Intel DG33BU User Manual

5 (3)

Intel® Desktop Board

DG33BU

Technical Product Specification

May 2007

Order Number: D88104-001US

The Intel® Desktop Board DG33BU may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG33BU Specification Update.

Revision History

Revision

Revision History

Date

 

 

 

-001

First release of the Intel® Desktop Board DG33BU Technical Product

May 2007

 

Specification

 

 

 

 

This product specification applies to only the standard Intel® Desktop Board DG33BU with BIOS identifier DPP3510A.86A.

Changes to this specification will be published in the Intel Desktop Board DG33BU Specification Update before being incorporated into a revision of this document.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel® desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:

Intel Corporation

P.O. Box 5937

Denver, CO 80217-9808

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.

Intel, the Intel logo, Pentium, Core, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Copyright © 2007, Intel Corporation. All rights reserved.

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel® Desktop Board DG33BU. It describes the standard product and available manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the Desktop Board DG33BU and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1A description of the hardware used on the board

2A map of the resources of the board

3The features supported by the BIOS Setup program

4A description of the BIOS error messages, beep codes, and POST codes

5Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

INTEGRATOR’S NOTES

Integrator’s notes are used to call attention to information that may be useful to system integrators.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

iii

Intel Desktop Board DG33BU Technical Product Specification

Other Common Notation

#

Used after a signal name to identify an active-low signal (such as USBP0#)

 

 

GB

Gigabyte (1,073,741,824 bytes)

 

 

GB/sec

Gigabytes per second

 

 

Gbit

Gigabit (1, 073,741,824 bits)

 

 

KB

Kilobyte (1024 bytes)

 

 

Kbit

Kilobit (1024 bits)

 

 

kbits/sec

1000 bits per second

 

 

MB

Megabyte (1,048,576 bytes)

 

 

MB/sec

Megabytes per second

 

 

Mbit

Megabit (1,048,576 bits)

 

 

Mbit/sec

Megabits per second

 

 

xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

 

 

x.x V

Volts. Voltages are DC unless otherwise specified.

*This symbol is used to indicate third-party brands and names that are the property of their respective owners.

iv

Contents

1 Product Description

1.1

Overview........................................................................................

10

 

1.1.1

Feature Summary ................................................................

10

 

1.1.2

Board Layout .......................................................................

12

 

1.1.3

Block Diagram .....................................................................

14

1.2

Legacy Considerations......................................................................

15

1.3

Online Support................................................................................

15

1.4

Processor .......................................................................................

15

1.5

System Memory ..............................................................................

16

 

1.5.1

Memory Configurations .........................................................

17

1.6

Intel® G33 Express Chipset ...............................................................

19

 

1.6.1

Intel G33 Graphics Subsystem ...............................................

19

 

1.6.2

Intel® Viiv™ Processor Technology ..........................................

21

 

1.6.3

USB ...................................................................................

21

 

1.6.4

Serial ATA Interfaces ............................................................

21

1.7

Parallel IDE Controller ......................................................................

22

1.8

Real-Time Clock Subsystem ..............................................................

23

1.9

Legacy I/O Controller.......................................................................

23

 

1.9.1

Serial Port Interface..............................................................

23

 

1.9.2

Diskette Drive Interface ........................................................

23

 

1.9.3

PS/2 Keyboard and Mouse Interface........................................

24

1.10 Audio Subsystem.............................................................................

24

 

1.10.1

Audio Subsystem Software ....................................................

25

 

1.10.2

Audio Connectors and Headers ...............................................

25

1.11 LAN Subsystem...............................................................................

26

 

1.11.1

Intel® 82566DC Gigabit Ethernet Controller..............................

26

 

1.11.2

LAN Subsystem Software.......................................................

27

 

1.11.3

RJ-45 LAN Connector with Integrated LEDs ..............................

27

1.12 Hardware Management Subsystem ....................................................

28

 

1.12.1

Hardware Monitoring and Fan Control......................................

28

 

1.12.2

Fan Monitoring.....................................................................

28

 

1.12.3

Chassis Intrusion and Detection..............................................

28

 

1.12.4

Thermal Monitoring ..............................................................

29

1.13 Power Management .........................................................................

30

 

1.13.1

ACPI...................................................................................

30

 

1.13.2

Hardware Support ................................................................

33

v

Intel Desktop Board DG33BU Technical Product Specification

2 Technical Reference

2.1

Memory Map...................................................................................

37

 

2.1.1

Addressable Memory.............................................................

37

2.2

Connectors and Headers...................................................................

40

 

2.2.1

Back Panel Connectors ..........................................................

41

 

2.2.2 Component-side Connectors and Headers ................................

42

2.3

Jumper Block ..................................................................................

50

2.4

Mechanical Considerations ................................................................

51

 

2.4.1

Form Factor.........................................................................

51

2.5

Electrical Considerations...................................................................

52

 

2.5.1

Power Supply Considerations .................................................

52

 

2.5.2 Fan Header Current Capability................................................

53

 

2.5.3

Add-in Board Considerations ..................................................

53

2.6

Thermal Considerations....................................................................

53

2.7

Reliability .......................................................................................

55

2.8

Environmental ................................................................................

56

3 Overview of BIOS Features

3.1

Introduction ...................................................................................

57

3.2

BIOS Flash Memory Organization.......................................................

58

3.3

Resource Configuration ....................................................................

58

 

3.3.1

PCI Autoconfiguration ...........................................................

58

 

3.3.2

PCI IDE Support...................................................................

59

3.4

System Management BIOS (SMBIOS).................................................

59

3.5

Legacy USB Support ........................................................................

60

3.6

BIOS Updates .................................................................................

61

 

3.6.1

Language Support ................................................................

61

 

3.6.2

Custom Splash Screen ..........................................................

62

3.7

BIOS

Recovery................................................................................

62

3.8

Boot Options...................................................................................

63

 

3.8.1

CD-ROM Boot ......................................................................

63

 

3.8.2

Network Boot.......................................................................

63

 

3.8.3

Booting Without Attached Devices...........................................

63

 

3.8.4

Changing the Default Boot Device During POST ........................

63

3.9

Adjusting Boot Speed.......................................................................

64

 

3.9.1

Peripheral Selection and Configuration.....................................

64

 

3.9.2

BIOS Boot Optimizations .......................................................

64

3.10 BIOS

Security Features ....................................................................

65

4 Error Messages and Beep Codes

 

4.1

Speaker .........................................................................................

67

4.2

BIOS Beep Codes ............................................................................

67

4.3

BIOS Error Messages .......................................................................

67

4.4

Port 80h POST Codes .......................................................................

68

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance.....................................................................

73

vi

 

 

 

Contents

 

5.1.1

Safety Standards..................................................................

73

 

5.1.2 European Union Declaration of Conformity Statement................

74

 

5.1.3

Product Ecology Statements...................................................

75

 

5.1.4

EMC Regulations ..................................................................

79

 

5.1.5 Product Certification Markings (Board Level).............................

80

5.2

Battery Disposal Information.............................................................

81

Figures

 

 

1.

Major Board Components..................................................................

12

2.

Block Diagram ................................................................................

14

3.

Memory Channel Configuration and DIMM Configuration........................

18

4.

Back Panel Audio Connector Options ..................................................

25

5.

LAN Connector LED Locations............................................................

27

6.

Thermal Sensors and Fan Headers .....................................................

29

7.

Location of the Standby Power Indicator LED.......................................

36

8.

Detailed System Memory Address Map ...............................................

38

9.

Back Panel Connectors .....................................................................

41

10.

Component-side Connectors and Headers ...........................................

42

11.

Connection Diagram for Front Panel Header ........................................

47

12.

Connection Diagram for Front Panel USB Headers ................................

49

13.

Location of the Jumper Block.............................................................

50

14.

Board Dimensions ...........................................................................

51

15.

Localized High Temperature Zones.....................................................

54

Tables

 

 

1.

Feature Summary............................................................................

10

2.

Board Components Shown in Figure 1 ................................................

13

3.

Supported Memory Configurations .....................................................

16

4.

Audio Jack Support ..........................................................................

24

5.

LAN Connector LED States ................................................................

27

6.

Effects of Pressing the Power Switch ..................................................

30

7.

Power States and Targeted System Power...........................................

31

8.

Wake-up Devices and Events ............................................................

32

9.

System Memory Map .......................................................................

39

10.

Component-side Connectors and Headers Shown in Figure 10................

43

11.

Serial ATA Connectors......................................................................

44

12.

Chassis Intrusion Header ..................................................................

44

13.

Serial Port Header ...........................................................................

44

14.

Front and Rear Chassis Fan Headers ..................................................

44

15.

Processor Fan Header ......................................................................

44

16.

Front Panel Audio Header .................................................................

45

17.

Auxiliary Front Panel Power/Sleep LED Header.....................................

45

18.

Processor Core Power Connector........................................................

46

19.

Main Power Connector......................................................................

46

20.

Front Panel Header ..........................................................................

47

vii

Intel Desktop Board DG33BU Technical Product Specification

 

21.

States for a One-Color Power LED......................................................

48

22.

States for a Two-Color Power LED......................................................

48

23.

Auxiliary Front Panel Power LED Header..............................................

48

24.

BIOS Setup Configuration Jumper Settings..........................................

50

25.

Recommended Power Supply Current Values .......................................

52

26.

Fan Header Current Capability...........................................................

53

27.

Thermal Considerations for Components .............................................

55

28.

Desktop Board DG33BU Environmental Specifications ...........................

56

29.

BIOS Setup Program Menu Bar..........................................................

58

30.

BIOS Setup Program Function Keys....................................................

58

31.

Acceptable Drives/Media Types for BIOS Recovery ...............................

62

32.

Boot Device Menu Options ................................................................

63

33.

Supervisor and User Password Functions.............................................

65

34.

Beep Codes ....................................................................................

67

35.

BIOS Error Messages .......................................................................

67

36.

Port 80h POST Code Ranges..............................................................

68

37.

Port 80h POST Codes .......................................................................

69

38.

Typical Port 80h POST Sequence........................................................

72

39.

Safety Standards.............................................................................

73

40.

Lead-Free Board Markings ................................................................

78

41.

EMC Regulations .............................................................................

79

42.

Product Certification Markings ...........................................................

80

viii

1 Product Description

What This Chapter Contains

 

1.1

Overview........................................................................................

10

1.2

Legacy Considerations......................................................................

15

1.3

Online Support................................................................................

15

1.4

Processor .......................................................................................

15

1.5

System Memory ..............................................................................

16

1.6

Intel® G33 Express Chipset ...............................................................

19

1.7

Parallel IDE Controller ......................................................................

22

1.8

Real-Time Clock Subsystem ..............................................................

23

1.9

Legacy I/O Controller.......................................................................

23

1.10 Audio Subsystem.............................................................................

24

1.11 LAN Subsystem...............................................................................

26

1.12 Hardware Management Subsystem ....................................................

28

1.13 Power Management .........................................................................

30

9

Intel Desktop Board DG33BU Technical Product Specification

1.1Overview

1.1.1Feature Summary

Table 1 summarizes the major features of the Desktop Board DG33BU.

Table 1. Feature Summary

Form Factor

microATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])

 

 

 

 

Processor

Support for the following:

 

• Intel® Core™2 Quad processor in an LGA775 socket with a 1066 MHz system

 

bus

 

• Intel® Core™2 Duo processor in an LGA775 socket with a 1066 or 800 MHz

 

system bus

 

• Intel® Pentium® Dual-Core processor in an LGA775 socket with an 800 MHz

 

system bus

 

• Intel® Celeron® processor in an LGA775 socket with an 800 MHz system bus

 

Memory

• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets

 

• Support for DDR2 667 or DDR2 800 MHz DIMMs

 

• Support for up to 8 GB of system memory

 

 

 

Chipset

Intel® G33 Express Chipset, consisting of:

 

• Intel® 82G33 Graphics and Memory Controller Hub (GMCH)

 

• Intel® 82801IH I/O Controller Hub (ICH9DH)

 

Video

Intel® Graphics Media Accelerator (Intel® GMA) 3100 onboard graphics subsystem

 

Audio

6-channel (5.1) audio subsystem using the Realtek* ALC888 audio codec

 

 

 

Legacy I/O

Legacy I/O controller for diskette drive, serial, and PS/2* ports

Control

 

 

 

 

 

Peripheral

• 12 USB 2.0 ports

Interfaces

• Four Serial ATA interfaces

 

• One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support

 

• One diskette drive interface

 

• One IEEE 1394a port

 

• PS/2 keyboard and mouse ports

 

• One serial port header (may require specialized chassis or cable for use)

 

 

 

LAN Support

Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82566DC Gigabit

 

Ethernet Controller

 

 

 

BIOS

• Intel® BIOS (resident in the SPI Flash device)

 

 

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

 

and SMBIOS

 

 

 

Instantly

• Support for PCI* Local Bus Specification Revision 2.3

Available PC

• Support for PCI Express* Revision 1.1

Technology

• Suspend to RAM support

 

• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports

 

 

 

 

continued

10

 

 

 

 

 

Product Description

 

Table 1. Feature Summary (continued)

 

 

 

 

 

 

 

 

Expansion

Two PCI Conventional bus connectors

 

 

Capabilities

One PCI Express x1 bus add-in card connector

 

 

 

• One PCI Express x16 bus add-in card connector

 

 

 

 

 

 

 

Hardware Monitor

Intel® Quiet System Technology implemented through the Intel® Management

 

Subsystem

 

Engine in ICH9DH

 

 

 

 

 

 

 

 

• Voltage sense to detect out of range power supply voltages

 

 

• Thermal sense to detect out of range thermal values

 

 

 

Three fan headers

 

 

 

• Three fan sense inputs used to monitor fan activity

 

 

 

 

 

 

 

 

For information about

 

 

Refer to

 

 

 

 

 

Available configurations for the Desktop Board DG33BU

Section 1.2, page 15

 

 

 

 

 

 

11

Intel Desktop Board DG33BU Technical Product Specification

1.1.2Board Layout

Figure 1 shows the location of the major components.

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

12

Product Description

Table 2. Board Components Shown in Figure 1

Item/callout

 

from Figure 1

Description

 

 

A

PCI Conventional bus add-in card connector 1

 

 

B

Front panel audio header

 

 

C

PCI Conventional bus add-in card connector 2

 

 

D

PCI Express x1 connector

 

 

E

Speaker

 

 

F

PCI Express x16 connector

 

 

G

Back panel connectors

 

 

H

Processor core power connector (2 X 2)

 

 

I

Rear chassis fan header

 

 

J

LGA775 processor socket

 

 

K

Intel 82G33 GMCH

 

 

L

Processor fan header

 

 

M

DIMM Channel A sockets

 

 

N

Serial port header

 

 

O

DIMM Channel B sockets

 

 

P

Main Power connector (2 X 12)

 

 

Q

Diskette drive connector

 

 

R

Chassis intrusion header

 

 

S

Battery

 

 

T

Front chassis fan header

 

 

U

Intel 82801IH I/O Controller Hub (ICH9DH)

 

 

V

BIOS Setup configuration jumper block

 

 

W

Auxiliary front panel power LED header

 

 

X

Front panel header

 

 

Y

Serial ATA connectors [4]

 

 

Z

Front panel USB headers [3]

 

 

AA

Parallel ATA IDE connector

 

 

BB

IEEE 1394a header

 

 

13

Intel DG33BU User Manual

Intel Desktop Board DG33BU Technical Product Specification

1.1.3Block Diagram

Figure 2 is a block diagram of the major functional areas.

Figure 2. Block Diagram

14

Product Description

1.2Legacy Considerations

This board differs from other Intel® Desktop Board products, with specific changes including (but not limited to) the following:

No parallel port

The location of the floppy drive connector has moved

No serial port on the back panel

The serial port header is located between the memory sockets and may require a specialized chassis or cabling solution to use

1.3Online Support

To find information about…

Visit this World Wide Web site:

 

 

Intel Desktop Board DG33BU

http://www.intel.com/products/motherboard/DG33BU/index.htm

 

 

Desktop Board Support

http://support.intel.com/support/motherboards/desktop

 

 

Available configurations for the

http://www.intel.com/products/motherboard/DG33BU/index.htm

Desktop Board DG33BU

 

 

 

Supported processors

http://www.intel.com/go/findcpu

 

 

Chipset information

http://www.intel.com/products/desktop/chipsets/index.htm

 

 

BIOS and driver updates

http://downloadcenter.intel.com

 

 

Tested Memory

http://support.intel.com/support/motherboards/desktop/sb/CS-

 

025414.htm

 

 

1.4Processor

The board is designed to support the following processors:

Intel Core 2 Quad processor in an LGA775 socket with a 1066 MHz system bus

Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus

Intel Pentium Dual-Core processor in an LGA775 socket with an 800 MHz system bus

Intel Celeron processor in an LGA775 socket with an 800 MHz system bus

Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 95 W. The processors listed above are only supported when falling within the wattage requirements of the DG33BU board. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about…

Refer to:

 

 

Supported processors

http://www.intel.com/go/findcpu

 

 

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.

15

Intel Desktop Board DG33BU Technical Product Specification

INTEGRATOR’S NOTE

Use only ATX12V-compliant power supplies.

For information about

Refer to

 

 

Power supply connectors

Section 2.2.2.4, page 46

 

 

1.5System Memory

The board has four DIMM sockets and supports the following memory features:

1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts

Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported.

8 GB maximum total system memory. Refer to Section 2.1.1 on page 37 for information on the total amount of addressable memory.

Minimum total system memory: 512 MB

Non-ECC DIMMs

Serial Presence Detect

DDR2 667 or DDR2 800 MHz SDRAM DIMMs

DDR2 667 DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)

DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This enables the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.

Table 3 lists the supported DIMM configurations.

Table 3. Supported Memory Configurations

 

 

Smallest usable

Largest usable

Maximum capacity

 

 

DIMM (one x16

DIMM (one x8

with four identical

DIMM

SDRAM

Single-sided

Double-sided

x8 Double-sided

Type

Technology

DIMM)

DIMM)

DIMMs

 

 

 

 

 

DDR2 667

512 Mbit

256 MB

1 GB

4 GB

 

 

 

 

 

DDR2 667

1 Gbit

512 MB

2 GB

8 GB

 

 

 

 

 

DDR2 800

512 Mbit

256 MB

1 GB

4 GB

 

 

 

 

 

DDR2 800

1 Gbit

512 MB

2 GB

8 GB

 

 

 

 

 

For information about…

Refer to:

 

 

Tested Memory

http://support.intel.com/support/motherboards/desktop/sb/

 

CS-025414.htm

 

 

16

Product Description

1.5.1Memory Configurations

The Intel 82G33 GMCH supports the following types of memory organization:

Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.

Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.

Flex mode. This mode provides the most flexible performance characteristics. The bottommost DRAM memory (the memory that is lowest within the system memory map) is mapped to dual channel operation; the topmost DRAM memory (the memory that is nearest to the 8 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.

For information about…

Refer to:

 

 

Memory Configuration Examples

http://www.intel.com/support/motherboards/desktop/sb/cs-

 

011965.htm

 

 

17

Intel Desktop Board DG33BU Technical Product Specification

Figure 3 illustrates the memory channel and DIMM configuration.

NOTE

The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels are black.

Figure 3. Memory Channel Configuration and DIMM Configuration

INTEGRATOR’S NOTE

Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the Intel Management Engine in ICH9DH.

18

Product Description

1.6Intel® G33 Express Chipset

The Intel G33 Express chipset consists of the following devices:

Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect

Intel 82801IH I/O Controller Hub (ICH9DH) with DMI interconnect

The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D, and display capabilities. The ICH9DH is a centralized controller for the board’s I/O paths.

The chipset supports the following features:

Onboard Graphics

Dynamic Video Memory Technology

USB

Serial ATA

Parallel IDE

For information about

Refer to

 

 

The Intel G33 Express chipset

http://www.intel.com/products/desktop/chipsets/index.htm

 

 

Resources used by the chipset

Chapter 2

 

 

1.6.1Intel G33 Graphics Subsystem

The Intel G33 Express chipset contains two separate, mutually exclusive graphics options. Either the Intel Graphics Media Accelerator 3100 (Intel GMA 3100) graphics controller (contained within the 82G33 GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express x16 add-in card is installed, the Intel GMA 3100 graphics controller is disabled.

1.6.1.1Intel® Graphics Media Accelerator 3100 Graphics

Controller

The Intel GMA 3100 graphics controller features the following:

400 MHz core frequency

High quality texture engine

DX9.0c* and OpenGL* 1.4 compliant

Hardware Pixel Shader 2.0

Vertex Shader Model 2.0

3D Graphics Rendering enhancements

1.6 dual texture GigaPixel/sec max fill rate

16-bit and 32-bit color

Vertex cache

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Intel Desktop Board DG33BU Technical Product Specification

Video

Software DVD at 30 fps full screen

DVMT support up to 256 MB

Display

Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA)

Dual independent display support

DDC2B compliant interface with Advanced Digital Display 2 card or Media Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display connections

1.6.1.2Dynamic Video Memory Technology (DVMT)

DVMT enables enhanced graphics and memory performance through highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be allocated to DVMT on systems that have 512 MB or more of total system memory installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem.

DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions.

NOTE

The use of DVMT requires operating system driver support.

1.6.1.3Configuration Modes

The video modes supported by this board are based on the Extended Display Identification Data (EDID) modes of the monitor to which the system is connected. Standard monitors are assumed.

1.6.1.4Advanced Digital Display (ADD2/MEC) Card Support

The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a 225 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC card is detected, the Intel GMA 3100 graphics controller is enabled and the PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be accessed by the ADD2/MEC card. An ADD2/MEC card can either be configured to support simultaneous display or can be configured to support dual independent display as an extended desktop configuration with different color depths and resolutions. ADD2/MEC cards can be designed to support the following configurations:

Low Voltage Differential Signaling (LVDS)

Single device operating in dual channel mode

HDTV output

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Product Description

HDMI support (when used with the HD Audio Link)

1.6.2Intel® Viiv™ Processor Technology

This Intel desktop board supports Intel Viiv processor technology. To be eligible for the Intel Viiv processor technology brand, a system must meet certain hardware and software requirements. To get the list of requirements for Intel Viiv processor technology branding as well as all the features supported by Intel Viiv processor technology, refer to

http://www.intel.com/products/viiv/index.htm

1.6.3USB

The board supports up to 12 USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers.

The ICH9DH provides the USB controller for all ports. The port arrangement is as follows:

Six ports are implemented with stacked back panel connectors

Six ports are routed to three separate front panel USB headers

For information about

Refer to

 

 

The location of the USB connectors on the back panel

Figure 9, page 41

 

 

The location of the front panel USB headers

Figure 10, page 42

 

 

1.6.4Serial ATA Interfaces

The board provides four Serial ATA (SATA) connectors, which support one device per connector.

1.6.4.1Serial ATA Support

The DG33BU Desktop Board’s Serial ATA controller offers four independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of four Serial ATA devices. A point-to- point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel.

For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP operating system.

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Intel Desktop Board DG33BU Technical Product Specification

NOTE

Many Serial ATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/

For information about

Refer to

 

 

The location of the Serial ATA connectors

Figure 10, page 42

 

 

1.7Parallel IDE Controller

The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes:

Programmed I/O (PIO): processor controls data transfer.

8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.

Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec.

ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.

ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.

ATA-133: DMA protocol on IDE bus allows host and target throttling. The ATA-133 logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer rates in excess of 100 MB/sec.

NOTE

ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling.

The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

For information about

Refer to

 

 

The location of the Parallel ATA IDE connector

Figure 10, page 42

 

 

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Product Description

1.8Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

NOTE

If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 12 shows the location of the battery.

1.9Legacy I/O Controller

The I/O controller provides the following features:

One serial port header

Serial IRQ interface compatible with serialized IRQ support for PCI systems

PS/2-style mouse and keyboard interfaces

Interface for one 1.44 MB or 2.88 MB diskette drive

Intelligent power management, including a programmable wake-up event interface

PCI power management support

The BIOS Setup program provides configuration options for the I/O controller.

1.9.1Serial Port Interface

The serial port header is located on the component side of the board. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.

For information about

Refer to

 

 

The location of the serial port header

Figure 10, page 42

 

 

The serial port header signal mapping

Table 13, page 44

 

 

1.9.2Diskette Drive Interface

The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface.

For information about

Refer to

 

 

The location of the diskette drive connector

Figure 10, page 42

 

 

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Intel Desktop Board DG33BU Technical Product Specification

1.9.3PS/2 Keyboard and Mouse Interface

The PS/2 keyboard and mouse connectors are located on the back panel.

NOTE

The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.

For information about

Refer to

 

 

The location of the keyboard and mouse connectors

Figure 9, page 41

 

 

1.10 Audio Subsystem

The onboard audio subsystem consists of the following:

Intel 82801IH (ICH9DH)

Realtek ALC888 audio codec

Back panel audio connectors

Component-side audio headers:

Intel® High Definition Audio front panel header

The audio subsystem supports the following features:

A signal-to-noise (S/N) ratio of 95 dB

Independent 5.1 audio playback from back panel connectors and stereo playback from the Intel High Definition Audio front panel header.

NOTE

Systems built with AC 97 front panel will not be able to obtain the Microsoft Windows Vista* logo after June 2007.

Table 4 lists the supported functions of the front panel and back panel audio jacks.

Table 4. Audio Jack Support

 

Supports

Supports

Supports

Supports

Audio Jack

Line in?

Line out?

Microphone?

Headphones?

 

 

 

 

 

Front panel – Green

No

Yes

No

Yes

 

 

 

 

 

Front panel – Pink

No

No

Yes

No

 

 

 

 

 

Back panel – Blue

Yes

Yes

No

No

 

 

 

 

 

Back panel – Green

No

Yes

No

Yes

 

 

 

 

 

Back panel – Pink

No

Yes

Yes

No

 

 

 

 

 

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Product Description

1.10.1Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about

Refer to

 

 

Obtaining audio software and drivers

Section 1.2, page 15

 

 

1.10.2Audio Connectors and Headers

The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors.

The front/back panel audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 4.

Item Description

ALine in

BLine out

CMic in

Figure 4. Back Panel Audio Connector Options

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

For information about

Refer to

 

 

The location of the front panel audio header

Figure 10, page 42

 

 

The signal names of the front panel audio header

Table 16, page 45

 

 

The back panel audio connectors

Section 2.2.1, page 41

 

 

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Intel Desktop Board DG33BU Technical Product Specification

1.11 LAN Subsystem

The LAN subsystem consists of the following:

Intel 82566DC Gigabit Ethernet Controller (10/100/1000 Mbits/sec)

Intel 82801IH (ICH9DH)

RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

CSMA/CD protocol engine

LAN connect interface between ICH9DH and the LAN controller

PCI Conventional bus power management

ACPI technology support

LAN wake capabilities

LAN subsystem software

For information about

Refer to

 

 

LAN software and drivers

http://downloadcenter.intel.com

 

 

1.11.1Intel® 82566DC Gigabit Ethernet Controller

The Intel 82566DC Gigabit Ethernet Controller supports the following features:

PCI Express link

10/100/1000 IEEE 802.3 compliant

Compliant to IEEE 802.3x flow control support

802.1p and 802.1q

TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

Full device driver compatibility

PCI Express power management support

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