PRELIMINARY
Am29LV081
8 Megabit (1 M x 8-Bit)
CMOS 3.0 Volt-only Uniform Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
■Optimized architecture for Miniature Card and mass storage applications
■Single power supply operation
—Full voltage range: 2.7 to 3.6 volt read and write operations for battery-powered applications
—Regulated voltage range: 3.0 to 3.6 volt read and write operations and for compatibility with high performance 3.3 volt microprocessors
■High performance
—Full voltage range: access times as fast as 100 ns
—Regulated voltage range: access times as fast as 90 ns
■Ultra low power consumption (typical values at 5 MHz)
—200 nA Automatic Sleep mode current
—200 nA standby mode current
—10 mA read current
—20 mA program/erase current
■Flexible sector architecture
—Sixteen 64 Kbyte sectors
—Supports full chip erase
—Sector Protection features:
A hardware method of locking a sector (using programming equipment) to prevent any program or erase operations within that sector
Temporary Sector Unprotect feature allows code changes in previously locked sectors
■Embedded Algorithms
—Embedded Erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors
—Embedded Program algorithm automatically writes and verifies data at specified addresses
■Typical 1,000,000 write cycles per sector (100,000 cycles minimum guaranteed)
■Package option
—40-pin TSOP
■Compatibility with JEDEC standards
—Pinout and software compatible with singlepower supply Flash
—Superior inadvertent write protection
■Data# Polling and toggle bits
—Provides a software method of detecting program or erase operation completion
■Ready/Busy# pin (RY/BY#)
—Provides a hardware method of detecting program or erase cycle completion
■Erase Suspend/Erase Resume
—Suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation
■Hardware reset pin (RESET#)
—Hardware method to reset the device to reading array data
Publication# 20977 Rev: C Amendment/+1
Issue Date: March 1998
Refer to AMD’s Website (www.amd.com) for the latest information.
P R E L I M I N A R Y
GENERAL DESCRIPTION
The Am29LV081 is an 8 Mbit, 3.0 volt-only Flash memory organized as 1,048,576 bytes. The device is offered in a 40-pin TSOP package. The byte-wide (x8) data appears on DQ7–DQ0. This device requires only a single, 3.0 volt VCC supply to perform read, program, and erase operations. A standard EPROM programmer can also be used to program and erase the device.
The standard device offers access times of 90, 100, 120, and 150 ns, allowing high speed microprocessors to operate without wait states. To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls.
The device requires only a single 3.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.
Device programming occurs by executing the program command sequence. This initiates the Embedded Program algorithm—an internal algorithm that automatically times the program pulse widths and verifies proper cell margin.
Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase algo- rithm—an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin.
The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory.
Hardware data protection measures include a low VCC detector that automatically inhibits write operations during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of the sectors of memory. This is achieved via programming equipment.
The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. True background erase can thus be achieved.
The hardware RESET# pin terminates any operation in progress and resets the internal state machine to reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the automatic sleep mode. The system can also place the device into the standby mode. Power consumption is greatly reduced in both these modes.
AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The data is programmed using hot electron injection.
2 |
Am29LV081 |
P R E L I M I N A R Y
PRODUCT SELECTOR GUIDE
Family Part Number |
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Am29LV081 |
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Speed Options |
Regulated Voltage Range: VCC =3.0–3.6 V |
-90R |
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Full Voltage Range: VCC = 2.7–3.6 V |
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-100 |
-120 |
-150 |
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Max access time, ns (tACC) |
90 |
100 |
120 |
150 |
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Max CE# access time, ns (tCE) |
90 |
100 |
120 |
150 |
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Max OE# access time, ns (tOE) |
40 |
40 |
50 |
55 |
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Note: See “AC Characteristics” for full specifications.
BLOCK DIAGRAM
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RY/BY# |
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DQ0–DQ7 |
VCC |
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Sector Switches |
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VSS |
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RESET# |
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Erase Voltage |
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Input/Output |
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Generator |
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Buffers |
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WE# |
State |
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Control |
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Command |
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Register |
PGM Voltage |
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Generator |
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Chip Enable |
Data |
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STB |
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CE# |
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Output Enable |
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OE# |
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STB |
Y-Decoder |
Y-Gating |
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VCC Detector |
Timer |
Latch |
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Address |
X-Decoder |
Cell Matrix |
A0–A19 |
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20977C-1 |
Am29LV081 |
3 |
P R E L I M I N A R Y
CONNECTION DIAGRAMS
A16 1
A15 2
A14 3
A13 4
A12 5
A11 6
A9 7
A8 8
WE# 9 RESET# 10
NC 11 RY/BY# 12 A18 13 A7 14 A6 15 A5 16 A4 17 A3 18 A2 19 A1 20
A17 1
VSS 2
NC 3
A19 4
A10 5
DQ7 6
DQ6 7
DQ5 8
DQ4 9
VCC 10
VCC 11
NC 12
DQ3 13
DQ2 14
DQ1 15
DQ0 16
CE# 17
VSS 18
CE# 19
A0 20
Standard TSOP
Reverse TSOP
40 A17
39 VSS
38 NC
37 A19
36 A10
35 DQ7
34 DQ6
33 DQ5
32 DQ4
31 VCC
30 VCC
29 NC
28 DQ3
27 DQ2
26 DQ1
25 DQ0
24 OE#
23 VSS
22 CE#
21 A0
40 A16
39 A15
38 A14
37 A13
36 A12
35 A11
34 A9
33 A8
32 WE#
31 RESET#
30 NC
29 RY/BY#
28 A18
27 A7
26 A6
25 A5
24 A4
23 A3
22 A2
21 A1
20977C-2
4 |
Am29LV081 |
P R E L I M I N A R Y
PIN CONFIGURATION
A0–A19 |
= |
20 addresses |
DQ0–DQ7 |
= |
8 data inputs/outputs |
CE# |
= |
Chip enable |
OE# |
= |
Output enable |
WE# |
= |
Write enable |
RESET# |
= Hardware reset pin, active low |
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RY/BY# |
= |
Ready/Busy# output |
VCC |
= 3.0 volt-only single power supply |
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(see Product Selector Guide for speed |
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options and voltage supply tolerances) |
VSS |
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Device ground |
NC |
= Pin not connected internally |
LOGIC SYMBOL
20 |
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A0–A19 |
8 |
DQ0–DQ7
CE#
OE#
WE#
RESET#
RY/BY#
20977C-3
Am29LV081 |
5 |
P R E L I M I N A R Y
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below.
Am29LV081 -90R E C
OPTIONAL PROCESSING
Blank = Standard Processing
B = Burn-in
(Contact an AMD representative for more information)
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
E = Extended (–55°C to +125°C)
PACKAGE TYPE
E= 40-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 040)
F= 40-Pin Thin Small Outline Package (TSOP) Reverse Pinout (TSR040)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
Am29LV081
8 Megabit (1 M x 8-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations
Am29LV081-90R
EC, EI, FC, FI
VCC = 3.0–3.6 V
Am29LV081-100
Am29LV081-120
EC, EI, EE,
FC, FI, FE
Am29LV081-150
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations.
6 |
Am29LV081 |
P R E L I M I N A R Y
DEVICE BUS OPERATIONS
This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory location. The register is composed of latches that store the commands, along with the address and data information needed to execute the command. The contents of
the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. Table 1 lists the device bus operations, the inputs and control levels they require, and the resulting output. The following subsections describe each of these operations in further detail.
Table 1. Am29LV081 Device Bus Operations
Operation |
CE# |
OE# |
WE# |
RESET# |
Addresses (See Note) |
DQ0–DQ7 |
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Read |
L |
L |
H |
H |
AIN |
DOUT |
Write |
L |
H |
L |
H |
AIN |
DIN |
Standby |
VCC ± |
X |
X |
VCC ± |
X |
High-Z |
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0.3 V |
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0.3 V |
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Output Disable |
L |
H |
H |
H |
X |
High-Z |
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Reset |
X |
X |
X |
L |
X |
High-Z |
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Temporary Sector Unprotect |
X |
X |
X |
VID |
X |
X |
Legend:
L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5 V, X = Don’t Care, AIN = Address In, DIN = Data In, DOUT = Data Out
Note: Addresses are A19–A0.
Requirements for Reading Array Data
To read array data from the outputs, the system must drive the CE# and OE# pins to VIL. CE# is the power control and selects the device. OE# is the output control and gates array data to the output pins. WE# should remain at VIH.
The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs. The device remains enabled for read access until the command register contents are altered.
See “Reading Array Data” for more information. Refer to the AC Read Operations table for timing specifications and to Figure 12 for the timing diagram. ICC1 in the DC Characteristics table represents the active current specification for reading array data.
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data to the device and erasing sectors of memory), the system must drive WE# and CE# to VIL, and OE# to VIH.
An erase operation can erase one sector, multiple sectors, or the entire device. Table 2 indicates the address
space that each sector occupies. A “sector address” consists of the address bits required to uniquely select a sector. See the “Command Definitions” section for details on erasing a sector or the entire chip, or suspending/resuming the erase operation.
After the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on DQ7–DQ0. Standard read cycle timings apply in this mode. Refer to the “Autoselect Mode” and “Autoselect Command Sequence” sections for more information.
ICC2 in the DC Characteristics table represents the active current specification for the write mode. The “AC Characteristics” section contains timing specification tables and timing diagrams for write operations.
Program and Erase Operation Status
During an erase or program operation, the system may check the status of the operation by reading the status bits on DQ7–DQ0. Standard read cycle timings and ICC read specifications apply. Refer to “Write Operation Status” for more information, and to “AC Characteristics” for timing diagrams.
Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the
Am29LV081 |
7 |
P R E L I M I N A R Y
outputs are placed in the high impedance state, independent of the OE# input.
The device enters the CMOS standby mode when the CE# and RESET# pins are both held at VCC ± 0.3 V. (Note that this is a more restricted voltage range than VIH.) If CE# and RESET# are held at VIH, but not within VCC ± 0.3 V, the device will be in the standby mode, but the standby current will be greater. The device requires standard access time (tCE) for read access when the device is in either of these standby modes, before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the operation is completed.
In the DC Characteristics table, ICC3 and ICC4 represents the standby current specifications.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables this mode when addresses remain stable for tACC + 30 ns. The automatic sleep mode is independent of the CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output data is latched
and always available to the system. ICC5 in the DC Characteristics table represents the automatic sleep
mode current specification.
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of resetting the device to reading array data. When the system drives the RESET# pin to VIL for at least a period of tRP, the device immediately terminates any operation in
progress, tristates all data output pins, and ignores all read/write attempts for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity.
Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS±0.3 V, the device draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS±0.3 V, the standby current will be greater.
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash memory, enabling the system to read the boot-up firmware from the Flash memory.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is
completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after
the RESET# pin returns to VIH.
Refer to the AC Characteristics tables for RESET# parameters and to Figure 13 for the timing diagram.
Output Disable Mode
When the OE# input is at VIH, output from the device is disabled. The output pins are placed in the high impedance state.
8 |
Am29LV081 |
P R E L I M I N A R Y
Table 2. Am29LV081 Sector Address Table
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A19 |
A18 |
A17 |
A16 |
A15 |
A14 |
A13 |
Sector Size |
Address Range |
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SA0 |
0 |
0 |
0 |
0 |
X |
X |
X |
64 Kbytes |
00000h-0FFFFh |
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SA1 |
0 |
0 |
0 |
1 |
X |
X |
X |
64 Kbytes |
10000h-1FFFFh |
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SA2 |
0 |
0 |
1 |
0 |
X |
X |
X |
64 Kbytes |
20000h-2FFFFh |
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SA3 |
0 |
0 |
1 |
1 |
X |
X |
X |
64 Kbytes |
30000h-3FFFFh |
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SA4 |
0 |
1 |
0 |
0 |
X |
X |
X |
64 Kbytes |
40000h-4FFFFh |
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SA5 |
0 |
1 |
0 |
1 |
X |
X |
X |
64 Kbytes |
50000h-5FFFFh |
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SA6 |
0 |
1 |
1 |
0 |
X |
X |
X |
64 Kbytes |
60000h-6FFFFh |
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SA7 |
0 |
1 |
1 |
1 |
X |
X |
X |
64 Kbytes |
70000h-7FFFFh |
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SA8 |
1 |
0 |
0 |
0 |
X |
X |
X |
64 Kbytes |
80000h-8FFFFh |
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SA9 |
1 |
0 |
0 |
1 |
X |
X |
X |
64 Kbytes |
90000h-9FFFFh |
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SA10 |
1 |
0 |
1 |
0 |
X |
X |
X |
64 Kbytes |
A0000h-AFFFFh |
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SA11 |
1 |
0 |
1 |
1 |
X |
X |
X |
64 Kbytes |
B0000h-BFFFFh |
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SA12 |
1 |
1 |
0 |
0 |
X |
X |
X |
64 Kbytes |
C0000h-CFFFFh |
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SA13 |
1 |
1 |
0 |
1 |
X |
X |
X |
64 Kbytes |
D0000h-DFFFFh |
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SA14 |
1 |
1 |
1 |
0 |
X |
X |
X |
64 Kbytes |
E0000h-EFFFFh |
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SA15 |
1 |
1 |
1 |
1 |
X |
X |
X |
64 Kbytes |
F0000h-FFFFFh |
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Autoselect Mode
The autoselect mode provides manufacturer and device identification, and sector protection verification, through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be accessed in-system through the command register.
When using programming equipment, the autoselect mode requires VID (11.5 V to 12.5 V) on address pin A9. Address pins A6, A1, and A0 must be as shown in Table 3. In addition, when verifying sector protection, the sec-
tor address must appear on the appropriate highest order address bits (see Table 2). Table 3 shows the remaining address bits that are don’t care. When all necessary bits have been set as required, the programming equipment may then read the corresponding identifier code on DQ7–DQ0.
To access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in Table 4. This method does not require VID. See “Command Definitions” for details on using the autoselect mode.
Table 3. Am29LV081 Autoselect Codes (High Voltage Method)
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A19 |
A12 |
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A8 |
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A5 |
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DQ7 |
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to |
to |
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to |
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to |
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to |
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Description |
CE# |
OE# |
WE# |
A13 |
A10 |
A9 |
A7 |
A6 |
A2 |
A1 |
A0 |
DQ0 |
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Manufacturer ID: AMD |
L |
L |
H |
X |
X |
VID |
X |
L |
X |
L |
L |
01h |
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Device ID: Am29LV081 |
L |
L |
H |
X |
X |
VID |
X |
L |
X |
L |
H |
38h |
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01h |
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Sector Protection Verification |
L |
L |
H |
SA |
X |
VID |
X |
L |
X |
H |
L |
(protected) |
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00h |
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(unprotected) |
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L = Logic Low = VIL, H = Logic High = VIH, SA = Sector Address, X = Don’t care.
Am29LV081 |
9 |
P R E L I M I N A R Y
Sector Protection/Unprotection
The hardware sector protection feature disables both program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase operations in previously protected sectors.
The device is shipped with all sectors unprotected. AMD offers the option of programming and protecting sectors at its factory prior to shipping the device through AMD’s ExpressFlash™ Service. Contact an AMD representative for details.
It is possible to determine whether a sector is protected or unprotected. See “Autoselect Mode” for details.
Sector protection/unprotection must be implemented using programming equipment.The procedure requires a high voltage (VID) on address pin A9 and OE#. Details on this method are provided in a supplement, publication number 21225. Contact an AMD representative to request a copy.
Temporary Sector Unprotect
This feature allows temporary unprotection of previously protected sectors to change data in-system. The Sector Unprotect mode is activated by setting the RESET# pin to VID. During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once VID is removed from the RESET# pin, all the previously protected sectors are protected again. Figure 1 shows the algorithm, and Figure 19 shows the timing diagrams, for this feature.
Logical Inhibit
Write cycles are inhibited by holding any one of OE#
= VIL, CE# = VIH or WE# = VIH. To initiate a write cycle, CE# and WE# must be a logical zero while OE#
is a logical one.
Power-Up Write Inhibit
If WE# = CE# = VIL and OE# = VIH during power up, the device does not accept commands on the rising edge of WE#. The internal state machine is automatically reset to reading array data on power-up.
START
RESET# = VID
(Note 1)
Perform Erase or
Program Operations
RESET# = VIH
Temporary Sector
Unprotect Completed
(Note 2)
Hardware Data Protection
The command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to Table 4 for command definitions). In addition, the following hardware data protection measures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals during VCC power-up and power-down transitions, or from system noise.
Low VCC Write Inhibit
When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register and all internal program/erase circuits are disabled, and the device resets. Subsequent writes are ignored until VCC is greater than VLKO. The system must provide the proper signals to the control pins to prevent unintentional writes when VCC is greater than VLKO.
Write Pulse “Glitch” Protection
Noise pulses of less than 5 ns (typical) on OE#, CE# or WE# do not initiate a write cycle.
20977C-4
Notes:
1.All protected sectors unprotected.
2.All previously protected sectors are protected once again.
Figure 1. Temporary Sector Unprotect Operation
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P R E L I M I N A R Y
COMMAND DEFINITIONS
Writing specific address and data commands or sequences into the command register initiates device operations. Table 4 defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data.
All addresses are latched on the falling edge of WE# or CE#, whichever happens later. All data is latched on the rising edge of WE# or CE#, whichever happens first. Refer to the appropriate timing diagrams in the “AC Characteristics” section.
Reading Array Data
The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is also ready to read array data after completing an Embedded Program or Embedded Erase algorithm.
After the device accepts an Erase Suspend command, the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erase-suspended sectors, the device outputs status data. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See “Erase Suspend/Erase Resume Commands” for more information on this mode.
The system must issue the reset command to re-en- able the device for reading array data if DQ5 goes high, or while in the autoselect mode. See the “Reset Command” section, next.
See also “Requirements for Reading Array Data” in the “Device Bus Operations” section for more information. The Read Operations table provides the read parameters, and Figure 12 shows the timing diagram.
Reset Command
Writing the reset command to the device resets the device to reading array data. Address bits are don’t care for this command.
The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the device to reading array data. Once erasure begins, however, the device ignores reset commands until the operation is complete.
The reset command may be written between the sequence cycles in a program command sequence before programming begins. This resets the device to reading array data (also applies to programming in Erase Suspend mode). Once programming begins, however, the device ignores reset commands until the operation is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return to reading array data (also applies to autoselect during Erase Suspend).
If DQ5 goes high during a program or erase operation, writing the reset command returns the device to reading array data (also applies during Erase Suspend).
See the applicable “AC Characteristics” section for parameters, and to the Figure 13 for the timing waveforms.
Autoselect Command Sequence
The autoselect command sequence allows the host system to access the manufacturer and devices codes, and determine whether or not a sector is protected. Table 4 shows the address and data requirements. This method is an alternative to that shown in Table 3, which is intended for PROM programmers and requires VID on address bit A9.
The autoselect command sequence is initiated by writing two unlock cycles, followed by the autoselect command. The device then enters the autoselect mode, and the system may read at any address any number of times, without initiating another command sequence.
A read cycle at address XX00h retrieves the manufacturer code. A read cycle at address XX01h returns the device code. A read cycle containing a sector address (SA) and the address 02h in it, returns 01h if that sector is protected, or 00h if it is unprotected. Refer to Table 2 for valid sector addresses.
The system must write the reset command to exit the autoselect mode and return to reading array data.
Byte Program Command Sequence
Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated program pulses and verify the programmed cell margin. Table 4 shows the address and data requirements for the byte program command sequence.
When the Embedded Program algorithm is complete, the device then returns to reading array data and addresses are no longer latched. The system can determine the status of the program operation by using DQ7, DQ6, or RY/BY#. See “Write Operation Status” for information on these status bits.
Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a
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