Intel® Desktop Board
D810EMO/MO810E
Technical Product Specification
February 2000
Order Number A00653-001
The Intel® Desktop Board D810EMO/MO810E may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D810EMO/MO810E Specification Update.
Revision History
Revision |
Revision History |
Date |
-001 |
First release of the Intel® Desktop Board D810EMO/MO810E Technical |
February 2000 |
|
Product Specification |
|
This product specification applies to only standard D810EMO/MO810E boards with BIOS identifier MO81010A.86A.
Changes to this specification will be published in the Intel Desktop Board D810EMO/MO810E Specification Update before being incorporated into a revision of this document.
Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The D810EMO/MO810E board may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.
† All other brands and names are the property of their respective owners.
Copyright © 2000, Intel Corporation. All rights reserved.
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the D810EMO/MO810E desktop board. It describes the standard product and available manufacturing options.
The D810EMO desktop board is known in some documentation and sales collateral as the MO810E. Both names refer to the same product.
The TPS is intended to provide detailed, technical information about the board and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
Chapter Description
1A description of the hardware used on this board
2A map of the resources of the board
3The features supported by the BIOS Setup program
4The contents of the BIOS Setup program’s menus and submenus
5A description of the BIOS error messages, beep codes, and POST codes
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions that, if not observed, can cause personal injury.
iii
Intel Desktop Board D810EMO/MO810E Technical Product Specification
#Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX)
KB
Kbit
MB
Mbit
GB
xxh
x.x V
When used in the description of a component, N indicates component type, xn are the relative coordinates of its location on the board, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area.
Kilobyte (1024 bytes)
Kilobit (1024 bits)
Megabyte (1,048,576 bytes)
Megabit (1,048,576 bits)
Gigabyte (1,073,741,824 bytes)
An address or data value ending with a lowercase h indicates a hexadecimal value.
Volts. Voltages are DC unless otherwise specified.
†This symbol is used to indicate third-party brands and names that are the property of their respective owners.
iv
1 Product Description
1.1 |
Overview ................................................................................................................... |
10 |
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1.1.1 |
Feature Summary ....................................................................................... |
10 |
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1.1.2 |
Board Layout............................................................................................... |
11 |
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1.1.3 |
Block Diagram............................................................................................. |
12 |
1.2 |
Online Support........................................................................................................... |
13 |
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1.3 |
Design Specifications ................................................................................................ |
13 |
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1.4 |
Processor .................................................................................................................. |
16 |
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1.5 |
System Memory......................................................................................................... |
17 |
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1.6 |
Intel® 810E Chipset ................................................................................................... |
18 |
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1.6.1 |
Direct AGP .................................................................................................. |
19 |
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1.6.2 |
USB............................................................................................................. |
19 |
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1.6.3 |
IDE Support................................................................................................. |
20 |
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1.6.4 |
Real-Time Clock, CMOS SRAM, and Battery.............................................. |
20 |
1.7 |
I/O Controller ............................................................................................................. |
21 |
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1.8 |
Serial Debug Port ...................................................................................................... |
21 |
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1.9 |
Graphics Subsystem ................................................................................................. |
22 |
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1.10 Audio Subsystem....................................................................................................... |
23 |
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1.10.1 Creative Sound Blaster AudioPCI 128V ...................................................... |
23 |
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1.10.2 Creative ES1373D Digital Audio Controller.................................................. |
23 |
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1.10.3 Crystal Semiconductor CS4297A Analog Codec ......................................... |
23 |
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1.10.4 |
Audio Connectors........................................................................................ |
24 |
1.11 Hardware Monitor Component................................................................................... |
24 |
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1.12 LAN Subsystem......................................................................................................... |
25 |
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1.12.1 Intel® 82559 PCI LAN Controller ................................................................. |
25 |
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1.12.2 |
LAN Subsystem Software............................................................................ |
26 |
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1.12.3 RJ-45 LAN Connector LEDs........................................................................ |
26 |
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1.13 Power Management Features.................................................................................... |
27 |
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1.13.1 |
ACPI............................................................................................................ |
27 |
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1.13.2 |
Hardware Support ....................................................................................... |
29 |
2 Technical Reference
2.1 |
Introduction................................................................................................................ |
33 |
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2.2 |
Memory Map ............................................................................................................. |
33 |
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2.3 |
I/O Map |
..................................................................................................................... |
34 |
2.4 |
DMA Channels .......................................................................................................... |
35 |
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2.5 |
PCI Configuration ...................................................................................Space Map |
36 |
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2.6 |
Interrupts ................................................................................................................... |
36 |
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2.7 |
PCI Interrupt .........................................................................................Routing Map |
37 |
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2.8 |
Connectors ................................................................................................................ |
38 |
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2.8.1 ......................................................................... |
Back Panel I/O Connectors |
39 |
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2.8.2 ............................................................................... |
Internal I/O Connectors |
41 |
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2.8.3 .............................................................................. |
External I/O Connectors |
46 |
v
Intel Desktop Board D810EMO/MO810E Technical Product Specification
2.9 |
Jumper Block............................................................................................................. |
49 |
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2.10 |
Mechanical Considerations........................................................................................ |
51 |
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2.10.1 |
FlexATX Form Factor .................................................................................. |
51 |
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2.10.2 |
I/O Shield .................................................................................................... |
52 |
2.11 |
Electrical Considerations ........................................................................................... |
53 |
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2.11.1 |
Add-in Board Considerations....................................................................... |
53 |
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2.11.2 |
Power Consumption .................................................................................... |
53 |
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2.11.3 |
Power Supply Considerations...................................................................... |
54 |
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2.11.4 |
Fan Power Requirements............................................................................ |
54 |
2.12 |
Thermal Considerations............................................................................................. |
55 |
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2.13 |
Reliability ................................................................................................................... |
56 |
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2.14 |
Environmental............................................................................................................ |
57 |
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2.15 |
Regulatory Compliance ............................................................................................. |
58 |
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2.15.1 |
Safety Regulations ...................................................................................... |
58 |
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2.15.2 |
EMC Regulations ........................................................................................ |
58 |
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2.15.3 |
Certification Markings.................................................................................. |
59 |
3 Overview of BIOS Features
3.1 |
Introduction................................................................................................................ |
61 |
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3.2 |
BIOS Flash Memory Organization ............................................................................. |
62 |
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3.3 |
Resource Configuration ............................................................................................. |
62 |
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3.3.1 |
PCI Autoconfiguration ................................................................................. |
62 |
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3.3.2 |
PCI IDE Support.......................................................................................... |
63 |
3.4 |
System Management BIOS (SMBIOS) ...................................................................... |
64 |
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3.5 |
BIOS Upgrades ......................................................................................................... |
65 |
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3.5.1 |
Language Support....................................................................................... |
65 |
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3.5.2 |
Custom Splash Screen................................................................................ |
65 |
3.6 |
Recovering BIOS Data .............................................................................................. |
66 |
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3.7 |
Boot Options.............................................................................................................. |
67 |
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3.7.1 |
CD-ROM and Network Boot ........................................................................ |
67 |
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3.7.2 |
Booting Without Attached Devices .............................................................. |
67 |
3.8 |
USB Legacy Support ................................................................................................. |
68 |
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3.9 |
BIOS Security Features ............................................................................................. |
69 |
4 BIOS Setup Program
4.1 |
Introduction................................................................................................................ |
71 |
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4.2 |
Maintenance Menu .................................................................................................... |
72 |
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4.2.1 |
Extended Configuration Submenu............................................................... |
73 |
4.3 |
Main Menu................................................................................................................. |
74 |
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4.4 |
Advanced Menu......................................................................................................... |
75 |
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4.4.1 |
Boot Configuration Submenu ...................................................................... |
76 |
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4.4.2 |
Peripheral Configuration Submenu.............................................................. |
77 |
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4.4.3 |
IDE Configuration Submenu........................................................................ |
78 |
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4.4.4 |
Event Log Configuration.............................................................................. |
81 |
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4.4.5 |
Video Configuration..................................................................................... |
82 |
vi
Contents
4.5 |
Security Menu............................................................................................................ |
83 |
4.6 |
Power Menu .............................................................................................................. |
84 |
4.7 |
Boot Menu ................................................................................................................. |
85 |
4.8 |
Exit Menu .................................................................................................................. |
87 |
5 Error Messages and Beep Codes |
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5.1 |
BIOS Error Messages................................................................................................ |
89 |
5.2 |
Port 80h POST Codes ............................................................................................... |
91 |
5.3 |
Bus Initialization Checkpoints .................................................................................... |
95 |
5.4 |
Speaker ..................................................................................................................... |
96 |
5.5 |
BIOS Beep Codes ..................................................................................................... |
97 |
Figures |
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|
1. |
Board Components.................................................................................................... |
11 |
2. |
Block Diagram ........................................................................................................... |
12 |
3. |
Intel 810E Chipset Block Diagram ............................................................................. |
18 |
4. |
Back Panel I/O Connectors ....................................................................................... |
39 |
5. |
Internal I/O Connectors ............................................................................................. |
41 |
6. |
External I/O Connectors ............................................................................................ |
46 |
7. |
Location of the Jumper Block .................................................................................... |
49 |
8. |
Board Dimensions ..................................................................................................... |
51 |
9. |
I/O Shield Dimensions ............................................................................................... |
52 |
10. |
High Temperature Zones........................................................................................... |
55 |
11. |
Memory Map of the Flash Memory Device ................................................................ |
62 |
Tables |
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|
1. |
Feature Summary...................................................................................................... |
10 |
2. |
Specifications ............................................................................................................ |
13 |
3. |
Processors Supported by the Board .......................................................................... |
16 |
4. |
System Memory Configuration................................................................................... |
17 |
5. |
Supported Graphics Refresh Rates ........................................................................... |
22 |
6. |
LAN Connector LED States ....................................................................................... |
26 |
7. |
Effects of Pressing the Power Switch ........................................................................ |
27 |
8. |
Power States and Targeted System Power ............................................................... |
28 |
9. |
Wake Up Devices and Events ................................................................................... |
29 |
10. |
Fan Connector Descriptions ...................................................................................... |
30 |
11. |
System Memory Map................................................................................................. |
33 |
12. |
I/O Map ..................................................................................................................... |
34 |
13. |
DMA Channels .......................................................................................................... |
35 |
14. |
PCI Configuration Space Map ................................................................................... |
36 |
15. |
Interrupts ................................................................................................................... |
36 |
16. |
PCI Interrupt Routing Map ......................................................................................... |
37 |
17. |
USB Connectors........................................................................................................ |
40 |
18. |
VGA Port Connector.................................................................................................. |
40 |
19. |
LAN Connector .......................................................................................................... |
40 |
20. |
Audio Line Out Connector ......................................................................................... |
40 |
vii
Intel Desktop Board D810EMO/MO810E Technical Product Specification
21. |
Mic In Connector ....................................................................................................... |
40 |
22. |
Chassis Fan Connector (J2J1) .................................................................................. |
42 |
23. |
Processor Fan Connector (J7J1) ............................................................................... |
42 |
24. |
Primary IDE Connector (J7E1) .................................................................................. |
42 |
25. |
Slimline IDE Connector (J8E1) .................................................................................. |
43 |
26. |
Serial Debug Port Connector (J7C1) ......................................................................... |
43 |
27. |
Power Connector (J8B1) ........................................................................................... |
44 |
28. |
PCI Bus Connector (J4B1) ........................................................................................ |
45 |
29. |
ATAPI CD-ROM Connector (J2D1) ........................................................................... |
45 |
30. |
USB Port Connector (J7A1)....................................................................................... |
47 |
31. |
Front Panel Connector (J8C1) ................................................................................... |
47 |
32. |
States for a Single-colored Power LED...................................................................... |
48 |
33. |
States for a Dual-colored Power LED ........................................................................ |
48 |
34. |
BIOS Setup Configuration Jumper Settings (J8F1).................................................... |
50 |
35. |
Power Usage ............................................................................................................. |
53 |
36. |
Chassis Fan (J3A2) DC Power Requirements ........................................................... |
54 |
37. |
Thermal Considerations for Components .................................................................. |
56 |
38. |
Board Environmental Specifications .......................................................................... |
57 |
39. |
Safety Regulations .................................................................................................... |
58 |
40. |
EMC Regulations....................................................................................................... |
58 |
41. |
Supervisor and User Password Functions ................................................................. |
69 |
42. |
BIOS Setup Program Menu Functions....................................................................... |
71 |
43. |
BIOS Setup Program Function Keys ......................................................................... |
72 |
44. |
Maintenance Menu .................................................................................................... |
72 |
45. |
Extended Configuration Submenu ............................................................................. |
73 |
46. |
Main Menu................................................................................................................. |
74 |
47. |
Advanced Menu......................................................................................................... |
75 |
48. |
Boot Configuration Submenu..................................................................................... |
76 |
49. |
Peripheral Configuration Submenu ............................................................................ |
77 |
50. |
IDE Configuration Submenu ...................................................................................... |
78 |
51. |
Primary/Secondary IDE Master/Slave Submenus...................................................... |
79 |
52. |
Event Log Configuration Submenu ............................................................................ |
81 |
53. |
Video Configuration Submenu ................................................................................... |
82 |
54. |
Security Menu............................................................................................................ |
83 |
55. |
Power Menu .............................................................................................................. |
84 |
56. |
Boot Menu ................................................................................................................. |
85 |
57. |
Exit Menu .................................................................................................................. |
87 |
58. |
BIOS Error Messages................................................................................................ |
89 |
59. |
Uncompressed INIT Code Checkpoints..................................................................... |
91 |
60. |
Boot Block Recovery Code Checkpoints ................................................................... |
91 |
61. |
Runtime Code Uncompressed in F000 Shadow RAM ............................................... |
92 |
62. |
Bus Initialization Checkpoints .................................................................................... |
95 |
63. |
Upper Nibble High Byte Functions ............................................................................. |
95 |
64. |
Lower Nibble High Byte Functions ............................................................................. |
96 |
65. |
Beep Codes............................................................................................................... |
97 |
viii
What This Chapter Contains |
|
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1.1 |
Overview ................................................................................................................... |
10 |
1.2 |
Online Support........................................................................................................... |
13 |
1.3 |
Design Specifications ................................................................................................ |
13 |
1.4 |
Processor .................................................................................................................. |
16 |
1.5 |
System Memory......................................................................................................... |
17 |
1.6 |
Intel® 810E Chipset ................................................................................................... |
18 |
1.7 |
I/O Controller ............................................................................................................. |
21 |
1.8 |
Serial Debug Port ...................................................................................................... |
21 |
1.9 |
Graphics Subsystem ................................................................................................. |
22 |
1.10 Audio Subsystem....................................................................................................... |
23 |
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1.11 Hardware Monitor Component................................................................................... |
24 |
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1.12 LAN Subsystem......................................................................................................... |
25 |
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1.13 Power Management Features.................................................................................... |
27 |
9
Intel Desktop Board D810EMO/MO810E Technical Product Specification
Table 1 summarizes the D810EMO/MO810E board’s major features.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Direct AGP Video
Audio
I/O Controller
Peripheral
Interfaces
Serial Debug
Port
Expansion capabilities
Management
Level 4 Support
Instantly
Available PC
BIOS
FlexATX (9.0 inches by 7.5 inches)
Support for either an Intel®Pentium®III processor in a Flip Chip Pin Grid Array (FC-PGA) package or an Intel®Celeron™ processor in an FCPGA package or a PPGA package
∙One 168-pin dual inline memory module (DIMM) socket
∙Supports up to 256 MB of 100 MHz non-ECC synchronous DRAM (SDRAM)
∙Support for serial presence detect (SPD) and non-SPD DIMMs
Intel®810E chipset, consisting of:
∙Intel®82810E DC-133 Graphics/Memory Controller Hub (GMCH)
∙Intel®82801AA I/O Controller Hub (ICH)
∙Intel®82802AB 4 Mbit Firmware Hub (FWH)
∙Intel 82810E DC-133 GMCH
∙4 MB of display cache
∙VGA port connector on back panel
Audio Codec ’97 (AC ’97) compatible audio subsystem, consisting of the following:
∙Creative Sound Blaster† AudioPCI 128V digital audio controller (ES1373D)
∙Crystal Semiconductor CS4297A analog codec
SMSC LPC47M102 SIO low pin count (LPC) interface I/O controller
∙Up to four universal serial bus (USB) ports
∙Two IDE interfaces with Ultra DMA support One 9-pin stake-pin serial debug port connector
One PCI bus connector at PCI slot 5 location
∙Intel®82559 local area network (LAN) controller
∙Hardware monitor
∙Support for PCI Local Bus Specification, Revision 2.2
∙Suspend-to-RAM support
∙Wake on USB ports
∙Intel®/AMI BIOS stored in an Intel 82802AB 4 Mbit firmware hub (FWH)
∙Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS
NOTE
The D810EMO/MO810E board is designed to support only USB-aware operating systems.
10
Product Description
For information about |
Refer to |
The board’s compliance level with ACPI, Plug and Play, and SMBIOS |
Table 2, page 13 |
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Figure 1 shows the location of the major components on the board.
A B |
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Q |
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K |
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H |
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OM08923 |
A |
Crystal Semiconductor CS4297A codec |
J |
Front panel connector |
B |
Creative ES1373D digital audio controller |
K |
Power connector |
C |
4 MB display cache |
L |
SMSC LPC47M102 I/O controller |
D |
Back panel I/O connectors |
M |
Intel 82801AA ICH |
E |
Intel 82810E DC-133 GMCH |
N |
Intel 82559 PCI LAN Controller |
F |
Processor socket |
O |
Speaker |
G |
DIMM socket |
P |
Battery |
H |
Primary IDE connector |
Q |
PCI bus connector |
I |
Slimline Secondary IDE connector |
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Figure 1. Board Components
11
Intel Desktop Board D810EMO/MO810E Technical Product Specification
Figure 2 is a block diagram of the major functional areas of the board.
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Primary/ |
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USB |
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Secondary IDE |
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ATA33/66 |
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USB |
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PPGA370 |
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66/100/133 |
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Processor |
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MHz Host Bus |
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810E Chipset |
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100 MHz |
82810E |
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82802AB |
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Graphics Memory |
AHA |
82801AA I/O Controller Hub |
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SDRAM |
Firmware Hub |
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Controller Hub |
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4 MB |
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PCI Bus |
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SMBus |
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AC ’97 Link |
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10/100 |
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LAN |
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Mbps |
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PCI Bus |
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CD-ROM |
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Subsystem |
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Analog |
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Ethernet |
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Line Out |
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Codec |
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PCI Bus |
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Mic In |
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Connector |
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OM09093 |
||||||||||
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Figure 2. Block Diagram
12
Product Description
Find information about Intel®desktop boards under “Product Info” or “Customer Support” at these World Wide Web sites:
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
Table 2 lists the specifications applicable to the D810EMO/MO810E board.
Table 2. |
Specifications |
|
|
|
|
|
|
|
|
Reference |
|
Specification |
Version, Revision Date, |
This specification is |
Name |
|
Title |
and Ownership |
available at: |
AC ‘97 |
|
Audio Codec ‘97 |
Version 2.1, |
ftp://download.intel.com/ |
|
|
|
May 1998, |
pc-supp/platform/ac97 |
|
|
|
Intel Corporation. |
|
ACPI |
|
Advanced Configuration |
Version 1.0, |
http://www.teleport.com/~acpi/ |
|
|
and Power Interface |
July 1, 1998, |
|
|
|
Specification (2X only) |
Intel Corporation, |
|
|
|
|
Microsoft Corporation, |
|
|
|
|
and Toshiba Corporation. |
|
AGP |
|
Accelerated Graphics Port |
Version 2.0, |
the Accelerated Graphics |
|
|
Interface Specification |
May 4, 1998, |
Implementers Forum at: |
|
|
|
Intel Corporation. |
http://www.agpforum.org/ |
AMI BIOS |
|
American Megatrends |
AMIBIOS 99, |
http://www.ami.com/amibios/ |
|
|
BIOS Specification |
June 1999, |
bios.platforms.desktop.html |
|
|
|
American Megatrends, Inc. |
|
ATA-3 |
|
Information Technology - |
Version 6 |
ATA Anonymous FTP Site: |
|
|
AT Attachment-3 Interface, |
|
ftp://fission.dt.wdc.com |
|
|
X3T10/2008D |
|
|
ATAPI |
|
Information Technology |
Version 18 |
T13 Anonymous FTP Site: |
|
|
AT Attachment with Packet |
August 13, 1998, |
ftp://fission.dt.wdc.com/ |
|
|
Interface Extensions |
Contact: T13 Chair, |
x3t13/project/d1153r18.pdf |
|
|
T13/1153D |
Seagate Technology |
|
ATX |
|
ATX Specification |
Version 2.01, |
http://download.intel.com/ |
|
|
|
February 1997, |
design/motherbd/atx.htm |
|
|
|
Intel Corporation. |
|
El Torito |
|
Bootable CD-ROM format |
Version 1.0, |
the Phoenix Technologies web |
|
|
specification |
January 25, 1995, |
site at: |
|
|
|
Phoenix Technologies Ltd., |
http://www.ptltd.com/techs/ |
|
|
|
and IBM Corporation. |
specs.html |
FlexATX |
|
FlexATX Addendum to the |
Version 1.0 |
http://www.teleport.com/~ffsupprt |
|
|
microATX Specification |
|
/spec/FlexATXaddn1_01.pdf |
|
|
|
|
continued |
13
Intel Desktop Board D810EMO/MO810E Technical Product Specification
Table 2. |
Specifications (continued) |
|
|
|
|
|
|
|
|
Reference |
|
Specification |
Version, Revision Date, and |
This specification is |
Name |
|
Title |
Ownership |
available at: |
IrDA† |
|
Serial Infrared Physical |
Version 1.1, October 17, 1995 |
E-mail: irda@netcom.com |
|
|
Layer Link Specification |
Infrared Data Association |
|
|
|
|
Phone: (510) 943-6546 |
|
|
|
|
Fax: (510) 943-5600 |
|
LPC |
|
Low Pin Count Interface |
Version 1.0, |
http://www.intel.com/ |
|
|
Specification |
September 29, 1997, |
design/chipsets/industry/ |
|
|
|
Intel Corporation. |
lpc.htm |
MicroATX |
|
microATX Motherboard |
Version 1.0, |
http://www/teleport.com/ |
|
|
Interface Specification |
December 1997 |
~ffsupprt/spec/ |
|
|
|
Intel Corporation |
microatxspecs.htm |
|
|
SFX Power Supply |
Version 1.1, |
http://www/teleport.com/ |
|
|
Design Guide |
February 1998 |
~ffsupprt/spec/ |
|
|
|
microatxspecs.htm |
|
|
|
|
Intel Corporation |
|
|
|
|
|
|
PCI |
|
PCI Local Bus |
Version 2.2, |
http://www.pcisig.com/ |
|
|
Specification |
December 18, 1998, |
|
|
|
|
PCI Special Interest Group. |
|
|
|
PCI Bus Power |
Version 1.1, |
http://www.pcisig.com/ |
|
|
Management Interface |
December 18, 1998, |
|
|
|
Specification |
PCI Special Interest Group. |
|
Plug and |
|
Plug and Play BIOS |
Version 1.0a, |
ftp://download.intel.com/ |
Play |
|
Specification |
May 5, 1994, |
ial/wfm/bio10a.pdf |
|
|
|
Compaq Computer Corp., |
|
|
|
|
Phoenix Technologies Ltd., |
|
|
|
|
and Intel Corporation. |
|
SDRAM |
|
PC SDRAM Unbuffered |
Revision 1.0, |
http://www.intel.com/ |
DIMMs |
|
DIMM Specification |
February 1998, |
design/chipsets/memory/ |
(64-and |
|
|
Intel Corporation. |
sdram.htm#S1 |
72-bit) |
|
PC Serial Presence |
Revision 1.2A, |
http://www.intel.com/ |
|
|
|||
|
|
Detect (SPD) |
December 1997, |
design/chipsets/memory/ |
|
|
Specification |
Intel Corporation |
sdram.htm#S1 |
SMBIOS |
|
System Management |
Version 2.3, |
http://developer.intel.com/ |
|
|
BIOS |
August 12, 1998, |
ial/wfm/design/smbios |
|
|
|
Award Software International Inc., |
|
|
|
|
Dell Computer Corporation, |
|
|
|
|
Hewlett-Packard Company, |
|
|
|
|
Intel Corporation, |
|
|
|
|
International Business Machines |
|
|
|
|
Corporation, |
|
|
|
|
Phoenix Technologies Limited, |
|
|
|
|
American Megatrends Inc., |
|
|
|
|
and SystemSoft Corporation. |
|
|
|
|
|
continued |
14
Product Description
Table 2. |
Specifications (continued) |
|
|
|
|
|
|
|
|
Reference |
|
Specification |
Version, Revision Date, and |
This specification is |
Name |
|
Title |
Ownership |
available at: |
UHCI |
|
Universal Host Controller |
Version 1.1, |
This guide is available at: |
|
|
Interface Design Guide |
March 1996, |
http://www.usb.org/ |
|
|
|
Intel Corporation. |
developers |
USB |
|
Universal Serial Bus |
Version 1.1, |
http://www.usb.org/ |
|
|
Specification |
September 23, 1998, |
developers/docs.html |
|
|
|
Compaq Computer Corporation, |
|
|
|
|
Intel Corporation, Microsoft |
|
|
|
|
Corporation, and NEC. |
|
WfM |
|
Wired for Management |
Version 2.0, |
http://developer.intel.com/ |
|
|
Baseline |
December 18, 1998, |
ial/WfM/wfmspecs.htm |
|
|
|
Intel Corporation |
|
15
Intel Desktop Board D810EMO/MO810E Technical Product Specification
CAUTION
The board supports processors that draw a maximum of 22 amps. Using a processor that draws more than 22 amps can damage the processor, the board, and the power supply. See the processor’s data sheet for current usage requirements.
The board supports the processors listed in Table 3. The host bus frequency is automatically selected.
Table 3. Processors Supported by the Board
Processor Type |
Processor Speed |
Host Bus Frequency |
L2 Cache Size |
Pentium III processor |
600EB MHz |
133 MHz |
256 KB |
|
600E MHz |
100 MHz |
256 KB |
|
550E MHz |
100 MHz |
256 KB |
|
500E MHz |
100 MHz |
256 KB |
Celeron processor |
533 MHz |
66 MHz |
128 KB |
|
500 MHz |
66 MHz |
128 KB |
|
466 MHz |
66 MHz |
128 KB |
|
433 MHz |
66 MHz |
128 KB |
|
400 MHz |
66 MHz |
128 KB |
|
366 MHz |
66 MHz |
128 KB |
All supported onboard memory can be cached, up to the cachability limit of the processor.
For information about
Processor support for the D810EMO/MO810E board
Processor data sheets
Refer to
http://support.intel.com/support/motherboards/desktop
http://www.intel.com/design/litcentr
16
Product Description
CAUTION
To be fully compliant with all applicable Intel®SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your memory modules do not support SPD, you will see a notification to this effect on the screen at power up. The BIOS will attempt to configure the memory controller for normal operation; however, DIMMs may not function at the determined frequency.
CAUTION
Because the main system memory is also used as video memory, the board requires a 100 MHz SDRAM DIMM even though the host bus frequency is 66 MHz. It is highly recommended that an SPD DIMM be used, since this allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted.
The board has one DIMM socket. The minimum memory size is 32 MB and the maximum memory size is 256 MB. The BIOS automatically detects memory type, size, and frequency.
The board supports the following memory features:
∙3.3 V, 168-pin DIMM with gold-plated contacts
∙100 MHz SDRAM
∙Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires an SPD DIMM)
∙Non-ECC (64-bit) memory
∙Unbuffered singleor double-sided DIMM
The board is designed to support the DIMM configurations listed in Table 4 below.
Table 4. System Memory Configuration
DIMM Size
32 MB
64 MB
128 MB
256 MB (Note)
Non-ECC Configuration
4 Mbit x 64
8 Mbit x 64
16 Mbit x 64
32 Mbit x 64
Note: |
A 256 MB DIMM used with this board must be built with 128 Mbit device technology. |
For information about
The PC Serial Presence Detect Specification
Obtaining copies of PC SDRAM specifications
Refer to
Table 2, page 13
http://www.intel.com/design/pcisets/memory
17
Intel Desktop Board D810EMO/MO810E Technical Product Specification
The Intel 810E chipset consists of the following devices:
∙82810E DC-133 Graphics Memory Controller Hub (GMCH) with accelerated hub architecture (AHA) bus
∙82801AA I/O Controller Hub (ICH) with AHA bus
∙82802AB Firmware Hub (FWH)
The chipset provides the host, memory, display, and I/O interfaces shown in Figure 3.
66/100/133 MHz |
|
|
|
|
|
|
|
|
|
ATA33/66 |
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USB |
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Host Bus |
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810E Chipset |
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100 MHz |
82810E |
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82802AB |
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Graphics Memory |
AHA |
82801AA I/O Controller Hub |
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SDRAM |
Firmware Hub |
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Controller Hub |
Bus |
(ICH) |
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(FWH) |
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SMBus |
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PCI Bus
LPC Bus
Display
AC Link
Interface
OM09130
Figure 3. Intel 810E Chipset Block Diagram
For information about
The Intel 810E chipset
The resources used by the chipset
The chipset’s compliance with ACPI and AC ‘97
Refer to
http://developer.intel.com
Chapter 2
Table 2, page 13
18
Product Description
Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for graphics-intensive applications, such as 3-D applications. AGP overcomes certain limitations of the PCI bus related to handling large amount of graphics data with the following features:
∙Pipelined memory read and write operations that hide memory access latency
∙Demultiplexing of address and data on the bus for nearly 100 percent bus efficiency
For information about
The location of the VGA port connector
Obtaining the Accelerated Graphics Port Interface Specification
Refer to
Figure 4, page 39
Table 2, page 13
1.6.2USB
The board supports up to four USB ports; one USB peripheral can be connected to each port. For more than four USB devices, an external hub can be connected to any of the ports. Two USB ports are implemented with stacked back panel connectors. The other two ports can be routed from the connector at location J7A1 via a cable to the front panel. The board fully supports UHCI and uses UHCI-compatible software drivers. USB features include:
∙Support for self-identifying peripherals that can be connected or disconnected while the computer is running
∙Automatic mapping of function to driver and configuration
∙Support for isochronous and asynchronous transfer types over the same set of wires
∙Support for up to 127 physical devices
∙Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other applications
∙Error-handling and fault-recovery mechanisms built into the protocol
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.
For information about
The location of the USB connectors on the back panel
The signal names of the USB connectors
The location of the USB port connector for the front panel
The signal names for the USB port connector for the front panel
The USB and UHCI specifications
Refer to
Figure 4, page 39
Table 17, page 40
Figure 6, page 46
Table 30, page 47
Table 2, page 13
19
Intel Desktop Board D810EMO/MO810E Technical Product Specification
The board has two independent bus-mastering IDE interfaces. These interfaces support:
∙ATAPI devices (such as CD-ROM drives)
∙ATA devices using the transfer modes listed in Table 51 on page 79
The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The board supports laser servo (LS-120) diskette technology through its IDE interfaces. The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:
∙ARMD-FDD (ATAPI removable media device – floppy disk drive)
∙ARMD-HDD (ATAPI removable media device – hard disk drive)
The board has two IDE interface connectors. The primary IDE connector is a standard 40-pin IDE interface. The secondary IDE connector is a 50-pin Slimline IDE connector, intended for use with devices such as 2.5-inch hard disk drives and mobile CD-ROM drives. The Slimline IDE connector has the standard IDE interface pins but also includes audio and power signals.
For information about
The location of the IDE connectors
The signal names of the primary IDE connector
The signal names of the Slimline secondary IDE connector
BIOS Setup program’s Boot menu
Refer to
Figure 5, page 41
Table 24, page 42
Table 25, page 43
Table 56, page 85
1.6.4Real-Time Clock, CMOS SRAM, and Battery
The real-time clock is compatible with DS1287 and MC146818 components. The clock provides a time-of-day clock and a multicentury calendar with alarm features and century rollover. The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use.
A coin-cell battery powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the 3.3 V standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.
NOTE
If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS RAM at power on.
20
Product Description
NOTE
The recommended method of accessing the date in systems with Intel desktop boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel desktop boards contains a century checking and maintenance feature. This feature checks the two least significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature enables operating systems and applications using the BIOS date/time services to reliably manipulate the year as a four-digit value.
For information about |
Refer to |
Proper date access in systems with Intel desktop boards |
http://support.intel.com/support/year2000/ |
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|
The SMSC LPC47M102 I/O controller provides the following features:
·Low pin count (LPC) interface
·One serial port
·Infrared (IrDA) interface
·Intelligent power management, including a programmable wake up event interface
·Fan control:
¾One pulse width modulation (PWM) fan speed control output
¾One fan tachometer input
The BIOS Setup program provides configuration options for the I/O controller.
For information about
SMSC LPC47M102 I/O controller
The IrDA interface
Refer to
http://www.smsc.com
Section 2.8.3, page 46
The board has one 9-pin serial debug port connector. The serial debug port’s NS16C550-compatible UART supports data transfers at rates of up to 115.2 kbits/sec with BIOS support. The serial debug port can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h).
For information about
The location of the serial debug port connector
The signal names of the serial debug port connector
Refer to
Figure 5, page 41
Table 26, page 43
21
Intel Desktop Board D810EMO/MO810E Technical Product Specification
The Intel 82810E DC-133 GMCH graphics memory controller hub component provides the following graphics support features:
∙Integrated 2-D and 3-D graphics engines
∙Integrated hardware motion compression engine
∙Integrated 230 MHz DAC
Table 5 lists the refresh rates supported by graphics subsystem.
Table 5. |
Supported Graphics Refresh Rates |
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Resolution |
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Color Palette |
Available Refresh Frequencies (Hz) |
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640 x 480 |
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16 colors |
60, 70, 72, 75, 85 |
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256 colors |
60, 70, 72, 75, 85 |
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64 |
K colors |
60, 70, 72, 75, 85 |
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16 |
M colors |
60, 70, 72, 75, 85 |
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720 x 480 |
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256 colors |
75, 85 |
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64 |
K colors |
75, 85 |
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16 |
M colors |
75, 85 |
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720 x 576 |
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256 colors |
60, 75, 85 |
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64 |
K colors |
60, 75, 85 |
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16 |
M colors |
60, 75, 85 |
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800 x 600 |
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256 colors |
60, 70, 72, 75, 85 |
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64 |
K colors |
60, 70, 72, 75, 85 |
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16 |
M colors |
60, 70, 72, 75, 85 |
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1024 x 768 |
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256 colors |
60, 70, 72, 75, 85 |
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64 |
K colors |
60, 70, 72, 75, 85 |
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16 |
M colors |
60, 70, 72, 75, 85 |
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1152 x 864 |
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256 colors |
60, 70, 72, 75, 85 |
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64 |
K colors |
60, 70, 72, 75, 85 |
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16 |
M colors |
60, 70, 72, 75, 85 |
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1280 x 1024 |
256 colors |
60, 70, 72, 75, 85 |
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64 |
K colors |
60, 70, 72, 75, 85 |
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16 |
M colors |
60, 70, 75, 85 |
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1600 x 1200 |
256 colors |
60, 70, 72, 75, 85 |
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For information about |
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Refer to |
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Obtaining graphics software and utilities |
http://support.intel.com/support/motherboards/desktop |
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22
Product Description
The Audio Codec ’97 (AC ’97) compatible audio subsystem includes these features:
·Split digital/analog architecture for improved signal-to-noise ratio (³ 85 dB) measured at line out, from any analog input, including line in, and CD-ROM
·3-D stereo enhancement
·Power management support for ACPI 1.0a
The audio subsystem consists of these devices:
· Creative Sound Blaster AudioPCI 128V
· Crystal Semiconductor CS4297A stereo audio codec · Audio connectors
For information about |
Refer to |
Obtaining audio software and utilities |
Section 1.2, page 13 |
|
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1.10.1Creative Sound Blaster AudioPCI 128V
The Creative Sound Blaster AudioPCI 128V features:
·Interfaces to the PCI bus as a Plug and Play device
·100% DOS legacy compatible
·Access to main memory (through the PCI bus) for wavetable synthesis support – does not require a separate wavetable ROM device
·Conforms to the PC 98 and PC 99 design guides
For information about |
Refer to |
Creative Sound Blaster AudioPCI 128V |
http://www.soundblaster.com |
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1.10.2Creative ES1373D Digital Audio Controller
The Creative ES1373D digital audio controller’s features include:
·PCI 2.1 compliant
·PCI bus master for PCI audio
·128-voice wavetable synthesizer
·Aureal A3D† API, Sound Blaster Pro†, Roland MPU-401 MIDI, joystick compatible
·Ensoniq 3D positional audio and Microsoft DirectSound† 3D support
The Crystal Semiconductor CS4297A is a fully AC ’97 compliant codec. The codec's features include:
·18-bit stereo full-duplex operation
·Up to 48 kHz sampling rate
·Connects to ES1373D digital controller using a five-wire digital interface
23
Intel Desktop Board D810EMO/MO810E Technical Product Specification
The audio connectors include the following:
∙Line out (back panel)
∙Mic in (back panel)
∙ATAPI CD-ROM (connects an internal ATAPI CD-ROM drive to the audio mixer)
For information about
The back panel audio connectors
The location of the ATAPI CD-ROM connector
The signal names of the ATAPI CD-ROM connector
Refer to
Section 2.8.1, page 39
Figure 5, page 41
Table 29, page 45
The hardware monitor component provides low-cost instrumentation capabilities. The features of the component include:
∙Internal ambient temperature sensing
∙Remote thermal diode sensing for direct monitoring of processor temperature
∙Power supply monitoring (+12, +5, +3.3, +2.5, VCCP) to detect levels above or below acceptable values
∙SMBus interface
∙The hardware monitor component enables the board to be compatible with the Wired for Management (WfM) specification.
For information about |
Refer to |
The board’s compatibility with the WfM specification |
Table 2, page 13 |
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24
Product Description
The Intel 82559 Fast Ethernet Wired for Management (WfM) PCI LAN subsystem provides both 10Base-T and 100Base-TX connectivity. Features include:
·32-bit, 33 MHz direct bus mastering on the PCI bus
·10Base-T and 100Base-TX capability using a single RJ-45 connector with connection and activity status LEDs
·IEEE 802.3u Auto-Negotiation for the fastest available connection
·Jumperless configuration; the LAN subsystem is completely software-configurable
For information about |
Refer to |
The WfM specification |
Table 2, page 13 |
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1.12.1Intel®82559 PCI LAN Controller
The Intel 82559 PCI LAN controller’s features include:
·CSMA/CD Protocol Engine
·PCI bus interface
·DMA engine for movement of commands, status, and network data across the PCI bus
·Integrated physical layer interface, including:
¾Complete functionality necessary for the 10Base-T and 100Base-TX network interfaces; when in 10 Mbit/sec mode, the interface drives the cable directly
¾A complete set of Media Independent Interface (MII) management registers for control and status reporting
¾IEEE 802.3u Auto-Negotiation for automatically establishing the best operating mode when connected to other 10Base-T or 100Base-TX devices, whether halfor full-duplex capable
·Integrated power management features, including support for wake on network event (from an ACPI S3 state using the PCI bus PME# signal)
For information about |
Refer to |
The LAN subsystem’s PCI specification compliance |
Table 2, page 13 |
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25
Intel Desktop Board D810EMO/MO810E Technical Product Specification
The Intel 82559 Fast Ethernet WfM PCI LAN software and drivers are available from Intel’s World Wide Web site.
For information about |
Refer to |
Obtaining LAN software and drivers |
Section 1.2, page 13 |
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1.12.3RJ-45 LAN Connector LEDs
Two LEDs are built into the RJ-45 LAN connector. Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating.
Table 6. |
LAN Connector LED States |
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LED Color |
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LED State |
Condition |
Green |
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Off |
10 Mbit/sec data rate is selected. |
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On |
100 Mbit/sec date rate is selected. |
Yellow |
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Off |
LAN link is not established. |
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On (steady state) |
LAN link is established. |
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On (brighter and pulsing) |
The computer is communicating with another computer on |
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the LAN. |
26
Product Description
Power management is implemented at several levels, including:
·Advanced Configuration and Power Interface (ACPI)
·Hardware support:
¾Power connector
¾Wake on network event
¾Instantly Available technology
¾Wake on Ring
¾Resume on Ring
If the board is used with an ACPI-aware operating system, the BIOS can provide ACPI support. ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires the support of an operating system that provides full ACPI functionality. ACPI features include:
·Plug and Play (including bus and device enumeration)
·Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives
·Methods for achieving less than 30-watt system operation in the Power On Suspend sleeping state, and less than 5-watt system operation in the Suspend to RAM sleeping state
·A Soft-off feature that enables the operating system to power off the computer
·Support for multiple wake up events (see Table 9 on page 29)
·Support for a front panel power and sleep mode switch. Table 7 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch
If the system is in this state…
Off |
(ACPI G2/S5 state) |
On |
(ACPI G0 state) |
On |
(ACPI G0 state) |
Sleep |
(ACPI G1 state) |
Sleep |
(ACPI G1 state) |
…and the power switch is pressed for
Less than four seconds
Less than four seconds
More than four seconds
Less than four seconds
More than four seconds
…the system enters this state
Power on
Soft off/Suspend
Fail safe power off
Wake up
Power off
For information about |
Refer to |
The board’s compliance level with ACPI |
Section 1.3, page 13 |
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27
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.13.1.1System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Table 8 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.
Table 8. Power States and Targeted System Power
Global States
G0 – working state
G1 – sleeping state
G1 – sleeping state
G2/S5
G3 – mechanical off.
AC power is disconnected from the computer.
Sleeping States |
CPU States |
Device States |
Targeted System Power* |
S0 – working |
C0 – working |
D0 – working |
Full power > 30 W |
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state |
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S1 – CPU stopped |
C1 – stop |
D1, D2, D3 – |
5 W < power < 30 W |
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grant |
device |
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specification |
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specific. |
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S3 – Suspend-to- |
No power |
D3 – no power |
Power < 5 W ** |
RAM. Context |
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except for wake |
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saved to RAM. |
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up logic. |
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S5 – Soft off. |
No power |
D3 – no power |
Power < 5 W ** |
Context not saved. |
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except for wake |
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Cold boot is |
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up logic. |
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required. |
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No power to the |
No power |
D3 – no power for |
No power to the system so |
system. |
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wake up logic, |
that service can be |
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except when |
performed. |
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provided by |
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battery or external |
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source. |
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*Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply.
**Dependent on the standby power consumption of wake up devices used in the system.
28
Product Description
1.13.1.2Wake Up Devices and Events
Table 9 lists the devices or specific events that can wake the computer from specific states.
Table 9. Wake Up Devices and Events
These devices/events can wake up the computer… |
…from this state |
Power switch
RTC alarm
LAN
Modem
USB
PCI bus PME#
S1, S3, S5
S1, S3, S5
S1, S3
S1, S3
S1, S3
S3
1.13.1.3Plug and Play
In addition to power management, ACPI provides controls and information so that the operating system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to enumerate and configure devices that do not have other hardware standards for enumeration and configuration. PCI devices on a desktop board, for example, are not enumerated by ACPI.
CAUTION
If Wake on network event and Instantly Available technology features are used, the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Refer to Section 2.11.3 on page 54 for additional information.
The board provides several hardware features that support power management, including:
∙Power connector
∙Wake on network event
∙Instantly Available technology
∙Wake on Ring
∙Resume on Ring
Wake on network event and Instantly Available technology require power from the +5 V standby line. The sections discussing these features describe the incremental standby power requirements for each.
Wake on Ring and Resume on Ring enable telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal) and the power management mode being used (ACPI).
NOTE
The use of Wake on Ring and Resume on Ring technologies from an ACPI state require the support of an operating system that provides full ACPI functionality.
29
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.13.2.1Power Connector
When used with an ATX-compliant power supply that supports remote power on/off, the board can turn off the system power through software control. To enable soft-off control in software, advanced power management must be enabled in the BIOS Setup program and in the operating system. When the system BIOS receives the correct power management command from the operating system, the BIOS turns off power to the computer.
With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected power cord, when power resumes, the computer returns to the power state it was in before power was interrupted (on or off).
For information about
The location of the power connector
The signal names of the power connector
The ATX specification
Refer to
Figure 5, page 41
Table 27, page 44
Section 1.3, page 13
1.13.2.2Fan Connectors
The board has two fan connectors. The functions of these connectors are described in Table 10.
Table 10. Fan Connector Descriptions
Connector
Chassis fan
Processor fan
Function
Provides +12 V DC for a system or chassis fan.
Provides +12 V DC for a processor fan or active fan heatsink.
For information about
The location of the fan connectors
The signal names of the chassis fan connector
The signal names of the processor fan connector
Refer to
Figure 5, page 41
Table 22, page 42
Table 23, page 42
1.13.2.3Wake on Network Event
CAUTION
For Wake on network event, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Wake on network event can damage the power supply. Refer to Section 2.11.3 on page 54 for additional information.
Wake on network event enables remote wakeup of the computer through a network. The LAN subsystem, whether onboard or as a PCI bus network adapter, monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet†, the LAN subsystem asserts a wakeup signal that powers up the computer. The board supports Wake on network event through the PCI bus PME# signal.
30