INTEL D815EEA User Manual

Intel® Desktop Board D815EEA

Technical Product Specification

May 2000

Order Number A16964 –001

The Intel®Desktop Board D815EEA may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D815EEA Specification Update.

Revision History

Revision	Revision History	Date
-P1	First review draft of the Intel Desktop Board D815EEA Technical Product	March 2000
	Specification
-P2	Second review draft of the Intel Desktop Board D815EEA Technical	April 2000
	Product Specification
-P3	Third review draft of the Intel Desktop Board D815EEA Technical Product	June 2000
	Specification
-001	First release of the Intel Desktop Board D815EEA Technical Product	June 2000
	Specification

This product specification applies to only standard D815EEA boards with BIOS identifier EA81510A.86A.

Changes to this specification will be published in the Intel Desktop Board D815EEA Specification Update before being incorporated into a revision of this document.

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

The Intel® Desktop Board D815EEA may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:

Intel Corporation

P.O. Box 5937

Denver, CO 80217-9808

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.

† Third-party brands and names are the property of their respective owners.

Copyright © 2000, Intel Corporation. All rights reserved.

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board D815EEA. It describes the standard product and available manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the D815EEA board and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1A description of the hardware used on the D815EEA board

2A map of the resources of the board

3The features supported by the BIOS Setup program

4The contents of the BIOS Setup program’s menus and submenus

5A description of the BIOS error messages, beep codes, POST codes, and diagnostic LEDs

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

WARNING

Warnings indicate conditions, which if not observed, can cause personal injury.

iii

Intel®Desktop Board D815EEA Technical Product Specification

Other Common Notation

#Used after a signal name to identify an active-low signal (such as USBP0#)

(NxnX)	When used in the description of a component, N indicates component type, xn are the relative
	coordinates of its location on the D815EEA board, and X is the instance of the particular part
	at that general location. For example, J5J1 is a connector, located at 5J. It is the first
	connector in the 5J area.
GB	Gigabyte (1,073,741,824 bytes)
KB	Kilobyte	(1024 bytes)
Kbit	Kilobit	(1024 bits)
kbits/sec	1000 bits per second
MB	Megabyte (1,048,576 bytes)
MB/sec	Megabytes per second
Mbit	Megabit	(1,048,576 bits)
Mbit/sec	Megabits per second
xxh	An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V	Volts. Voltages are DC unless otherwise specified.

†This symbol is used to indicate third-party brands and names that are the property of their respective owners.

iv

Contents

1 Product Description

1.1	Overview ...................................................................................................................		12
	1.1.1	Feature Summary .......................................................................................	12
	1.1.2	Manufacturing Options ................................................................................	13
	1.1.3	D815EEA Board Layout ..............................................................................	14
	1.1.4	Block Diagram.............................................................................................	15
1.2	Online Support...........................................................................................................		16
1.3	Design Specifications ................................................................................................		16
1.4	Processor ..................................................................................................................		19
1.5	System Memory.........................................................................................................		20
1.6	Intel® 815E Chipset ...................................................................................................		22
	1.6.1	Intel® 82815E Graphics and Memory Controller Hub (GMCH) ....................	23
	1.6.2	Intel® 82801BA I/O Controller Hub (ICH2)...................................................	23
	1.6.3	Intel® 82802AB 4 Mbit Firmware Hub (FWH) ..............................................	25
1.7	I/O Controller .............................................................................................................		26
	1.7.1	Serial Ports..................................................................................................	26
	1.7.2	Infrared Support ..........................................................................................	26
	1.7.3	Parallel Port.................................................................................................	27
	1.7.4	Diskette Drive Controller..............................................................................	27
	1.7.5	Keyboard and Mouse Interface ...................................................................	27
1.8	Graphics Subsystem .................................................................................................		28
	1.8.1	Integrated Graphics Controller ....................................................................	28
	1.8.2	Digital Video Output (DVO) Connector ........................................................	30
	1.8.3	AGP Universal Connector ...........................................................................	31
1.9	Audio Subsystem (Optional) ......................................................................................		32
	1.9.1	Basic Audio Subsystem...............................................................................	32
	1.9.2	Enhanced PCI Audio Subsystem.................................................................	33
	1.9.3	Audio Connectors........................................................................................	34
1.10 LAN Subsystem.........................................................................................................			35
	1.10.1 Intel® 82562ET Platform LAN Connect Device (Optional) ...........................		36
	1.10.2 RJ-45 LAN Connector LEDs........................................................................		36
	1.10.3	LAN Subsystem Software............................................................................	36
1.11 CNR (Optional) ..........................................................................................................			36
1.12 Hardware Management Subsystem (Optional) ..........................................................			37
	1.12.1	Hardware Monitor Component ....................................................................	38
	1.12.2	Chassis Intrusion Detect Connector ............................................................	38
	1.12.3	Fan Control and Monitoring .........................................................................	38
1.13 Power Management ..................................................................................................			39
	1.13.1	Software Support ........................................................................................	39
	1.13.2	Hardware Support .......................................................................................	42

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Intel®Desktop Board D815EEA Technical Product Specification

2 Technical Reference

2.1	Introduction................................................................................................................		47
2.2	Memory Map .............................................................................................................		47
2.3	I/O Map	.....................................................................................................................	48
2.4	DMA Channels ..........................................................................................................		50
2.5	PCI Configuration ...................................................................................Space Map		50
2.6	Interrupts ...................................................................................................................		51
2.7	PCI Interrupt .........................................................................................Routing Map		51
2.8	Connectors ................................................................................................................		53
	2.8.1 ...............................................................................	Back Panel Connectors	54
	2.8.2 ...............................................................................	Internal I/O Connectors	58
	2.8.3 ..............................................................................	External I/O Connectors	69
2.9	Jumper .............................................................................................................Block		73
2.10 Mechanical ........................................................................................Considerations			75
	2.10.1 .................................................................................................	Form Factor	75
	2.10.2 ....................................................................................................	I/O Shield	76
2.11	Electrical ...........................................................................................Considerations		77
	2.11.1 ....................................................................................	Power Consumption	77
	2.11.2 .......................................................................	Add - in Board Considerations	78
	2.11.3 ...................................................................	Standby Current Requirements	78
	2.11.4 ...............................................................	Fan Connector Current Capability	79
	2.11.5 ......................................................................	Power Supply Considerations	80
2.12 Thermal .............................................................................................Considerations			80
2.13	Reliability ...................................................................................................................		82
2.14 Environmental............................................................................................................			83
2.15 Regulatory .............................................................................................Compliance			84
	2.15.1 ......................................................................................	Safety Regulations	84
	2.15.2 ........................................................................................	EMC Regulations	84
	2.15.3 ..................................................................................	Certification Markings	85

3 Overview of BIOS Features

3.1	Introduction................................................................................................................		87
3.2	BIOS Flash Memory Organization .............................................................................		88
3.3	Resource Configuration .............................................................................................		88
	3.3.1	PCI Autoconfiguration .................................................................................	88
	3.3.2	PCI IDE Support..........................................................................................	88
3.4	System Management BIOS (SMBIOS) ......................................................................		89
3.5	USB Legacy Support .................................................................................................		90
3.6	BIOS Updates............................................................................................................		90
	3.6.1	Language Support.......................................................................................	91
	3.6.2	Custom Splash Screen................................................................................	91
3.7	Recovering BIOS Data ..............................................................................................		91
3.8	Boot Options..............................................................................................................		92
	3.8.1	CD-ROM and Network Boot ........................................................................	92
	3.8.2	Booting Without Attached Devices ..............................................................	92

vi

Contents

3.9 Fast Booting Systems with Intel® Rapid BIOS Boot ...................................................		92
3.9.1	Peripheral Selection and Configuration .......................................................	93
3.9.2	Intel Rapid BIOS Boot .................................................................................	93
3.9.3	Operating System .......................................................................................	94
3.10 BIOS Security Features .............................................................................................		94

4 BIOS Setup Program

4.1	Introduction................................................................................................................		97
4.2	Maintenance Menu ....................................................................................................		98
	4.2.1	Extended Configuration Submenu...............................................................	99
4.3	Main Menu...............................................................................................................		100
4.4	Advanced Menu.......................................................................................................		101
	4.4.1	PCI Configuration Submenu......................................................................	102
	4.4.2	Boot Configuration Submenu ....................................................................	103
	4.4.3	Peripheral Configuration Submenu............................................................	104
	4.4.4	IDE Configuration Submenu......................................................................	106
	4.4.5	Diskette Configuration Submenu ...............................................................	109
	4.4.6	Event Log Configuration Submenu............................................................	110
	4.4.7	Video Configuration Submenu...................................................................	111
4.5	Security Menu..........................................................................................................		112
4.6	Power Menu ............................................................................................................		113
4.7	Boot Menu ...............................................................................................................		114
	4.7.1	IDE Drive Configuration Submenu.............................................................	115
4.8	Exit Menu ................................................................................................................		116

5 Error Messages and Beep Codes

5.1	BIOS Error Messages..............................................................................................	116
5.2	Port 80h POST Codes .............................................................................................	119
5.3	Bus Initialization Checkpoints ..................................................................................	123
5.4	Speaker ...................................................................................................................	124
5.5	BIOS Beep Codes ...................................................................................................	124
5.6	Diagnostic LEDs ......................................................................................................	125

Figures

1.	D815EEA Board Components ...................................................................................	14
2.	Block Diagram ...........................................................................................................	15
3.	Intel 815E Chipset Block Diagram .............................................................................	22
4.	Block Diagram of Basic Audio Subsystem .................................................................	33
5.	Block Diagram of Enhanced PCI Audio Subsystem ...................................................	33
6.	ICH2 and CNR Signal Interface .................................................................................	37
7.	Using the Wake on LAN Technology Connector........................................................	44
8.	Location of Standby Power Indicator LED .................................................................	45
9.	Back Panel Connectors .............................................................................................	54
10.	Audio, Video, Hardware Control, and Fan Connectors ..............................................	59
11.	Add-in Board and Peripheral Interface Connectors....................................................	63
12.	External I/O Connectors ............................................................................................	69
13.	Location of the Jumper Block ....................................................................................	73

vii

Intel®Desktop Board D815EEA Technical Product Specification

14.	D815EEA Board Dimensions.....................................................................................	75
15.	I/O Shield Dimensions ...............................................................................................	76
16.	Localized High Temperature Zones ...........................................................................	81
17.	Diagnostic LEDs ......................................................................................................	125
Tables
1.	Feature Summary......................................................................................................	12
2.	Manufacturing Options...............................................................................................	13
3.	Specifications ............................................................................................................	16
4.	Supported Processors ...............................................................................................	19
5.	Supported Memory Configurations ............................................................................	21
6.	Supported Graphics Refresh Frequencies.................................................................	29
7.	LAN Connector LED States .......................................................................................	36
8. Effects of Pressing the Power Switch ........................................................................		40
9.	Power States and Targeted System Power ...............................................................	41
10.	Wake Up Devices and Events ...................................................................................	42
11.	Fan Connector Descriptions ......................................................................................	43
12.	System Memory Map.................................................................................................	47
13.	I/O Map .....................................................................................................................	48
14.	DMA Channels ..........................................................................................................	50
15.	PCI Configuration Space Map ...................................................................................	50
16.	Interrupts ...................................................................................................................	51
17.	PCI Interrupt Routing Map .........................................................................................	52
18.	PS/2 Mouse/Keyboard Connectors............................................................................	55
19.	LAN Connector ..........................................................................................................	55
20.	USB Connectors........................................................................................................	55
21.	VGA Port Connector..................................................................................................	56
22.	Parallel Port Connector..............................................................................................	56
23.	Serial Port A Connector .............................................................................................	56
24.	MIDI/Game Port Connector .......................................................................................	57
25.	Audio Line Out Connector .........................................................................................	57
26.	Audio Line In Connector ............................................................................................	57
27.	Mic In Connector .......................................................................................................	57
28.	Chassis Fan Connector (J3F1) ..................................................................................	60
29.	CD-ROM Legacy Style Connector (J2F2)..................................................................	60
30.	ATAPI CD-ROM Connector (J2F1)............................................................................	60
31.	Auxiliary Line In Connector (J2G1) ............................................................................	60
32.	Telephony Connector (J2G2).....................................................................................	60
33.	Digital Video Out Connector (J3H1)...........................................................................	61
34.	Processor Fan Connector (J3M1)..............................................................................	61
35.	Power Connector (J8K1) ...........................................................................................	61
36.	Wake on LAN Technology Connector (J6B1) ............................................................	62
37.	Chassis Intrusion Connector (J7B1) ..........................................................................	62
38.	Chassis Fan Connector (J8B1)..................................................................................	62
39.	CNR Connector (J3A1)..............................................................................................	64
40.	PCI Bus Connectors (J4A1, J4B1, J4C1, J4D1, J4E1) ..............................................	65

viii

Contents

41.	AGP Universal Connector (J5E1) ..............................................................................	66
42.	Diskette Drive Connector (J8G3) ...............................................................................	67
43.	PCI IDE Connectors (J8G2, Primary and J6G1, Secondary) .....................................	68
44.	Front Panel USB Connector (J8C1)...........................................................................	70
45.	Serial Port B Connector (J8E1)..................................................................................	70
46.	SCSI LED Connector (J7A1) .....................................................................................	70
47.	Auxiliary Front Panel Power LED Connector (J8C2)..................................................	70
48.	Front Panel Connector (J8C3) ...................................................................................	71
49.	States for a Single-Colored Power LED.....................................................................	72
50.	States for a Dual-Colored Power LED .......................................................................	72
51.	BIOS Setup Configuration Jumper Settings (J7B1) ...................................................	74
52.	Power Usage For Board with Basic Audio and Onboard LAN....................................	77

53.Power Usage For Board with Enhanced PCI Audio Subsystem and

	no Onboard LAN subsystem......................................................................................	78
54.	Standby Current Requirements .................................................................................	79
55.	Thermal Considerations for Components ..................................................................	82
56.	D815EEA Board Environmental Specifications ..........................................................	83
57.	Safety Regulations ....................................................................................................	84
58.	EMC Regulations.......................................................................................................	84
59.	Supervisor and User Password Functions .................................................................	95
60.	BIOS Setup Program Menu Bar.................................................................................	97
61.	BIOS Setup Program Function Keys .........................................................................	98
62.	Maintenance Menu ....................................................................................................	98
63.	Extended Configuration Submenu .............................................................................	99
64.	Main Menu...............................................................................................................	100
65.	Advanced Menu.......................................................................................................	101
66.	PCI Configuration Submenu ....................................................................................	102
67.	Boot Configuration Submenu...................................................................................	103
68.	Peripheral Configuration Submenu ..........................................................................	104
69.	IDE Configuration Submenu ....................................................................................	106
70.	Primary/Secondary IDE Master/Slave Submenus....................................................	107
71.	Diskette Configuration Submenu .............................................................................	109
72.	Event Log Configuration Submenu ..........................................................................	110
73.	Video Configuration Submenu .................................................................................	111
74.	Security Menu..........................................................................................................	112
75.	Power Menu ............................................................................................................	113
76.	Boot Menu ...............................................................................................................	114
77.	IDE Drive Configuration Submenu...........................................................................	115
78.	Exit Menu ................................................................................................................	116
79.	BIOS Error Messages..............................................................................................	116
80.	Uncompressed INIT Code Checkpoints...................................................................	119
81.	Boot Block Recovery Code Checkpoints .................................................................	119
82.	Runtime Code Uncompressed in F000 Shadow RAM .............................................	120
83.	Bus Initialization Checkpoints ..................................................................................	123
84.	Upper Nibble High Byte Functions ...........................................................................	123
85.	Lower Nibble High Byte Functions ...........................................................................	124
86.	Beep Codes.............................................................................................................	125
87.	Diagnostic LED Codes.............................................................................................	126

ix

Intel®Desktop Board D815EEA Technical Product Specification

x

1 Product Description

What This Chapter Contains
1.1	Overview ...................................................................................................................	12
1.2	Online Support...........................................................................................................	16
1.3	Design Specifications ................................................................................................	16
1.4	Processor ..................................................................................................................	19
1.5	System Memory.........................................................................................................	20
1.6	Intel® 815E Chipset ...................................................................................................	22
1.7	I/O Controller .............................................................................................................	26
1.8	Graphics Subsystem .................................................................................................	28
1.9	Audio Subsystem (Optional) ......................................................................................	32
1.10 LAN Subsystem.........................................................................................................		35
1.11 CNR (Optional) ..........................................................................................................		36
1.12 Hardware Management Subsystem (Optional) ..........................................................		37
1.13 Power Management ..................................................................................................		39

11

Intel®Desktop Board D815EEA Technical Product Specification

1.1 Overview

1.1.1Feature Summary

Table 1 summarizes the D815EEA board’s major features.

Table 1. Feature Summary

Form Factor

Processor

Memory

Chipset

I/O Control

Video

Peripheral

Interfaces

Expansion

Capabilities

BIOS

Diagnostic LEDs

Instantly Available

PC

Wake on LAN†

Technology

Connector

ATX (12.0 inches by 8.2 inches)

Support for either an Intel®Pentium® III processor in a Flip Chip Pin Grid Array (FC-PGA) package or an Intel®Celeron™ processor in an FCPGA package or a PPGA package

∙Three 168-pin SDRAM Dual Inline Memory Module (DIMM) sockets

∙Support for up to 512 MB system memory

∙Singleor double-sided DIMMs supported

Intel®815E Chipset, consisting of:

∙Intel®82815E Graphics and Memory Controller Hub (GMCH)

∙Intel®82801BA I/O Controller Hub (ICH2)

∙Intel®82802AB 4 Mbit Firmware Hub (FWH)

SMSC LPC47M102 LPC bus I/O controller

∙Intel®82815E integrated graphics support

∙AGP universal connector supporting 1X, 2X, and 4X AGP cards or a Graphics Performance Accelerator (GPA)

∙Digital video output (DVO) connector

∙Four Universal Serial Bus (USB) ports

∙Two serial ports

∙One parallel port

∙Two IDE interfaces with Ultra DMA, ATA-66/100 support

∙One diskette drive interface

∙MIDI/game port

∙PS/2† keyboard and mouse ports

∙Five PCI bus add-in card connectors (SMBus routed to PCI bus connector 2)

∙One AGP universal connector

∙Intel/AMI BIOS (resident in the Intel 82802AB 4 Mbit FWH)

∙Support for Advanced Power Management (APM), Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS

Four dual-color LEDs on back panel

∙Support for PCI Local Bus Specification Revision 2.2

∙Suspend to RAM support

∙Wake on PS/2 keyboard and USB ports

Support for system wake up using an add-in network interface card with remote wake up capability

For information about	Refer to
The board’s compliance level with APM, ACPI, Plug and Play, and SMBIOS.	Section 1.3, page 16

12

Product Description

1.1.2Manufacturing Options

Table 2 describes the D815EEA board’s manufacturing options.

Table 2. Manufacturing Options

Audio

LAN

Hardware Monitor

Subsystem

Communication

and Networking

Riser (CNR)

Two separate Audio Codec ’97 (AC ’97) compatible audio subsystem options:

∙A basic audio subsystem that includes the ICH2 component and an Analog Devices AD1885 analog codec, or

∙An enhanced audio subsystem that includes a Creative Labs ES1373 AC ’97 digital controller and a Crystal Semiconductor CS4297 stereo audio codec.

Intel®82562ET 10/100 Mbit/sec Platform LAN Connect (PLC) device

∙Voltage sense to detect out of range values

∙Chassis intrusion detect connector

∙Two fan sense inputs used to monitor fan activity

One CNR connector (slot shared with PCI bus connector 5)

13

Intel®Desktop Board D815EEA Technical Product Specification

1.1.3D815EEA Board Layout

Figure 1 shows the location of the major components on the D815EEA board.

	A	B		C D		E
U						F
T						G
S						H
R
Q	P	O	N M L	K	J	I
						OM10041

A	Creative Labs ES1373 Digital Controller	K	IDE connectors
	(optional)	L	Serial port B connector
B	AD1885 audio codec (optional)	M	Intel 82801BA I/O Controller Hub (ICH2)
C	AGP universal connector	N SMSC LPC47M102 I/O Controller
D	DVO connector	O	Front panel connectors
E	Back panel connectors	P Intel 82802AB 4 Mbit Firmware Hub (FWH)
F	Intel 82815E Graphics and Memory Controller	Q	Battery
	Hub (GMCH)	R	Front panel USB connector
G	Processor socket	S	Speaker
H	DIMM sockets	T PCI bus add-in card connectors
I	Power connector	U	Communication and Networking Riser (CNR)
J	Diskette drive connector		connector (optional)

Figure 1. D815EEA Board Components

14

Product Description

1.1.4Block Diagram

Figure 2 is a block diagram of the major functional areas of the D815EEA board.

Diagnostic

Primary/

LEDs

Secondary IDE

ATA-33/66/100

USB USB Ports 0 and 1

Processor Socket		System Bus

USB Ports 2 and 3

			815E Chipset
SDRAM Bus		82815E		82801BA		82802AB
		Graphics and	AHA
				I/O Controller Hub		Firmware Hub
		Memory Controller	Bus
				(ICH2)		(FWH)
		Hub (GMCH)
DIMM
Banks
(3)					LPC
					Bus
DVO	Digital video					Diskette Drive
Connector		output
						Connector
						Serial Port A
AGP	AGP / Display Cache				LPC I/O	Serial Port B
Universal					Controller	Parallel Port
		Interface				PS/2 Mouse
Connector
						PS/2 Keyboard
		Hardware
		Monitor	SMBus		Optional
		(Optional)				Analog
						Codec
		PCI Bus			AC Link	CNR
						Connector
PCI Slot 1				CSMA/CD	Physical	LAN
				Unit	Layer
PCI Slot 2						Connector
				Interface	Interface

PCI Slot 3

PCI Slot 4

Optional

PCI Slot 5

CD-ROM

Audio Digital

AC ’97

Line In

Line Out

Audio

AC Link

Controller

Mic In

Codec

Auxiliary Line In

Telephony

OM10090

Figure 2. Block Diagram

15

Intel®Desktop Board D815EEA Technical Product Specification

1.2 Online Support

Find information about the Intel®D815EEA board under “Product Info” or “Customer Support” at these World Wide Web sites:

http://www.intel.com/design/motherbd

http://support.intel.com/support/motherboards/desktop

Find “Processor Data Sheets” or information about “Proper Date Access in Systems with Intel ® Motherboards” at these World Wide Web sites:

http://www.intel.com/design/litcentr

http://support.intel.com/support/year2000

Find information about the ICH addressing at this World Wide Web site:

http://developer.intel.com/design/chipsets/datashts/

1.3 Design Specifications

Table 3 lists the specifications applicable to the D815EEA board.

Table 3.	Specifications
Reference		Specification	Version, Revision Date,	The information is
Name		Title	and Ownership	available from…
AC ‘97		Audio Codec ‘97	Version 2.1,	ftp://download.intel.com/
			May 1998,	pc-supp/platform/ac97
			Intel Corporation.
ACPI		Advanced Configuration	Version 1.0b,	http://www.teleport.com/~acpi/
		and Power Interface	February 1, 1999,
		Specification	Intel Corporation,
			Microsoft Corporation,
			and Toshiba Corporation.
AGP		Accelerated Graphics Port	Version 2.0,	the Accelerated Graphics
		Interface Specification	May 4, 1998,	Implementers Forum at:
			Intel Corporation.	http://www.agpforum.org/
AIMM		AGP Inline Memory Module	Version 0.9,	http://developer.intel.com/
(for Graphics			March 2000,	technology/memory/aimm/
			Intel Corporation	index.htm
Performance
Accelerator				Intel document order number
cards)				298177-003
AMI BIOS		American Megatrends	AMIBIOS 99,	http://www.amibios.com, or
		BIOS Specification	1999	http://www.ami.com/download/
			American Megatrends, Inc.	amibios99.pdf
APM		Advanced Power	Version 1.2,	http://www.microsoft.com/
		Management BIOS	February 1996,	hwdev/busbios/amp_12.htm
		Interface Specification	Intel Corporation,
			Microsoft Corporation.
				continued

16

Product Description

Table 3.	Specifications (continued)
		Specification	Version, Revision Date and	The information is
Description		Title	Ownership	available from…
ATA-3		Information Technology -	Version 6,	ATA Anonymous FTP Site:
		AT Attachment-3	October 1995,	ftp://www.dt.wdc.com/ata/
		Interface,	ASC X3T10 Technical	ata-3/
		X3T10/2008D	Committee.
ATAPI		Information Technology	Version 18,	T13 Anonymous FTP Site:
		AT Attachment with	August 19, 1998,	ftp://fission.dt.wdc.com/
		Packet Interface	Contact: T13 Chair,	x3t13/project/
		Extensions	Seagate Technology.	d1153r18.pdf
		T13/1153D
ATX		ATX Specification	Version 2.01,	http://developer.intel.com/
			February 1997,	design/motherbd/atx.htm
			Intel Corporation.
CNR		Communication and	Version 1.0,	http://developer.intel.com/
		Network Riser (CNR)	February 7, 2000,	technology/cnr/index.htm
		Specification	Intel Corporation
EPP		Enhanced Parallel Port	Version 1.7,	http://standards.ieee.org/
		IEEE std 1284.1-1997	1997,	reading/ieee/std_public/
			Institute of Electrical and	description/busarch/
			Electronic Engineers.	1284.1-1997_desc.html
El Torito		Bootable CD-ROM	Version 1.0,	the Phoenix Web site at:
		format specification	January 25, 1995,	http://www.ptltd.com/techs/
			Phoenix Technologies Ltd., and	specs.html
			IBM Corporation.
GPA (see
AIMM)
IrDA†		Serial Infrared Physical	Version 1.1,	Phone: [phone]
		Layer Link specification	October 17, 1995,	Fax: [phone]
			Infrared Data Association.	E-mail: [e-mail]
LPC		Low Pin Count Interface	Version 1.0,	http://www.intel.com/
		Specification	September 29, 1997,	design/chipsets/industry/
			Intel Corporation.	lpc.htm
PCI		PCI Local Bus	Version 2.2,	http://www.pcisig.com/
		Specification	December 18, 1998,
			PCI Special Interest Group.
		PCI Bus Power	Version 1.1,	http://www.pcisig.com/
		Management Interface	December 18, 1998,
		Specification	PCI Special Interest Group.
Plug and		Plug and Play BIOS	Version 1.0a,	http://www.microsoft.com/
Play		specification	May 5, 1994,	hwdev/respec/
			Compaq Computer Corp.,	pnpspecs.htm
			Phoenix Technologies Ltd.,
			and Intel Corporation.
				continued

17

Intel®Desktop Board D815EEA Technical Product Specification

Table 3.	Specifications (continued)
		Specification	Version, Revision Date	The information is
Description		Title	and Ownership	available from…
SDRAM		PC SDRAM Unbuffered	Revision 1.0,	http://www.intel.com/
		DIMM Specification	February, 1998,	design/chipsets/memory
			Intel Corporation.
		PC SDRAM DIMM	Revision 1.5,	http://www.intel.com/
		Specification	November, 1997,	design/chipsets/memory
			Intel Corporation.
		PC Serial Presence	Revision 1.2A,	http://www.intel.com/
		Detect (SPD)	December, 1997	design/pcisets/memory
		Specification	Intel Corporation.
SMBIOS		System Management	Version 2.3,	http://developer.intel.com/
		BIOS	August 12, 1998,	ial/wfm/design/smbios
			Award Software International Inc.,
			Dell Computer Corporation,
			Hewlett-Packard Company,
			Intel Corporation,
			International Business Machines
			Corporation,
			Phoenix Technologies Limited,
			American Megatrends Inc.,
			and SystemSoft Corporation.
UHCI		Universal Host Controller	Version 1.1,	http://www.usb.org/
		Interface Design Guide	March 1996,	developers
			Intel Corporation.
USB		Universal Serial Bus	Version 1.1,	http://www.usb.org/
		Specification	September 23, 1998,	developers
			Compaq Computer Corporation,
			Intel Corporation, Microsoft
			Corporation, and NEC.
WfM		Wired for Management	Version 2.0,	http://developer.intel.com/
		Baseline	December 18, 1998,	ial/WfM/wfmspecs.htm
			Intel Corporation.

18

Product Description

1.4 Processor

CAUTION

The D815EEA board supports processors that have an 18.2 A maximum current draw with a 1.65 to 2.0 V core voltage. Using a processor not in compliance with the above guidelines can damage the processor, the D815EEA board, and the power supply. See the processor’s data sheet for voltage and current usage requirements.

The D815EEA board supports a single Pentium III or Celeron processor. The system bus speed is automatically selected. The D815EEA board supports the processors listed in Table 4.

Table 4. Supported Processors

Type	Designation	System Bus Frequency	L2 Cache Size
Pentium III processor in	533EB, 600EB, 667, 733,	133 MHz	256 KB
an FC-PGA package	800EB, 866, and 933
	500E, 550E, 600E, 650, 700,	100 MHz	256 KB
	750, 800, and 850
Celeron processor in an	533A, 566, and 600	66 MHz	128 KB
FC-PGA package
Celeron processor in a	500 and 533	66 MHz	128 KB
PPGA package

All supported onboard memory can be cached, up to the cachability limit of the processor. See the processor’s data sheet for cachability limits.

For information about

Processor support

Processor data sheets

Refer to

Section 1.2, page 16

Section 1.2, page 16

19

Intel®Desktop Board D815EEA Technical Product Specification

1.5 System Memory

The D815EEA board has three DIMM sockets and supports the following memory features:

∙3.3 V (only) 168-pin SDRAM DIMMs with gold-plated contacts

∙Unbuffered singleor double-sided DIMMs

∙Maximum system memory: 512 MB; minimum system memory: 32 MB

∙133 MHz SDRAM or 100 MHz SDRAM

∙Serial Presence Detect (SPD) and non-SPD memory

∙Non-ECC and ECC DIMMs (ECC DIMMs will operate in non-ECC mode only)

∙Suspend to RAM

Table 5 lists the supported DIMM configurations. In the second column of Table 5:

∙“DS” refers to double-sided memory modules (containing two rows of SDRAM)

∙“SS” refers to single-sided memory modules (containing one row of SDRAM).

When installing memory, note the following:

∙Non-SPD DIMMs will always revert to a 100 MHz with 3-3-3 timing SDRAM bus.

∙Mixing Non-SPD DIMMs with SPD DIMMs will always revert to a 100 MHz with 3-3-3 timing SDRAM bus.

∙The BIOS will not initialize installed memory above 512 MB. At boot, the BIOS displays a message indicating that any installed memory above 512 MB has not been initialized.

∙Mixed memory speed configurations (133 and 100 MHz) will default to 100 MHz.

∙133 MHz SDRAM operation requires a 133 MHz system bus frequency processor.

∙The board should be populated with no more than four rows of 133 MHz SDRAM (two double-sided or one double-sided plus two single-sided DIMMs)

∙100 MHz SDRAM may be populated with six rows of SDRAM (three double-sided DIMMs).

NOTE

If more than four rows of 133 MHz SDRAM are populated, the BIOS will initialize installed memory up to 512 MB at 100 MHz.

20

Product Description

Table 5.

Supported Memory Configurations

DIMM

Number of

SDRAM

SDRAM Organization

Number of

Capacity

Sides

Density

Front-side/Back-side

SDRAM devices

32 MB

DS

16 Mbit

2

M X 8 /

2 M X 8

16

(Note 1)

32 MB

SS

64 Mbit

4 M X 16

/ empty

4

48 MB

DS

64 / 16 Mbit

4

M X 16

/

2

M X 8

12

(Notes 1 and 2)

64 MB

DS

64 Mbit

4 M X 16

/

4 M X 16

8

64 MB

SS

64 Mbit

8 M X 8 / empty

8

64 MB

SS

128 Mbit

8 M X 16

/ empty

4

96 MB

DS

64 Mbit

8

M X 8 /

4 M x 16

12

(Notes 1 and 2)

96 MB

DS

128

/ 64 Mbit

8

M X 16

/

4

M x 16

8 (Notes 1 and 2)

128 MB

DS

64 Mbit

8

M X 8 /

8 M X 8

16

(Note 1)

128 MB

DS

128

Mbit

8

M X 16

/

8

M X 16

8 (Notes 1 and 2)

128 MB

SS

128 Mbit

16 M X

8

/ empty

8

128 MB

SS

256 Mbit

16 M X

16

/ empty

4

192 MB

DS

128

Mbit

16

M X

8

/

8

M x 16

12

(Notes 1 and 2)

192 MB

DS

128

/ 64 Mbit

16

M X

8

/

8

M x 8

16

(Notes 1 and 2)

256 MB

DS

128

Mbit

16

M X

8

/

16 M X 8

16

(Notes 1 and 2)

256 MB

DS

256

Mbit

16

M X

16

/ 16 M X 16

8 (Notes 1 and 2)

256 MB

SS

256 Mbit

32 M X

8

/ empty

8

512 MB

DS

256

Mbit

32

M X

8

/

32 M X 8

16

(Notes 1 and 2)

Notes

1.If the number of SDRAM devices is greater than nine, the DIMM will be double sided.

2.Front side population / back side population indicated for SDRAM density and SDRAM organization.

CAUTION

To be fully compliant with all applicable Intel®SDRAM memory specifications, the motherboard should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your memory modules do not support SPD, you will see a notification to this effect on the screen at power up. The BIOS will attempt to configure the memory controller for normal operation. However, DIMMs may not function under the determined frequency. You can access the PC Serial Presence Detect Specification at:

http://www.intel.com/design/pcisets/memory/

21

Intel®Desktop Board D815EEA Technical Product Specification

1.6 Intel® 815E Chipset

The Intel 815E chipset consists of the following devices:

∙82815E Graphics and Memory Controller Hub (GMCH) with Accelerated Hub Architecture (AHA) bus

∙82801BA I/O Controller Hub (ICH2) with AHA bus

∙82802AB Firmware Hub (FWH).

The GMCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the Accelerated Hub Architecture interface. The ICH2 is a centralized controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS as well as hardware-dependent security features. The chipset provides the interfaces shown in Figure 3.

ATA-33/66/100

Network

System Bus

USB

SDRAM Bus

		815E Chipset
	82815E				82801BA		82802AB
	Graphics and		AHA
				I/O Controller Hub			Firmware Hub
	Memory Controller		Bus
					(ICH2)		(FWH)
	Hub (GMCH)
	Digital video	AGP					LPC Bus
	output	Interface		SMBus	PCI Bus	AC Link

OM10202

Figure 3. Intel 815E Chipset Block Diagram

For information about

The Intel 815E chipset

The resources used by the chipset

The chipset’s compliance with ACPI, APM, AC ‘97

Refer to

Http://developer.intel.com

Chapter 2

Section 1.3, page 16

22

Product Description

1.6.1Intel®82815E Graphics and Memory Controller Hub (GMCH)

The GMCH provides the following:

·An integrated Synchronous DRAM memory controller with autodetection of SDRAM

·An interface for a single AGP device or a Graphics Performance Accelerator (GPA) card

·An interface for a digital video output (DVO) connector for a flat panel, digital CRT, or TV-out

·Support for ACPI Rev 1.0 and APM Rev 1.2 compliant power management

1.6.2Intel®82801BA I/O Controller Hub (ICH2)

The ICH2 provides the following:

·33 MHz PCI bus interface

·Support for up to six PCI master devices

·Low Pin Count (LPC) interface that supports an LPC-compatible I/O controller

·Support for two Master/DMA devices

·Integrated IDE controller that supports Ultra DMA (33 MB/sec) and ATA-66/100 mode (66 MB/sec, 100 MB/sec)

·Integrated LAN Media Access Controller

·Universal Serial Bus interface with two USB controllers providing four ports in a UHCI Implementation

·Power management logic for ACPI Rev 1.0b compliance

·System Management Bus (SMBus clock and data lines also routed to PCI bus connector 2)

·Real-Time Clock with 256-byte battery-backed CMOS RAM

·AC’97 digital link for Audio and telephony codecs, including:

¾AC’97 2.1 compliance

¾Logic for PCM in, PCM out, Mic input, Modem in, and Modem out

¾Separate PCI functions for audio and modem

¾Communications Network Riser (CNR) interface

1.6.2.1IDE Interfaces

The ICH2’s IDE controller has two independent bus-mastering IDE interfaces that can be independently enabled. The IDE interfaces support the following modes:

·Programmed I/O (PIO): CPU controls data transfer

·8237-style DMA: DMA offloads the CPU, supporting transfer rates of up to 16 MB/sec

·Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec.

·Ultra ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to ATA-33 and is device driver compatible. ATA-66 uses faster timings and requires a specialized cable to reduce reflections, noise, and inductive coupling.

·Ultra ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH2 Ultra ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec. The higher quality cable used for ATA-66 DMA support is adequate to reduce reflections, noise, and inductive coupling for ATA-100 operation.

23

Intel®Desktop Board D815EEA Technical Product Specification

The IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes listed in Table 70 on page 107.

The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

The D815EEA board supports laser servo (LS-120) diskette technology through its IDE interfaces. The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:

∙ARMD-FDD (ATAPI removable media device – floppy disk drive)

∙ARMD-HDD (ATAPI removable media device – hard disk drive)

For information about

The location of the IDE connectors

The signal names of the IDE connectors

BIOS Setup program’s Boot menu

Refer to

Figure 11, page 63

Table 43, page 68

Table 76, page 114

1.6.2.2USB

The ICH2 contains two separate USB controllers. The D815EEA board has four USB ports; one USB peripheral can be connected to each port. For more than four USB devices, an external hub can be connected to any of the ports. Two of the USB ports are implemented with stacked back panel connectors; the other two are accessible via the front panel USB connector at location J8C1. The D815EEA board fully supports UHCI and uses UHCI-compatible software drivers.

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.

For information about

The location of the USB connectors on the back panel

The signal names of the back panel USB connectors

The location of the front panel USB connector

The signal names of the front panel USB connector

The USB specification and UHCI

Refer to

Figure 9, page 54

Table 20, page 55

Figure 12, page 69

Table 44, page 70

Section 1.3, page 16

24

Product Description

1.6.2.3Real-Time Clock, CMOS SRAM, and Battery

The real-time clock provides a time-of-day clock and a multicentury calendar with alarm features. The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use.

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.

NOTE

If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS RAM at power-on.

NOTE

The recommended method of accessing the date in systems with D815EEA boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIOS on D815EEA boards contains a century checking and maintenance feature. This feature checks the two least significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature enables operating systems and applications using the BIOS date/time services to reliably manipulate the year as a four-digit value.

For information about	Refer to
Proper date access in systems with D815EEA boards	Section 1.2, page 16

1.6.3Intel®82802AB 4 Mbit Firmware Hub (FWH)

The FWH provides the following:

∙System BIOS

∙System security and manageability logic that enables protection for storing and updating of platform information

25

Intel®Desktop Board D815EEA Technical Product Specification

1.7 I/O Controller

The SMSC LPC47M102 I/O Controller provides the following features:

·Low pin count (LPC) interface

·3.3 V operation

·Two serial ports

·One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support

·Serial IRQ interface compatible with serialized IRQ support for PCI systems

·PS/2-style mouse and keyboard interfaces

·Interface for one 1.2 MB, 1.44 MB, or 2.88 MB diskette drive

·Intelligent power management, including a programmable wake up event interface

·PCI power management support

·IrDA† 1.0 compliant

·Fan control:

¾Two fan control outputs

¾Two fan tachometer inputs

The BIOS Setup program provides configuration options for the I/O controller.

For information about	Refer to
SMSC LPC47M102 I/O controller	http://www.smsc.com

1.7.1Serial Ports

The D815EEA board has two serial ports. Serial port A is located on the back panel. Serial port B is accessible using the connector at location J8E1. The serial ports’ NS16C550-compatible UARTs support data transfers at speeds up to 115.2 kbits/sec with BIOS support. The serial ports can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h).

For information about

The location of the Serial port A connector

The signal names of the Serial port A connector

The location of the Serial port B connector

The signal names of the Serial port B connector

Refer to

Figure 9, page 54

Table 23, page 56

Figure 12, page 69

Table 45, page 70

1.7.2Infrared Support

The front panel connector includes four pins that support Hewlett-Packard HSDL-1000 compatible infrared (IR) transmitters and receivers. In the BIOS Setup program, Serial port B can be directed to a connected IR device. The IR connection can be used to transfer files to or from portable devices like laptops, PDAs, and printers. The Infrared Data Association (IrDA) specification supports data transfers of 115.2 kbits/sec at a distance of 1 meter.

26

For information about

The location of the front panel connector

The signal names of the front panel connector

Configuring serial port B for infrared applications

The IrDA specification

Product Description

Refer to

Figure 12, page 69

Table 48, page 71

Section 4.4.3, page 104

Section 1.3, page 16

1.7.3Parallel Port

The connector for the multimode bidirectional parallel port is a 25-pin D-Sub connector located on the back panel. In the BIOS Setup program, the parallel port can be configured for the following:

∙Output only (PC AT†-compatible mode)

∙Bi-directional (PS/2 compatible)

∙EPP

∙ECP

For information about

The location of the parallel port connector

The signal names of the parallel port connector

Refer to

Figure 9, page 54

Table 22, page 56

1.7.4Diskette Drive Controller

The I/O controller supports one diskette drive that is compatible with the 82077 diskette drive controller and supports both PC-AT and PS/2 modes.

For information about

The location of the diskette drive connector

The signal names of the diskette drive connector

The supported diskette drive capacities and sizes

Refer to

Figure 11, page 63

Table 42, page 67

Table 71, page 109

1.7.5Keyboard and Mouse Interface

PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines to these connectors are protected with a PolySwitch† circuit that, like a self-healing fuse, reestablishes the connection after an overcurrent condition is removed.

NOTE

The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.

The keyboard controller contains the AMI keyboard and mouse controller code, provides the keyboard and mouse control functions, and supports password protection for power-on/reset. A power-on/reset password can be specified in the BIOS Setup program.

The keyboard controller also supports the hot-key sequence <Ctrl><Alt><Del> for a software reset (operating system dependent). This key sequence resets the computer’s software by jumping to the beginning of the BIOS code and running the power-on self-test (POST).

27

Intel®Desktop Board D815EEA Technical Product Specification

For information about

Refer to

The location of the keyboard and mouse connectors

The signal names of the keyboard and mouse connectors

Figure 9, page 54

Table 18, page 55

1.8 Graphics Subsystem

The 815E chipset contains two separate, mutually exclusive graphics options. Either the integrated graphics controller (contained within the 82815E GMCH) is used, or an add-in AGP adapter can be used.

The GMCH includes an integrated display cache SDRAM controller that supports a Graphics Performance Accelerator (GPA) card. The GPA card is a 32-bit 133 MHz 4 MB SDRAM array for enhanced integrated 2D and 3D graphics performance. This interface is multiplexed between the display cache interface and the AGP connector. When an AGP card is installed, the integrated graphics controller is disabled and the display cache interface is not used.

For information about

GPA support

Refer to

Section 1.8.3.1, page 31

1.8.1Integrated Graphics Controller

The GMCH features the following:

·Integrated graphics controller

¾3-D Hyper pipelined architecture

¾Full 2-D hardware acceleration

¾Motion video acceleration

·3-D graphics visual and texturing enhancement

·Display

¾Integrated 24-bit 230 MHz RAMDAC

¾Display Data Channel Standard, Version 3.0, Level 2B protocols compliant

·Video

¾Hardware motion compensation for software MPEG2 decode

¾Software DVD at 30 fps

·Integrated graphics memory controller

Table 6 lists the refresh frequencies supported by the graphics subsystem.

28

Product Description

Table 6. Supported Graphics Refresh Frequencies

			Available Refresh
Resolution	Color Palette		Frequencies (Hz)	Notes
320 x 200	256 colors		70	D
	64	K colors	70	D3
	16	M colors	70	D
320 x 240	256 colors		70	D
	64	K colors	70	D3
	16	M colors	70	D
352 x 480	256 colors		70	D
	64	K colors	70	D3
	16	M colors	70	D
352 x 576	256 colors		70	D
	64	K colors	70	D3
	16	M colors	70	D
400 x 300	256 colors		70	D
	64	K colors	70	D3
	16	M colors	70	D
512 x 384	256 colors		70	D
	64	K colors	70	D3
	16	M colors	70	D
640 x 400	256 colors		70	D
	64	K colors	70	D3
	16	M colors	70	D
640 x 480	256 colors		60, 70, 72, 75, 85	KDO
	64	K colors	60, 75, 85	KD3O
	64	K colors	70, 72	KDO
640 x 480	16 M colors		60, 70, 72, 75, 85	KDO
800 x 600	256 colors		60, 70, 72, 75, 85	KDO
	64	K colors	60, 70, 72, 75, 85	KD3O
	16	M colors	60, 70, 72, 75, 85	KDO
1024 x 768	256 colors		60, 70, 75, 85	KDO
	64	K colors	60, 70, 75	KD3O
	64	K colors	85	KD3
	16	M colors	60, 70, 75, 85	KD

continued

29

Intel®Desktop Board D815EEA Technical Product Specification

Table 6. Supported Graphics Refresh Frequencies (continued)

			Available Refresh
Resolution	Color Palette		Frequencies (Hz)	Notes
1152 x 864	256 colors		60, 70, 72, 75	KDO
	256 colors		85	KD
	64	K colors	60, 70	KD3O
	64	K colors	72, 75, 85	KD3
	16 M colors		60	KDO
	16	M colors	75, 85	KD
1280 x 768	256 colors		60 (reduced blanking)	KDOF
	64	K colors	60 (reduced blanking)	KD3F
	16	M colors	60 (reduced blanking)	KDF
1280 x 1024	256 colors		60	KDO
	256 colors		70, 72, 75, 85	KD
	64	K colors	60, 70, 72, 75, 85	KD3
	16	M colors	60, 70, 75, 85	KD
1600 x 1200	256 colors		60, 70, 72, 75	KD

Notes: K = Desktop

D = DirectDraw

3 = Direct3D and OpenGL O = Overlay

F = Digital Display Device only. A mode will be supported on both analog CRTs and digital display devices (the KD3O flags above apply to both types of displays), unless indicated otherwise.

For information about	Refer to
Obtaining graphics software and utilities	Section 1.2, page 16

1.8.2Digital Video Output (DVO) Connector

The board routes the Intel 82815E GMCH DVO port to an onboard 40-pin DVO connector. The DVO connector can be cabled to a DVI or TV out card to enable digital displays or TV out functionality. The Digital Visual Interface (DVI) specification provides a high-speed digital connection for visual data types when using the integrated graphics controller. This interface is active only when the integrated graphics controller is enabled.

The DVI interface allows interfacing with a discrete Transmission Minimized Differential Signaling (TMDS) transmitter to enable platform support for DVI compliant digital displays or with a discrete TV encoder for TV Out functionality.

For information about

The location of the DVO connector

The signal names of the DVO connector

Refer to

Figure 10, page 59

Table 33, page 61

30