7-8-8.		SE-857 Board ......................................................	7-40
7-1-8.		Replacing Spindle Motor ....................................	7-15
7-1-9.		Removing/Reinstalling Lock Release
		Assembly .............................................................	7-16	8.	Optical Drive Alignment
7-1-10.		Removing/Reinstalling LD Motor ......................	7-17
7-2. Removing/Reinstalling Mounted Circuit Board of the				8-1. Optical Drive Alignment Overview ................................			8-1
	Optical Drive ................................................................		7-18	8-1-1.		Precautions ............................................................	8-1
7-2-1.		SE-709 Board .....................................................	7-18	8-1-2.		Fixtures ..................................................................	8-1
7-2-2.		SE-857 Board .....................................................	7-19	8-1-3.		Preparations Before Adjustment ...........................	8-1
7-2-3.		SE-858 Board .....................................................	7-21	8-2. Procedures After Replacing the Optical Block
7-3. Replacing Fan Motor (Drive) .......................................			7-23		Assembly and the Board .................................................		8-1
7-4. Replacing Fan Motor (Rear) .........................................			7-24	8-2-1.		Adjustment After Replacing the Optical
7-5.	Removing/Reinstalling CCD Unit ................................		7-25			Block Assembly ....................................................	8-1
7-5-1.		Removing CCD Unit ...........................................	7-25	8-2-2.		Adjustment After Replacing the DR-606
7-5-2.		Reinstalling CCD Unit ........................................	7-26			Board .....................................................................	8-1
7-6.	Service Action After Replacing the CCD Unit		7-27	8-2-3.		Adjustment After Replacing the SE-857 Board ....	8-1
7-7.	Removing/Installing Boards		7-28	8-3.	Servo1 Automatic Adjustment .......................................		8-2
7-7-1.		CN-2947 Board and TG-260 Board ....................	7-28	8-4.	Skew Adjustment ............................................................		8-3
7-7-2.		AT-177 Board and DCP-44 Board ......................	7-28	8-4-1.		Tangential Skew Adjustment ................................	8-3
7-7-3.		DVP-45 Board and SY-355 Board ......................	7-29	8-4-2.		Radial Skew Adjustment .......................................	8-5
7-7-4.		ENC-118 Board, HP-148 Board and		8-5.	Servo2 Automatic Adjustment .......................................		8-6
		SW-1391 Board ...................................................	7-29	8-6.	Clearing Media Log ........................................................		8-6
7-7-5.		FP-157 Board ......................................................	7-30	8-7.	After Adjustment		8-6
7-7-6.		CN-2946 Board and CN-3026 Board ..................	7-31
7-7-7.		KY-623 Board .....................................................	7-32
7-7-8.		CN-3025 Board and SW-1425 Board .................	7-32
7-7-9.		CN-3001 Board ...................................................	7-33
7-7-10.		IO-235 Board .......................................................	7-33
7-7-11.		CI-37 Board .........................................................	7-33
7-7-12.		PS-731 Board ......................................................	7-34
7-7-13.		AXM-38 Board, CN-2948 Board,
		SW-1352 Board and RM-216 Board ...................	7-34
7-7-14.		MS-86 Board .......................................................	7-34
7-7-15.		CNB-25 Board and PS-708 Board ......................	7-35
7-7-16.		CN-3005 Board and SW-1426 Board .................	7-35
7-7-17.		DR-606 Board .....................................................	7-36
7-7-18.		RE-246 Board ......................................................	7-37
7-7-19.		RX-101 Board .....................................................	7-37
7-7-20.		MB-1111 Board ...................................................	7-38

PDW-700/V1 (E)

3

9.	Electrical Alignment
9-1.	Preparation ......................................................................		9-1
9-1-1.		Fixtures and Equipment ........................................	9-1
9-1-2.		Connection ............................................................	9-1
9-1-3.		Switch Setting before Adjustment .........................	9-2
9-1-4.		Notes on Adjustment .............................................	9-2
9-1-5.		Gray-Scale Chart and its Maintenance ..................	9-3
9-2.	Adjustment ......................................................................		9-4
9-2-1.		Confirming VCO CONT Frequency .....................	9-4
9-2-2.		Modulator Balance Adjustment ............................	9-4
9-2-3.		VA Gain Adjustment .............................................	9-5
9-2-4.		Black Shading Adjustment ....................................	9-6
9-2-5.		White Shading Adjustment ...................................	9-7
9-2-6.		Black Set Adjustment ............................................	9-8
9-2-7.		Flare Adjustment ...................................................	9-9
9-2-8.		Auto Iris Adjustment ...........................................	9-10
9-2-9.		RPN Adjustment .................................................	9-11
9-2-10.		S/H DC Adjustment ............................................	9-12
9-2-11.		RPN Correction Procedure ..................................	9-13

4	PDW-700/V1 (E)

Manual Structure

Purpose of this manual

There are volume 1 and volume 2 in the Maintenance manual of PDW-700.

The maintenance manuals (volume 1, 2) are intended for use by trained system and service engineers, and provides the information of maintenance and detailed service.

Related manuals

The following manuals are available in this model.

If this manual is required, please contact your local Sony Sales Office/Service Center.

.Operation Manual (Supplied with the unit)

This manual is necessary for application and operation (and installation) of this unit.

.Maintenance Manual

Volume 1: Describes about maintenance information, parts replacement, and guideline for adjustment.

Part number: 9-968-417-03

Volume 2: Describes about block diagrams, schematic diagrams, board layouts and detailed parts list required for parts-level service.

Part number: 9-968-435-03

.“Semiconductor Pin Assignments” CD-ROM

This “Semiconductor Pin Assignments” CD-ROM allows you to search for semiconductors used in Broadcast and Professional equipment.

This manual contains a complete list of semiconductors and their ID Nos., and thus should be used together with the CD-ROM.

Part number: 9-968-546-06

PDW-700/V1 (E)

5

Section 1

Service Overview

1-1. Locations of Main Parts

1-1-1. Locations of the Printed Wiring Boards

Main unit

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1 AT-177	$- SW-1391
2 AXM-38	$= SW-1425
3 CI-37	$[ SW-1426
4 CN-2946	$] SY-355
5 CN-2947	$\ TG-260
6 CN-2948
7 CN-3001
8 CN-3005
9 CN-3025
0 CN-3026
!- CNB-25
!= DCP-44
![ DET-45
!] DET-47
!\ DR-606
!; DR-617
!' DVP-45
!, ENC-118
!. FP-157
@/ HP-148
@- HP-149
@= IO-235
@[ KY-623
@] LED-444
@\ MA-162
@; MB-1111
@' MS-86
@, PA-342/342A
@. PA-343/343A
#/ PA-344
#- PD-118
#= PS-708
#[ PS-731
#] RE-246
#\ RM-216
#; RX-101
#' SE-924
#, SW-1249
#. SW-1352
$/ SW-1385

PDW-700/V1 (E)

1-1

Optical drive

4

2

1

3

1 SE-709

2 SE-857

3 SE-858

4 SW-1125G

1-2	PDW-700/V1 (E)

1-1-2. Locations of Main Mechanical Parts

3

4

2	5
1

9

!/

![

7

!-

6

8

!=

1 CCD unit	!- Optical block assembly
2 Filter knob	!= Seek motor assembly
3 LCD Hinge assembly	![ Spindle motor
4 LCD back light
5 Fan motor (exhaust)
6 Fan motor (drive)
7 Loader assembly
8 Cleaner assembly
9 Loading motor assembly
!/ Drive sub assembly

PDW-700/V1 (E)

1-3

1-2. Circuit Description

1-2-1. Camera System

AT-177 board

The AT-177 board is the microprocessor board that controls the camera block.

1. Microprocessor peripherals

The CPU (IC209) uses SH2A (R5S7206), and the clock provides 32 MHz from an external source that is six multiplication in the CPU so that the clock runs on 192 MHz. The memory is composed of 64 MBit flash memory (IC302, IC303), 16 MBit SRAM (IC3056), and 1 MBit FRAM (IC308).

2. A/D input of the CPU

The A/D port equipped to the CPU is connected to the following signal lines and monitored: CC position, ND position, temperature, IRIS position of a camera lens, ZOOM position, and mic volume level.

3. Internal communication

The serial communication includes intercommunication with the BleConSh IC on the DCP-44 board, the writing controls to the character generator IC, and intercommunication with the disc.

The parallel communication is equipped with the 8-bit data line, the total 11-bit address line (A0-A7, A14-A16), control line clock, XRD, XWR, OE, DIR, CS, and (QWERTY, ZXCV, TG).

In addition, the intercommunication is performed with EEPROM on the DCP-44 board, the DAC and I/O port IC for the video signal, and the I/O port IC on the FP-157 board with the I2C line that is installed directly to the CPU.

4. Memory stick circuit

The memory stick controller IC (IC610) is driven at 16 MHz, and the two-way communication and the clock signal are directly connected from the connector (CN602) to the memory stick connector of the MS-86 board via the coaxial harness. This is compatible with the Memory Stick PRO/DUO.

5. External communication

The 2 channel serial communication driver CXD9093R (IC411) is equipped and performs external communication with the remote control unit RM-B150/B750.

6. ROM jig connector (CN601)

The connector CN101 that can be connected to the jig for writing the boot program (MS-86 board) is included.

1-4

DCP-44 board

The DCP-44 board consists of the block for A/D conversion of the analog RGB signal from the PA-342/PA-342A/PA- 343/PA-343A/PA-344 board via the feedback clamp circuit, the cam-era DSP block that performs the signal processing, the dri-ver block that sends the analog signal that is D/A con- vert-ed to the outputs, and the I/F block to the AT-177 board.

After passing through the pre-filter (FL300 to FL302), the analog RGB signal input from the PA-342/PA-342A/PA- 343/PA-343A/PA-344 board is converted to 74 MHz rate 14-bit digital RGB sign-al by the A/D converter (IC107 to IC109), then input into the camera processor IC (IC600).

The camera signal processor IC (IC600) detects the average value and the peak value of the camera video signals that are required for the AUTO operations of the camera such as AUTO black balance, AUTO white balance, and AUTO iris control. The detected average value and peak value are sent to the AT-microprocessor on the AT-177 board. In addition to the above operations, the 25/30 PsF conversion function and the 1080 to 720 conversion function are realized by using the DDR SDRAM (IC700 to 704).

After passing through white balance, white shading, and flare correction, the camera main video signal performs the Digital GAIN UP, then performs the Digital Noise Reduction. Then, the matrix signal and the detail signal are added to perform pedestal control, gamma correction, knee correction, and white clip processing. After passing through the selector circuit with which either the camera main video signal or the color bar signal can be selected, the selected signal is output from IC (IC600) to IC800.

The digital VBS signal and the digital Y signal for VF supplied from the camera signal processor IC (IC800) are converted into the analog VBS signal and analog VF signal by the D/A converter* (IC1513, IC1524, IC1525). After passing through the circuit with which either the camera analog VBS signal or the VF Y can be selected, the selected signal is output to the TEST OUT connector. After passing through the circuit with which either the GENLOCK IN connector input or the video signal can be selected, the selected signal is output to the VF connector. In addition, the sync separation circuit and the PLL circuit to synchronize with the external input video of the GENLOCK IN connector are included.

The detected average value of the video signal detected in the camera signal processor IC (IC600) and peak value are loaded to the AT-microprocessor on the AT-177 board through the 8-bit data bus.

PDW-700/V1 (E)

At the same time, various control signals are controlled by the AT-177 board via I/O Expander (IC3, IC4, IC67).

All volumes are controlled electronically, and the level adjustment is adjusted from the menu.

The main functions of IC800 are the down-conversion HD to SD, the conversion 720 to 1080 for VF output, and the VF DETAIL generation processing digital ECN processing.

The camera main signal of the SD system is output to IC1000.

After performing the multiplex and parallel-serial conversion on the character signal, audio signal, and the ancillary signal in IC1000, the HD signal and SD signal output from IC800 pass through IC (IC1112, IC1113) and are output to SDI1 and SDI2 connectors as the HD-SDI and SD-SDI signals. After another system performs scaling in IC1000 through the SDRAM (IC1309), the HD signal output from IC800 passes through the D/A converter (IC1518) and the video signal is sent to the LCD display. The HD signal output from IC600 is sent to the recording system (DVP-45 board) through multiple character signals in IC1000. After the signal from the RX-105 board on the SDI input option and the SDI signal from the 50-pin I/F are selected internally in IC1000, the signals are separated into the video signal, audio signal, and the ancillary signal, then sent to the recording system (DVP-45 board).

*:The main functions of IC800 are the down-conversion HD to SD, the conversion 720 to 1080 for VF output, and the VF DETAIL generation processing digital ECN processing. The camera main output of the SD system is output to IC1000.

1-2-2. CCD Block

PA-342/PA-342A/PA-343/PA-343A/PA-344 board

The CCD drive pulses that are supplied from the TG-260 board are amplified so that these pulses can drive the CCD imagers directly (IC2: H Driver). On the other hand, the CCD output signals are amplified approximately two times and input to IC10. The video signal is drawn by the co-rel- ated dual sampling inside IC10 and GAIN UP of 0 to 12 dB is performed by the internal GAIN AMP. In addition, the differences in the CCD sensitivity are adjusted by adjusting GAIN. In addition to the above operations, the temperature that is detected by the temperature sensor (IC4) is converted to the voltage data and is sent to the AT177 board via the DCP-44 board.

TG-260 board

The pulses that drive the CCD imagers and the pulses that are used for sample-and-hold of the CCD output signals

PDW-700/V1 (E)

are generated by IC8 and are sent to the DR-617 board. These pulses are generated from the 74 MHz clock in synchronization with the HD VD signal input from the DCP-44 board. In addition, the TG-260 board has an interface circuit with the optical filter.

DR-617 board

The CCD drive pulses input from the TG-260 board and the sample-and-hold pulse are latched and output to the PA-342/PA-342A/PA-343/PA-343A/PA-344 boards. In addition, the DR-617 board has the V driver of CCD.

The CCD V sub voltage and CCD sensitivity adjustment data are recorded in the EEPROM (IC20).

1-2-3. Video Signal System

DVP-45 board

1. Baseband/Video signal processing system <Recording system>

The component parallel digital video signal supplied from the video circuit of the DCP-44 board is input to LVIS (IC400) of the DVP-45 board.

Signal pre-processing such as the filtering and scaling is performed in this system.

<Playback system>

The playback digital video data is loaded from LVIS (IC400) and sent to the DCP-44 board via the MB board as the component parallel digital video signal.

The component parallel digital video signal sent to the DCP-44 board is distributed to each path of HD/SD-SDI, VF, COLOR-LCD, and down-conversion and encoding to the composite video signal are performed according to the setting.

2. Video compression signal processing system <Recording system>

The recording digital video signal that has undergone signal processing on the DVP-45 board is sent to MPEG2VIDEO Codec (TORINO: IC1000, 1200, 1400) and compressed to the MPEG-2 VIDEO format.

The compressed digital video data is sent to PIER G4 (IC1900) and written to PIER_SDRAM (IC1901 to IC1904). The recording digital video signal is encoded to MPEG4VIDEO format in LVIS (IC400) at the same time and generated as the Proxy video data.

The generated Proxy video data is sent to PIER G4 (IC1900) and written to PIER_SDRAM (IC1901 to IC1904).

1-5

The recording digital data via i.LINK/network is sent to PIER G4 (IC1900) via the PCI bus and written to PIER_SDRAM (IC1901 to IC1904).

While recording on a disc, the data in PIER_SDRAM (IC1901 to IC1904) is sent to the DR-606 board via the ATA interface.

<Playback system>

The playback video data and the Proxy video data are sent to PIER G4 (IC1900) via the ATA interface and written to PIER_SDRAM (IC1901 to IC1904).

The playback digital video data in PIER_SDRAM (IC1901 to IC1904) is sent to the MPEG2-VIDEO Codec (TORINO: IC1200, IC1400). Decode processing is performed and then the data is sent to LVIS (IC400).

The playback Proxy video data in PIER_SDRAM (IC1901 to IC1904) is sent from PIER G4 (IC1900) to LVIS (IC400) and decode processing is performed.

The Proxy video data is used as the video signal during the search.

The playback video data in PIER_SDRAM (IC1901 to IC1904) is provided to i.LINK/network via the PCI bus as the MXF file data.

3. Sync signal system

Whether the status is on record or on playback, 74/27 MHz clock, HD-F, HD-V, HD-H, HD-PB-F, SD-F, SD-V, and SD-H that are always input from the DCP-44 board are the reference signal.

Based on these reference clocks, the video sync timings and system timings are generated.

1-2-4. System Control

SY-355 board

1. Disc record/playback system control

The following functions are realized using the RISC microprocessor (hereinafter refer to as CPU: IC 200) as the CPU for the system control on the SY-355 board.

<PCI bus interface>

CPU is connected to PIER G4 (IC1900/DVP-45 board)/ FAM controller on the DVP-45 board and PCI-PCI Bridge (IC900) via the PCI bus interface to receive and send data with one another and perform control.

The PCI bus interface communicates with the following devices by relaying through PIER G4 (IC1900/DVP-45 board).

. CAVA (IC200/DVP-45 board)

1-6

.MPEG2-VIDEO CODEC (IC1000, 1200, 1400/DVP-45 board)

.AUDIO REC/PB DSP (IC800, 801/DVP-45 board)/ AUDIO Low Resolution DSP (IC900/DVP-45 board)

. LVIS (IC400/DVP-45 board)

. Optical Drive (DR-606 board)

. AT microprocessor (AT-177 board)

. FP microprocessor (FP-157 board)

. Character generator (IC503/DCP-44 board)

. LTC generator/reader (PIER G4 (IC1900) built-in)

The PCI bus interface is connected to the Linux system on the SY-355 board via the PCI-PCI Bridge (IC900/SY-355 board) and receives and sends data to the controllers.

<Memory controller>

. SDRAM (SY-355 board: IC201 to 204) control (32 bit x 64M word)

.Flash memory (IC505, IC506/SY-355 board) control (32 bit x 16 M word)

<Serial interface>

. EEPROM control saving the setting data

<External control bus (CPU LOCAL bus)>

.IN port/OUT port control

RESET signal output on each device, loading the switch

setting, and similar signals

. CAVA/PIER G4/FAM/BRIDGE each FPGA configuration

. FRAM (IC507/SY-355 board) control

2. Application device control system (Linux) This is the system that uses RISC microprocessor

(hereinafter refer to as CPU: IC1300) on the SY-355 board to control the device for the application. Linux is used as the OS.

CPU and peripheral circuit configuration is almost same as that of the system control.

<PCI bus interface>

The CPU exchanges data with the USB controller (IC1500) via the PCI bus interface. In addition, the CPU exchanges the data with the CPU of the system control via the PCI-PCI Bridge (IC500/SY-355 board) on the same bus.

<PCI BRIDGE (IC900)>

The functions of PCI BRIDGE are data relay of the PCI bus and the I/F function to the OSD display controller on the LVIS (IC400/DVP-45 board).

PDW-700/V1 (E)

<USB HOST Controller (IC1500)>

USB HOST Controller exchanged data with the USB devices such as the flash memory using the interface compatible with the USB 2.0.

<Ether interface>

Ether interface controls the Ether PHY (IC1/CN-2946 board) and connects to the network via it.

FP-157 board

The FP-157 board has the FP_CPU (IC921) as the submicroprocessor and the hardware consists of the synchronous and asynchronous serial communication, I2C communication bus, and the 8-bit bus. The main function is controlling the audio system.

Main functions

.Synchronous serial communication

The functions of synchronous serial communication are the color LCD monitor setting, monochrome LCD display, audio D/A setting, analog wireless communica-

tion, and the ITORON communication.

. Asynchronous serial communication Digital wireless communication.

.I2C bus

The rear connector, detection such as PLAY/STOP key, Info_BATTERY communication, Real Time Clock communication, Serial EEPROM (Memory) communication, and I/O control communication make up the 3-

channel I2C bus.

.8-bit bus

The 8-bit bus controls the serial communication bus

(SDA,SCL) of the 3-channel I2C bus controller (Parallel bus to I2C_bus Controller).

.CPU I/O

The CPU I/O loads the A/D and controls the I/O port terminal.

Main blocks

1.Audio mode control

2.AUDIO level indication

3.STOP/PLAY keys control

4.CTL/TC/UBIT control

5.Real Time Clock control

6.WARNING_LED control and alarm tone control

7.Wireless receiver (optional equipment) control

8.Software download function

9.Power supply voltage measuring circuit

10.Info-Battery communication circuit

11.POWER OFF soft control circuit

PDW-700/V1 (E)

12.FP_CPU backup circuit

13.Backup lithium battery voltage measurement circuit

14.Independent operation of FP_CPU

15.REAR input control

16.REAR XLR automatic insertion detection circuit control (DET-47 board and sensor holder)

17.Color LCD monitor drive control and switching/ rotation detection circuit

18.Nonvolatile memory control

19.Monochrome LCD display circuit with back light

Description of each block

1. Audio mode control

Audio control is performed by receiving the audio mode information and the menu setup information from the ITORON (CPU) on the SY-355 board.

The switch information of the three positions is connected to the AD terminal of the CPU and processed as the AD signal of the three-valued data.

The audio is switched in the I2C bus PCA-9555 (I/O port: IC923, 924).

2. AUDIO level indication

The digital signal applied on the DSP is converted to 16 bits and set in the register in DSP.

ITRON (CPU) reads and displays it on the color LCD monitor. The peak hold time is approx. 1400 ms.

3. STOP/PLAY keys control

Each switch on the KY-623 board is connected to PCA9555 for I2C bus to read the ON/OFF information of the switch and turn on the LED. The switch information is transferred to ITORON (CPU).

At POWER-ON, the LED of EJECT, F REV, PLAY, F FWD are turned on, initialized, and turned off.

4. CTL/TC/UBIT control

The switch information of the three positions is connected to the AD terminal of the CPU and processed as the AD signal of the three-valued data.

The ON/OFF information of the switches are transferred to the ITRON (CPU) and displayed on the color LCD monitor.

5. Real Time Clock control

The Real Time Clock IC (IC908:RX-8025NB) uses nonadjustable clock for the I2C bus. The accuracy is ± 15 seconds per month. When the power is turned on, the FP_CPU reads data and send it to ITRON (CPU)

The ITRON (CPU) sends the time data to the Camera CPU

1-7

of the AT-177 board. The viewfinder uses the time data for displaying the time. The data for year, month, day, and time of the clock can be changed using the menu.

The settings for year, month, day, and time are sent to the FP_CPU and the year, month, day, and time are written to the Real Time Clock IC.

6.WARNING_LED control and alarm tone control The WARNING information is supplied from the ITRON

(CPU) that is used to turn on and off the WARNING LED on the FP-157 board.

The 1 KHz square wave generated from the PWM generator circuit inside the FP_CPU alarm tone is used as the alarm tone.

7.Wireless Receiver Control (Optional function)

This communication circuit can control both analog and digital wireless receivers.

Analog wireless receivers use the conventional method of synchronous serial communication (200 Bps).

(Interval time: 80 ms)

Digital wireless receivers use 38 KBps asynchronous serial communication to handle large amounts of communication data.

With a built-in wireless receiver, when FP_CPU is in the POWER-ON state, the receiver type is determined and information such as the transmission RF sensitivity is loaded. This data is transmitted to Camera CPU via ITRON (CPU) and can be viewed on the viewfinder.

8. Software download function

FP_CPU has internal flash memory so the software can be overwritten. Load the software in the memory stick into the camera microcomputer and transmit the data through ITRON (CPU) in the SY-335 board to the FP_CPU where it is written.

9. Power voltage measurement circuit (batteries other than the info battery)

Power voltage measurement circuit (IC839) outputs two types of DC voltage from DA output of the FP_CPU and switches voltage in the IC839 6-pin to switch between a measurement range of +9 V to +14 V and +12 V to +17 V. The voltage measurement is sent to ITRON (CPU) as the voltage value. ITRON calculates the remaining battery charge, creates voltage display data, and returns the data to FP_CPU. FP_CPU displays the voltage display data on the monochrome LCD. The voltage display data can be checked at the same time in the status menu for the color LCD.

CH1&2

IC705

or

TC74HC4052

CH3&4

CH-1/3

IC706

CH-1/3

MIX

NJM-2172

IC708

CH-2/4

VCA

CH-2/4

NJM386

Front_EARPHONE

IC750

Final AMP

+InA OutA

+

L

FP-CPU

MIX

INV

_InA

_

R

Cont

CN701

(CH-1/3,

MIX,

CH-2/4)

IC704

IC707

IC709

REAR_EARPHONE

TC74HC4052

NJM-2172

NJM386

with SW

Final AMP

Mono	OutB		+			CN702	SW
CH-1/3	+InB		_			L
	_InB
Streo
	VCA		IC710
						R
			NJM386
			Final AMP
SW	OutA		+
	+InA		_				SW
	_InA	IC706
	Cont	VCA			FP_CPU			CN703
Mono	+3 Vdc		+3 Vdc		(SP ATT LEVEL:0dB)
		+InA OutB				Q712
						Q715		MONITOR
CH-2/4	RV700	_InA			FP_CPU		SW-1
								SP
Streo		Cont			(SP ATT LEVEL:_3dB)
	MONITOR-VR			RV701		Q711
		ALARM-VR			FP_CPU	Q716	SW-2
FP-CPU(Head Phone Out:Streo/Mono)					(SP ATT LEVEL:_6dB)
	ALARM SIGNAL(FP_CPU)					Q713
					FP_CPU	Q717	SW-3
	FP_CPU (MIN ALARM VOL)			R761
					(SP ATT LEVEL:_9dB)
		Q707				Q718
							SW-4
	When ALARM-VOL Position 0 %,
	Alarm Level is about _38 dBu.

Audio Monitor Block

1-8	PDW-700/V1 (E)

10. Info battery communication circuit.

This equipment supports batteries with SM Bus specifications. The serial communication bus (SDA, SCL) for IC916 (Parallel bus to I2C_bus Controller) connected to the FP_CPU bus passes through IC927 and IC928 (switching switch) and connects to the serial terminal of the info battery. The Serial Clock Rate is 88 KHz.

The battery type, remaining time, and other information is loaded onto FP_CPU and transmitted to ITRON (CPU). ITRON (CPU) calculates the remaining battery charge and creates remaining charge display data, and transmits the data to Camera CPU and FP_CPU. FP_CPU displays the remaining charge display data on the monochrome LCD. The remaining charge display data can be checked at the same time in the status menu for the color LCD.

11. Power off software control circuit

FP_CPU detects the POWER-SW OFF information. When power can be turned on, the "Power OFF" command is sent from ITRON (CPU) and FP_CPU controls the power OFF circuit on the CNB-25 board.

12. FP_CPU backup circuit

Even when power is turned off for FP_CPU, the data is saved for the internal RAM and Real Time Clock (RX8025NB) through backup on a coin battery. By saving the system data, FP_CPU can be started up quickly when the power is turned on.

13.Backup lithium battery voltage measurement circuit FP_CPU performs voltage measurement on the backup lithium battery. When recharging is detected, the reducedvoltage information is send to ITRON (CPU). (Measurement interval time: 60 s)

Current is prevented from running through FET-SW (Q836) in order to prevent power from being lost during measurement. Furthermore, reverse current above +3 V is prevented with FET-SW (Q829), thus extending the life of the lithium battery. The battery life is guaranteed for about

5years.

14.FP_CPU independent operations

When the POWER-SW is set to power off, power is supplied from the UNSW +12 V power circuit to display the counter and other information on the monochrome LCD. Power is supplied to each power regulator with IC830 (hyposaturation regulator 8 V) and independent operations can be performed. The operations can be turned on or off from the menu.

15. REAR input control

The serial communication bus (SDA, SCL) for IC917 (Parallel bus to I2C_bus Controller) connected to the FP_CPU bus sends control for the AXM-38 board through the motherboard with IC202 (PCA-9555: I2C_I/O_PORT) on the CNB-25 board and acquires the following information: REAR_XLR automatic insertion detection

+3 V

+3 V

IC927

BATTERY

IC916

(IC805)

SW

IC928

PCA9564

Q829

Q836

INFO_ BATT

I2C_BUS

F

A

Port

Vcc

IC844

FET-SW

_SDA

SDA

FET-SW

8 bit

E

AN15

B

CPU_BUS

D7

D15

:

:

Port

Lithium

Battery

INFO_BATT

A

D0

D8

(1 time/60 sec)

IC908

Coin

SCL

IC921

Battery

ID Register

_SCL

Real Time

HD64F2378

+3 V

B

CPU

Clock

+

IC914

Voltage

Port

CLOCK 16 MHz

RX-8025NB

measurement

AN11

+3 V

+3 V

+3 V

Voltage measurement

AN8

Battery

IC838

Voltage

CH-1

RV1

ID Data

measurement

AN14

FET-SW

+3 V

(CNB-25 board)

IC839

Voltage measurement

UNREG+12 V

Voltage

AN9

Battery-in

CH-2

measurement

AN13

RV2

AN0

DC-in

AN1

AN2

FRONT,REA,WRR-SW1,2,3,4

AN3

+5 V

IC7

CTL,TC,U_BIT-SW

Voltage

AN4

FREE,SET,REC_RUN-SW

Front

measurement

AN10

AN5

PRESET,REGENE,CLOCK-SW

Microphone

AN6

Monitor-SW

Volume

AN7

(3 digitize level)

SW-1425

to iTRON_CPU

Voltage Measurement Block Overview

PDW-700/V1 (E)

1-9

circuit control, microphone amplifier gain control, operational amplifier power control, and digital/analog input switching switch information.

16.REAR XLR automatic insertion detection circuit control (DET-47 board and sensor holder)

Combine the DET-47 board on the sensor holder and connect with the harness to the AXM-38 board.

The infrared light emitter uses one LED that connects to the CH1 and CH2 receivers positioned in the middle of the sensor holder on the left and right sides. When “Detection ON” is set from the menu and the XLR connector is inserted into the 3P-XLR connector, the infrared light is blocked, the output from the receivers changes from L to H, and insertion is detected. At this time, CH1 and CH2 operate automatically and the XLR input on the REAR area is selected. (CH3 and CH4 are not switched automatically. ) Detection interval time is 200 ms.

17. Color LCD monitor drive control and opening/rotation detection circuit

The CN108 connector is connected to the power supply and the RGB signal for video, the passes through CN802 to connect directly into the LCD driver.

FP_CPU and LCD driver are connected with synchronous serial communication. During POWER_ON, parameters

such as brightness and contrast can be set. This information is saved in the LCD (PD-118 board) nonvolatile memory and the FP-157 board IC913 (nonvolatile memory).

Rotation is detected by the rotation sensor switch in DET45 after passing through CN802.

Opening and closing is detected from the hole terminal (H801) on the FP-157 board and the field intensity from the permanent magnet (neodymium: Ne-FeB).

18. Nonvolatile memory control

IC907 on the FP-157 board is nonvolatile memory that supports the I2C bus.

This memory stores system information such as the A/D and D/A error compensation values and color LCD settings. During POWER-ON, this information is sent to ITRON (CPU) and the color LCD device.

19. Monochrome LCD display circuit with backlight FP_CPU and IC806 (UPD7225GB) are connected by a 500 KHz serial communication port. IC806 is an LCD controller/driver that is programmable with software. ND800 displays the BATTERY value, DISC capacity, time, and counter value on the monochrome LCD at three hour intervals.

H_AMP12CH_ON		L_A/D_PD12CH_ON			FP_H_AUOUT_ON FP_H_AUIN_ON
	B1	DVP-45 board			B3	B4
					CNB-25 board
		PD		AMP	ch1
Buffer
	ch1	AK5383	AK4382	ch1
ATT
				FIL
				TER
				AMP
Buffer	ch2			ch2	ch2
ATT
	AMP			AMP
				Monitor-OUT	AXM-34 board
	AMP	AK5383
Buffer
	ch3			STEREO
ATT						REAR-1
					(-3,0,4 dB standard ATT)
Buffer	ch4					REAR-2
ATT				MONO
		PD
	AMP			MIX/CH1/CH2
		FP-157 board
	B2			MA-162 board	RX-101 board
H_AMP34CH_ON		L_A/D_PD34CH_ON
				FrontMIC-1
				FrontMIC-2

Audio Power Save Block

1-10	PDW-700/V1 (E)

PCA-9555-4

I/OIN&OUT +3V

AXM-38

AudioinSelectSw AmpGainControl

DET-47

XLR-DETCT

SW-1352

SW-1 SW-2

CNB-25

I2C-BUS(+3V)

I2C-BUS(+5V)

Magnet

45

LCD Position

COLOR-LCD

(CXD-3662R)

KY-623

PCA-9555-3 I/OOUT+3V

I2C-BUS(+3V)

FET SW N Channel

AntonSW

I2CBUS(88KHz) CONTROL-2 IC916(PAC9564)

BusSw

SCK3,TxD3, RxD3

DVP-45

8bit	PORT

SY-355

CPU iTRON

CPU	Camera
AT-177										MENU STBY/SAVE OFF/ONLOW/M/HIGH PREST DDC-
DCP-44	MB-1111	MA-162 MIC-AMP GAINControl	CN-3001	MIC 5Pterminal	SW-1425	FRONT MIC	ENC-82	Rotary	SW-1391

Audio System Control

PDW-700/V1 (E)

1-11

1-2-5. Digital Audio System

DVP-45 board

1. Audio signal processing system <Recording system>

The analog audio signal input from the AUDIO IN connector is converted into a serial digital audio signal (two channels) with the AUDIO A/D converter on the FP157 board. The digital audio signal enters CAVA (IC200) of the DVP-45 board through the MB-1111 board.

The serial digital audio signal (four channels) input from the AES/EBU INPUT connector undergoes level conversion in the AXM-38 board and is input into CAVA (IC200) of the DVP-45 board. After the signal is decoded in CAVA (IC200), it is synchronized and converted to the same sampling rated as the recorded video signal with the sampling rate converter (IC700, IC703).

Digital audio signals (eight channels) that include input HD-SDI signal (when the option is attached) are decoded with the DCP-44 board. Then, the signals are converted into serial digital audio signals and entered into CAVA (IC200) of the DVP-45 board via the MB-1111 board. CAVA (IC200) selects the above entered digital audio signal and sends it as the recorded audio data to AUDIO REC DSP (IC800).

<Playback system>

The playback digital audio signal that underwent playback signal processing in AUDIO PB DSP (IC801) is entered into CAVA (IC200), then separated and converted into the serial digital audio signals for analog output systems and digital output systems.

The analog output system serial digital audio signal is sent to the AUDIO D/A converter in the FP-157 board via the MB-1111 board. After it is converted into an analog audio signal, the signal is output to the AUDIO OUT connector, headphone, and monitor speaker.

The digital output system serial digital audio signal is sent to the DCP-44 board via the MB-1111 board. The signal is combined with the video signal in the DCP-44 board and output as the HD/SD-SDI audio signal.

2. Digital signal processing system <Recording system>

The recording audio data from CAVA (IC200) undergoes signal processing such as recording level control, muting process, and MIX/SWAP in AUDIO REC DSP (IC800), and then it is sent to PIER G4 (IC1900) as recording digital audio data.

1-12

The recording digital audio data is sent to AUDIO Low Resolution DSP (IC900) through CAVA (IC200), Proxy audio data is generated in compressed A-Low format, and the data is sent to PIER G4 (IC1900).

The above recording digital audio data and recording compressed Proxy audio data are written PIER_SDRAM (IC1901 to IC1904).

The recording digital data from the i.LINK/network is sent to PIER G4 (IC1900) via the PCI bus and written to the PIER_SDRAM (IC1901 to IC1904).

While recording to a disc, the data in PIER_SDRAM (IC1901 to IC1904) is sent to the DR-606 board via the ATA interface.

<Playback system>

The audio data and the Proxy audio data are sent to PIER G4 (IC1900) via the ATA interface and written to the PIER_SDRAM (IC1901 to IC1904).

The playback digital audio data in PIER_SDRAM (IC1901 to IC1904) is sent from PIER G4 (IC1900) to AUDIO PB DSP (IC801), After performing signal processing such as limiter, playback level control, and mute processing, the signal is input to CAVA (IC200).

The audio data and Proxy audio data in PIER_SDRAM (IC1901 to IC1904) is provided to i.LINK/network via the PCI bus as the MXF file data.

3. Sync signal system

The reference signal is always the 24.576 MHz clock entered from the DCP-44 board, whether recording or playing back.

This reference clock is divided and timing signal for 256 FS, 64 FS and FS audio processing is generated.

1-2-6. Audio System

Block structure
Front microphone amp	: MA-162 board
Input signal selector	: FP-157 board
A/D circuit (CH1&2)	: FP-157 board
A/D circuit (CH3&4)	: FP-157 board
D/A circuit	: FP-157 board
Final amp	: CNB-25 board
Monitor amp	: FP-157 board
Rear input	: AXM-38 board
DPS operation processing	: DVP-45 board

PDW-700/V1 (E)

1. Front microphone amp

The front microphone amp on the MA-162 board comes with a gain switch. (30 dB/20 dB/10 dB)

Gain switching can be performed from the menu. (_60 dBu/_50 dBu/_40 dBu)

2. Input signal selector

The audio signal can be selected with the analog switch (IC1 to IC4) based on the side panel switch information.

3. A/D circuit

A/D uses 24-bit AK-5383. The sampling frequency is 48 KHz.

The first has an ATT circuit for head room level adjustment.

4. D/A circuit

D/A uses 24-bit AK-4382A. The sampling frequency is 48 KHz.

The latter has a differential LPF circuit and an output level amp circuit.

5. Final amp

The final amp is located on the CNB-25 board and is connected to the AXM-38 board with the connector-to- connector. The CH1 and CH2 output signals are output from the 5-pin XLR connector.

The output level can be selected as _3 dBu, 0 dBu, or +4 dBu from the menu.

6. Monitor amp

Composed of the monaural amp for the front earphone and stereo amp for the rear earphone, the volume control is

performed with the operational amp with electronic volume (NJM2172).

7. Rear input

The rear input is composed of the following: a switch for Line In, AES/EBU, and MIC-IN; +48 V ON/OFF-SW; automatic detection circuit (DET-47 board) for the 3-pin input XLR connector; and the microphone amp (10 dB/20 dB/30 dB).

Gain switching can be performed from the menu. (_60 dBu/_50 dBu/_40 dBu)

Line In input level setting can be switched to +4 dBu, 0 dBu, or _3 dBu with the slide switch on the AXM-38 board. (Open the inside panel.)

Operation description

After the power to the device is turned on, each port in the FP-157 board CPU is initialized, the necessary resistor data is set, and MUTE is cancelled. (After approximately 3 seconds, the digital EE sound can be monitored.)

The front mic signal passes through the MA-162 board and MB-1111 board before entering the input signal selector (analog switch: IC1 to IC4) of the FP157 board.

The rear input signal passes through the AXM-38 board, CNB-25 board, and MB-1111 board before entering the input signal selector (analog switch: IC1 to IC4) of the FP157 board.

The information from the FRONT/REAR/WIRELSS switch position can be obtained by loading the three

Fs							Fs
64Fs							64Fs
	23	0		23	0
A/D OUT CH3&4 (24bit)	MSB		CH3 MSB			CH4	AN34
	23	0	CH1 MSB	23	0
A/D OUT CH1&2 (24bit)	MSB					CH2	AN12	DVP-45
(Left Justified,24bit Data)
	23	0	CH3 MSB	23	0
D/A IN CH3&4 (24bit)	MSB					CH4	DA34
D/A IN CH1&2 (24bit)	MSB 23	0	CH1 MSB	23	0	CH2	DA12
(Left Justified,24bit Data)		32bit			32bit

A/D & D/A Signal Format Diagram

PDW-700/V1 (E)

1-13

signals from the switch connected to each A/D terminal in the FP_CPU (S1 to S4).

FP_CPU sends the switch position information to ITORN_CPU of the SY-355 board, and then selects the audio signal by receiving the audio mode information from the ITORN_CPU.

The selected CH1 and CH2 system signals enter the differential amp (IC5: balance-to-unbalance converter) and pass through the head room level switching circuit and balance-to-unbalance conversion amp for A/D. Then, the signals are applied to the A/D converter IC (IC102: 24-bit). The serial digital audio signal (2 channels) converted to digital is entered to VAX (IC200) of the DVP-45 board via the MB-1111 board

VAX (IC400) selects the entered digital audio signal and sends it as the recorded audio data to AUDIO REC DSP (IC800).

DSP for audio performs high-speed processing for operations such as gain processing during manual operations, AUTO processing, LIMITER processing, 67 Hz notch filter while using the front mic, LPF (15 KHz) ON/OFF, internal SG, and audio level detection.

On the other hand, the front volume and side volume are connected to the A/D terminal in the CPU and the volume voltage is converted into digital with the internal 10-bit A/ D. After being converted into a multiplication value for DSP, the signal is sent to ITORN_CPU.

ITORN_CPU performs operation processing on the

combined front and side volumes and sends the results to DSP.

The D/A serial signal for playback passes through the DVP-45 board and MB-1111 board and enters the digital switch (IC461) of the FP-157 board. In the monitor CHSW, CH1&2 or CH3&4 is selected and applied to the 24bit D/A converter (IC453).

The D/A converter output passes through the differential LPF, ATT balance-to-unbalance conversion amp (IC514), and MB-1111 board. It is applied to the final amp (IC200, IC201) of the CNB-25 board and output from the 5-pin XLR connector (AXM-38 board).

The audio signal for the monitor passes from IC520/620 output through the monaural, mix, and stereo switching switch (IC703, IC704). Then, the signal is applied to the operation amp (NJM2172) with electronic volume.

The rear earphone can be switched between stereo and mono from the menu.

The monitor speaker output level can be lowered from the volume. Select one of the following for the ATT value: 0, _3 dB, _6 dB, or _9 dB.

1-2-7. Audio DSP Operation Processing

Main functions

1.AUTO-AMP: Two to four types of characteristics can be selected depending on each headroom.

InPut

24dBu

20dBu

10dBu

+4dBu +0dBu _3dBu

_10dBu

_20dBu

_30dBu

_40dBu

_50dBu

_60dBu

Digital_WRR;	I2S-Format		DSP		_20dBFS	AES/EBU;
Reference OUT : _40dBFS
	_40dBFS		(TMS320DA150GGU120)			Reference OUT : _20dBFS
(DSP setting the same MIC
as specifications)

XLR-OUT

				16dB:ATT 4dB			20dBFS
				HeadRoom
				12dB:ATT 0dB
	_	_		18dB:ATT 6dB
_	20dB	24dB		20dB:ATT 8dB
17dB					30dB	40dB
			_20dBu	Tp-1			AK5383
				_21dBu			24bit
							A/D
						Tp-101
WireLess			_30dBu				_30dBFS
				_31dBu		_29dBu
	_40dBu		MIC			_39dBu	_40dBFS
		Max Input : 0dBu
_50dBu		Max Input : _10dBu
_60dBu						LINE-IN;
						HeadRoom : Get 30dBu
	Max Input : _20dBu
						AK-5383 input : _23dBu
						(X, Y terminal : _29dBu)
						MIC-IN;
						HeadRoom : Get 40dBu
						AK-5383 input : _33dBu
						(X, Y terminal : _39dBu)

ALARM-TONE

		CPU_OUT:2.7dBu
_4dBu			_
_8dBu					17
						.
_10dBu						5dB				Tp-500
_12dBu
		_3dB								_15dBu
AK4382A
24bit					HeadRoom
D/A					_12dB:ATT8dB
					_16dB:ATT4dB
					_18dB:ATT2dB
					_20dB:ATT0dB
		(Controled ATT of DAC)
AK-4382A
Max Output;
±2.75Vp-p

+5dBu

+9dBu

(IN : +24dBu, Limiter-ON)

+4dBu

+0dBu

(IN : +4dBu, AGC-ON)

20dB

_3dBu

9dB

Tp-501

_4dBu

+

_10dBu

26dB

_

14dB

HeadPhone

_13dBu

_

_

+

+

_22dBu (8Z loded)

12dB

9dB

15dB

_

VR_Max:_30dBu

26dB

_31dBu

33dB

+

ALARM (Max)

VR_Max:_48dBu

26dB

_62dBu

+

ALARM (Min)

Faint : On

ALARM_VR(Min):Faint_On

26dB

_90dBu

+

ALARM (Min)

Faint : Off

ALARM_VR(Min):Faint_Off

Audio Level Chart

1-14	PDW-700/V1 (E)

2.LIMITER characteristics: Two to four types of characteristics can be selected depending on each headroom.

3.OUT_PUT_LIMITER characteristics: Performs LIMITER processing on the PB and EE_OUT. ON/ OFF.

4.Turns on and off the HPF (67 Hz) and LPF (15 KHz; _24 dB). (Runs automatically during front microphone selection)

5.Performs gain control when CH1 and CH2 are on MANUAL status. (VR-MAX: +12 dB)

6.CH3 and CH4 turn on and off the AUTO operation.

7.Internal SG: Four types of 1 KHz/_12, _16, _18, _20 dBFS.

8.Recording error correction: +0 to _2 dB (started from the terminal)

9.Playback error correction: +0 to _2 dB (started from the terminal)

10.INPUT delay amount: Performs delay processing to match the VIDEO and AUDIO phases of each CH.

Description of each part

1.DIGITAL AUTO_AMP Processing Selects the AUTO level from the menu.

AU AUTO SPEC : _6 dB/_9 dB/_12 dB/_15 dB/_17 dB _6 dB : Linear operation until approx. _9 dBFS. Approx.

_6 dBFS at Max.

_9 dB : Linear operation until approx. _12 dBFS. Approx. _9 dBFS at Max.

_12 dB : Linear operation until approx. _15 dBFS. Approx. _12 dBFS at Max.

_15 dB : Linear operation until approx. _18 dBFS. Approx. _15 dBFS at Max.

_17 dB : Linear operation until approx. _20 dBFS. Approx. _17 dBFS at Max.

2.DIGITAL In Put LIMITER characteristics (only during MANUAL)

Selects the LIMITER level from the menu.

AU AUTO SPEC : _6 dB/_9 dB /_12 dB/_15 dB/_17 dB

_6 dB	: Linear operation until approx. _9 dBFS. Approx.
	_6 dBFS at Max.
_9 dB	: Linear operation until approx. _12 dBFS.
	Approx. _9 dBFS at Max.

_12 dB : Linear operation until approx. _15 dBFS. Approx. _12 dBFS at Max.

_15 dB : Linear operation until approx. _18 dBFS. Approx. _15 dBFS at Max.

_17 dB : Linear operation until approx. _20 dBFS. Approx. _17 dBFS at Max.

PDW-700/V1 (E)

: Features in common of the MIC/LINE input.

0

Features of the AGC/LIM OFF.

_6dBFS

_5.4dBFS max

_10

_9dBFS

_12dBFS

_15dBFS

_20

_17dBFS

Output level at 0dBFS input.

_30

_8.4dBFS max

_11.4dBFS max

_40

_14.4dBFS max

_16.4dBFS max

_50

_4.8dBFS max

_7.8dBFS max

[dBFS]

Subthresholdlevel

17.9dBFS

dBFS20.0

dBFS14.6

dBFS11.4 dBFS8.1

0dBFS

_60

_10.8dBFS max

_13.8dBFS max

_70

_15.8dBFS max

OUTOPUT

_70

_60

_50

_40

_30

_20

_10

0

+10

+20

INPUT [dBFS]

Max input level

of the LINE input.

Max input level

of the MIC input.

AGC/LIM SPECIFICATION

3. DIGITAL Out Put LIMITER characteristics Turn the LIMITER ON/OFF from the menu.

ON : Linear operation until approx. _12 dBFS, approx. _11 dBFS (at Max.)

OFF : Turn off LIMITER at 0 dBFS.

4. Gain control during MANUAL

The A/D converted VR value is converted into a DSP multiplication value at FP_CPU and synchronized with the VIDEO1 frame, then handed over to the CPU to set in the register of the DSP. The maximum variable for volume is +12 dB. (_∞ to +12 dB)

5. Recording error correction

For error correction on the A/D converter for audio, the multiplication value is corrected in the range +0 to _2 dB. Starts from the terminal with the standard signal level applied. (fully automatic)

6. Playback error correction

For error correction on the D/A converter for audio, the multiplication value is corrected in the range +0 to _2 dB. The correction is performed after the playback error correction is completed. Starts from the terminal. (semiautomatic)

The internal SG is used as the standard signal, and the inside panel for each LEVEL_VR is turned and fine-tuned.

1-15

1-2-8. Optical Drive System

Recording System

Recording data sent from the DVP-45 board through the ATA bus (Ultra ATA33) is sent to the Blu-ray Disc Controller (BDC) IC300 on the DR-606 board.

The BDC performs signal processing to conform to recording format, such as ATA interface, ECC coding and 17PP (Parity Preserve/Prohibit RMTR) modulation.

The recording data is converted to multi-pulse in the BDC, and the multi-pulse data is sent through the flexible card wire to the optical block to be written into the disc.

Playback System

•Data Playback System

The RF signal played back from the disc is sent from the optical block to the Front End Processor (FEP) IC200 on the DR-606 board where equalizing and asymmetry correction are performed after the RF signal passes through the AGC. After A/D conversion by the read clock played back in the PLL, the signal is sent to the BDC IC300.

In the BDC, the signal passes through the adaptive digital filter, and Viterbi demodulation, 17PP demodulation, and ECC decoding are applied to the signal. Then the signal is sent through the ATA bus to the DVP-45 board as played back data.

•Address restoration system

The address data restored from the disc is sent from the optical block to the FEP (IC200) on the DR-606 board. The analog address data passes through the AGC and BPF and is converted to digital data in the FEP. The digital data is then sent to the BDC (IC300) for address decoding.

The PLL in the FEP generates a wobble clock (WCK).

Servo System

•Tri-Axis Actuator and SA Actuator

The object lens of the optical block is controlled for focus direction, track direction, and tilt angle by the tri axis actuator.

The light reflected from the disc is converted to the electrical signal by the optical block. The electrical signal is input to the FEP IC200, and the focus error signal and the track error signal are detected. The SV DSP IC400 outputs the control data based on the errors to the driver IC501 and controls the focus actuator and the track actuator through the driver.

The tilt actuator is controlled for its angle against the disc to be optimum based on the tilt adjustment result for the jitter of the playback signal to be minimum and the output of the angular velocity sensor.

The SA actuator position is controlled for the spherical aberration to be optimum at the start-up adjustment when the disc is inserted. The SA actuator for the double layer disc is controlled to the optimum position every time to jump the layer.

•Seek Motor

The seek motor controls the position of the optical block so that the track to be recorded or played back is kept within the object lens driving range.

•ND Filter

The transmission factor of the ND filter is selectable to reduce the laser noise that occurs when the read power light is emitted for the single layer disc.

•Spindle Motor

The FG generated by the spindle motor is amplified and shaped on the SE-857 board, and is then input into the SV DSP IC400 on the DR-606 board.

The SV DSP compares the FG frequency with the target frequency, and then controls the spindle motor via the driver IC500.

System Control

The SY CPU IC600 on the DR-606 board performs system control. It controls ATA interface, Data Manager, RFrelated ICs, servo ICs, and loader. It also carries out interlocking control, maintenance and error log management of each device including the optical block. Firmware programs of the SY CPU and DSP as well as sources of each PLD are stored in the flash memory IC602, and the CPU loads them to each device when the power is turned on.

The BDC IC300 and SV DSP IC400 are controlled by the parallel CPU bus, while RF-related ICs are controlled by the serial port through SYS PE IC700.

Adjustment values and hours meter data are stored in the EEPROM IC4 on the SE-857 board.

1-16	PDW-700/V1 (E)

1-2-9. Power Supply Systems

CNB-25 board

The board checks the input voltage +12 V, and controls distribution of the input power to each circuit board.

•Power ON/OFF Control

The ON/OFF control is performed in IC1 and IC5. The IC1 input signals include L PWR SW ON signal, H POWERW HOLD signal, EXTDC detection signal, battery detection, excess voltage detection, and low voltage detection. During normal operation, when L PWR SW ON signal is turned to “L”, Q4, 5, 6, and 7 or Q11, 12, 15, and 16 are turned on, and the battery or EXT DC IN +12 V is supplied to respective circuit. The H POWERW HOLD signal is sent from the FP-157 board after the main power of this unit is turned on. Therefore, the power is kept on even if the L PWR SW ON (L) signal is set to OFF (H). In order to turn off the main power of this unit, the L PWR SW must be turned off (H) and the H POWERW HOLD signal must be opened and set to “L”. When the FP-157 board detects that the POWER switch is turned OFF, it sets the POWERW HOLD signal to “L” to turn off the power after a disc operation is completed if the equipment is in the midst of operating a disc.

•Battery/EXT DC selector

The EXT DC voltage is detected and either battery or EXT DC is selected with priority given to the EXT DC. The IC5 performs the control and Q4, Q5, Q6, and Q7 are turned on when a battery is selected and Q11, Q12, Q15, and Q16 are turned on when the EXT DC is selected.

In this IC5, a step-up circuit (Vcc +8.5 V) that drives the N-CH MOS FET gate is employed.

•Protection from Excess Input Voltage

VOLTAGE DETECT (IC18) monitors the input +12 V. If the voltage exceeds approximately +18 V, the output of the IC18-1 is set to “H”. This is input to IC1 to start the protection from the excess voltage and turn on the +12 V output. (SHUT DOWN)

Since this function is a latch operation, the main power of the unit needs to be turned off once and back on after

the input power is set to below 18 V.

•Excess current detection

The output circuit of the UNREG +12 V has excess current detection resistors R70, R71 and R72. A voltage drop at the resistors is detected by the IC5.

When the voltage drop at the resistors exceeds 200 mV, the +12 V output is turned off.(SHUT DOWN) Another SHUT DOWN signal is the H SHUT DOWN

signal that is supplied from the RE-246 board. If any one of the DC-DC converter outputs is shorted, the output 12 V enters the SHUT DOWN state except UN SW +12 V. (SHUT DOWN)

Since this function is a latch operation, the main power of the unit needs to be turned off once and back on after the cause of the excess current is removed.

•Protection against input power connection of reverse polarity

If the input power is connected in reverse polarity, FET (Q2) is turned off so that the GND lines of the control system circuits are disconnected. Thus the control circuits are protected and supply of +12 V power to the respective circuits is stopped.

•FAN voltage control

The Q13 and Q14 are controlled by the FAN CONT signal from the AT-177 board and the PWM wave is converted to the DC voltage according to the DUTY.

The voltage controls the FAN and reduces the temperature increase.

•Audio Circuit

This is the output circuit for the AUDIO OUT (rear connector). The signal is output by selecting the CH1/2 or CH3/4 in the MONITOR.

•± 4.8 regulator circuit

This is the voltage regulator for AUDIO using on the AXM-38 board.

PDW-700/V1 (E)

1-17

1-2-10. LCD System

PD-118 board

The PD-118 board consists of the color LCD panel drive circuit and the power supply circuit for LCD backlight. IC1 is the color LCD panel drive IC that contains of the built-in video signal RGB driver, the timing generator, and the VCO.

IC1 also contains the serial interface circuit and electronic potentiometers that are used to establish the various setups in accordance with the commands from the microprocessor (IC921) of the FP-157 board.

The RGB video signals that are input to IC1 pin-37 through pin-39 receive contrast adjustment and brightness adjustment. Then, they pass through the output signal polarity inversion circuit and are output from IC1 pin-20 through pin-22.

The factory adjustment data is stored in the IC3 EEPROM. The respective timing signals for driving the LCD panel are generated from the sync signals that are input to IC1 pin-41 and pin-42.

The operations such as turning off the backlight and inverting the video signal left to right or up to down are performed in accordance with the control signals supplied from the microprocessor (IC921) of the FP-157 board.

1-2-11. Others

CN-3005 board

The VF power supply, light power supply, light switch signal, and the EEPROM circuit that stores the rely and system information of the handle switch signal are included.

Handle switch relay

Input and output the handle switch signal (CN2).

Light switch relay

Relays the light switch signal (CN3).

EEPROM

The system information is written to the EEPROM (IC2) by the I2C communication to control.

MS-86 board

The MS-86 board is the connector board for the memory stick connection.

When a memory stick is inserted, the INS signal is set to

LOW so that the camera microprocessor checks capacity and types of the memory stick inserted.

VCC is supplied to a memory stick only when a memory stick is inserted or only when accessing a file on a memory stick. When VCC is supplied, the INS_LED and ACTIVE_LED (D1) is turned ON.

Access to the memory stick data is processed in the following order: VCC IN → SCLK ON → BS Pulse → DATA IN/OUT → SCLK OFF → . . → SCLK ON → BS ON → DATA IN/OUT → SCLK OFF → . . → VCC OFF.

1-18	PDW-700/V1 (E)

AXM-38	XLR5P OUT
4dB	4dB
CNB-25

						PB 4ch		4ch	ResoLow 4ch
								PB
	Rec4ch								DE MUX
	DE MUX
	4ch			DE MUX		DigitalOUTD12	DigitalOUTD34	ANAOUTD12	ANAOUTD34
	32BITx				EE	PB
DSP(120MHz) TM320DA150GG120	4ch REC					PB
	32BITx
VAX						24bit I2S	Left Justified 24bit	DataCnv.
CAD12	CAD34	AES/EBUD12	AES/EBUD34	AUD12	AUD34	DigitalWRRD12	DigitalWRRD34
			SRC
DVP-45									MB-1111

FRONT

HeadPhone

MONITORSP

REAR

Stereo HeadPhone

NJM

368M

NJM 368M

NJM

368M

&

15dB

ATT

33dB

ATT

ATT

15dB

ATT

15dB

14dB

14dB

ControlControl-VR

NJM

2172

VCA 95dB

ATT

0dB

9dB

12dB 0dB 3dBATT 0dB

9dB

12dB

NJM

SW VCA 95dB

NJM

SW VCA 95dB

15dBu ATT

17.5dB

Control-VR

+4dB

2172

2172

CH1

+

CH1

CH2

CH2

CH1: 15dBu

CH2: 15dBu

Control

Control

ALARM-TONE

0dB

0dB

(ControledATTofDAC)

PCA9555

12dB:ATT8dB

16dB:ATT4dB

18dB:ATT2dB

20dB:ATT0dB

3dB

LPF

3dB

LPF

HeadRoom

HaedRoom ATT

FPCPU HD64F2378

X

Y

AK-4382A 24bitD/A X

Y

Control

PCA9564

I2CBUS

Control

SW

SystemControl

PCA9555

AK-5383

24bitA/D

X

Y

AK-5383

24bitA/D

X

Y

Audio

Tp101

Tp201

0dB

Tp301

Tp401

0dB

HeadRoom

SW

Control

HeadRoom SW

Control

(Balanced/Unbalanced)

Tp1

Tp2

Tp3

Tp4

DifferentialAmplifier

Control

1dB

1dB

FP-157

AUDIO

SELECT

X

Y

X

Y Y

X

Y

X

X

Y

17,ATT20, 24dB

AMP10dB,20dB,30dB

3001-CN

10dB/20dB/30dB

MB-1111

38-AXM

422-RS Receiver

XLR

5P

101-RX

Ch1

Ch2

I2SFormat

SW

SW

SW

SW

162-MA

AMP

D12WRRDigital

D34WRRDigital

64FS

FS

MICIN: 40dBu

50dBu

60dBu

MICIN: 40dBu

50dBu

60dBu

XLRREAR

AES/EBU

OR

LINEIN:4dBu

+0dBu 3dBu

XLRFront

Analog-Wireless

2chAdapter

40dBu25Z

OR

Digital-Wireless Adapter

40dBFS AUDIO FORMAT:

I2S

Audio Block Overview

PDW-700/V1 (E)

1-19

1-3. Matching Connectors

Use the following connectors at the ends of the cables when connecting the cables during installation and maintenance, or alternately use the following cables.

Panel indication	Matching connectors/cables
GENLOCK IN
TC IN	1-569-370-12
TC OUT	Plug, BNC
TEST OUT
SDI IN
SDI OUT 1
SDI OUT 2
AUDIO IN CH1/CH2	1-508-084-00 XLR 3-pin, male
AUDIO OUT	Audio cable
	(XLR 5 pin-XLR 3-pin, 2 m)
	CCXA-53 made by Sony or equivalent
DC IN	1-508-362-00 XLR 4-pin, female
DC OUT 12 V	1-566-425-11 round type 4-pin, male
EARPHONE	Mini jack (commercially available
	on market)
LIGHT	Power tap (OE)
	Made by ANTONBAUER Inc.,
	33710 or equivalent
MIC IN	1-508-370-11 XLR 5-pin, male
NETWORK	100 BASE-TX
REMOTE	1-766-848-11 round type 8-pin, male
VF	Connector, 20-pin, male
	Hirose HR 12-14PA-20PC or equivalent
i.LINK	DV cable (6-pin-4-pin) : CCFD-3L
	DV cable (6-pin-6-pin) : CCF-3L
WIRELESS	WRR-855A, DWR-S01D (by Sony) only
RECEIVER IN	connectable
	n
	Do not connect with a connector/
	cable other than above.

1-4. Signal Inputs and Outputs

Inputs

GENLOCK IN : BNC type 1.0 V p-p, 75 Z unbalanced TC IN : BNC type 0.5 V to 18 V p-p, 10 kZ SDI IN (Option) : BNC type

Outputs

TEST OUT : BNC type 1.0 V p-p, 75 Z unbalanced SDI OUT : BNC type SDI 0.8 V p-p, 75 Z,

270 Mbps, 1.5 Gbps

TC OUT : BNC type 1.0 V p-p, 75 Z EARPHONE : 8 Z or more, _∞ to _18 dBu variable

DC IN : XLR, 4-pin (Male)

		1	4
		2	3
		_ EXT VIEW _
No.	Signal	I/O	Specifications
1	GND	_	GND for BATT OUT (+)
2	_		No connection
3	_		No connection
4	BATT OUT (+)	IN	+11 to 17 V dc

AUDIO IN CH-1, CH-2 : XLR, 3-pin (Female)

			2	1
			3
			_ EXT VIEW _
				(0 dBu = 0.775 V rms)
	MIC/LINE INPUT
	No.	Signal	I/O	Specifications
	1	MIC/LINE (G)	_	_60 dBu/+4 dBu, selectable
				High impedance, Balanced
	2	MIC/LINE (X)	IN
	3	MIC/LINE (Y)	IN
	AES/EBU INPUT
	No.	Signal	I/O	Specifications
	1	AES/EBU (G)	_	1 Vp-p, 110 Z, Balanced
	2	AES/EBU (X)	IN
	3	AES/EBU (Y)	IN

1-20	PDW-700/V1 (E)