CTLST CAT65LC40SI-TE13, CAT65LC40SA-TE13, CAT65LC40S-TE13, CAT65LC40PI-TE13, CAT65LC40PA-TE13 Datasheet

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CTLST CAT65LC40SI-TE13, CAT65LC40SA-TE13, CAT65LC40S-TE13, CAT65LC40PI-TE13, CAT65LC40PA-TE13 Datasheet

CAT64LC10/20/40

1K/2K/4K-Bit SPI Serial E2PROM

FEATURES

SPI Bus Compatible

Low Power CMOS Technology

2.5V to 6.0V Operation

Self-Timed Write Cycle with Auto-Clear

Hardware Reset Pin

Hardware and Software Write Protection

Commercial, Industrial and Automotive Temperature Ranges

Power-Up Inadvertant Write Protection

RDY/BSY Pin for End-of-Write Indication

1,000,000 Program/Erase Cycles

100 Year Data Retention

DESCRIPTION

The CAT64LC10/20/40 is a 1K/2K/4K-bit Serial E2PROM which is configured as 64/128/256 registers by 16 bits. Each register can be written (or read) serially by using the DI (or DO) pin. The CAT64LC10/20/40 is manufactured using Catalyst’s advanced CMOS E2PROM float-

ing gate technology. It is designed to endure 1,000,000 program/erase cycles and has a data retention of 100 years. The device is available in 8-pin DIP or SOIC packages.

PIN CONFIGURATION

 

DIP Package (P)

 

SOIC Package (J)

 

SOIC Package (S)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

8

 

 

 

 

 

 

 

 

 

1

8

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

8

 

 

 

 

 

 

CS

VCC

 

RDY/BUSY

 

 

 

 

 

 

 

 

 

 

RESET

CS

 

 

 

 

 

 

 

 

 

VCC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

7

 

 

 

 

 

2

7

 

 

 

 

 

 

 

 

 

 

2

7

 

 

 

 

 

SK

RDY/BUSY

 

VCC

 

 

 

 

 

 

 

 

 

 

GND

 

SK

 

 

 

 

 

 

 

 

 

RDY/BUSY

 

 

 

 

 

 

 

 

 

 

 

 

 

3

6

 

 

 

 

 

3

6

 

 

 

 

 

 

 

 

 

 

3

6

 

 

 

 

 

DI

RESET

 

CS

 

 

 

 

 

 

 

 

 

DO

 

DI

 

 

 

 

 

 

 

 

RESET

DO

4

5

GND

 

SK

 

 

 

 

4

5

 

 

 

 

 

DI

DO

 

 

 

 

4

5

 

 

 

 

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5064 FHD F01

PIN FUNCTIONS

 

 

 

BLOCK DIAGRAM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC

 

GND

 

 

 

 

 

 

 

 

 

 

 

Pin Name

 

 

Function

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chip Select

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SK

 

Clock Input

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MEMORY ARRAY

 

 

 

ADDRESS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DI

 

Serial Data Input

 

 

 

 

64/128/256 x 16

 

 

 

DECODER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DO

 

Serial Data Output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC

 

+2.5V to +6.0V Power Supply

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DATA

 

 

 

 

 

 

 

 

 

 

 

GND

 

Ground

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DI

 

 

 

 

REGISTER

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RESET

 

Reset

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BUFFER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RDY/BUSY

 

Ready/BUSY Status

RESET

 

 

 

MODE DECODE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LOGIC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SK

 

 

 

 

CLOCK

 

 

 

 

 

DO RDY/BUSY

 

 

 

 

 

 

 

 

 

 

 

 

 

GENERATOR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

64LC10/20/40 F02

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

© 1998 by Catalyst Semiconductor, Inc.

1

 

 

 

 

 

 

 

 

 

 

 

 

Doc. No. 25057-00 3/98 SPI-1

Characteristics subject to change without notice

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CAT64LC10/20/40

ABSOLUTE MAXIMUM RATINGS*

*COMMENT

Temperature Under Bias .................

–55°C to +125°C

Storage Temperature .......................

–65°C to +150°C

Voltage on any Pin with

 

 

Respect to Ground(1) ............

–2.0V to +VCC +2.0V

VCC with Respect to Ground ...............

 

–2.0V to +7.0V

Package Power Dissipation

 

 

Capability (Ta = 25°C) ...................................

 

1.0W

Lead Soldering Temperature (10 secs)

............ 300°C

Output Short Circuit Current(2) ........................

 

100 mA

RELIABILITY CHARACTERISTICS

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.

Symbol

Parameter

Min.

Max.

Units

Reference Test Method

 

 

 

 

 

 

NEND(3)

Endurance

1,000,000

 

Cycles/Byte

MIL-STD-883, Test Method 1033

TDR(3)

Data Retention

100

 

Years

MIL-STD-883, Test Method 1008

VZAP(3)

ESD Susceptibility

2000

 

Volts

MIL-STD-883, Test Method 3015

ILTH(3)(4)

Latch-Up

100

 

mA

JEDEC Standard 17

CAPACITANCE (TA = 25°C, f= 1.0 MHz, VCC =6.0V)

Symbol

Test

Max.

Units

Conditions

 

 

 

 

 

CI/O(3)

Input/Output Capacitance (DO, RDY/BSY)

8

pF

VI/O = 0V

CIN(3)

Input Capacitance (CS, SK, DI, RESET)

6

pF

VIN = 0V

Note:

(1)The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns.

(2)Output shorted for no more than one second. No more than one output shorted at a time.

(3)This parameter is tested initially and after a design or process change that affects the parameter.

(4)Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.

Doc. No. 25057-00 3/98 SPI-1

2

 

CAT64LC10/20/40

D.C. OPERATING CHARACTERISTICS

VCC = +2.5V to +6.0V, unless otherwise specified.

 

 

 

 

 

 

 

Limits

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Sym.

Parameter

 

 

 

Min.

Typ.

Max.

Units

 

Test Conditions

 

 

 

 

 

 

 

 

 

 

ICC

Operating Current

 

2.5V

 

 

 

0.4

mA

 

fSK = 250 kHz

 

EWEN, EWDS, READ

6.0V

 

 

 

1

mA

 

fSK = 1 MHz

ICCP

Program Current

 

2.5V

 

 

 

2

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6.0V

 

 

 

3

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ISB(1)

Standby Current

 

 

 

 

 

0

μA

 

VIN = GND or VCC

 

 

 

 

 

 

 

 

 

 

 

CS

= VCC

ILI

Input Leakage Current

 

 

 

 

 

2

μA

 

VIN = GND to VCC

ILO

Output Leakage Current

 

 

 

10

μA

 

VOUT = GND to VCC

VIL

Low Level Input Voltage, DI

 

–0.1

 

VCC x 0.3

V

 

 

 

VIH

High Level Input Voltage, DI

 

VCC x 0.7

 

VCC + 0.5

V

 

 

 

VIL

Low Level Input Voltage,

 

–0.1

 

VCC x 0.2

V

 

 

 

 

CS, SK, RESET

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VIH

High Level Input Voltage,

 

VCC x 0.8

 

VCC + 0.5

V

 

 

 

 

CS, SK, RESET

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOH(2)

High Level Output Voltage

 

2.5V

VCC – 0.3

 

 

V

 

IOH = –10μA

 

 

 

 

 

6.0V

VCC – 0.3

 

 

V

 

IOH = –10μA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.4

 

 

V

 

IOH = –400μA

 

 

 

 

 

 

 

 

 

 

VOL(2)

Low Level Output Voltage

 

2.5V

 

 

0.4

V

 

IOL = 10μA

 

 

 

 

 

6.0V

 

 

0.4

V

 

IOL = 2.1mA

 

 

 

 

 

 

 

 

 

 

 

 

 

Note:

(1)Standby Current (ISB) = 0μA (<900nA)

(2)VOH and VOL spec applies to READY/BUSY pin also

3

Doc. No. 25057-00 3/98 SPI-1

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