Mitsubishi Electric Corporation Semiconductor Group CM600HU-24H Datasheet

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Mitsubishi Electric Corporation Semiconductor Group CM600HU-24H Datasheet

MITSUBISHI IGBT MODULES

CM600HU-24H

HIGH POWER SWITCHING USE INSULATED TYPE

2 - M4 NUTS

 

 

A

 

2 - M8 NUTS

 

 

 

B

 

 

 

E

H

K

L

N(4 - Mounting

 

 

 

 

 

Holes)

 

J

 

 

F

 

 

 

 

 

 

C

G

 

 

 

 

 

G

 

 

 

D

E

 

E

C

 

 

 

CM

 

 

 

 

 

 

 

 

 

 

TC Measured Point

 

M

P

E

C

E

G

Outline Drawing and Circuit Diagram

Dimensions

Inches

Millimeters

A

4.33

110.0

 

 

 

B

3.66±0.01

93.0±0.25

 

 

 

C

3.15

80.0

 

 

 

D

2.44±0.01

62.0±0.25

 

 

 

E

0.53

13.5

 

 

 

F

0.37

9.5

 

 

 

G

0.57

14.5

 

 

 

Dimensions

Inches

Millimeters

H

 

0.96

24.5

 

 

 

 

J

 

0.22

5.5

 

 

 

 

K

 

1.14

29.0

 

 

 

 

L

 

0.85

21.5

 

 

 

M

1.34 +0.04/-0.02

34 +1.0/-0.5

 

 

 

 

N

 

0.26 Dia.

6.5 Dia.

 

 

 

P

 

1.02 +0.04/-0.02 26 +1.0/-0.5

 

 

 

 

Description:

Mitsubishi IGBT Modules are designed for use in switching applications. Each module consists of one IGBT in a single configuration with a reverse-connected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.

Features:

uLow Drive Power

uLow VCE(sat)

uDiscrete Super-Fast Recovery Free-Wheel Diode

uHigh Frequency Operation

uIsolated Baseplate for Easy Heat Sinking

Applications:

uAC Motor Control

uMotion/Servo Control

uUPS

uWelding Power Supplies

Ordering Information:

Example: Select the complete module number you desire from the table - i.e. CM600HU-24H is a

1200V (VCES), 600 Ampere Single IGBT Module.

 

Current Rating

VCES

Type

Amperes

Volts (x 50)

CM

600

24

 

 

 

Sep.1998

MITSUBISHI IGBT MODULES

CM600HU-24H

HIGH POWER SWITCHING USE

INSULATED TYPE

Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified

Ratings

 

Symbol

CM600HU-24H

 

Units

Junction Temperature

 

Tj

-40 to 150

 

°C

Storage Temperature

 

Tstg

-40 to 125

 

°C

Collector-Emitter Voltage (G-E SHORT)

 

VCES

1200

 

 

Volts

Gate-Emitter Voltage (C-E SHORT)

 

VGES

±20

 

 

Volts

Collector Current (Tc = 25°C)

 

IC

600

 

 

Amperes

Peak Collector Current (Tj 150°C)

 

ICM

1200*

 

Amperes

Emitter Current** (Tc = 25°C)

 

IE

600

 

 

Amperes

Peak Emitter Current**

 

IEM

1200*

 

Amperes

Maximum Collector Dissipation (Tc = 25°C)

 

Pc

3100

 

 

Watts

Mounting Torque, M8 Main Terminal

 

8.8~10.8

 

N · m

 

 

 

 

 

 

Mounting Torque, M6 Mounting

 

3.5~4.5

 

N · m

 

 

 

 

 

 

Mounting Torque, M4 Terminal

 

1.3~1.7

 

N · m

 

 

 

 

 

 

 

Weight

 

600

 

 

Grams

 

 

 

 

 

 

Isolation Voltage (Main Terminal to Baseplate, AC 1 min.)

Viso

2500

 

 

Vrms

* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tj(max) rating.

 

 

 

**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).

 

 

 

 

Static Electrical Characteristics, Tj = 25 °C unless otherwise specified

 

 

 

 

Characteristics

Symbol

Test Conditions

Min.

Typ.

Max.

Units

 

 

 

 

 

 

 

Collector-Cutoff Current

ICES

VCE = VCES, VGE = 0V

2

mA

Gate Leakage Voltage

IGES

VGE = VGES, VCE = 0V

0.5

μA

Gate-Emitter Threshold Voltage

VGE(th)

IC = 60mA, VCE = 10V

4.5

6

7.5

Volts

Collector-Emitter Saturation Voltage

VCE(sat)

IC = 600A, VGE = 15V, Tj = 25°C

2.9

3.7

Volts

 

 

IC = 600A, VGE = 15V, Tj = 125°C

2.85

Volts

Total Gate Charge

QG

VCC = 600V, IC = 600A, VGE = 15V

2250

nC

Emitter-Collector Voltage*

VEC

IE = 600A, VGE = 0V

3.2

Volts

* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tj(max) rating.

Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified

Characteristics

 

Symbol

Test Conditions

Min.

Typ.

Max.

Units

Input Capacitance

 

Cies

 

 

 

 

90

nF

 

 

 

 

 

Output Capacitance

 

Coes

VCE = 10V, VGE = 0V

31.5

nF

Reverse Transfer Capacitance

Cres

 

 

 

18

nF

Resistive

Turn-on Delay Time

td(on)

VCC = 600V, IC = 600A,

 

300

ns

Load

Rise Time

tr

VGE1 = VGE2 = 15V,

 

700

ns

Switch

Turn-off Delay Time

td(off)

RG = 2.1Ω, Resistive

 

450

ns

Times

Fall Time

tf

Load Switching Operation

350

ns

Diode Reverse Recovery Time

trr

IE = 600A, diE/dt = -1200A/μs

300

ns

Diode Reverse Recovery Charge

Qrr

IE = 600A, diE/dt = -1200A/μs

3.3

μC

Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified

 

 

 

 

 

 

 

 

 

 

 

 

 

Characteristics

 

Symbol

Test Conditions

Min.

Typ.

Max.

Units

 

 

 

 

 

 

 

 

 

Thermal Resistance, Junction to Case

Rth(j-c)Q

Per IGBT Module

0.04

°C/W

Thermal Resistance, Junction to Case

Rth(j-c)D

Per FWDi Module

0.06

°C/W

Contact Thermal Resistance

Rth(c-f)

Per Module, Thermal Grease Applied

0.015

°C/W

Sep.1998

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