Sharp LH5116HD-10, LH5116H-10, LH5116H, LH5116, LH5116N-10 Datasheet

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LH5116/H

CMOS 16K (2K × 8) Static RAM

FEATURES

2,048 × 8 bit organization

Access time: 100 ns (MAX.)

Power consumption:

Operating: 220 mW (MAX.) Standby: 5.5 μW (MAX.)

Single +5 V power supply

Fully-static operation

TTL compatible I/O

Three-state outputs

Wide temperature range available LH5116H: -40 to +85°C

Packages:

24-pin, 600-mil DIP

24-pin, 300-mil SK-DIP

24-pin, 450-mil SOP

DESCRIPTION

The LH5116/H are static RAMs organized as 2,048 × 8 bits. It is fabricated using silicon-gate CMOS process technology. It features high speed access in read mode using output enable (tOE).

PIN CONNECTIONS

24-PIN DIP

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TOP VIEW

24-PIN SK-DIP

 

 

 

 

 

 

 

 

 

 

 

 

24-PIN SOP

A7

 

 

 

 

1

24

 

Vcc

 

 

 

 

 

 

 

 

 

 

 

 

A6

 

 

 

 

2

23

 

A8

 

 

 

 

 

 

 

A5

 

 

 

 

22

 

A9

 

 

 

 

 

 

3

 

 

 

 

 

 

 

 

A4

 

 

 

 

4

21

 

WE

 

 

 

 

 

 

 

 

 

 

 

 

 

A3

 

 

5

20

 

 

 

 

 

 

 

 

 

 

 

OE

 

 

 

 

 

 

 

A2

 

 

 

 

6

19

 

A10

 

 

 

 

 

 

 

A1

 

 

 

 

7

18

 

 

CE

 

 

 

 

 

 

 

 

A0

 

 

 

 

8

17

 

I/O8

 

 

 

 

 

 

 

I/O1

 

 

 

 

9

16

 

I/O7

 

 

 

 

 

 

 

I/O2

 

 

 

 

10

15

 

I/O6

 

 

 

 

 

 

 

I/O3

 

 

11

14

 

I/O5

 

 

 

 

 

 

 

 

 

 

 

GND

 

 

12

13

 

I/O4

 

 

 

 

 

 

 

 

 

 

5116-1

Figure 1. Pin Connections for DIP, SK-DIP, and SOP Packages

1

Sharp LH5116HD-10, LH5116H-10, LH5116H, LH5116, LH5116N-10 Datasheet

LH5116/H

 

 

 

 

 

 

CMOS 16K (2K × 8) Static RAM

A0

8

ROW ADDRESS

 

ROW DECODERS

 

 

 

 

 

A5

3

BUFFERS

 

 

 

24

VCC

A6

2

 

 

 

MEMORY CELL

 

A7

1

 

ARRAY

12

GND

A8

23

 

(128 x128)

 

 

 

 

 

 

 

A9

22

 

 

 

 

 

A10

19

 

 

 

 

 

 

 

 

 

 

 

 

 

I/O1

9

 

 

CE

 

 

 

 

 

 

 

 

 

 

 

 

 

I/O2

10

 

 

CONTROL

 

 

 

 

 

I/O3

11

 

 

 

COLUMN

 

 

I/O4

13

 

 

 

I/O CIRCUIT

 

 

I/O5

14

 

 

 

 

 

 

 

 

 

DATA

 

 

 

 

 

I/O6

15

 

 

COLUMN DECODERS

 

I/O7

16

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I/O8

17

 

 

 

 

 

 

 

 

 

 

 

 

 

COLUMN ADDRESS

 

 

 

 

 

 

 

BUFFERS

 

 

 

 

 

 

 

CE

 

 

 

 

CE 18

 

 

 

 

 

 

 

 

WE 21

 

 

 

 

 

 

 

 

OE

20

 

 

 

 

 

 

 

 

 

 

 

 

 

4

5

6

7

 

 

 

 

 

 

A4

A3

A2

A1

 

 

 

 

 

 

 

 

 

 

5116-2

Figure 2. LH5116/H Block Diagram

PIN DESCRIPTION

SIGNAL

PIN NAME

SIGNAL

PIN NAME

A0 - A10

Address input

I/O1 - I/O8

Data input/output

CE

Chip Enable input

VCC

Power supply

OE

Output Enable input

GND

Ground

WE

Write Enable input

 

 

TRUTH TABLE

 

 

 

 

 

 

 

 

 

 

CE

 

OE

 

WE

MODE

I/O1 - I/O8

SUPPLY CURRENT

NOTE

L

X

L

Write

DIN

Operating (ICC)

1

L

L

H

Read

DOUT

Operating (ICC)

 

H

X

X

Deselect

High-Z

Standby (ISB)

1

L

H

X

Outputs disable

High-Z

Operating (ICC)

1

NOTE:

1. X = H or L

2

CMOS 16K (2K × 8) Static RAM

LH5116/H

 

 

ABSOLUTE MAXIMUM RATINGS

PARAMETER

SYMBOL

RATING

Supply voltage

VCC

-0.3 to +7.0

Input voltage

VIN

-0.3 to VCC + 0.3

Operating temperature

Topr

0 to +70

-40 to +85

 

 

Storage temperature

Tstg

-55 to +150

NOTES:

1.The maximum applicable voltage on any pin with respect to GND.

2.Applied to the LH5116/D/NA

3.Applied to the LH5116H/HD/HN

UNIT

NOTE

V

1

V

1

°C

2

3

 

°C

 

RECOMMENDED OPERATING CONDITIONS 1

PARAMETER

SYMBOL

MIN.

TYP.

MAX.

UNIT

Supply voltage

VCC

4.5

5.0

5.5

V

Input voltage

VIH

2.2

 

VCC + 0.3

V

VIL

-0.3

 

0.8

V

 

 

NOTE:

1. TA = 0 to 70°C (LH5116/D/NA), TA = -40 to +85°C (LH5116H/HD/HN)

DC CHARACTERISTICS 1 (VCC = 5 V ±10%)

PARAMETER

SYMBOL

Output ‘LOW’ voltage

V

 

OL

Output ‘HIGH’ voltage

VOH

Input leakage current

ILI

Output leakage current

ILO

Operating current

ICC1

ICC2

 

Standby current

ISB

NOTES:

CONDITIONS

MIN.

TYP.

MAX.

UNIT

NOTE

IOL = 2.1 mA

 

 

0.4

V

 

IOH = -1.0 mA

2.4

 

 

V

 

VIN = 0 V to VCC

-1.0

 

1.0

mA

 

CE = VIH, VI/O = 0 V to VCC

-1.0

 

1.0

mA

 

Outputs open (OE = VCC)

 

25

30

mA

2

Outputs open (OE = VIH)

 

30

40

mA

3

CE ³ VCC - 0.2 V

 

 

1.0

mA

 

All other input pins = 0 V to VCC

 

 

0.2

4

 

 

 

1.TA = 0 to 70°C (LH5116/D/NA), TA = -40 to +85°C (LH5116H/HD/HN)

2.CE = 0 V; all other input pins = 0 V to VCC

3.CE = VIL; all other input pins = VIL to VIH

4.TA = 25°C

AC CHARACTERISTICS 1

(1) READ CYCLE (VCC = 5 V ±10%)

PARAMETER

SYMBOL

MIN.

TYP.

MAX.

UNIT

NOTE

Read cycle time

tRC

100

 

 

ns

 

Address access time

tAA

 

 

100

ns

 

Chip enable access time

tACE

 

 

100

ns

 

Chip enable Low to output in Low-Z

tCLZ

10

 

 

ns

2

Output enable access time

tOE

 

 

40

ns

 

Output enable Low to output in Low-Z

tOLZ

10

 

 

ns

2

Chip disable to output in High-Z

tCHZ

0

 

40

ns

2

Output disable to output in High-Z

tOHZ

0

 

40

ns

2

Output hold time

tOH

10

 

 

ns

 

NOTES:

1.TA = 0 to 70°C (LH5116/NA/D). TA = -40 to 85°C (LH5116H/HD/HN).

2.Active output to high-impedance and high-impedance to output active tests specified for a ±200 mV transition from steady state levels into the test load.

3

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