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CAT24WC01/02/04/08/16 |
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1K/2K/4K/8K/16K-Bit Serial E2PROM |
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FEATURES |
■ Self-Timed Write Cycle with Auto-Clear |
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■ 400 KHZ I2C Bus Compatible* |
■ 1,000,000 Program/Erase Cycles |
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■ 1.8 to 6.0Volt Operation |
■ 100 Year Data Retention |
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■ Low Power CMOS Technology |
■ 8-pin DIP, 8-pin SOIC or 8 pin TSSOP |
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■ Write Protect Feature |
■ Commercial, Industrial and Automotive |
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— Entire Array Protected When WP at VIH |
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Temperature Ranges |
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■ Page Write Buffer |
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DESCRIPTION
The CAT24WC01/02/04/08/16 is a 1K/2K/4K/8K/16Kbit Serial CMOS E2PROM internally organized as 128/ 256/512/1024/2048 words of 8 bits each. Catalyst’s advanced CMOS technology substantially reduces device power requirements. The the CAT24WC01/02/04/
08/16 feature a 16-byte page write buffer. The device operates via the I2C bus serial interface, has a special write protection feature, and is available in 8-pin DIP, 8- pin SOIC or 8-pin TSSOP.
PIN CONFIGURATION
DIP Package (P) |
SOIC Package (J) |
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A0 |
1 |
8 |
VCC |
A0 |
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1 |
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8 |
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VCC |
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2 |
7 |
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2 |
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7 |
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A1 |
WP |
A1 |
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WP |
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3 |
6 |
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3 |
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6 |
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A2 |
SCL |
A2 |
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SCL |
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4 |
5 |
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4 |
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5 |
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VSS |
SDA |
VSS |
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SDA |
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5020 FHD F01 |
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TSSOP Package (U) |
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(* Available for 24WC01 and 24WC02 only) |
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A0 |
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1 |
8 |
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VCC |
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2 |
7 |
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A1 |
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WP |
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3 |
6 |
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A2 |
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SCL |
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4 |
5 |
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VSS |
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SDA |
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PIN FUNCTIONS
Pin Name |
Function |
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A0, A1, A2 |
Device Address Inputs |
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SDA |
Serial Data/Address |
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SCL |
Serial Clock |
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WP |
Write Protect |
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VCC |
+1.8V to +6.0V Power Supply |
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VSS |
Ground |
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BLOCK DIAGRAM
EXTERNAL LOAD
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DOUT |
SENSE AMPS |
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SHIFT REGISTERS |
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ACK |
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VCC |
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VSS |
WORD ADDRESS |
COLUMN |
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BUFFERS |
DECODERS |
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SDA |
START/STOP |
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LOGIC |
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XDEC |
E2PROM |
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WP |
CONTROL |
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LOGIC |
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DATA IN STORAGE |
HIGH VOLTAGE/
TIMING CONTROL
SCL STATE COUNTERS
A0 |
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SLAVE |
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A1 |
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ADDRESS |
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A2 |
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COMPARATORS |
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* Catalyst Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol. |
24WCXX F03 |
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© 1999 by Catalyst Semiconductor, Inc. |
1 |
Doc. No. 25051-00 3/98 S-1 |
Characteristics subject to change without notice |
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CAT24WC01/02/04/08/16
ABSOLUTE MAXIMUM RATINGS* |
*COMMENT |
Temperature Under Bias ................. |
–55° C to +125° C |
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Storage Temperature ....................... |
–65° C to +150° C |
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Voltage on Any Pin with |
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Respect to Ground(1) ........... |
–2.0V to +VCC + 2.0V |
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VCC with Respect to Ground ............... |
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–2.0V to +7.0V |
Package Power Dissipation |
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Capability (Ta = 25° C) .................................. |
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1.0W |
Lead Soldering Temperature (10 secs) |
............ 300° C |
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Output Short Circuit Current(2) ........................ |
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100mA |
RELIABILITY CHARACTERISTICS
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
Symbol |
Parameter |
Min. |
Max. |
Units |
Reference Test Method |
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NEND(3) |
Endurance |
1,000,000 |
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Cycles/Byte |
MIL-STD-883, Test Method 1033 |
TDR(3) |
Data Retention |
100 |
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Years |
MIL-STD-883, Test Method 1008 |
VZAP(3) |
ESD Susceptibility |
2000 |
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Volts |
MIL-STD-883, Test Method 3015 |
ILTH(3)(4) |
Latch-up |
100 |
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mA |
JEDEC Standard 17 |
D.C. OPERATING CHARACTERISTICS
VCC = +1.8V to +6.0V, unless otherwise specified.
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Limits |
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Symbol |
Parameter |
Min. |
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Typ. |
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Max. |
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Units |
Test Conditions |
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ICC |
Power Supply Current |
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3 |
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mA |
fSCL = 100 KHz |
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ISB(5) |
Standby Current (VCC = 5.0V) |
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0 |
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A |
VIN = GND or VCC |
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ILI |
Input Leakage Current |
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10 |
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A |
VIN = GND to VCC |
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ILO |
Output Leakage Current |
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10 |
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A |
VOUT = GND to VCC |
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VIL |
Input Low Voltage |
–1 |
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VCC x 0.3 |
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V |
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VIH |
Input High Voltage |
VCC x 0.7 |
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VCC + 0.5 |
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V |
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VOL1 |
Output Low Voltage (VCC = 3.0V) |
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0.4 |
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V |
IOL = 3 mA |
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VOL2 |
Output Low Voltage (VCC = 1.8V) |
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0.5 |
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V |
IOL = 1.5 mA |
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CAPACITANCE TA = 25° C, f = 1.0 MHz, VCC = 5V |
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Symbol |
Test |
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Max. |
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Units |
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Conditions |
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CI/O(3) |
Input/Output Capacitance (SDA) |
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8 |
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pF |
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VI/O = 0V |
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CIN(3) |
Input Capacitance (A0, A1, A2, SCL, WP) |
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6 |
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pF |
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VIN = 0V |
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Note: |
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(1)The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns.
(2)Output shorted for no more than one second. No more than one output shorted at a time.
(3)This parameter is tested initially and after a design or process change that affects the parameter.
(4)Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
(5)Standby Current (ISB) = 0 A (<900nA).
Doc. No. 25051-00 3/98 S-1 |
2 |
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CAT24WC01/02/04/08/16
A.C. CHARACTERISTICS
VCC = +1.8V to +6.0V, unless otherwise specified.
Read & Write Cycle Limits
Symbol |
Parameter |
1.8V, 2.5V |
4.5V-5.5V |
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Min. |
Max. |
Min. |
Max. |
Units |
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FSCL |
Clock Frequency |
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100 |
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400 |
kHz |
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TI(1) |
Noise Suppression Time |
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200 |
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200 |
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Constant at SCL, SDA Inputs |
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tAA |
SCL Low to SDA Data Out |
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3.5 |
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1 |
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and ACK Out |
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tBUF(1) |
Time the Bus Must be Free Before |
4.7 |
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1.2 |
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a New Transmission Can Start |
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tHD:STA |
Start Condition Hold Time |
4 |
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0.6 |
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tLOW |
Clock Low Period |
4.7 |
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1.2 |
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tHIGH |
Clock High Period |
4 |
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0.6 |
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tSU:STA |
Start Condition Setup Time |
4.7 |
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0.6 |
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(for a Repeated Start Condition) |
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tHD:DAT |
Data In Hold Time |
0 |
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0 |
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tSU:DAT |
Data In Setup Time |
50 |
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tR(1) |
SDA and SCL Rise Time |
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1 |
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0.3 |
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tF(1) |
SDA and SCL Fall Time |
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300 |
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300 |
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tSU:STO |
Stop Condition Setup Time |
4 |
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0.6 |
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tDH |
Data Out Hold Time |
100 |
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100 |
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Power-Up Timing(1)(2)
Symbol |
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Max. |
Units |
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tPUR |
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Power-up to Read Operation |
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1 |
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tPUW |
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Power-up to Write Operation |
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1 |
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Write Cycle Limits |
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Symbol |
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Min. |
Typ. |
Max |
Units |
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tWR |
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Write Cycle Time |
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10 |
ms |
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The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal program/erase cycle. During the write cycle, the bus
Note:
interface circuits are disabled, SDA is allowed to remain high, and the device does not respond to its slave address.
(1)This parameter is tested initially and after a design or process change that affects the parameter.
(2)tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
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Doc. No. 25051-00 3/98 S-1 |
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