Intel D54250WYB, D34010WYB Technical Product Specification

Intel® NUC Board D54250WYB and

Intel® NUC Board D34010WYB

Technical Product Specification

March 2014

Order Number: H18263-004

Intel® NUC Board D54250WYB and Intel® NUC Board D34010WYB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in Intel NUC Board D54250WYB and Intel NUC Board D34010WYB Specification Update.

Revision History

Revision	Revision History	Date
001	First release of the Intel NUC Board D54250WYB and Intel NUC Board	September 2013
	D34010WYB Technical Product Specification
002	Specification Clarification	October 2013
003	Specification Clarification	November 2013
004	Specification Clarification	March 2014

Disclaimer

This product specification applies to only the standard Intel NUC Board with BIOS identifier WYLPT10H.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

Copyright 2013, 2014 Intel Corporation. All rights reserved.

Board Identification Information

Basic Intel® NUC Board D54250WYB Identification Information

AA Revision	BIOS Revision	Notes
H13922-303	WYLPT10H.86A.0021	1,2
Notes:

1.The AA number is found on a small label on the component side of the board.

2.The Intel® Core™ i5-4250U processor is used on this AA revision consisting of the following component:

Device	Stepping	S-Spec Numbers
Intel Core i5-4250U	C0	SR16M

Basic Intel® NUC Board D34010WYB Identification Information

AA Revision	BIOS Revision	Notes
H14771-303	WYLPT10H.86A.0021	1,2
Notes:

1.The AA number is found on a small label on the component side of the board.

2.The Intel® Core™ i3-4010U processor is used on this AA revision consisting of the following component:

Device	Stepping	S-Spec Numbers
Intel Core i3-4010U	C0	SR16Q

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Board D54250WYB and Intel NUC Board D34010WYB.

Specification Changes or Clarifications

Date	Type of Change	Description of Changes or Clarifications
October 2013	Spec Clarification	• Added Figure 9 to show the front panel connectors.
		• Added Figure 15 to show the location of the front panel
		Consumer Infrared (CIR) sensor
		• Updated the link for BIOS update utilities in Section 3.5.
		• Updated the link for BIOS recovery in Section 3.6.
		• Added information about length and character restrictions for
		HDD passwords in Section 3.8.
		• Added Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out.
		continued

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Specification Changes or Clarifications (continued)

Date	Type of Change	Description of Changes or Clarifications
November 2013	Spec Clarification	• Updated Section 1.5.1.3 Mini High Definition Multimedia
		Interface* (Mini HDMI*)
		• Updated Section 1.5.1.4 Mini DisplayPort*
		• Updated Section 1.5.1.5 Multiple DisplayPort and HDMI
		Configurations
February 2014	Spec Clarification	• Updated the first Caution in Section 2.6 Thermal
		Considerations.
		• Added Figure 18 Board Height Dimensions.

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See http://www.intel.com/content/www/us/en/motherboards/desktopmotherboards/motherboards.html?wapkw=desktop+boards for the latest documentation.

iv

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board D54250WYB and Intel® NUC Board D34010WYB.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel NUC Board D54250WYB and Intel NUC Board D34010WYB and their components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter	Description
1	A description of the hardware used on Intel NUC Board D54250WYB and Intel
	NUC Board D34010WYB
2	A map of the resources of the Intel NUC Board
3	The features supported by the BIOS Setup program
4	A description of the BIOS error messages, beep codes, and POST codes
5	Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

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Other Common Notation

#	Used after a signal name to identify an active-low signal (such as USBP0#)
GB	Gigabyte (1,073,741,824 bytes)
GB/s	Gigabytes per second
Gb/s	Gigabits per second
KB	Kilobyte (1024 bytes)
Kb	Kilobit (1024 bits)
kb/s	1000 bits per second
MB	Megabyte (1,048,576 bytes)
MB/s	Megabytes per second
Mb	Megabit (1,048,576 bits)
Mb/s	Megabits per second
TDP	Thermal Design Power
xxh	An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V	Volts. Voltages are DC unless otherwise specified.

*This symbol is used to indicate third-party brands and names that are the property of their respective owners.

vi

Contents

Revision History

Disclaimer ................................................................................................	ii
Board Identification Information ..................................................................	iii
Errata ......................................................................................................	iv

Preface

Intended Audience.....................................................................................	v
What This Document Contains.....................................................................	v
Typographical Conventions .........................................................................	v

1 Product Description

1.1	Overview.........................................................................................		11
	1.1.1	Feature Summary .................................................................	11
	1.1.2	Board Layout (Top) ...............................................................	13
	1.1.3	Board Layout (Bottom) ..........................................................	15
	1.1.4	Block Diagram ......................................................................	17
1.2	Online Support .................................................................................		18
1.3	Processor ........................................................................................		18
1.4	System Memory ...............................................................................		19
	1.4.1	Memory Configurations ..........................................................	20
1.5	Processor Graphics Subsystem ...........................................................		21
	1.5.1	Integrated Graphics...............................................................	21
1.6	USB ................................................................................................		24
1.7	SATA Interface.................................................................................		25
	1.7.1	AHCI Mode ...........................................................................	25
	1.7.2	Intel® Rapid Storage Technology / SATA RAID ..........................	25
	1.7.3	Intel® Smart Response Technology..........................................	25
1.8	Real-Time Clock Subsystem ...............................................................		26
1.9	Audio Subsystem..............................................................................		26
	1.9.1	Audio Subsystem Software .....................................................	27
1.10 LAN Subsystem ................................................................................			27
	1.10.1	Intel® I218V Gigabit Ethernet Controller...................................	27
	1.10.2	LAN Subsystem Software .......................................................	27
	1.10.3	RJ-45 LAN Connector with Integrated LEDs ..............................	28
1.11 Hardware Management Subsystem .....................................................			29
	1.11.1	Hardware Monitoring .............................................................	29
	1.11.2	Fan Monitoring......................................................................	29
	1.11.3	Thermal Solution...................................................................	30
1.12 Power Management ..........................................................................			31
	1.12.1	ACPI ....................................................................................	31
	1.12.2	Hardware Support .................................................................	33

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2 Technical Reference

2.1	Memory Resources ...........................................................................		37
	2.1.1	Addressable Memory .............................................................	37
2.2	Connectors and Headers....................................................................		37
	2.2.1	Front Panel Connectors ..........................................................	38
	2.2.2	Back Panel Connectors...........................................................	38
	2.2.3	Header (Top) ........................................................................	39
	2.2.4 Connectors and Headers (Bottom)...........................................		40
2.3	BIOS Security Jumper .......................................................................		49
2.4	Mechanical Considerations .................................................................		51
	2.4.1	Form Factor..........................................................................	51
2.5	Electrical Considerations ....................................................................		52
	2.5.1	Power Supply Considerations ..................................................	52
	2.5.2 Fan Header Current Capability ................................................		53
2.6	Thermal Considerations .....................................................................		53
2.7	Reliability.........................................................................................		56
2.8	Environmental..................................................................................		56

3 Overview of BIOS Features

3.1	Introduction.....................................................................................		57
3.2	BIOS Flash Memory Organization........................................................		58
3.3	System Management BIOS (SMBIOS) .................................................		58
3.4	Legacy USB Support .........................................................................		58
3.5	BIOS Updates ..................................................................................		59
	3.5.1	Language Support .................................................................	59
	3.5.2	Custom Splash Screen ...........................................................	60
3.6	BIOS Recovery.................................................................................		60
3.7	Boot Options....................................................................................		61
	3.7.1	Network Boot........................................................................	61
	3.7.2 Booting Without Attached Devices ...........................................		61
	3.7.3 Changing the Default Boot Device During POST.........................		61
	3.7.4	Power Button Menu ...............................................................	62
3.8	Hard Disk Drive Password Security Feature..........................................		63
3.9	BIOS Security Features .....................................................................		64

4 Error Messages and Blink Codes

4.1	Front-panel Power LED Blink Codes.....................................................	65
4.2	BIOS Error Messages ........................................................................	65

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Contents

5 Regulatory Compliance and Battery Disposal Information

5.1	Regulatory Compliance......................................................................		67
	5.1.1	Safety Standards...................................................................	67
	5.1.2 European Union Declaration of Conformity Statement ................		68
	5.1.3	EMC Regulations ...................................................................	69
	5.1.4 e-Standby and ErP Compliance ...............................................		72
	5.1.5 Regulatory Compliance Marks (Board Level) .............................		73
5.2	Battery Disposal Information..............................................................		74

Figures

1.	Major Board Components (Top)..........................................................	13
2.	Major Board Components (Bottom).....................................................	15
3.	Block Diagram..................................................................................	17
4.	Memory Channel and SO-DIMM Configuration ......................................	20
5.	4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out .........................................	26
6.	LAN Connector LED Locations.............................................................	28
7.	Thermal Solution and Fan Header .......................................................	30
8.	Location of the Standby Power LED.....................................................	35
9.	Front Panel Connectors .....................................................................	38
10.	Back Panel Connectors ......................................................................	38
11.	Header (Top) ...................................................................................	39
12.	Connectors and Headers (Bottom) ......................................................	40
13.	Connection Diagram for Front Panel Header (2.0 mm Pitch) ...................	46
14.	Connection Diagram for Internal USB 2.0 Dual-Port
	Header (2.0 mm Pitch)......................................................................	48
15.	Location of the CIR Sensor ................................................................	48
16.	Location of the BIOS Security Jumper .................................................	49
17.	Board Dimensions.............................................................................	51
18.	Board Height Dimensions...................................................................	52
19.	Localized High Temperature Zones .....................................................	54

Tables

1.	Feature Summary.............................................................................	11
2.	Components Shown in Figure 1 ..........................................................	14
3.	Components Shown in Figure 2 ..........................................................	16
4.	Supported Memory Configurations ......................................................	19
5.	DisplayPort Multi-Streaming Resolutions..............................................	23
6.	Multiple Display Configuration Maximum Resolutions .............................	23

7.Audio Formats Supported by the Mini HDMI and

	Mini DisplayPort Interfaces.................................................................	24
8.	LAN Connector LED States.................................................................	28
9.	Effects of Pressing the Power Switch ...................................................	31
10.	Power States and Targeted System Power ...........................................	32
11.	Wake-up Devices and Events .............................................................	33

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12.	Header Shown in Figure 10 ................................................................	39
13.	Connectors and Headers Shown in Figure 10........................................	41
14.	PCI Express Full-/Half-Mini Card Connector..........................................	42
15.	Dual-Port Front Panel USB 2.0 Header.................................................	43
16.	SATA Connector ...............................................................................	43
17.	SATA Power Connector......................................................................	44
18.	System ID / Custom Solutions Header (2.0 mm Pitch) ..........................	44
19.	12-24 V Internal Power Supply Connector............................................	45
20.	Front Panel Header (2.0 mm Pitch) .....................................................	45
21.	States for a One-Color Power LED.......................................................	46
22.	BIOS Security Jumper Settings...........................................................	50
23.	Fan Header Current Capability............................................................	53
24.	Thermal Considerations for Components..............................................	55
25.	Tcontrol Values for Components .........................................................	55
26.	Environmental Specifications..............................................................	56
27.	Acceptable Drives/Media Types for BIOS Recovery................................	60
28.	Boot Device Menu Options .................................................................	61
29.	Master Key and User Hard Drive Password Functions ............................	63
30.	Supervisor and User Password Functions .............................................	64
31.	Front-panel Power LED Blink Codes.....................................................	65
32.	BIOS Error Messages ........................................................................	65
33.	Safety Standards..............................................................................	67
34.	EMC Regulations...............................................................................	69
35.	Regulatory Compliance Marks ............................................................	73

x

1 Product Description

1.1Overview

1.1.1Feature Summary

Table 1 summarizes the major features of Intel NUC Board D54250WYB and Intel NUC Board D34010WYB.

Table 1. Feature Summary

Form Factor	4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor	•	Intel NUC Board D54250WYB has a soldered-down Intel® Core™ i5-4250U
		processor with up to 15 W TDP
		― Integrated graphics
		― Integrated memory controller
		― Integrated PCH
	• Intel NUC Board D34010WYB has a soldered-down Intel® Core™ i3-4010U
		processor with up to 15 W TDP
		― Integrated graphics
		― Integrated memory controller
		― Integrated PCH
Memory	•	Two 204-pin DDR3L SDRAM Small Outline Dual Inline Memory Module
		(SO-DIMM) sockets
	• Support for DDR3L 1600 MHz and DDR3L 1333 MHz SO-DIMMs
	• Support for 2 Gb and 4 Gb memory technology
	• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
		memory technology
	• Support for non-ECC memory
	• Support for 1.35 V low voltage JEDEC memory only
Graphics	•	Integrated graphics support for processors with Intel® Graphics Technology:
		― One Mini High Definition Multimedia Interface* (Mini HDMI*) back panel
		connector
		― One Mini DisplayPort* back panel connector
Audio	•	Intel® High Definition (Intel® HD) Audio via the Mini HDMI v1.4a and Mini
		DisplayPort 1.2 interfaces through the processor
	• Intel HD Audio via a stereo microphone/headphone jack on the front panel
	• Front panel audio jack (3.5 mm jack)
Peripheral	•	USB 3.0 ports:
Interfaces		― Two ports are implemented with external front panel connectors (blue)
		― Two ports are implemented with external back panel connectors (blue)
	•	USB 2.0 ports:
		― Two ports via one dual-port internal 2.0 mm pitch header (black)
		― One port is reserved for the PCI Express* Half-Mini Card
		― One port is reserved for the PCI Express Full-Mini Card
	•	SATA ports:
		― One internal mSATA port (PCI Express Full-Mini Card) for SSD support
		― One SATA 6.0 Gb/s port (blue)
		continued

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Technical Product Specification

Table 1. Feature Summary (continued)

Expansion	• One PCI Express Half-Mini Card connector
Capabilities	• One PCI Express Full-Mini Card connector
BIOS	• Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
	• Support for Advanced Configuration and Power Interface (ACPI), Plug and
	Play, and System Management BIOS (SMBIOS)
Instantly Available	• Support for PCI Express*
PC Technology	• Suspend to RAM support
	• Wake on PCI Express, LAN, front panel, Consumer Infrared (CIR), and
	USB ports
LAN Support	Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I218V Gigabit
	Ethernet Controller
Hardware Monitor	Hardware monitoring subsystem, based on a Nuvoton NCT5577D embedded
Subsystem	controller, including:
	• Voltage sense to detect out of range power supply voltages
	• Thermal sense to detect out of range thermal values
	• One processor fan header
	• Fan sense input used to monitor fan activity
	• Fan speed control

12

Product Description

1.1.2Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Board D54250WYB and Intel NUC Board D34010WYB.

Figure 1. Major Board Components (Top)

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Technical Product Specification

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item from Figure 1	Description
A	Battery
B	Custom Solutions header (2.0 mm pitch)
C	Processor fan header
D	Onboard power button
E	Power LED
F	Standby power LED
G	Hard Disk Drive LED
H	Thermal solution

14

Product Description

1.1.3Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board D54250WYB and Intel NUC Board D34010WYB.

Figure 2. Major Board Components (Bottom)

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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB

Technical Product Specification

Table 3. Components Shown in Figure 2

Item from
Figure 2	Description
A	Back panel connectors
B	PCI Express Full-Mini Card connector
C	PCI Express Half-Mini Card connector
D	SATA 6.0 Gb/s connector
E	Front panel dual-port USB 2.0 header (2.0 mm pitch)
F	Front panel USB 3.0 connector
G	Front panel USB 3.0 connector
H	Front panel header (2.0 mm pitch)
I	SATA power connector
J	Front panel stereo microphone/headphone jack
K	BIOS setup configuration jumper
L	Consumer Infrared (CIR) sensor
M	DDR3L SO-DIMM 2 socket
N	DDR3L SO-DIMM 1 socket
O	Internal DC power connector

16

Product Description

1.1.4Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Figure 3. Block Diagram

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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB Technical Product Specification

1.2	Online Support
	To find information about…	Visit this World Wide Web site:
	Intel NUC Board D54250WYB and Intel	http://www.intel.com/NUC
	NUC Board D34010WYB
	Intel NUC Board Support	http://www.intel.com/NUCSupport
	Available configurations for Intel NUC	http://ark.intel.com
	Board D54250WYB and Intel NUC
	Board D34010WYB
	BIOS and driver updates	http://downloadcenter.intel.com
	Tested memory	http://www.intel.com/NUCSupport
	Integration information	http://www.intel.com/NUCSupport
	Processor datasheet	http://ark.intel.com

1.3Processor

•Intel NUC Board D54250WYB has a soldered-down Intel® Core™ i5-4250U processor with up to 15 W TDP

Integrated graphics

Integrated memory controller

Integrated PCH

•Intel NUC Board D34010WYB has a soldered-down Intel® Core™ i3-4010U processor with up to 15 W TDP

Integrated graphics

Integrated memory controller

Integrated PCH

NOTE

There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 52 for information on power supply requirements.

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Product Description

1.4System Memory

The board has two 204-pin SO-DIMM sockets and support the following memory features:

•1.35 V DDR3L SDRAM SO-DIMMs with gold plated contacts

•Two independent memory channels with interleaved mode support

•Unbuffered, single-sided or double-sided SO-DIMMs

•16 GB maximum total system memory (with 4 Gb memory technology). Refer to Section 2.1.1 on page 37 for information on the total amount of addressable memory.

•Minimum recommended total system memory: 1024 MB

•Non-ECC SO-DIMMs

•Serial Presence Detect

•DDR3L 1600 MHz and DDR3L 1333 MHz SDRAM SO-DIMMs

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.

Table 4 lists the supported SO-DIMM configurations.

Table 4. Supported Memory Configurations

DIMM	Configuration (Note)	SDRAM	SDRAM Organization		Number of SDRAM
Capacity		Density	Front-side/Back-side		Devices
4096 MB	DS	2 Gbit	256	M x8/256 M x8	16
4096 MB	SS	4 Gbit	512	M x8/empty	8
8192 MB	DS	4 Gbit	512	M x8/512 M x8	16

Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to single-sided memory modules (containing one row of SDRAM).

For information about…	Refer to:
Tested Memory	http://www.intel.com/NUCSupport

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Technical Product Specification

1.4.1Memory Configurations

The processor supports the following types of memory organization:

•Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both SO-DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.

•Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single SO-DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.

For information about…	Refer to:
Memory Configuration Examples	http://www.intel.com/NUCSupport

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

20

Product Description

1.5Processor Graphics Subsystem

The board supports graphics through Intel HD Graphics.

1.5.1Integrated Graphics

The board supports integrated graphics via the processor.

1.5.1.1Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:

•3D Features

DirectX* 11 support

OpenGL* 4.0 support

•Video

•Next Generation Intel® Clear Video Technology HD support is a collection of video playback and enhancement features that improve the end user’s viewing experience

•Encode/transcode HD content

•Playback of high definition content including Blu-ray* disc

•Superior image quality with sharper, more colorful images

•Playback of Blu-ray disc S3D content using Mini HDMI (v1.4a spec compliant with 3D)

•DirectX* Video Acceleration (DXVA) support for accelerating video processing

•Full AVC/VC1/MPEG2 HW Decode

•Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)

NOTE

Intel Quick Sync Video is enabled by an appropriate software application.

1.5.1.2Video Memory Allocation

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.

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1.5.1.3Mini High Definition Multimedia Interface* (Mini HDMI*)

The Mini High-Definition Multimedia Interface (Mini HDMI) is provided for transmitting uncompressed digital audio and video signals to television sets, projectors and other video displays. It can carry high quality multi-channel audio data and all standard and high-definition consumer electronics video formats. The Mini HDMI display interface connecting the processor and display devices utilizes transition minimized differential signaling (TMDS) to carry audio visual information through the same Mini HDMI cable. The processor HDMI interface is designed according to the High-Definition Multimedia Interface Specification with 3D, Deep Color, and x.v.Color. The maximum supported resolution is 1920 x 1200 @ 60 Hz, 24bpp. The Mini HDMI port is compliant with the HDMI 1.4a specification.

1.5.1.4Mini DisplayPort*

DisplayPort is a digital communication interface that utilizes differential signaling to achieve a high bandwidth bus interface designed to support connections between PCs and monitors, projectors, and TV displays. DisplayPort is suitable for display connections between consumer electronics devices such as high definition optical disc players, set top boxes, and TV displays. The maximum supported resolution is 3840 x 2160 @ 30 Hz, 24bpp. The Mini DisplayPort interface supports the 1.2 specification.

The DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple independent video streams (daisy-chain connection with multiple monitors) over a single DisplayPort. This will require the use of displays that support DisplayPort 1.2 and allow for this feature.

For information about	Refer to
DisplayPort technology	http://www.displayport.org

22

Product Description

1.5.1.4.1DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining

Table 5 lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream Transport.

Table 5. DisplayPort Multi-Streaming Resolutions

DisplayPort Usage
Models	Monitor 1	Monitor 2	Monitor 3
3 Monitors	1920 x 1200 @ 60 Hz	1920 x 1080 @ 60 Hz	1920 x 1080 @ 60 Hz
2 Monitors	2560 x 1600 @ 60 Hz	2560 x 1600 @ 60 Hz
3 Monitors	1920 x 1080 @ 60 Hz	1920 x 1080 @ 60 Hz	1920 x 1080 @ 60 Hz
(with DisplayPort 1.2
hub)

1.5.1.5Multiple DisplayPort and HDMI Configurations

Multiple DisplayPort and HDMI configurations feature the following:

•Two independent displays

•Single HDMI 1.4a with 1080P support

•Single DisplayPort 1.2 with 4K support

•Collage Display

Table 6. Multiple Display Configuration Maximum Resolutions

Single Display	Dual Display	Single Display
HDMI	DisplayPort and HDMI	DisplayPort
1920 x 1200 @ 60 Hz	3840 x 2160 @ 30 Hz (DisplayPort)	3840 x 2160 @ 30 Hz
	1920 x 1200 @ 60 Hz (HDMI)

Note: Higher resolutions may be achievable but have not been tested on Intel NUC.

For information about	Refer to
Multiple display maximum	https://www-
resolutions	ssl.intel.com/content/www/us/en/processors/core/CoreTechnicalResou
	rces.html (Generic link)
	https://www-ssl.intel.com/content/www/us/en/processors/core/4th-
	gen-core-family-desktop-vol-1-datasheet (Specific Link)

1.5.1.6High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized copy or interception between a source (computer, digital set top boxes, etc.) and the sink (panels, monitor, and TVs). The PCH supports HDCP 1.4a for content protection over wired displays (Mini HDMI and Mini DisplayPort).

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Intel NUC Board D54250WYB and Intel NUC Board D34010WYB

Technical Product Specification

1.5.1.7Integrated Audio Provided by the Mini HDMI and Mini DisplayPort Interfaces

The Mini HDMI and Mini DisplayPort interfaces from the PCH support audio. The processor supports two High Definition audio streams on two digital ports simultaneously.

Table 7 shows the specific audio technologies supported by the PCH.

Table 7. Audio Formats Supported by the Mini HDMI and

Mini DisplayPort Interfaces

Audio Formats	Mini HDMI	Mini DisplayPort
AC-3 – Dolby* Digital	Yes	Yes
Dolby Digital Plus	Yes	Yes
DTS-HD*	Yes	Yes
LPCM , 192 kHz/24 bit, 8 channel	Yes	Yes
Dolby True HD, DTS-HD Master Audio* (Lossless Blu-ray Disc	Yes	Yes
Audio Format)

1.6USB

The board supports eight USB ports. All eight ports are high-speed, full-speed, and low-speed capable. The port arrangement is as follows:

•USB 3.0 ports:

Two front panel USB 3.0 ports are implemented through an external connector (blue)

Two ports are implemented with vertical back panel connectors (blue)

•USB 2.0 ports:

Two ports via one dual-port internal 2.0 mm pitch header (black)

One port is reserved for the PCI Express Half-Mini Card

One port is reserved for the PCI Express Full-Mini Card

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.

For information about	Refer to
The location of the USB connectors on the back panel	Figure 9, page 38
The location of the front panel USB headers	Figure 2, page 15

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