CTLST CAT24WC64PI-TE13, CAT24WC64PI-1.8TE13, CAT24WC64PA-1.8TE13, CAT24WC64P-TE13, CAT24WC64P-1.8TE13 Datasheet

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CTLST CAT24WC64PI-TE13, CAT24WC64PI-1.8TE13, CAT24WC64PA-1.8TE13, CAT24WC64P-TE13, CAT24WC64P-1.8TE13 Datasheet

Preliminary

CAT24WC32/64

32K/64K-Bit I2C Serial CMOS E2PROM

FEATURES

400 KHz I2C Bus Compatible*

1.8 to 6 Volt Read and Write Operation

Cascadable for up to Eight Devices

32-Byte Page Write Buffer

Self-Timed Write Cycle with Auto-Clear

8-Pin DIP or 8-Pin SOIC

Schmitt Trigger Inputs for Noise Protection

Zero Standby Current

Commercial, Industrial and Automotive

Temperature Ranges

Write Protection

– Entire Array Protected When WP at V

IH

1,000,000 Program/Erase Cycles

100 Year Data Retention

DESCRIPTION

The CAT24WC32/64 is a 32K/64K-bit Serial CMOS E2PROM internally organized as 4096/8192 words of 8 bits each. Catalyst’s advanced CMOS technology substantially reduces device power requirements. The

CAT24WC32/64 features a 32-byte page write buffer. The device operates via the I2C bus serial interface and is available in 8-pin DIP or 8-pin SOIC packages.

PIN CONFIGURATION

BLOCK DIAGRAM

DIP Package (P)

EXTERNAL LOAD

A0

1

8

VCC

 

DOUT

SENSE AMPS

 

SHIFT REGISTERS

A1

2

7

WP

 

ACK

 

 

 

A2

3

6

SCL

VCC

 

 

 

VSS

4

5

SDA

VSS

WORD ADDRESS

COLUMN

 

 

 

 

BUFFERS

DECODERS

 

 

 

 

 

 

 

 

 

 

 

 

256

SOIC Package (J,K)

SDA

START/STOP

 

 

 

 

 

 

 

LOGIC

 

 

A0

1

8

VCC

 

 

 

 

A1

2

7

WP

 

 

2

PROM

 

 

 

 

 

XDEC

E

A2

3

6

SCL

 

128/256 128/256 X 256

VSS

4

5

SDA

WP

CONTROL

 

 

 

 

 

 

LOGIC

 

 

 

 

 

 

 

 

 

 

 

24WC32/64 F01

 

 

 

 

PIN FUNCTIONS

 

 

 

 

 

 

Pin Name

 

Function

 

 

DATA IN STORAGE

 

 

 

 

 

 

A0, A1, A2 Device Address Inputs

 

 

 

 

SDA

Serial Data/Address

 

 

HIGH VOLTAGE/

SCL

Serial Clock

 

 

 

TIMING CONTROL

 

 

 

 

 

WP

Write Protect

 

SCL

STATE COUNTERS

 

 

VCC

+1.8V to +6V Power Supply

A0

SLAVE

 

 

 

 

 

 

 

 

VSS

Ground

 

A1

ADDRESS

 

 

 

A2

COMPARATORS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

24WC32/64 F02

* Catalyst Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol.

© 1998 by Catalyst Semiconductor, Inc.

Doc. No. 25053-00 2/98 S-1

Characteristics subject to change without notice

1

CAT24WC32/64

Preliminary

ABSOLUTE MAXIMUM RATINGS*

*COMMENT

Temperature Under Bias .................

–55°C to +125°C

Storage Temperature .......................

–65°C to +150°C

Voltage on Any Pin with

 

 

Respect to Ground(1) ...........

–2.0V to +VCC + 2.0V

VCC with Respect to Ground ...............

 

–2.0V to +7.0V

Package Power Dissipation

 

 

Capability (Ta = 25°C) ...................................

 

1.0W

Lead Soldering Temperature (10 secs)

............ 300°C

Output Short Circuit Current(2) ........................

 

100mA

RELIABILITY CHARACTERISTICS

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.

Symbol

Parameter

Min.

Max.

Units

Reference Test Method

 

 

 

 

 

 

NEND(3)

Endurance

1,000,000

 

Cycles/Byte

MIL-STD-883, Test Method 1033

TDR(3)

Data Retention

100

 

Years

MIL-STD-883, Test Method 1008

VZAP(3)

ESD Susceptibility

2000

 

Volts

MIL-STD-883, Test Method 3015

ILTH(3)(4)

Latch-up

100

 

mA

JEDEC Standard 17

D.C. OPERATING CHARACTERISTICS

VCC = +1.8V to +6.0V, unless otherwise specified.

 

 

 

Limits

 

 

 

 

 

 

 

 

 

 

 

Symbol

Parameter

Min.

 

Typ.

Max.

Units

Test Conditions

 

 

 

 

 

 

 

 

ICC

Power Supply Current

 

 

 

3

mA

fSCL = 100 KHz

ISB(5)

Standby Current (VCC = 5V)

 

 

 

0

μA

VIN = GND or VCC

ILI

Input Leakage Current

 

 

 

10

μA

VIN = GND to VCC

ILO

Output Leakage Current

 

 

 

10

μA

VOUT = GND to VCC

VIL

Input Low Voltage

–1

 

 

VCC x 0.3

V

 

VIH

Input High Voltage

VCC x 0.7

 

 

VCC + 0.5

V

 

VOL1

Output Low Voltage (VCC = +3.0V)

 

 

 

0.4

V

IOL = 3.0 mA

VOL2

Output Low Voltage (VCC = +1.8V)

 

 

 

0.5

V

IOL = 1.5 mA

CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V

Symbol

Test

Max.

Units

Conditions

 

 

 

 

 

CI/O(3)

Input/Output Capacitance (SDA)

8

pF

VI/O = 0V

CIN(3)

Input Capacitance (A0, A1, A2, SCL, WP)

6

pF

VIN = 0V

Note:

(1)The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns.

(2)Output shorted for no more than one second. No more than one output shorted at a time.

(3)This parameter is tested initially and after a design or process change that affects the parameter.

(4)Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.

(5)Standby current (ISB ) = 0 μA (<900 nA).

Doc. No. 25053-00 2/98 S-1

2

 

Preliminary

CAT24WC32/64

A.C. CHARACTERISTICS

VCC = +1.8V to +6V, unless otherwise specified

Output Load is 1 TTL Gate and 100pF

Read & Write Cycle Limits

Symbol

Parameter

1.8V, 2.5 V

4.5V-5.5V

 

 

 

 

 

 

 

 

 

 

Min.

Max.

Min.

Max.

Units

 

 

 

 

 

 

 

FSCL

Clock Frequency

 

100

 

400

kHz

 

 

 

 

 

 

 

TI(1)

Noise Suppression Time

 

200

 

200

ns

 

Constant at SCL, SDA Inputs

 

 

 

 

 

 

 

 

 

 

 

 

tAA

SCL Low to SDA Data Out

 

3.5

 

1

μs

 

and ACK Out

 

 

 

 

 

 

 

 

 

 

 

 

tBUF(1)

Time the Bus Must be Free Before

4.7

 

1.2

 

μs

 

a New Transmission Can Start

 

 

 

 

 

 

 

 

 

 

 

 

tHD:STA

Start Condition Hold Time

4

 

0.6

 

μs

 

 

 

 

 

 

 

tLOW

Clock Low Period

4.7

 

1.2

 

μs

 

 

 

 

 

 

 

tHIGH

Clock High Period

4

 

0.6

 

μs

 

 

 

 

 

 

 

tSU:STA

Start Condition Setup Time

4.7

 

0.6

 

μs

 

(for a Repeated Start Condition)

 

 

 

 

 

 

 

 

 

 

 

 

tHD:DAT

Data In Hold Time

0

 

0

 

ns

 

 

 

 

 

 

 

tSU:DAT

Data In Setup Time

50

 

50

 

ns

 

 

 

 

 

 

 

tR(1)

SDA and SCL Rise Time

 

1

 

0.3

μs

tF(1)

SDA and SCL Fall Time

 

300

 

300

ns

tSU:STO

Stop Condition Setup Time

4

 

0.6

 

μs

 

 

 

 

 

 

 

tDH

Data Out Hold Time

100

 

100

 

ns

 

 

 

 

 

 

 

Power-Up Timing (1)(2)

Symbol

Parameter

Max.

Units

 

 

 

 

tPUR

Power-Up to Read Operation

1

ms

 

 

 

 

tPUW

Power-Up to Write Operation

1

ms

Note:

(1)This parameter is tested initially and after a design or process change that affects the parameter.

(2)tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.

Write Cycle Limits

Symbol

Parameter

Min.

Typ.

Max

Units

 

 

 

 

 

 

tWR

Write Cycle Time

 

 

10

ms

 

 

 

 

 

 

The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal program/erase cycle. During the write cycle, the bus

interface circuits are disabled, SDA is allowed to remain high, and the device does not respond to its slave address.

3

Doc. No. 25053-00 2/98 S-1

 

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