Intel BOXNUC8I7BEH Manual

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Intel® NUC Products

NUC8i3BE/NUC8i5BE/NUC8i7BE

Technical Product Specification

Regulatory Models: NUC8BEK (Short Kit/Mini PC)

NUC8BEH (Tall Kit/Mini PC)

NUC8BEB (Board)

July 2018

Order Number: K15389-001

Intel NUC Products NUC8i3BE, NUC8i5BE and NUC8i7BE may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC Products NUC8i3BE/NUC8i5BE/NUC8i7BE Specification Update.

Revision History

Revision	Revision History	Date

001	First release of Intel NUC Products NUC8i3BE/NUC8i5BE/NUC8i7BE Technical	April 2018
	Product Specification

002	First production release of the Intel NUC Products	July 2018
	NUC8i3BE/NUC8i5BE/NUC8i7BE Technical Product Specification

Disclaimer

This product specification applies to only the standard Intel NUC Board, Kit or System with BIOS identifier BECFL357.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries. * Other names and brands may be claimed as the property of others.

Contents

Note: For this Technical Product Specification, the use of Intel NUC Products NUC8i3BE/NUC8i5BE/NUC8i7BE refers to Intel NUC Kit NUC8i3BEH, Intel NUC Kit NUC8i5BEH, Intel NUC Kit NUC8i7BEH, Intel NUC Kit NUC8i3BEK, Intel NUC Kit NUC8i5BEK, Intel NUC Mini PC NUC8i3BEKx, Intel NUC Mini PC NUC8i5BEKx, Intel NUC Mini PC NUC8i3BEHx, Intel NUC Mini PC NUC8i5BEHx, Intel NUC Mini PC NUC8i7BEHx, and Intel NUC Boards NUC8i3BEB, NUC8i5BEB and NUC8i7BEB.

Board Identification Information

Basic Intel® NUC Board NUC8i3BEB Identification Information

AA Revision	BIOS Revision	Notes

J72693-303	BECFL357.86A.0038	1,2

Notes:

1.The AA number is found on a small label on the SO-DIMM sockets.

2.The Intel® Core™ i3-8109U processor is used on this AA revision consisting of the following component:

Device	Stepping	S-Spec Numbers

Intel Core i3-8109U	D0	SRCKC

Basic Intel® NUC Board NUC8i5BEB Identification Information

AA Revision	BIOS Revision	Notes

J72692-303	BECFL357.86A.0038	1,2

Notes:

1.The AA number is found on a small label on the SO-DIMM sockets.

2.The Intel® Core™ i5-8259U processor is used on this AA revision consisting of the following component:

Device	Stepping	S-Spec Numbers

Intel Core i5-8259U	D0	SRCKB

Basic Intel® NUC Board NUC8i7BEB Identification Information

AA Revision	BIOS Revision	Notes

J72688-303	BECFL357.86A.0038	1,2

Notes:

1.The AA number is found on a small label on the SO-DIMM sockets.

2.The Intel® Core™ i7-8559U processor is used on this AA revision consisting of the following component:

Device	Stepping	S-Spec Numbers

Intel Core i7-8559U	D0	SRCK5

iii

Product Identification Information

Intel® NUC Products NUC8i{x}BE{y}{z}1 Identification Information

Product Name	Intel® NUC	Differentiating Features
	Board

NUC8i3BEK		Kit with power adapter

NUC8i3BEH	NUC8i3BEB	HDD-capable kit with power adapter
	NUC8i3BEB
NUC8i3BEHXF	J72693-303	HDD kit with power adapter, 16GB Intel® Optane™ Module, 1TB HDD,
	J72693-303	4GB DDR4-2400 SDRAM[2], Microsoft Windows 10 Home, “Intel® NUC

		8 Home, a Mini PC with Windows 10”

NUC8i5BEK		Kit with power adapter

NUC8i5BEH	NUC8i5BEB	HDD-capable kit with power adapter
	NUC8i5BEB
NUC8i5BEHXF	J72692-303	HDD kit with power adapter, 16GB Intel® Optane™ Module, 1TB HDD,
	J72692-303	4GB DDR4-2400 SDRAM[2], Microsoft Windows 10 Home, “Intel® NUC

		8 Home, a Mini PC with Windows 10”

NUC8i7BEH		HDD-capable kit with power adapter
	NUC8i7BEB
NUC8i7BEHXG	NUC8i7BEB	32GB Intel® Optane™ Module, 2TB HDD, 8GB DDR4-2400 SDRAM[2],
	J72688-303	Microsoft* Windows* 10 Home, “Intel® NUC 8 Enthusiast, a Mini PC
		with Windows 10”

Notes:

1.Where {x} = 3|5|7; {y} = “K” for “slim kit”, “H” for “tall kit”; and {z} = “XF” | “XG” for “Intel Optane system”

2.The maximum supported memory speed of the Intel NUC Board NUC8i[x]BEB is 2400 MHz.

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Products NUC8i3BE, NUC8i5BE and NUC8i7BE.

Specification Changes or Clarifications

Date	Type of Change	Description of Changes or Clarifications

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.

Contents

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board NUC8i3BEB, Intel® NUC Board NUC8i5BEB and Intel® NUC Board NUC8i7BEB.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel® NUC Board NUC8i3BEB, Intel® NUC Board NUC8i5BEB and Intel® NUC Board NUC8i7BEB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter	Description

1	A description of the features and hardware used on Intel NUC Board NUC8i3BEB, Intel NUC
	Board NUC8i5BEB and Intel NUC Board NUC8i7BEB

2	A map of the resources of the Intel NUC Board

3	The features supported by the BIOS Setup program

4	A description of the BIOS error messages, beep codes, and POST codes

5A description of the Intel NUC kit NUC8i3BE[x], Intel NUC kit NUC8i5BE[x] and Intel NUC kit

NUC8i7BEH features

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Other Common Notation

#	Used after a signal name to identify an active-low signal (such as USBP0#)

GB	Gigabyte (1,073,741,824 bytes)

GBps	Gigabytes per second

Gbps	Gigabits per second

KB	Kilobyte (1024 bytes)

Kb	Kilobit (1024 bits)

kbps	1000 bits per second

MB	Megabyte (1,048,576 bytes)

MBps	Megabytes per second

Mb	Megabit (1,048,576 bits)

Mbps	Megabits per second

TDP	Thermal Design Power

Xxh	An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V	Volts. Voltages are DC unless otherwise specified.

*This symbol is used to indicate third-party brands and names that are the property of their respective owners.

		Contents
Contents

Revision History...............................................................................................................			ii
Disclaimer ..................................................................................................................................................................			ii
Note: For this Technical Product Specification, the use of Intel NUC Products
	NUC8i3BE/NUC8i5BE/NUC8i7BE refers to Intel NUC Kit NUC8i3BEH, Intel NUC Kit
	NUC8i5BEH, Intel NUC Kit NUC8i7BEH, Intel NUC Kit NUC8i3BEK, Intel NUC Kit
	NUC8i5BEK, Intel NUC Mini PC NUC8i3BEKx, Intel NUC Mini PC NUC8i5BEKx, Intel
	NUC Mini PC NUC8i3BEHx, Intel NUC Mini PC NUC8i5BEHx, Intel NUC Mini PC
	NUC8i7BEHx, and Intel NUC Boards NUC8i3BEB, NUC8i5BEB and NUC8i7BEB. ...........		iii
Board Identification Information.....................................................................................................................			iii
Product Identification Information.................................................................................................................			iv
Errata...........................................................................................................................................................................			iv
Preface ...............................................................................................................................			v
Intended Audience.................................................................................................................................................			v
What This Document Contains.........................................................................................................................			v
Typographical Conventions ...............................................................................................................................			v
Contents ..........................................................................................................................			vii
1 Product Description ..................................................................................................			1
1.1	Overview .........................................................................................................................................................		1
	1.1.1	Feature Summary .....................................................................................................................	1
	1.1.2	Board Layout (Top) ..................................................................................................................	3
	1.1.3	Board Layout (Bottom) ...........................................................................................................	4
	1.1.4	Block Diagram ............................................................................................................................	6
1.2	Online Support.............................................................................................................................................		7
1.3	Processor........................................................................................................................................................		8
1.4	System Memory ...........................................................................................................................................		8
1.5	Processor Graphics Subsystem..........................................................................................................		11
	1.5.1	Integrated Graphics ..............................................................................................................	11
1.6	USB.................................................................................................................................................................		14
1.7	SATA Interface...........................................................................................................................................		14
	1.7.1	AHCI Mode................................................................................................................................	15
	1.7.2	Intel® Rapid Storage Technology / SATA RAID .........................................................	15
	1.7.3	Intel® Next Generation Storage Acceleration.............................................................	15
1.8	Thunderbolt 3............................................................................................................................................		16
1.9	Real-Time Clock Subsystem................................................................................................................		16
1.10	Audio Subsystem .....................................................................................................................................		16
	1.10.1	Audio Subsystem Software ...............................................................................................	17
1.11	LAN Subsystem.........................................................................................................................................		17

vii

1.11.1 Intel® I219V Gigabit Ethernet Controller .....................................................................		17
1.11.2	LAN Subsystem Software...................................................................................................	18
1.11.3 RJ-45 LAN Connector with Integrated LEDs..............................................................		18
1.11.4	Wireless Network Module..................................................................................................	19
1.12 Hardware Management Subsystem .................................................................................................		19
1.12.1	Hardware Monitoring ...........................................................................................................	19
1.12.2	Fan Monitoring........................................................................................................................	19
1.12.3	Thermal Solution ...................................................................................................................	19
1.13 Power Management ................................................................................................................................		20
1.13.1	ACPI.............................................................................................................................................	21
1.13.2	Hardware Support.................................................................................................................	23
1.13.3 Microsoft Modern Standby Support..............................................................................		26
1.14 Intel Platform Security Technologies ..............................................................................................		26
1.14.1	Intel® Virtualization Technology......................................................................................	26
1.14.2 Intel® Platform Trust Technology ...................................................................................		27

2 Technical Reference...............................................................................................			28
2.1	Memory Resources ..................................................................................................................................		28
	2.1.1	Addressable Memory...........................................................................................................	28
2.2	Connectors and Headers.......................................................................................................................		28
	2.2.1	Front Panel Connectors ......................................................................................................	29
	2.2.2	Back Panel Connectors .......................................................................................................	29
	2.2.3	Headers and Connectors (Top)........................................................................................	30
	2.2.4	Connectors and Headers (Bottom).................................................................................	31
2.3	BIOS Security Jumper ............................................................................................................................		41
2.4	Mechanical Considerations ..................................................................................................................		43
	2.4.1	Form Factor..............................................................................................................................	43
2.5	Electrical Considerations ......................................................................................................................		44
	2.5.1	Power Supply Considerations..........................................................................................	44
	2.5.2	Fan Header Current Capability.........................................................................................	44
2.6	Thermal Considerations........................................................................................................................		45
2.7	Reliability .....................................................................................................................................................		50
2.8	Environmental ...........................................................................................................................................		50

3 Overview of BIOS Features...................................................................................			51
3.1	Introduction................................................................................................................................................		51
3.2	BIOS Flash Memory Organization .....................................................................................................		51
3.3	System Management BIOS (SMBIOS)..............................................................................................		51
3.4	Legacy USB Support ...............................................................................................................................		52
3.5	BIOS Updates.............................................................................................................................................		52
	3.5.1	Language Support.................................................................................................................	53
3.6	BIOS Recovery ...........................................................................................................................................		53
3.7	Boot Options ..............................................................................................................................................		54
	3.7.1	Network Boot...........................................................................................................................	54

viii

			Contents
	3.7.2	Booting Without Attached Devices (Headless)..........................................................	54
	3.7.3	Changing the Default Boot Device during POST......................................................	54
	3.7.4	Power Button Menu..............................................................................................................	55
3.8	Hard Disk Drive Password Security Feature..................................................................................		56
3.9	BIOS Security Features ..........................................................................................................................		57
4 Error Messages and Blink Codes.........................................................................			58
4.1	Front-panel Power LED Blink Codes................................................................................................		58
4.2	BIOS Error Messages...............................................................................................................................		58
5 Intel NUC Kit Features ...........................................................................................			59
5.1	Chassis Front Panel Features..............................................................................................................		59
5.3	Chassis Rear Panel Features................................................................................................................		61

Figures
Figure 1. Major Board Components (Top) ..........................................................................................................	3
Figure 2. Major Board Components (Bottom) ...................................................................................................	4
Figure 3. Block Diagram..............................................................................................................................................	6
Figure 4. Memory Channel and SO-DIMM Configuration..........................................................................	10
Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ...............................................................................	17
Figure 6. LAN Connector LED Locations...........................................................................................................	18
Figure 7. Thermal Solution and Fan Header...................................................................................................	20
Figure 8. Location of the Standby Power LED ...............................................................................................	25
Figure 9. Front Panel Connectors........................................................................................................................	29
Figure 10. Back Panel Connectors ......................................................................................................................	29
Figure 11. Headers and Connectors (Top).......................................................................................................	30
Figure 12. Connectors and Headers (Bottom) ...............................................................................................	31
Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................	37
Figure 14. Connection Diagram for the Internal USB 2.0 Single-Port Header (1.25 mm Pitch)39
Figure 15. Location of the CIR Sensor...............................................................................................................	39
Figure 16. Location of the BIOS Security Jumper ........................................................................................	41
Figure 17. Board Dimensions................................................................................................................................	43
Figure 18. Board Height Dimensions .................................................................................................................	44
Figure 19. Localized High Temperature Zones .............................................................................................	46
Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC8i3BEK/NUC8i5BEK.............	47
Figure 21. Installation area of Thermal Pad for Intel NUC Kit
NUC8i3BEH/NUC8i5BEH/NUC8i7BEH......................................................................................................	48
Figure 22. Intel NUC Kit NUC8i3BEH/NUC8i5BEH/NUC8i7BEH Features – Front ...........................	59
Figure 23. Intel NUC Kit NUC8i3BEK/NUC8i5BEK Features – Front ......................................................	60
Figure 24. Intel NUC Kit NUC8i3BEH/NUC8i5BEH/NUC8i7BEH Features – Rear.............................	61
Figure 25. Intel NUC Kit NUC8i3BEK/NUC8i5BEK Features – Rear........................................................	62
Tables
Table 1. Feature Summary........................................................................................................................................	1
Table 2. Components Shown in Figure 1............................................................................................................	3
Table 3. Components Shown in Figure 2............................................................................................................	5
Table 4. Supported Memory Configurations.....................................................................................................	9
Table 5. Unsupported Memory Configurations................................................................................................	9
Table 6. DisplayPort Multi-Streaming Resolutions......................................................................................	12
Table 7. Multiple Display Configuration Maximum Resolutions ............................................................	13
Table 8. Audio Formats Supported by the HDMI and USB Type C Interfaces..................................	13
Table 9. LAN Connector LED States...................................................................................................................	18
Table 10. Effects of Pressing the Power Switch............................................................................................	21
Table 11. Power States and Targeted System Power.................................................................................	22
Table 12. Wake-up Devices and Events ...........................................................................................................	23
Table 13. Headers and Connectors Shown in Figure 11...........................................................................	30
Table 14. Connectors and Headers Shown in Figure 12...........................................................................	32

	Contents
Table 15. SATA Power Connector (1.25 mm pitch).....................................................................................	33
Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch) ...........................................................	33
Table 17. M.2 2280 Module (key type M) Connector..................................................................................	33
Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch)..........................................	34
Table 19. RGB LED Connector (1.25 mm Pitch) ............................................................................................	35
Table 20. CEC Header (1.25 mm pitch).............................................................................................................	35
Table 21. USB Type C Connector.........................................................................................................................	36
Table 22. Front Panel Header (2.0 mm Pitch)................................................................................................	36
Table 23. States for a One-Color Power LED .................................................................................................	37
Table 24. States for a Dual-Color Power LED ................................................................................................	37
Table 25. SDXC Card Reader Connector..........................................................................................................	38
Table 26. HDMI CEC expected behavior............................................................................................................	40
Table 27. RGB LED Options ...................................................................................................................................	40
Table 28. Fan Header Current Capability.........................................................................................................	44
Table 29. Thermal Considerations for Components...................................................................................	49
Table 30. Tcontrol Values for Components ...................................................................................................	49
Table 31. Environmental Specifications...........................................................................................................	50
Table 32. Acceptable Drives/Media Types for BIOS Recovery ...............................................................	53
Table 33. Boot Device Menu Options................................................................................................................	54
Table 34. Master Key and User Hard Drive Password Functions...........................................................	56
Table 35. Supervisor and User Password Functions...................................................................................	57
Table 36. Front-panel Power LED Blink Codes .............................................................................................	58
Table 37. Components Shown in Figure 22 ...................................................................................................	59
Table 38. Components Shown in Figure 23 ...................................................................................................	60
Table 39. Components Shown in Figure 24 ...................................................................................................	61
Table 40. Components Shown in Figure 25 ...................................................................................................	62

1 Product Description

1.1Overview

1.1.1Feature Summary

Table 1 summarizes the major features of Intel® NUC Board NUC8i3BEB, Intel® NUC Board NUC8i5BEB and Intel® NUC Board NUC8i7BEB.

Table 1. Feature Summary

	Form Factor	4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

	Processor	• A soldered-down 8th generation Intel® Core™ i3-8109U dual-core processor with a
	(one of 3 models)	maximum 28 W TDP, 3.0 GHz base, 3.6 GHz Turbo, 4 threads
	(one of 3 models)	― Intel® Iris™ Plus Graphics 655
		― Intel® Iris™ Plus Graphics 655
		― Integrated memory controller
		― Integrated PCH
		• A soldered-down 8th generation Intel® Core™ i5-8259U quad-core processor with a
		maximum 28 W TDP, 2.3 GHz base, 3.8 GHz Turbo, 8 threads
		― Intel® Iris™ Plus Graphics 655
		― Integrated memory controller
		― Integrated PCHA
		• A soldered-down 8th generation Intel® Core™ i7-8559U quad-core processor with a
		maximum 28 W TDP, 2.7 GHz base, 4.5 GHz Turbo, 8 threads
		― Intel® Iris™ Plus Graphics 655
		― Integrated memory controller
		― Integrated PCH

	Memory	• Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)
		sockets
		• Support for DDR4 2400 MHz SO-DIMMs
		• Support for 4 Gb and 8 Gb memory technology
		• Support for up to 32 GB of system memory with two SO-DIMMs using 8 Gb memory
		technology
		• Support for non-ECC memory
		• Support for 1.2 V low voltage JEDEC memory only
		Note: 2 Gb memory technology (SDRAM Density) is not compatible

	Graphics	• Integrated graphics support for processors with Intel® Graphics Technology:
		― One High Definition Multimedia Interface* (HDMI*) back panel connector
		― One DisplayPort signal via USB Type C back panel connector

	Audio	• Intel® High Definition (Intel® HD) Audio via the HDMI v2.0 and USB Type C interfaces
		through the processor
		• Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel
		• Digital microphone array (DMICS) connector (internal)

	Storage	• SATA ports:
		― One SATA 6.0 Gbps port (black) for 2.5“ storage device
		• One SATA 6.0 Gbps port is reserved for an M.2 storage module supporting M.2 2242
		and M.2 2280 (key type M and B+M) modules
		Note: Supports key type M and B+M (PCI Express* x1/x2/x4 and SATA)

		continued

Table 1. Feature Summary (continued)

Peripheral Interfaces	• One USB 3.1 (Gen 2/10 Gbps) port implemented via the external back panel Type C
		connector
	• USB 3.1 (Gen 2/10 Gbps) Type A ports:
		• Two ports are implemented with external front panel connectors (one blue and one
		orange charging capable)
		• Two ports are implemented with external back panel connectors (blue)
	•	USB 2.0 ports:
		• Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)
		• One port is reserved for the NGFF 1216 Wireless module Bluetooth capability
	•	Consumer Infrared (CIR)

Expansion Capabilities	• One M.2 connector supporting M.2 2242 and M.2 2280 (key type M and B+M) modules
	• One Micro SDXC slot
	• One Thunderbolt™ 3 via back panel USB Type C connector

BIOS	• Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
	• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, System
		Management BIOS (SMBIOS), and Modern Standby

Instantly Available PC	• Suspend to RAM support
Technology	• Wake on PCI Express, LAN, front panel, CIR, and USB ports

LAN	Gigabit (10/100/1000 Mbps) LAN subsystem using the Intel® I219V Gigabit Ethernet
	Controller

Hardware Monitor	Hardware monitoring subsystem, based on an ITE Tech. IT8987E-VG embedded controller,
Subsystem	including:
	• Voltage sense to detect out of range power supply voltages
	• Thermal sense to detect out of range thermal values
	• One processor fan header
	• Fan sense input used to monitor fan activity
	•	Fan speed control

Wireless	Intel® Dual Band Wireless-AC 9560
	• 802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth 5
	• Maximum Transfer speed up to 1.73 Gbps
	• Supports Intel® Smart Connect Technology
	• Next Generation Form Factor (NGFF) 12x16 soldered-down package

Intel NUC Kit Features

1.1.2Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Board NUC8i3BEB, Intel NUC Board NUC8i5BEB and Intel NUC Board NUC8i7BEB.

Figure 1. Major Board Components (Top)

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item from Figure 1	Description

A	Thermal solution

B	Processor fan header

C	Battery connector

1.1.3Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board NUC8i3BEB, Intel NUC Board NUC8i5BEB and Intel NUC Board NUC8i7BEB.

Figure 2. Major Board Components (Bottom)

Intel NUC Kit Features

Table 3. Components Shown in Figure 2

Item from Figure 2
	Description

A	DC Input Jack

B	HDMI connector

C	LAN connector

D	USB 3.1 ports (blue)

E	Digital Microphones (DMICs) header

F	Front Panel header

G	Intel Dual Band Wireless AC + Bluetooth 9560 module

H	RGB (HDD) LED header

I	Micro SDXC slot

J	SATA power connector (1.25 mm pitch)

K	M.2 connector (key type M and B+M) for 2242 and 2280 modules

L	Front panel single-port USB 2.0 header (1.25 mm pitch)

M	HDD Activity LED

N	Front panel single-port USB 2.0 header (1.25 mm pitch)

O	Front panel USB 3.1 connector (blue)

P	Standby LED

Q	Front panel USB 3.1 connector (orange, charging)

R	SATA 6.0 Gbps connector

S	Front panel stereo microphone/headphone jack

T	Consumer Infrared (CIR) sensor

U	Front panel power button

V	BIOS security header & jumper

W	Consumer electronics control (CEC) header

X	DDR4 SO-DIMM1 socket

Y	DDR4 SO-DIMM2 socket

1.1.4Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Figure 3. Block Diagram

1.2Online Support

To find information about…

Intel NUC Board NUC8i3BEB, Intel NUC Board NUC8i5BEB, and Intel NUC Board NUC8i7BEB

Intel NUC Support

Available configurations for Intel NUC Board NUC8i3BEB, Intel NUC Board NUC8i5BEB and Intel NUC Board NUC8i7BEB

Product support page NUC8i3BEK

Product support page NUC8i3BEH

Product support page NUC8i5BEK

Product support page NUC8i5BEH

Product support page NUC8i7BEH

BIOS and driver updates

BIOS and driver updates for NUC8i3BEK

BIOS and driver updates for NUC8i3BEH

BIOS and driver updates for NUC8i5BEK

BIOS and driver updates for NUC8i5BEH

BIOS and driver updates for NUC8i7BEH

Tested memory

Compatible peripherals and components

Integration information

Processor datasheet

Regulatory documentation

Intel NUC Kit Features

Visit this Intel web site:

http://www.intel.com/NUC

http://www.intel.com/NUCSupport

http://ark.intel.com

https://www.intel.com/content/www/us/en/support /boards-and-kits/intel-nuc-kits/intel-nuc-kit-nuc8i3bek.html

http://www.intel.com/content/www/us/en/support /boards-and-kits/intel-nuc-kits/intel-nuc-kit-nuc8i3beh.html

https://www.intel.com/content/www/us/en/support/boards-and- kits/intel-nuc-boards/intel-nuc-board-nuc8i5bek.html

http://www.intel.com/content/www/us/en/support /boards-and-kits/intel-nuc-kits/intel-nuc-kit-nuc8i5beh.html

http://www.intel.com/content/www/us/en/support /boards-and-kits/intel-nuc-kits/intel-nuc-kit-nuc8i7beh.html

http://downloadcenter.intel.com https://downloadcenter.intel.com/product/126149 https://downloadcenter.intel.com/product/126150 https://downloadcenter.intel.com/product/126147 https://downloadcenter.intel.com/product/126148 https://downloadcenter.intel.com/product/126140

http://www.intel.com/content/www/us/en/support/boards-and- kits/ 000027798.html

https://www.intel.com/content/www/us/en/support/articles/000 027966.html

http://www.intel.com/NUCSupport http://ark.intel.com

https://www.intel.com/content/www/us/en/support/articles/000 028043.html

1.3Processor

One of the following:

A soldered-down 8th generation Intel® Core™ i3-8109U dual-core processor with up to a maximum 28 W TDP (if thermal margin is available).

•3.0 GHz base frequency, 3.6 GHz turbo frequency, 4 threads

•Intel® Iris™ Plus Graphics 655

•Integrated memory controller

•Integrated PCH

A soldered-down 8th generation Intel® Core™ i5-8259U quad-core processor with up to a maximum 28 W TDP (if thermal margin is available).

•2.3 GHz base frequency, 3.8 GHz turbo frequency, 8 threads

•Intel® Iris™ Plus Graphics 655

•Integrated memory controller

•Integrated PCH

A soldered-down 8th generation Intel® Core™ i7-8559U quad-core processor with up to a maximum 28 W TDP (if thermal margin is available).

•2.7 GHz base frequency, 4.5 GHz turbo frequency, 8 threads

•Intel® Iris™ Plus Graphics 655

•Integrated memory controller

•Integrated PCH

NOTE

There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 44 for information on power supply requirements.

1.4System Memory

The board has two 260-pin SO-DIMM sockets and supports the following memory features:

•1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts

•Two independent memory channels with interleaved mode support

•Unbuffered, single-sided or double-sided SO-DIMMs

•32 GB maximum total system memory (with 8 Gb memory technology). Refer to Section 2.1.1 on page 28 for information on the total amount of addressable memory.

•Minimum recommended total system memory: 2048 MB

•Non-ECC SO-DIMMs

•Serial Presence Detect

•DDR4 2400 MHz SDRAM SO-DIMMs

•Supports 4 Gb and 8Gb memory technology (SDRAM density)

Intel NUC Kit Features

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.

NOTE

Intel NUC Boards NUC8i3BEB, NUC8i5BEB and NUC8i7BEB support only 4 Gb and 8 Gb memory technologies (also referred to as “SDRAM density”). Table 4 lists the supported SO-DIMM configurations. Table 5 lists the SO-DIMM configurations that are not supported.

Table 4. Supported Memory Configurations

SO-DIMM		SDRAM	SDRAM Organization	Number of SDRAM
Capacity	Configuration (Note)	Density	Front-side/Back-side	Devices
2048 MB	SS	4 Gbit	512 M x4/empty	4
4096 MB	DS	4 Gbit	512 M x4/512 M x4	8
4096 MB	SS	8 Gbit	1024 M x4/empty	4
8192 MB	DS	4 Gbit	512 M x8/512 M x8	16
8192 MB	DS	8 Gbit	1024 M x4/1024 M x4	8
16384 MB	DS	8 Gbit	1024 M X8/1024 M x8	16

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

Table 5. Unsupported Memory Configurations

SO-DIMM		SDRAM	SDRAM Organization	Number of SDRAM
Capacity	Configuration (Note)	Density	Front-side/Back-side	Devices
1024 MB	SS	1 Gbit	128 M x8/empty	8
2048 MB	DS	1 Gbit	128 M x8/128 M x8	16
2048 MB	SS	2 Gbit	256 M x8/empty	8
4096 MB	DS	2 Gbit	256 M x8/256 M x8	16

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

For information about…	Refer to:

Tested Memory	http://www.intel.com/content/www/us/en/support/boards-and-
	kits/ 000027798.html

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

Intel NUC Kit Features

1.5Processor Graphics Subsystem

The Intel NUC Boards NUC8i3BEB, NUC8i5BEB and NUC8i7BEB support graphics through Intel Iris™ Plus Graphics 655.

1.5.1Integrated Graphics

The board supports integrated graphics via the processor.

1.5.1.1Intel® High Definition (Intel® HD) Graphics

The Intel Iris™ Plus graphics controller features the following:

•API support

―Direct3D* 2015, Direct3D 11.2, Direct3D 11.1, Direct3D 9, Direct3D 10, Direct2D

―OpenGL* 4.5 support

―OpenCL* 2.1 , OpenCL 2.0, OpenCL 1.2 support

•Next Generation Intel® Clear Video Technology HD support is a collection of video playback and enhancement features that improve the end user’s viewing experience

•Encode/transcode HD content

•Playback of high definition content including Blu-ray* disc

•Superior image quality with sharper, more colorful images

•DirectX* Video Acceleration (DXVA2) support for accelerating video processing

•Full AVC/VC1/MPEG2/HEVC/VP8/VP9/JPEG hardware-accelerated video decode

•Full AVC/MPEG2/HEVC/VP8/JPEG hardware-accelerated video encode

•Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)

NOTES

Intel Quick Sync Video is enabled by an appropriate software application.

HDMI 2.0a is enabled by LSPCON (DP 1.2 to HDMI 2.0a protocol converter); Stereo 3D (S3D) technology is not supported.

HDMI 2.0a supports High Dynamic Range (HDR) and 10-bit sampling. HDR requires use of appropriate software and display hardware.

1.5.1.2Video Memory Allocation

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.

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