NSC LM329DZ, LM329CZ, LM329CH, LM329BZ, LM329AH Datasheet

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NSC LM329DZ, LM329CZ, LM329CH, LM329BZ, LM329AH Datasheet

March 2000

LM129/LM329

Precision Reference

General Description

The LM129 and LM329 family are precision multi-current temperature-compensated 6.9V zener references with dynamic impedances a factor of 10 to 100 less than discrete diodes. Constructed in a single silicon chip, the LM129 uses active circuitry to buffer the internal zener allowing the device to operate over a 0.5 mA to 15 mA range with virtually no change in performance. The LM129 and LM329 are available with selected temperature coefficients of 0.001, 0.002, 0.005 and 0.01%/ÊC. These references also have excellent long term stability and low noise.

A new subsurface breakdown zener used in the LM129 gives lower noise and better long-term stability than conventional IC zeners. Further the zener and temperature compensating transistor are made by a planar process so they are immune to problems that plague ordinary zeners. For example, there is virtually no voltage shift in zener voltage due to temperature cycling and the device is insensitive to stress on the leads.

The LM129 can be used in place of conventional zeners with improved performance. The low dynamic impedance simplifies biasing and the wide operating current allows the replacement of many zener types.

The LM129 is packaged in a 2-lead TO-46 package and is rated for operation over a −55ÊC to +125ÊC temperature range. The LM329 for operation over 0ÊC to 70ÊC is available in both a hermetic TO-46 package and a TO-92 epoxy package.

Features

n0.6 mA to 15 mA operating current

n0.6Ω dynamic impedance at any current

nAvailable with temperature coefficients of 0.001%/ÊC

n7µV wideband noise

n5% initial tolerance

n0.002% long term stability

nLow cost

nSubsurface zener

Connection Diagrams

Metal Can Package (T0±46)

Plastic Package (TO-92)

DS005714-6

Pin 2 is electrically connected to case

Bottom View

Order Number LM129AH, LM129AH/883, LM129BH,

LM129BH/883, LM129CH, LM329AH, LM329BH,

LM329CH or LM329DH

See NS Package H02A

DS005714-4

Bottom View

Order Number LM329BZ,

LM329CZ or LM329DZ

See NS Package Z03A

Reference Precision LM129/LM329

© 2000 National Semiconductor Corporation

DS005714

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LM129/LM329

Typical Applications

Simple Reference

DS005714-1

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Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.

(Note 3)

Reverse Breakdown Current

30 mA

Forward Current

2 mA

Operating Temperature Range

 

LM129

−55ÊC to +125ÊC

LM329

0ÊC to +70ÊC

Storage Temperature Range

−55ÊC to +150ÊC

Soldering Information

 

TO-92 package: 10 sec.

260ÊC

TO-46 package: 10 sec.

300ÊC

Electrical Characteristics (Note 2)

 

 

 

LM129A, B, C

LM329A, B, C, D

 

Parameter

Conditions

 

 

 

 

 

 

 

Units

 

 

 

 

 

 

 

 

 

 

 

 

Min

 

Typ

Max

Min

Typ

Max

 

 

 

 

 

 

 

 

 

 

 

Reverse Breakdown Voltage

TA = 25ÊC,

 

 

 

 

 

 

 

 

 

0.6 mA IR 15 mA

6.7

 

6.9

7.2

6.6

6.9

7.25

V

Reverse Breakdown Change

TA = 25ÊC,

 

 

 

 

 

 

 

 

with Current (Note 4)

0.6 mA IR 15 mA

 

 

9

14

 

9

20

mV

Reverse Dynamic Impedance

TA = 25ÊC, IR = 1 mA

 

 

0.6

1

 

0.8

2

Ω

(Note 4)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RMS Noise

TA = 25ÊC,

 

 

 

 

 

 

 

 

 

10 Hz F 10 kHz

 

 

7

20

 

7

100

µV

 

 

 

 

 

 

 

 

 

 

Long Term Stability

TA = 45ÊC ± 0.1ÊC,

 

 

 

 

 

 

 

 

(1000 hours)

IR = 1 mA ± 0.3%

 

 

20

 

 

20

 

ppm

Temperature Coefficient

IR = 1 mA

 

 

 

 

 

 

 

 

LM129A, LM329A

 

 

 

6

10

 

6

10

ppm/ÊC

LM129B, LM329B

 

 

 

15

20

 

15

20

ppm/ÊC

LM129C, LM329C

 

 

 

30

50

 

30

50

ppm/ÊC

LM329D

 

 

 

 

 

 

50

100

ppm/ÊC

 

 

 

 

 

 

 

 

 

 

Change In Reverse Breakdown

1 mA IR 15 mA

 

 

1

 

 

1

 

ppm/ÊC

Temperature Coefficient

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Reverse Breakdown Change

1 mA IR 15 mA

 

 

12

 

 

12

 

mV

with Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Reverse Dynamic Impedance

1 mA IR 15 mA

 

 

0.8

 

 

1

 

Ω

Note 1: ªAbsolute Maximum Ratingsº indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the devicesi functional, but do not guarantee specific performance limits.

Note 2: These specifications apply for −55ÊC TA +125ÊC for the LM129 and 0ÊC TA +70ÊC for the LM329 unless otherwise specified. The maximum junction temperature for an LM129 is 150ÊC and LM329 is 100ÊC. For operating at elevated temperature, devices in TO-46 package must be derated based on a thermal resistance of 440ÊC/W junction to ambient or 80ÊC/W junction to case. For the TO-92 package, the derating is based on 180ÊC/W junction to ambient with 0.4 " leads from a PC board and 160ÊC/W junction to ambient with 0.125" lead length to a PC board.

Note 3: Refer to RETS129H for LM129 family military specifications.

Note 4: These changes are tested on a pulsed basis with a low duty-cycle. For changes versus temperature, compute in terms of tempco.

LM129/LM329

3

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