MITSUBISHI CM1600HC-34H User Guide

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MITSUBISHI CM1600HC-34H User Guide

MITSUBISHI HVIGBT MODULES

CM1600HC-34H

HIGH POWER SWITCHING USE

3rd-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules

INSULATED TYPE

CM1600HC-34H

● IC ................................................................

1600A

● VCES .......................................................

1700V

● Insulated Type

● 1-element in a Pack

● AISiC Baseplate

● Soft Reverse Recovery Diode

APPLICATION

Traction drives, High Reliability Converters / Inverters, DC choppers

OUTLINE DRAWING & CIRCUIT DIAGRAM

 

 

 

 

 

 

 

 

Dimensions in mm

 

 

130

 

 

 

 

 

 

 

 

 

 

 

 

114

 

 

 

 

 

 

 

 

 

 

 

57± 0.25

 

57± 0.25

 

4 - M8 NUTS

 

 

 

 

 

 

 

 

 

 

 

 

 

C

C

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

C

C

 

 

 

124± 0.25

 

 

 

G

 

 

 

 

 

 

 

 

140

 

 

 

 

 

 

 

 

30

 

 

E

 

CM

E

 

E

 

 

 

 

 

 

 

 

 

 

 

 

 

E

E

 

 

E

G

 

 

 

 

 

 

 

CIRCUIT DIAGRAM

 

 

 

C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

16.5

 

6 - φ

 

 

 

 

 

 

 

 

3 - M4 NUTS

2.5

 

7 MOUNTING HOLES

 

 

 

 

18.5

 

 

 

 

 

 

 

 

5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

61.5

 

screwing depth

 

 

35

 

 

 

 

min. 11.7

 

 

 

11

 

screwing depth

18

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

14.5

 

 

min. 7.7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

+1

0

 

 

+1

0

LABEL

31.5

 

 

 

 

5

38

 

 

28

 

 

 

 

 

 

 

HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules

Jul. 2005

MITSUBISHI HVIGBT MODULES

CM1600HC-34H

3rd-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules

HIGH POWER SWITCHING USE

 

 

 

INSULATED TYPE

 

 

 

 

 

 

 

 

 

 

 

MAXIMUM RATINGS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Symbol

Item

Conditions

 

 

 

Ratings

 

Unit

VCES

Collector-emitter voltage

VGE = 0V, Tj = 25° C

 

 

1700

 

 

V

VGES

Gate-emitter voltage

VCE = 0V, Tj = 25° C

 

 

± 20

 

 

V

IC

 

Collector current

TC = 80° C

 

 

1600

 

 

A

ICM

 

Pulse

(Note 1)

 

3200

 

 

A

 

 

 

 

 

 

IE

(Note 2)

Emitter current

 

 

 

1600

 

 

A

IEM (Note 2)

Pulse

(Note 1)

 

3200

 

 

A

 

 

 

 

 

PC (Note 3)

Maximum power dissipation

TC = 25° C, IGBT part

 

 

12500

 

 

W

Tj

 

Junction temperature

 

 

 

–40 ~ +150

 

° C

Top

 

Operating temperature

 

 

 

–40 ~ +125

 

° C

Tstg

Storage temperature

 

 

 

–40 ~ +125

 

° C

Viso

Isolation voltage

RMS, sinusoidal, f = 60Hz, t = 1min.

 

 

4000

 

 

V

tpsc

 

Maximum short circuit pulse

VCC = 1150V, VCES ≤ 1700V, VGE = 15V

 

 

10

 

 

µ s

 

width

Tj = 125° C

 

 

 

 

 

 

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Symbol

Item

Conditions

 

 

 

Limits

 

Unit

 

Min

 

Typ

 

Max

 

 

 

 

 

 

 

 

 

ICES

Collector cut-off current

VCE = VCES, VGE = 0V, Tj = 25° C

 

 

 

24

mA

VGE(th)

Gate-emitter

IC = 160mA, VCE = 10V, Tj = 25° C

 

4.5

 

5.5

 

6.5

V

threshold voltage

 

 

 

 

 

 

 

 

 

 

 

 

 

IGES

Gate leakage current

VGE = VGES, VCE = 0V, Tj = 25° C

 

 

 

0.5

µ A

VCE(sat)

Collector-emitter

IC = 1600A, VGE = 15V, Tj = 25° C

(Note 4)

 

2.60

 

3.30

V

saturation voltage

IC = 1600A, VGE = 15V, Tj = 125° C

(Note 4)

 

3.10

 

 

 

 

 

 

Cies

Input capacitance

VCE = 10V, f = 100kHz

 

 

140

 

nF

Coes

Output capacitance

 

 

20.0

 

nF

VGE = 0V, Tj = 25° C

 

 

 

Cres

Reverse transfer capacitance

 

 

7.6

 

nF

 

 

 

 

Qg

 

Total gate charge

VCC = 850V, IC = 1600A, VGE = 15V, Tj = 25° C

 

 

13.2

 

µ C

VEC (Note 2)

Emitter-collector voltage

 

IE = 1600A, VGE = 0V, Tj = 25° C

(Note 4)

 

2.30

 

3.00

V

 

IE = 1600A, VGE = 0V, Tj = 125° C

(Note 4)

 

1.85

 

 

 

 

 

 

 

 

td(on)

Turn-on delay time

VCC = 850V, IC = 1600A, VGE = ± 15V

 

 

 

1.60

µ s

tr

 

Turn-on rise time

RG(on) = 1.6Ω , Tj = 125° C, Ls = 100nH

 

 

 

1.30

µ s

Eon

 

Turn-on switching energy

Inductive load

 

 

540

 

mJ/pulse

td(off)

Turn-off delay time

VCC = 850V, IC = 1600A, VGE = ± 15V

 

 

 

2.70

µ s

tf

 

Turn-off fall time

RG(off) = 1.6Ω , Tj = 125° C, Ls = 100nH

 

 

 

0.80

µ s

Eoff

 

Turn-off switching energy

Inductive load

 

 

580

 

mJ/pulse

trr

(Note 2)

Reverse recovery time

VCC = 850V, IC = 1600A, VGE = ± 15V

 

 

 

2.70

µ s

Qrr

(Note 2)

Reverse recovery charge

RG(on) = 1.6Ω , Tj = 125° C, Ls = 100nH

 

 

420

 

µ C

Erec(Note 2)

Reverse recovery energy

Inductive load

 

 

220

 

mJ/pulse

Note 1. Pulse width and repetition rate should be such that junction temperature (Tj) does not exceed Topmax rating (125° C).

2.The symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).

3.Junction temperature (Tj) should not exceed Tjmax rating (150° C).

4.Pulse width and repetition rate should be such as to cause negligible temperature rise.

HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules

Jul. 2005

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