Page 1
Post-Amplifier for Optical Fiber Communication Receiver
Description
The CXB1573R achieves the 2R optical-fiber
communication receiver functions (Reshaping and
Regenerating) on a single chip. This IC is equipped
with the signal detection function, which is used to
enable TTL/ECL outputs. Also, the output disable
function performs the output shutdown.
Features
• Output disable function (TTL input)
• Signal detection function (TTL/ECL output)
Applications
• SONET/SDH: 622.08Mbps
• Fibre Channel: 531.25Mbps
: 1.062Gbps
• Gigabit-Ethernet: 1.25Gbps
Absolute maximum Ratings
• Supply voltage VCC – VEE –0.3 to +6 V
• Storage temperature Tstg –65 to +150 °C
• Input voltage difference|VD – VD
|
Vdif 0 to +2 V
• SW input voltage Vi VEE to VCC V
• ECL output current IOQ/SD-ECL –30 to 0 mA
• TTL output current (High level) IOH SD-TTL –20 to 0 mA
• TTL output current (Low level) IOL SD-TTL 0 to 20 mA
• D/DB input voltage Vcc – 2 to Vcc V
• ODIS input voltage VEE – 0.5 to VEE + 5.5 V
Recommended Operating Conditions
• Supply voltage VCC – VEE 3.3 ± 0.2 V
• Termination voltage (for data) VCC – VTD 1.8 to 2.2 V
• Termination voltage (for alarm 1,alarm 2) VTA VEE V
• Termination resistance (for data) RTD 46 to 56 Ω
• Termination resistance (for alarm 1) RTA1 240 to 300 Ω
• Termination resistance (for alarm 2) RTA2 460 to 560 Ω
• Operating temperature Ta –40 to +85 °C
Structure
Bipolar silicon monolithic IC
– 1 –
E98401-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
CXB1573R
32 pin LQFP (Plastic)
Page 2
– 2 –
CXB1573R
Block Diagram and Pin Configuration
V
EE
4
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
V
EE
3
ODIS
SW
VccX
V
EE
2
V
EE
1
TM
VccZ
CAP3
CAP2
V
EE
2
V
EE
I
DN
UP
VCC3
QB
Q
SDB-ECL
SDB-TTL
SD-TTL
V
CC4
V
CC1
VccY
CAP1B
CAP1
D
V
CC2
V
CC
2
DB
V
EE1
SD-ECL
peak hold
peak hold
∆V
Page 3
– 3 –
CXB1573R
Pin Description
Pin
No.
1
VEE3
0
Negative power supply for ECL
output buffer.
Switches the identification
maximum voltage amplitude.
High voltage when open; the
identification maximum voltage
amplitude becomes 40mVp-p.
Low voltage when connected to
VEE; the amplitude becomes
20mVp-p.
2
ODIS
0
or
3.3
(Open)
3
SW
0
or
3.3
(Open)
Positive power supply for digital
block.
Negative power supply for digital
block.
Negative power supply for analog
block.
Chip temperature monitor.
4
VCC2 3.3
3.3
5
VccX
6
7
VEE2
0
VEE1
0
8
TM
1.6
Controls the output shutdown
function. High voltage when
open; the Q output is fixed to
Low. Low voltage when
connected to VEE; the D input
results in the Q output with ECL
level. TTL level is also available.
Symbol
Typical pin
voltage (V)
DC
AC
Equivalent circuit
Description
VCC2
VEE2
40k
60k
3
2
VCC2
VEE2
VREF
10k
10k
300
Positive power supply for digital
block.
VEE1
7
8
9
VCC1
3.3
Positive power supply for analog
block.
Page 4
– 4 –
CXB1573R
11
12
13
14
15
16
17
18
19
20
CAP1B
CAP1
DB
D
VEE1
VCC2
UP
DN
VEEl
VEE2
1.6
to
2.4
1.6
to
2.4
Pins 11 and 12 connect a
capacitor which determines the
cut-off frequency for DC
feedback block.
Pins 13 and 14 are input pins
for limiting amplifier block. Input
the signal with AC coupled.
DC
AC
Negative power supply for analog
block.
Positive power supply for digital
block.
Connects a resistor for alarm
level setting.
Default voltage can be generated
without an external resistor by
shorting the VEEI pin to VEE.
Generates the default voltage
between UP and DOWN.
The voltage (8.0mV for input
conversion) can be generated
between UP and DOWN (Pins 17
and 18)
as alarm setting level by
connecting this pin to VEE.
2
2
0
3.3
0
0
1k
1k
V
CC1
V
EE1
2007.5k
100p
2007.5k
11
12
13
14
Pin
No.
Symbol
Typical pin
voltage (V)
Equivalent circuit
Description
VCC2
VEE2
100
986
100
140.9
140.9
VCS
SW
SW
17
18
19
Negative power supply for digital
block.
Positive power supply for analog
block.
3.3
10
VccY
Page 5
– 5 –
CXB1573R
DC
AC
21
CAP2
1.5
Connects a peak hold circuit
capacitor for alarm block.
470pF should be connected to
Vcc each.
CAP2 pin connects a peak
hold capacitor for alarm level
setting block.
CAP3 pin connects a peak
hold capacitor for limiting
amplifier signal.
VCC2
VEE2
80
200
5µA
10p
21
22
CAP3
1.5
24
25
VEE4
VCC4
0
3.3
VCC2
VEE2
80
200
5µA
10p
22
Pin
No.
Symbol
Typical pin
voltage (V)
Equivalent circuit
Description
Negative power supply for TTL
output buffer.
Positive power supply for TTL
output buffer.
26
SD-TTL
VEE
or
2.2
Alarm signal TTL level output.
VCC4
VEE4
40k
26
Positive power supply for ECL
output buffer.
3.323
VccZ
Page 6
– 6 –
CXB1573R
DC
AC
27
SDB-TTL
VEE
or
2.2
28
29
SD-ECL
SDB-ECL
1.6
or
2.4
1.6
or
2.4
Alarm signal ECL level output.
Terminate this pin in 270Ω to
VEE.
VCC4
VEE4
40k
27
VCC3
VEE3
28
29
Pin
No.
Symbol
Typical pin
voltage (V)
Equivalent circuit
Description
Alarm signal TTL level output.
30
Q
1.6
or
2.4
Data signal output.
Terminates this pin in 50Ω to
VTT = Vcc – 2V.
VCC3
VEE3
30
31
31 QB
1.6
or
2.4
32
VCC3
3.3
Positive power supply for ECL
output buffer.
Page 7
– 7 –
CXB1573R
Supply current
Q/QB High output voltage
Q/QB Low output voltage
SD-ECL/SDB-ECL High output voltage
SD-ECL/SDB-ECL Low output voltage
SD-TTL/SDB-TTL High output voltage
SD-TTL/SDB-TTL Low output voltage
SW High input voltage
SW Low input voltage
SW High input current
SW Low input current
ODIS High input voltage
ODIS Low input voltage
ODIS High input current
ODIS Low input current
D/DB input resistance
TM voltage
Electrical Characteristics
DC Characteristics
Item
IEE
VOH
VOL
VOH-E
VOL-E
VOH-T
VOL-T
VIHSW
VILSW
IIHSW
IILSW
VIHOD
VILOD
IIHOD
IILOD
Rin
VTM
50Ω to VTT
270Ω to VEE
IOH = –0.4mA
Ta = 0 to +85°C
IOL = 2mA
Ta = 0 to +85°C
at SW pin Open: High
at ODIS pin Open: High
VIH = Vcc
VIL = VEE
Iin = 1mA
–74
VCC – 1100
VCC – 1860
VCC – 1100
VCC – 1900
2.2
VCC – 0.5
0
–100
2.0
0
–400
765
1.2
–51
1020
VCC – 860
VCC – 1620
VCC – 860
VCC – 1620
0.5
VCC
0.5
10
VCC + 0.5
0.8
20
1275
2.0
mA
mV
V
µA
V
µA
Ω
V
Symbol Min. Typ. Max. UnitConditions
VCC = 3.3 ± 0.2V, VEE = GND, Ta = –40 to +85°C
Page 8
– 8 –
CXB1573R
AC Characteristics
∗1
VUP – VDOWN = 100mV, Vin = 100mVp-p (single ended), SW: High, peak hold capacitance (CAP2, CAP3
pins) of 470pF, VEEI: Open.
∗2
VUP – VDOWN = 100mV, Vin = 1Vp-p (single ended), SW: High, peak hold capacitance (CAP2, CAP3
pins) of 470pF, connect VEEI: Open.
∗3
Vin = 50mVp-p (single ended), SW: Low, peak hold capacitance of 470pF, connect VEEI to VEE.
∗4
Vin = 1Vp-p (single ended), SW: Low, peak hold capacitance of 470pF, connect VEEI to VEE.
Maximum input voltage amplitude
Amplifier gain (excluding the output buffer)
Identification maximum voltage
amplitude of alarm level
SD/SDB hysteresis width
Alarm setting level for default
Q/QB rise time
Q/QB fall time
SD-TTL/SDB-TTL rise time
SD-TTL/SDB-TTL fall time
SD-ECL/SDB-ECL rise time
SD-ECL/SDB-ECL fall time
Propagation delay time
SD response assert time
SD response deassert time
SD response assert time for alarm
level default
SD response deassert time for alarm
level default
Item
Vmax
GL
VmaxA1
VmaxA2
∆P1
∆P2
Vdef
TrQ
TfQ
TrSDT
TfSDT
TrSDE
TfSDE
TPD
Tas
Tdas
Tasd
Tdasd
single-ended input
SW: Low,
single-ended input
SW: Open High,
single-ended input
SW: Low,
at default alarm level
SW: Open High,
at default alarm level
SW: Open High,
VEEI = VEE, fin = 100Mbps
Differential voltage input
20% to 80%
50Ω to VTT
0.6V to 2.2V
CL = 10pF
20% to 80%
510Ω to VEE
∗1
∗2
∗3
∗4
1600
52
20
40
3
3
6.6
0.4
0
2.3
0
2.3
6
6
8.0
230
230
7
7
9.3
350
350
10
10
1.6
1.6
1.9
100
100
100
100
mVp-p
dB
mVp-p
dB
mV
ps
ns
µs
Symbol Min. Typ. Max. UnitConditions
VCC = 3.3 ± 0.2V, VEE = GND, Ta = –40 to +85°C
Page 9
– 9 –
CXB1573R
DC Electrical Characteristics Measurement Circuit
V
EE
3
ODIS
SW
VccX
V
EE
1
V
EE
2
V
EE
4
VccZ
CAP3
CAP2
V
EE
2
V
EE
I
DN
UP
VCC3
QB
Q
SDB-ECL
SDB-TTL
SD-TTL
V
CC4
V
CC1
VccY
CAP1B
CAP1
D
V
CC2
V
CC
2
DB
V
EE1
SD-ECL
C3C3
C1
C1
C2
V
D
3.3V
V
SWVODIS
270
51
51
VTT
1.3V
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
peak hold
peak hold
∆V
TM
270
Page 10
– 10 –
CXB1573R
AC Electrical Characteristics Measurement Circuit
0.047µF
V
EE
3
ODIS
SW
VccX
V
EE
1
V
EE
2
V
EE
4
VccZ
CAP3
CAP2
V
EE
2
V
EE
I
DN
UP
VCC3
QB
Q
SDB-ECL
SDB-TTL
SD-TTL
V
CC4
V
CC1
VccY
CAP1B
CAP1
D
V
CC2
V
CC
2
DB
V
EE1
SD-ECL
470p470p
0.047µF
1µF
VCC
+2V
Z0 = 50
VEE
–1.3V
Oscilloscope
50Ω input
Z0 = 50
Z0 = 50
Z0 = 50
Oscilloscope
Hi-Z input
REX1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
peak hold
peak hold
∆V
TM
Page 11
– 11 –
CXB1573R
Application Circuit
REX1
V
EE
3
ODIS
SW
VccX
V
EE
1
V
EE
2
V
EE
4
VccZ
CAP3
CAP2
V
EE
2
V
EE
I
DN
UP
VCC3
QB
Q
SDB-ECL
SDB-TTL
SD-TTL
V
CC4
V
CC1
VccY
CAP1B
CAP1
D
V
CC2
V
CC
2
DB
V
EE1
SD-ECL
470p
51Ω
0.047µF
V
IN
470p
VTT
51Ω
Signal Generator
51Ω
VTT
1µF
0.047µF
51Ω
VTT
VEETTL
Input
VCC
–2V
51Ω
51Ω
ECL Output
ECL Output
TTL Output
VEE
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
peak hold
peak hold
∆V
TM
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
Page 12
– 12 –
CXB1573R
R1R1
R2
R2
To IC interior
C1
C1
D
C2
11
12
13
14
Fig. 1
Feedback frequency
response
f2
Amplifier frequency
response
f1
Frequency
Gain
Fig. 2
Notes on Operation
1. Limiting amplifier block
The limiting amplifier block is equipped with the auto-offset canceler circuit. When external capacitors C1 and
C2 are connected as shown in Fig. 1, the DC bias is set automatically in this block. External capacitor C1 and
IC internal resistor R1 determine the low input cut-off frequency f2 as shown in Fig. 2. Similarly, external
capacitor C2 and IC internal resistor R2 determine the high cut-off frequency f1 for DC bias feedback. Since
peaking characteristics may occur in the low frequency area of the amplifier gain characteristics depending on
the f1/f2 combination, set the C1 and C2 values so as to avoid the occurrence of peaking characteristics. The
target values of R1 and R2 and the typical values of C1 and C2 are as indicated below. When a single-ended
input is used, provide AC grounding by connecting Pin 13 to a capacitor which has the same capacitance as
capacitor C1.
R1 (internal): 1kΩ R2 (internal): 7.5kΩ
f2: 3.4kHz f1: 21Hz
C1 (external): 0.047µF C2 (external): 1µF
Page 13
– 13 –
CXB1573R
2. Alarm block
In order to operate the alarm block, give the voltage difference between Pins 17 and 18 to set an alarm level
and connect the peak hold capacitor C3 shown in Fig. 3.
This IC has two setting methods of alarm level; one is to connect Pin 19 to VEE and leave Pins 17 and 18 open
to set an alarm level default value (8mV for input conversion). The other is to connect Pin 19 to VEE and set a
desired alarm level using the external resistors REX1, REX2 and REX3 shown in Fig. 3. Connect REX1 between
Pins 17 and 18 or connect REX3 between Pin 18 and Vcc when less alarm level is desired to be set than its
default value; connect REX2 between Pin 17 and Vcc when more alarm level is desired to be set than its default
value. However, the Pin 17 voltage must be higher than that of Pin 18.
This IC also features two-level setting of identification maximum voltage amplitude. The amplitude is set to
40mVp-p when Pin 3 is left open (High level) and it is set to 20mVp-p when Pin 3 is Low level. Therefore, the
noise margin can be increased by setting Pin 3 to Low level when the small signal is input. The relation of input
voltage and peak hold output voltage is shown in Fig. 5.
In the relation between the alarm setting level and hysteresis width, the hysteresis width is designed to
maintain a constant gain (design target value: 6dB) as shown in Fig. 4.
This IC is designed to externally have the capacitor C3, and the C3 value should be set so as to obtain desired
assert time and deassert time settings for the alarm signal.
The electrical characteristics for the SD response assert and deassert times are guaranteed only when
the waveforms are input as shown in the timing chart of Fig. 6.
REX1: 100Ω (when the alarm level is set to 4mV for input conversion.)
REX2: 8kΩ (when the alarm level is set to 10mV for input conversion.)
REX3: 4kΩ (when the alarm level is set to 4mV for input conversion.)
C3: 470pF
The table below shows the alarm logic.
The table below shows the output disable function logic.
VCC
C3
VCC
C3
Peak Hold SD-TTL
SD-ECL
SDB-ECL
SDB-TTL
Peak Hold
∆V
10p 10p
VCCA
V
CCA
From limiting amplifier
VCC
REX3
REX1
REX2
VCCVEE
Ra1
986
VCCA
IC interior
DN
V
EE
I
IC exterior
VCS
UP
Ra2B
141
Ra2A
141
Ra1, Ra2A and Ra2B values are
typical values.
17
18
19
3
19
18
21
22
17
Optical signal input
state
Signal input
Signal interruption
Low level
High level
SD
High level
Low level
SD
Optical signal input
state
ODIS: Open High
ODIS: Low
Fixed High
Data
Q
Fixed Low
Data
Q
Fig. 3
Page 14
– 14 –
CXB1573R
Input electrical
signal amplitude
SD output
VASVDAS
3dB3dB
Alarm setting
input level
Hysteresis
LargeSmall
High
level
Low
level
V
DAS → Deassert level
VAS → Assert level
Fig. 4
Input voltage [mVp-p]
Peak hold output voltage
SW → Low
0
20 40
SW → Open High
Fig. 5
Deassert time
Hysteresis width
Alarm setting level
Data input
(D)
Data output
(Q)
Assert time
Alarm output
(SD)
Fig. 6
Page 15
– 15 –
CXB1573R
1. Q/QB output waveform
Q
QB
Ch. 1 = 400mV/div OFFSET = –1330mV, Ch. 2 = 400mV/div OFFSET = –1330mV, Timebase = 500ps/div
V
CC = 3.3V
VEE = GND
VTT = 1.3V
Ta = 27°C
D = 622Mbps
Vin = 10mVp-p
Single input
pattern: PRBS223-1
Q/QB = 50Ω to VTT
Q
QB
Ch. 1 = 400mV/div OFFSET = –1330mV, Ch. 2 = 400mV/div OFFSET = –1330mV, Timebase = 200ps/div
V
CC = 3.3V
VEE = GND
VTT = 1.3V
Ta = 27°C
D = 1.25Gbps
Vin = 5mVp-p
Single input
pattern: PRBS223-1
Q/QB = 50Ω to VTT
Q
QB
Ch. 1 = 400mV/div OFFSET = –1330mV, Ch. 2 = 400mV/div OFFSET = –1330mV, Timebase = 500ps/div
VCC = 3.3V
VEE = GND
VTT = 1.3V
Ta = 27°C
D = 622Mbps
Vin = 5mVp-p
Single input
pattern: PRBS223-1
Q/QB = 50Ω to VTT
Fig. 7
Fig. 8
Fig. 9
Example of Representative Characteristics
Page 16
– 16 –
CXB1573R
2. Bit error rate
3. Alarm level
622Mbps
1.0Gbps
1.25Gbps
Bit error rate vs. Data input level
Data input level [mVp-p]
1.5 2 2.5 3 3.5 4 4.5
10
–10
10
–9
10
–8
10
–7
10
–6
10
–5
10
–4
10
–3
VCC = 3.3V
VEE = GND
VTT = 1.3V
Ta = 27°C
Single input
pattern: PRBS223-1
Q/QB = 50Ω to VTT
Bit error rate
Alarm level vs.Temperature
Ta [°C]
–40
2.0
20 80
Alarm level [mV]
2.5
3.0
3.5
4.0
4.5
5.0
6.0
–20 400 60
5.5
Alarm level vs. REX1
UP-DOWN (REX1) [Ω]
10
2
2
10
3
10
4
Alarm level [mV]
3
4
5
6
7
8
9
SW = H
SW = L
fin = 100Mbps
V
CC – VEE = 3.3V
Ta = 27°C
Differential input
Q
QB
Ch. 1 = 400mV/div OFFSET = –1330mV, Ch. 2 = 400mV/div OFFSET = –1330mV, Timebase = 200ps/div
V
CC = 3.3V
VEE = GND
VTT = 1.3V
Ta = 27°C
D = 1.25Gbps
Vin = 10mVp-p
Single input
pattern: PRBS223-1
Q/QB = 50Ω to VTT
Fig. 10
Fig. 11
Fig. 12 Fig. 13
100
SW = H
SW = L
fin = 100Mbps
VCC – VEE = 3.3V
Up-Down = 200Ω (REX1)
Page 17
– 17 –
CXB1573R
Alarm level vs. Supply voltage
VCC – VEE [V]
3.0
2.0
Fig. 14
3.3 3.6
Alarm level [mV]
2.5
3.0
3.5
4.0
4.5
5.0
6.0
SW = H
SW = L
fin = 100Mbps
Ta = 27°C
Up-Down = 200Ω (REX1)
3.1 3.43.2 3.5
5.5
Alarm level vs. Temperature
Ta [°C]
–40
11.0
20 80
Alarm level [mV]
11.5
12.0
12.5
13.0
13.5
14.0
15.0
–20 400 60
14.5
Alarm level vs. Supply voltage
VCC – VEE [V]
3.0
11.0
3.3 3.6
Alarm level [mV]
11.5
12.0
12.5
12.0
13.5
14.0
15.0
SW = H
SW = L
fin = 100Mbps
Ta = 27°C
VCC-UP = 5kΩ (REX2)
3.1 3.43.2 3.5
14.5
Alarm level vs. REX2
VCC-UP (REX2) [Ω]
10
3
8
10
4
10
5
Alarm level [mV]
10
11
12
13
14
15
16
SW = H
SW = L
fin = 100Mbps
VCC – VEE = 3.3V
Ta = 27°C
Differential input
9
Alarm level vs. Temperature
Ta [°C]
–40
2.5
20
Alarm level [mV]
3.0
3.5
4.0
4.5
5.0
6.0
–20 400 60
5.5
Alarm level vs. REX3
VCC-DOWN (REX3) [Ω]
10
3
3
10
4
10
5
Alarm level [mV]
4
5
6
7
8
9
SW = H
SW = L
fin = 100Mbps
VCC – VEE = 3.3V
Ta = 27°C
Differential input
Fig. 15
Fig. 16 Fig. 17
Fig. 18 Fig. 19
fin = 100Mbps
VCC – VEE = 3.3V
VCC-UP = 5kΩ (REX2)
100
SW = H
SW = L
SW = H
SW = L
fin = 100Mbps
VCC – VEE = 3.3V
VCC-Down = 3kΩ (REX3)
80 100
Page 18
– 18 –
CXB1573R
Alarm level vs. Supply voltage
VCC – VEE [V]
3.0
2.0
3.3 3.6
Alarm level [mV]
2.5
3.0
3.5
4.0
4.5
5.0
6.0
SW = H
SW = L
fin = 100Mbps
Ta = 27°C
VCC-Down = 3kΩ (REX3)
3.1 3.43.2 3.5
5.5
Hyteresis width vs. Supply voltage
VCC – VEE [V]
3.0
0
3.3 3.6
HYS [dB]
1.0
2.0
3.0
4.0
5.0
6.0
8.0
SW = H
SW = L
fin = 100Mbps
Ta = 27°C
Up, Down = Open
VEEI = VEE
3.1 3.43.2 3.5
7.0
Hysteresis width vs. Alarm level
Alarm level [mV]
2.0
0
8.0 14.0
HYS [dB]
1.0
2.0
3.0
4.0
5.0
6.0
8.0
SW = H
SW = L
fin = 100Mbps
VCC – VEE = 3.3V
Ta = 27°C
4.0 10.06.0 12.0
7.0
Hysteresis width vs. Temperature
Ta [°C]
–40
0
20 80
HYS [dB]
2.0
3.0
4.0
5.0
6.0
8.0
SW = H
SW = L
fin = 100Mbps
VCC – VEE = 3.3V
Up, Down = Open
VEEI = VEE
–20 400 60
7.0
1.0
Alarm level vs. Data rate
fin [Mbps]
200
2
800 1400
Alarm level [mV]
6
8
10
12
14
16
SW = H
SW = L
VCC – VEE = 3.3V
Ta = 27°C
Up, Down = Open
VEEI = VEE
400 1000600 1200
4
0
Hysteresis width vs. Data rate
fin [Mbps]
200
0
800 1400
HYS [dB]
4
6
8
10
12
SW = H
SW = L
VCC – VEE = 3.3V
Ta = 27°C
Up, Down = Open
VEEI = VEE
400 1000600 1200
2
0
Fig. 20 Fig. 21
Fig. 22 Fig. 23
Fig. 24 Fig. 25
Page 19
– 19 –
CXB1573R
SD-ECL "H" level vs. Supply voltage
VCC – VEE [V]
3.0
–1100
3.3 3.6
"H" level [mV]
–1060
–1020
–980
–940
–900
–860
SD-ECL
SDB-ECL
Ta = 27°C
3.1 3.43.2 3.5
SD-ECL "L" level vs. Temperature
Ta [°C]
–40 100200
–1880
"L" level [mV]
–1840
–1800
–1760
–1720
–1680
SD-ECL "L" level vs. Supply voltage
VCC – VEE [V]
3.0
–1880
3.3 3.6
"L" level [mV]
–1840
–1800
–1760
–1720
–1680
3.1 3.43.2 3.5
SD-ECL
SDB-ECL
Ta = 27°C
SD-ECL "H" level vs. Temperature
Ta [°C]
–1100
"H" level [mV]
–1060
–1020
–980
–940
–900
–860
SD-TTL "H" level vs. Supply voltage
VCC – VEE [V]
3.0
2.2
3.3 3.6
"H" level [V]
2.4
2.6
2.8
3.0
3.4
Ta = 27°C
3.1 3.43.2 3.5
3.2
SD-TTL "H" level vs. Temperature
Ta [°C]
2.2
"H" level [V]
2.4
2.6
2.8
3.0
3.4
3.2
4. DC voltage
Fig. 26 Fig. 27
Fig. 28 Fig. 29
Fig. 30 Fig. 31
–1640
–1640
SD-ECL
SDB-ECL
VCC – VEE = 3.3V
40 60 80–20
–40 100200 40 60 80–20
VCC – VEE = 3.3V
–40 100200 40 60 80–20
VCC – VEE = 3.3V
SD-ECL
SDB-ECL
Page 20
– 20 –
CXB1573R
SD-TTL "L" level vs. Temperature
Ta [°C]
200
"L" level [mV]
250
300
350
400
SD-TTL "L" level vs. Supply voltage
VCC – VEE [V]
3.0
200
3.3 3.6
"L" level [mV]
250
300
350
400
Ta = 27°C
3.1 3.43.2 3.5
Q "H" level vs. Supply voltage
VCC – VEE [V]
3.0
–1100
3.3 3.6
"H" level [mV]
–1060
–1020
–980
–940
–900
–860
Q-H
QB-H
Ta = 27°C
3.1 3.43.2 3.5
Q "H" level vs. Temperature
Ta [°C]
–1100
"H" level [mV]
–1060
–1020
–980
–940
–900
–860
Q "L" level vs. Supply voltage
VCC – VEE [V]
3.0
–1860
3.3 3.6
"L" level [mV]
–1820
–1780
–1740
–1700
–1660
Q-L
QB-L
Ta = 27°C
3.1 3.43.2 3.5
–1620
Q "L" level vs. Temperature
Ta [°C]
"L" level [mV]
–1860
–1820
–1780
–1740
–1700
–1660
–1620
Fig. 32 Fig. 33
Fig. 34 Fig. 35
Fig. 36 Fig. 37
–40 100200 40 60 80–20
–40 100200 40 60 80–20
VCC – VEE = 3.3V
Q-H
QB-H
–40 100200 40 60 80–20
VCC – VEE = 3.3V
Q-L
QB-L
VCC – VEE = 3.3V
Page 21
– 21 –
CXB1573R
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
PALLADIUM PLATING
COPPER ALLOY
32PIN LQFP (PLASTIC)
LQFP-32P-L01
LQFP032-P-0505
0.1g
5.0
7.0
DETAIL A
0° to 8°
(0.5)
0.6 ± 0.15
0.25
0.1 ± 0.05
(0.2)
0.2 ± 0.03
(0.125)
0.125 ± 0.02
DETAIL
B
0.2
X4
S
A B
24
1
8
25
9
17
32
16
A
0.08
M
S
A B
0.2
X4
S
A B
0.5
A
B
(0.5)
0.08
S
1.7MAX
S
B
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
Package Outline Unit: mm
Loading...