Texas Instruments 74AC11004N, 74AC11004DWR, 74AC11004DW, 74AC11004DBR, 74AC11004DBLE Datasheet

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74AC11004

 

 

 

 

 

 

 

HEX INVERTER

 

 

SCAS033B ± JANUARY 1988 ± REVISED APRIL 1996

 

 

 

 

 

 

 

 

D

Flow-Through Architecture Optimizes

DB, DW, OR N PACKAGE

 

PCB Layout

 

(TOP VIEW)

 

 

D Center-Pin VCC and GND Configuration

1Y

 

 

 

 

1A

 

1

20

 

 

 

 

Minimizes High-Speed Switching Noise

 

 

 

2Y

 

2

19

 

2A

D

EPIC (Enhanced-Performance Implanted

 

 

3Y

 

3

18

 

3A

 

 

 

CMOS) 1- m Process

 

 

 

GND

 

4

17

 

NC

 

 

 

D 500-mA Typical Latch-Up Immunity at

 

 

GND

 

5

16

 

VCC

 

 

 

125°C

GND

 

6

15

 

VCC

 

 

 

D Package Options Include Plastic

GND

 

7

14

 

NC

 

 

 

Small-Outline (DW) and Shrink

4Y

 

8

13

 

4A

 

 

 

 

Small-Outline (DB) Packages, and Standard

5Y

 

9

12

 

5A

 

 

 

 

Plastic 300-mil DIPs (N)

6Y

 

10

11

 

6A

 

 

 

 

 

 

 

 

 

 

 

 

description

NC ± No internal connection

 

This device contains six independent inverters. It performs the Boolean function Y = A.

The 74AC11004 is characterized for operation from ±40°C to 85°C.

 

 

 

FUNCTION TABLE

 

 

 

 

 

(each inverter)

 

 

 

 

 

 

 

 

 

 

 

 

 

INPUT

 

OUTPUT

 

 

 

 

 

A

 

Y

 

 

 

 

 

 

 

 

 

 

 

 

 

 

H

 

L

 

 

 

 

 

L

 

H

 

 

 

 

 

 

 

 

 

 

 

logic symbol²

 

 

 

 

 

20

 

 

 

 

 

1

 

1A

 

 

1

 

 

1Y

 

 

 

 

19

 

 

 

 

 

2

 

 

 

 

 

 

 

2A

 

 

 

 

 

 

2Y

 

 

 

 

 

 

 

18

 

 

 

 

 

3

 

 

 

 

 

 

 

3A

 

 

 

 

 

3Y

 

 

 

8

13

 

 

 

 

 

4Y

 

 

 

 

 

4A

 

 

 

 

 

 

 

 

 

 

 

12

 

 

 

 

 

9

 

 

 

 

 

 

 

5A

 

 

 

 

 

5Y

 

 

 

 

 

11

 

 

 

 

 

10

 

 

 

 

 

 

 

6A

 

 

 

 

 

 

6Y

 

 

 

 

 

² This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

EPIC is a trademark of Texas Instruments Incorporated.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1996, Texas Instruments Incorporated

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

1

Texas Instruments 74AC11004N, 74AC11004DWR, 74AC11004DW, 74AC11004DBR, 74AC11004DBLE Datasheet

74AC11004 HEX INVERTER

SCAS033B ± JANUARY 1988 ± REVISED APRIL 1996

logic diagram (positive logic)

1A

20

1

1Y

 

 

2A

19

2

2Y

 

 

3A

18

3

3Y

 

 

4A

13

8

4Y

 

 

5A

12

9

5Y

 

 

6A

11

10

6Y

 

 

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)²

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . ±0.5 V to 7

V

Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±0.5 V to VCC + 0.5

V

Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±0.5 V to VCC + 0.5

V

Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . ±20 mA

Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . ±50 mA

Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . ±50 mA

Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . ±100 mA

Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DW package . . . . .

. . . . . . . . . . . . . 1.6 W

DB package . . . . . .

. . . . . . . . . . . . . 0.6 W

N package . . . . . . .

. . . . . . . . . . . . . 1.3 W

Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . ±65°C to 150°C

² Stresses beyond those listed under ªabsolute maximum ratingsº may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2.The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils, except for the N package, which has a trace length of zero.

2

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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