Panasonic KX-TGE212B, KX-TGE233B, KX-TGE232B, KX-TGE210B, KX-TGEA20B User Manual

ORDER NO. KM41401789CE F13

KX-TGEA20	KX-TGE210
(Handset)	(Base Unit)

KX-TGE230			(Charger Unit)
(Base Unit)
Configuration for each model
Model No	Base Unit	Handset	Charger Unit	Expandable
KX-TGE210	1 (TGE210)	1 (TGEA20)		Up to 6
KX-TGE212	1 (TGE210)	2 (TGEA20)	1	Up to 6
KX-TGE232	1 (TGE230)	2 (TGEA20)	1	Up to 6
KX-TGE233	1 (TGE230)	3 (TGEA20)	2	Up to 6
KX-TGE234	1 (TGE230)	4 (TGEA20)	3	Up to 6
KX-TGEA20*		1 (TGEA20)	1

*KX-TGEA20 is also an optional accessory, which contains a handset and a charger.

Telephone Equipment

Model No. KX-TGE210B

KX-TGE212B

KX-TGE232B

KX-TGE233B

KX-TGE234B

KX-TGEA20B

Digital Cordless Phone

Digital Cordless Answering System

B: Black Version

(for U.S.A.)

© Panasonic System Networks Co., Ltd. 2014 Unauthorized copying and distribution is a violation of law.

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

WARNING

This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting to service a product. Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone else could result in serious injury or death.

IMPORTANT SAFETY NOTICE

There are special components used in this equipment which are important for safety. These parts are marked by

in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF. Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.

When this mark does appear, please read and follow the special instructions described in this manual on the use of PbF and how it might be permissible to use Pb solder during service and repair work.

L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit. L The illustrations in this Service Manual may vary slightly from the actual product.

2

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

TABLE OF CONTENTS

PAGE				PAGE
1 Safety Precautions-----------------------------------------------	5	10.1.11. Check Caller ID -------------------------------------			44
1.1. For Service Technicians ---------------------------------	5	11 Disassembly and Assembly Instructions---------------			45
2 Warning--------------------------------------------------------------	5	11.1. Disassembly Instructions-------------------------------			45
2.1. Battery Caution---------------------------------------------	5	11.1.1. Base Unit ----------------------------------------------			45
2.2. About Lead Free Solder (PbF: Pb free)--------------	5	11.1.2. Handset------------------------------------------------			49
2.2.1. Suggested PbF Solder ------------------------------	6	11.1.3. Charger Unit	------------------------------------------		50
2.3. Discarding of P. C. Board--------------------------------	6	11.2. How to Replace the Handset LCD-------------------			51
3 Specifications -----------------------------------------------------	7	12 Measurements and Adjustments --------------------------			52
4 Technical Descriptions -----------------------------------------	8	12.1. Equipment Required ------------------------------------			52
4.1. US-DECT Description ------------------------------------	8	12.2. The Setting Method of JIG-----------------------------			52
4.1.1. TDD Frame Format ----------------------------------	8	12.2.1. Connections (Base Unit) --------------------------			52
4.1.2. TDMA system------------------------------------------	8	12.2.2. Connections (Handset) ----------------------------			53
4.1.3. Signal Flowchart in the Radio Parts--------------	9	12.2.3. How to install Batch file into P.C. ----------------			54
4.2. Block Diagram (Base Unit_Main)---------------------	10	12.2.4. Commands--------------------------------------------			55
4.3. Tel Interface Circuit---------------------------------------	11	12.3. Adjustment Standard (Base Unit) --------------------			56
4.4. Block Diagram (Base Unit_RF Part) -----------------	12	12.3.1. Bottom View	------------------------------------------		56
4.5. Circuit Operation (Base Unit) --------------------------	13	12.4. Adjustment Standard (Handset) ----------------------			57
4.5.1. BBIC (Base Band IC: IC501) ---------------------	13	12.4.1. Component View ------------------------------------			57
4.5.2. Flash Memory (IC502)------------------------------	13	12.5. Things to Do after Replacing IC or X'tal ------------			58
4.5.3. Flash Memory (IC601)------------------------------	13	12.5.1. How to download the data ------------------------			58
4.5.4. EEPROM (IC611) ------------------------------------	13	12.6. Frequency Table------------------------------------------			59
4.5.5. Power Supply Circuit/Reset Circuit--------------	14	13 Miscellaneous----------------------------------------------------			60
4.5.6. Telephone Line Interface---------------------------	16	13.1. How to Replace the LLP (Leadless Leadframe
4.5.7. Parallel Connection Detect Circuit/Auto		Package) IC -----------------------------------------------			60
Disconnect Circuit -----------------------------------	17	13.1.1. Preparation--------------------------------------------			60
4.5.8. Calling Line Identification (Caller ID)/Call		13.1.2. Caution-------------------------------------------------			60
Waiting Caller ID -------------------------------------	18	13.1.3. How to Remove the IC-----------------------------			60
4.6. Block Diagram (Handset)-------------------------------	20	13.1.4. How to Install the IC --------------------------------			61
4.7. Block Diagram (Handset_RF Part)-------------------	21	13.2. How to Replace the Flat Package IC ---------------			62
4.8. Circuit Operation (Handset)----------------------------	22	13.2.1. Preparation--------------------------------------------			62
4.8.1. Outline --------------------------------------------------	22	13.2.2. How to Remove the IC-----------------------------			62
4.8.2. Power Supply Circuit/Reset Circuit--------------	22	13.2.3. How to Install the IC --------------------------------			63
4.8.3. Charge Circuit ----------------------------------------	23	13.2.4. How to Remove a Solder Bridge ----------------			63
4.8.4. Battery Low/Power Down Detector--------------	23	13.3. Terminal Guide of the ICs, Transistors and
4.8.5. Speakerphone ----------------------------------------	23	Diodes ------------------------------------------------------			64
4.9. Behavior of Electric Power Failure -------------------	24	13.3.1. Base Unit ----------------------------------------------			64
4.10. Circuit Operation (Charger Unit) ----------------------	24	13.3.2. Handset------------------------------------------------			64
5 Location of Controls and Components ------------------	25	14 Schematic Diagram --------------------------------------------			66
6 Installation Instructions ---------------------------------------	25	14.1. For Schematic Diagram --------------------------------			66
7 Operating Instructions-----------------------------------------	25	14.1.1. Base Unit	(Schematic Diagram (Base
8 Test Mode ----------------------------------------------------------	26	Unit_Main)) -------------------------------------------			66
8.1. Engineering Mode ----------------------------------------	26	14.1.2. Handset	(Schematic	Diagram
8.1.1. Base Unit ----------------------------------------------	26	(Handset_Main))-------------------------------------			66
8.1.2. Handset ------------------------------------------------	28	14.2. Schematic Diagram (Base Unit_Main)--------------			67
9 Service Mode -----------------------------------------------------	30	14.2.1. KX-TGE210-------------------------------------------			67
9.1. How to Clear User Setting (Handset Only)---------	30	14.2.2. KX-TGE230-------------------------------------------			69
10 Troubleshooting Guide ----------------------------------------	31	14.3. Schematic Diagram (Base Unit_Operation)-------			71
10.1. Troubleshooting Flowchart -----------------------------	31	14.3.1. KX-TGE230-------------------------------------------			71
10.1.1. Check Power------------------------------------------	32	14.4. Schematic Diagram (Handset_Main) ---------------			73
10.1.2. Check Record ----------------------------------------	33	15 Printed Circuit Board	------------------------------------------		76
10.1.3. Check Playback -------------------------------------	36	15.1. Circuit Board (Base Unit_Main) ----------------------			76
10.1.4. Check Battery Charge ------------------------------	36	15.1.1. Component View ------------------------------------			76
10.1.5. Check Link---------------------------------------------	37	15.1.2. Bottom View	------------------------------------------		77
10.1.6. Check the RF part -----------------------------------	39	15.2. Circuit Board (Base Unit_Operation)----------------			78
10.1.7. Registering a Handset to the Base Unit--------	43	15.2.1. KX-TGE230-------------------------------------------			78
10.1.8. Deregistering a Handset ---------------------------	43	15.3. Circuit Board (Handset_Main) ------------------------			80
10.1.9. Check Handset Transmission --------------------	44	15.3.1. Component View ------------------------------------			80
10.1.10. Check Handset Reception-------------------------	44	15.3.2. Bottom View	------------------------------------------		81

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KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20
16 Exploded View and Replacement Parts List -----------	82
16.1. Cabinet and Electrical Parts (Base Unit) -----------	82
16.1.1. KX-TGE210 -------------------------------------------	82
16.1.2. KX-TGE230 -------------------------------------------	83
16.2. Cabinet and Electrical Parts (Handset)-------------	84
16.3. Cabinet and Electrical Parts (Charger Unit) -------	85
16.4. Accessories and Packing Materials -----------------	86
16.4.1. KX-TGE210B -----------------------------------------	86
16.4.2. KX-TGE212B -----------------------------------------	87
16.4.3. KX-TGE232B -----------------------------------------	88
16.4.4. KX-TGE233B -----------------------------------------	89
16.4.5. KX-TGE234B -----------------------------------------	90
16.5. Replacement Parts List ---------------------------------	91
16.5.1. Base Unit ----------------------------------------------	91
16.5.2. Handset ------------------------------------------------	94
16.5.3. Charger Unit ------------------------------------------	95
16.5.4. Accessories and Packing Materials-------------	95
16.5.5. Screws -------------------------------------------------	96
16.5.6. Fixtures and Tools-----------------------------------	96

4

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

1 Safety Precautions

1.1.For Service Technicians

•Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires, injury or electric shock, which can be caused by improper repair work.

1.When repair services are provided, neither the products nor their parts or members shall be remodeled.

2.If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.

3.FASTON terminals shall be plugged straight in and unplugged straight out.

•ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1.Cover plastic parts boxes with aluminum foil.

2.Ground the soldering irons.

3.Use a conductive mat on worktable.

4.Do not grasp IC or LSI pins with bare fingers.

2 Warning

2.1.Battery Caution

Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.

Attention:

A nickel metal hydride battery that is recyclable powers the product you have purchased.

Please call 1-800-8-BATTERY (1-800-822-8837) for information on how to recycle this battery.

2.2.About Lead Free Solder (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder.

Caution

•PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700 F ± 20 F (370 C ± 10 C).

•Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

•PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C).

•When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below).

Component	Component
pin
Remove all of the
excess solder

Solder

(Slice View)

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KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

2.2.1.Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

0.3 mm X 100 g	0.6 mm X 100 g	1.0 mm X 100 g

2.3.Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

6

3Specifications

█Standard:

DECT 6.0 (Digital Enhanced Cordless

Telecommunications 6.0)

█ Number of channels:

60 Duplex Channels (DECT 6.0)

█Frequency range:

1.92GHz to 1.93 GHz (DECT 6.0)

█Duplex procedure:

TDMA (Time Division Multiple Access)

█ Channel spacing:

1.728MHz (DECT 6.0)

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

█ Bit rate:

1.152Mbit/s (DECT 6.0)

█ Modulation:

GFSK (Gaussian Frequency Shift Keying)

█RF transmission power:

115 mW (max/DECT6.0)

█Voice coding:

ADPCM 32 kbit/s (DECT 6.0)

		Base Unit			Handset	Charger
Power source		AC Adaptor	Rechargeable Ni-MH battery			AC Adaptor
		(PNLV226Z, 120 V AC, 60 Hz)	AAA (R03) size (1.2 V 400 mAh)			(PNLV233AZ, 120 V AC, 60 Hz)
Receiving Method		Super Heterodyne	Super Heterodyne
Oscillation Method		PLL synthesizer	PLL synthesizer
Detecting Method		Quadrature Discriminator	Quadrature Discriminator
Tolerance of OSC Frequency		10.368 MHz ±41 Hz	13.824 MHz ±100 Hz
Modulation Method		Frequency Modulation	Frequency Modulation
ID Code		40 bit	40 bit
Ringer Equivalence No. (REN)		0.1B
			Tone (DTMF)/Pulse
Dialing Mode		Tone (DTMF)/Pulse
Redial		Up to 48 digits	Up to 48 digits
Speed Dialer		Up to 24 digits (Phonebook)	Up to 24 digits (Phonebook)
Power Consumption		Base Unit*1	8 days at Standby,			Standby: Approx 0.1 W
		Standby: Approx. 1.0 W
		Maximum: Approx. 4.3 W	10 hours at Talk			Maximum: Approx 1.8 W
		Base Unit*2	8 days at Standby,			Standby: Approx 0.1 W
		Standby: Approx. 1.0 W
		Maximum: Approx. 4.3 W	10 hours at TalkApprox. 130			Maximum: Approx 1.8 W
Operating Conditions		0 °C - 40 °C (32 °F – 104 °F)	0 °C - 40 °C (32 °F – 104 °F)			0 °C - 40 °C (32 °F – 104 °F)
		20 % – 80 % relative air humidity	20 % – 80 % relative air humidity			20 % – 80 % relative air humidity
		(dry)	(dry)			(dry)
Dimensions (W x D x H)		Approx. 197 mm x 88 mm x 83 mm	Approx. 54 mm x 31 mm x 171 mm			Approx. 72 mm x 72 mm x 38 mm
Mass (Weight)		Approx. 270 g	Approx. 130 g			Approx. 90 g
*1	KX-TGE210 series
*2	KX-TGE230 series

Note:

Design and specifications are subject to change without notice.

Note for Service:

•Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.

•Analog telephone connection: Telephone Line

•Optional headset: KX-TCA60, KX-TCA93, KX-TCA400, KX-TCA430

•Optional Range extender: KX-TGA405

•Optional Key detector: KX-TGA20

•T-adaptor: KX-J66

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KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4 Technical Descriptions

4.1.US-DECT Description

The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same frequency. Refer to Frequency Table (P.59).

4.1.1.

TDD Frame Format

5 ms

5 ms

Up Link ( Handset -> Base Unit )

Down Link ( Base Unit -> Handset )

RX1

RX2

RX3

RX4

RX5

RX6

TX1

TX2

TX3

TX4

TX5

TX6

DATA rate : 1.152 Mbps

417 μs (available)

417 μs (blind)

4.1.2.

TDMA system

This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy bearer use.

In 1 slot 417 s, the 10 ms of voice data is transmitted.

• 2 - Handsets Link

	Traffic Bearer	Dummy bearer
Base unit	RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
Handset 1
(Stand by)	TX	RX
Handset 2
(Link)	TX	RX
Handset 3
(Link)

Traffic Bearer

A link is established between base unit and handset.

The state where duplex communication is performed.

Handset doesn't make up duplex in no free RF channels because of interference. (*1)

Dummy Bearer

Base unit sends Dummy-data to the all stand-by state handsets.

Handsets receive that data for synchronization and monitoring request from the base unit.

Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)

Note:

(*1) It is a feature under FCC 15 regulation and for interference avoidance. In the case of checking RF parts, it is better in least interference condition.

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KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.1.3.Signal Flowchart in the Radio Parts

Reception Base unit:

A voice signal from TEL line is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC501). The RF signal, after which is amplified in BBIC, is fed to selected antenna.

Handset:

As for a handset RF, RF signal is received in one antenna.

BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA". BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.

Transmission

Handset:

A voice signal from microphone is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC1). The RF signal, after which is amplified in BBIC, is fed to an antenna.

Base unit:

As for a base unit RF, RF signal is received in two antennas.

BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".

BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.

9

10

LED							Q141		TEL_JACK
				Crystal		Q161	TR_RLY	D101
							3	2	TIP
				10.368MHz		SIDE_TONE
						CIRCUIT	4	1	RING
			LSRp
			MICh
			P3_6
CKM/STM	IC501
			CIDINn
	BBIC
			CIDINp
					+1.8V	+3.0V
			QSPI	IC502
ANT1				Flash(Program)
			AVD/VDD			Q301
RF_Block									DC_JACK
		VRF					IC302
			VBAT						DC5.5V+
VDDPA	RFVDD	/VPA					REGULATOR
			PDN_DET						GND
		CHARGE_DET
								Power Down
								DET
		IC611				Q701			CHARGE
						CHARGE			+
		EEPROM				DETECT
	IC601								-
			KEY
	Flash						Power supply
			PAD
	(Voice prompt)						at AC failure

TGE234/TGEA20-TGE233/KX-TGE232/KX-TGE212/KX-TGE210/KX-KX Main)_Unit (Base Diagram Block .2.4

KX-TGE210/212/232/233/234 BLOCK DIAGRAM (Base Unit_Main)

4.3.Tel Interface Circuit

	TIP		RING

P101

SA101

C101	2	1
	D101	C102
	3	4

R141

Q141	R142

TX AMP SIDE TONE

RX AMP

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

C103	C105	C104	C106
R101	R103	R102	R104

CALLER ID

DETECT

BELL DETECT

REGULATOR

CONTROL

CIRCUIT

11

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.4.Block Diagram (Base Unit_RF Part)

		10.368	MHz		TXDATA	RXDATA		RF Part)
IC501 RF block	PLL	3856-3843MHz	/3859-3845MHz	Modulator	Control	Logic	Mixer Demodulator	KX-TGE210/212/232/233/234 BLOCK DIAGRAM (Base Unit
		RF TXp	RF TXn			RF RXp	RF RXn

ANT1

12

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.5.Circuit Operation (Base Unit)

General Description:

(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech compression, record and playback, and memory management required in a digital telephone answering machine.

The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions as follows.

	TDD & TDMA	ADPCM	Digital		TEL
	with FHSS
			Speech	Analog
	Processor	ADPCM			Line
			Processor	Front
					Interface
	RF part			End
	Host CPU			&
			Caller ID
				Multi-
			Modem
		BBIC (IC501)		plexer
		Digital TAM System			SP

EEPROM		Keys/ LEDs		Flash Memory		Flash Memory IC601
IC611		/ Charge		(Program)
				IC502

4.5.1.BBIC (Base Band IC: IC501)

•Voice Message Recording/Play back

The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory. An error correction algorithm is used to enable playback of these messages from the Flash Memory.

•DTMF Generator

When the DTMF data from the handset is received, the DTMF signal is output.

•Synthesized Voice (Pre-recorded message)

The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.

•Caller ID demodulation

The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.

•Digital Switching

The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the Telephone line, etc. They are determined by the signal path route operation of voice signal.

•Block Interface Circuit

RF part, LED, Key scan, Speaker, Telephone line.

4.5.2.Flash Memory (IC502)

Main program data is stored.

4.5.3.Flash Memory (IC601)

Following information data is stored.

•Voice signal

ex: Pre-recorded Greeting message, Incoming message

4.5.4.EEPROM (IC611)

Following information data is stored.

•Settings

ex: message numbers, ID code, Flash Time, Tone/Pulse

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KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.5.5.Power Supply Circuit/Reset Circuit

The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is insulated from VBAT by Doubler of BBIC.

Circuit Operation:

+5.5V	+3.0V	VDD3	VDD4

+5.5V

IC302

IC501

IC611

+3.0V

+3.0V_CP

3.0V

EEPROM

AC Adaptor

REGULATOR

VDD1

BBIC

VDD5

+1.8V

+3.0V_CP2

IC601

TAM FLASH

Q301

IC502

QSPI FLASH

RF Part

LEDs

VBAT

VDD1 (1.8 V)

Reset (RSTN) (IC501_77pin)

Startmonitor (IC501 57pin)

(CKM/STM)

BBIC chip initialize

14

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.5.5.1.Charge Circuit

The voltage from the AC adaptor is supplied to the charge circuits.

R371
R372	+5.5V
62 A	F301	DCP
3	R373
D K
	CHARGE+	DCM
C351
	CHARGE-

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KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.5.6.Telephone Line Interface

Telephone Line Interface Circuit:

Function

•Bell signal detection

•ON/OFF hook and pulse dial circuit

•Side tone circuit

Bell (RINGING) signal detection and OFF HOOK circuit:

In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T) and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:

L1T C105 R103 R110 R11 1 R112 BBIC pin18(RINGING)

When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through the circuit). Following signal flow is the DC current flow.

T D101 Q141 Q161 R163 D101 P101 R

ON HOOK Circuit:

Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition.

Pulse Dial Circuit:

Pin 19 of BBIC turns Q141 ON/OFF to make the pulse dialing.

Side Tone Circuit:

Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is canceled by the canceller circuit of BBIC.

			R160
	C161	+	C167	R165			R162
					C	Q161
			R168		E	B
RX	R178	C173		R164		R151
Pin25 of IC501
	C174		C171	R166	R163		R152

TX

Pin27 of IC501

HOOK

Pin19 of IC501

PARADET

Pin17 of IC501

ADC1

Pin33 of IC501

ADC0

Pin32 of IC501

RINGING

Pin18 of IC501

CIDOUT

Pin24 of IC501

	R111	C111	C113
C110	R110	R112

C184

C115			R117

C	Q141
	E
	B

R141

C142		K	D142
		A

		Q142		C101
			C
		B
							OFF Hook
			E	D101
				+			L1T
C152	R145	R142	3		~	2	SA101
			4	_	~	1
							L1R
				C102			P101

R115

C116			R118					R116

R101 C103

CIDINn	BELL signal detection	R103	C105
Pin23 of IC501
CIDINp		R102	C104
Pin21 of IC501	C109
		R104	C106
LSRn
Pin28 of IC501	R109

16

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.5.7.Parallel Connection Detect Circuit/Auto Disconnect Circuit

Function:

In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone connected in parallel is on hook or off hook by detecting changes in the T/R voltage.

Circuit Operation:

Parallel connection detection when on hook:

When on hook, the voltage is monitored at pin 32 of IC501. There is no parallel connection if the voltage is 0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.

Parallel connection detection when off hook:

When off hook, the voltage is monitored at pin 17 of IC501; the presence/absence of a parallel connection is determined by detecting the voltage changes.

If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after detecting parallel connection is off hook.

R160

Q141

C161

+

C167

R162

C

E

B

R165

Q161

C

B

R141

R168

E

C142

K

D142

A

C101

RX

R178

C173

R164

R151

Q142

C

Pin25 of IC501

B

C174

E

D101

L1T

+

C171

R166

R163

R152

C152

R145

R142

3

~

2

SA101

4

_

~

1

L1R

TX

C184

C102

P101

Pin27 of IC501

HOOK

Pin19 of IC501

PARADET

Pin17 of IC501

R115

ADC1

Pin33 of IC501

	ADC0	C115	R117	C116	R118
	Pin32 of IC501					R116

17

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.5.8.Calling Line Identification (Caller ID)/Call Waiting Caller ID

Function: Caller ID

The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK (Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of the message format which can be received: i.e. the single message format and plural message format. The plural message format allows to transmit the name and data code information in addition to the time and telephone number data.

*: Also the telephone exchange service provides other formats.

Single message format

1st Ring	Silent interval 4 sec		2nd Ring
2 sec			2 sec
0.5 s	575 ms	min 0.5 s
	DATA
STD Ring / 20 Hz
Tip-Ring		0.1 Vrms

70 Vrms

A

DATA in

1200 Hz	2200 Hz
=DATA "1"	=DATA "0 "

B DATA out

1 bit=833 µs

month		day		hour		minute		number
04		15		16		35		2013487000

Plural message format

1st Ring 0.5 s	718 ms
2 sec	2nd Ring
	DATA

DATA CODE NAME
			month		day		hour		minute		number
201	John Smith
			04		16		16		35		2013487000

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KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call, to receive information about a calling party on a waited call. The transmission of the calling information takes place almost immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new call.

Function:

The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and MARK data pass the following route.

Telephone Line P101 C105, C104 R103, R104 RA101 IC501(23, 21).

If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the information for the second and subsequent callers is not displayed on the portable handset display.

Call Waiting Format

CAS: CPE Alerting Signal

Dual Tone of 2130 Hz, 2750 Hz -15 dBm (900 ohm load)

Signal Flow		CAS
Telephone Exchange	Cordless phone

80 5 ms

	Signal Flow		ACK
	Cordless phone	Telephone Exchange

Continuance Signal
of 1200 Hz (Data "1")		"FSK"
	MARK	DATA
0~500 ms 58~75 ms		about 300 ms
		(be changed by
		Information Volume)

ACK: Acknowledged Signal DTMF

"D"

0~100 ms 60 5 ms

CIDOUT

Pin 24

CIDINn

Pin 23

IC501

CIDINp

Pin 21

LSRn

Pin 28

C110

R110

C109

R109

R101	C103
R103	C105	L1T
R102	C104	SA101
		L1R
R104	C106	P101

19

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.6.Block Diagram (Handset)

		3V
		IC3		X1			ANT1
		EEPROM
				13.824 MHz
			DATACLK,			VBAT
		CHG_DET
			WP,		RXp
					RXn
CHARGE	RSTN	RESET			TXp
					TXn		RF part
CONTROL
CHARGE
		CHG_CTL
POWER SUPPLY
CONTROL
VBAT		BATTERY_ON
MIC			IC1
BATTERY		MIP	BBIC
		MIN
Receiver
		HSSPOUTP
Headset Jack
		LOUT
3V		HSMIP
						4.0V
CN4						IC4	VBAT
LED		HEADSET_DET				CHARGE
(KEY)					CP_OFF
						PUMP
Q6		KEY_LED		A~EKEYSTOROBE
					1~5KEYIN
Monitor SP	CKM/STM	CKM//STM
		SPOUTP
		SPOUTN
4V
LED
(LCD)		LCD		KEYS

KX-TGEA20 BLOCK DIAGRAM (Handset)

20

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.7.Block Diagram (Handset_RF Part)

TXp

TXn

ANT

RXp

RXn

KX-TGEA20 BLOCK DIAGRAM (Handset_RF Part)

21

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.8.Circuit Operation (Handset)

4.8.1.Outline

Handset consists of the following ICs as shown in Block Diagram (Handset) (P.20).

•DECT BBIC (Base Band IC): IC1

-All data signals (forming/analyzing ACK or CMD signal)

-All interfaces (ex: Key, Detector Circuit, Charge, EEPROM, LCD)

•EEPROM: IC3

-Setting data is stored. (e.g. ID, user setting)

4.8.2.Power Supply Circuit/Reset Circuit

Circuit Operation:

When powering on the Handset, the voltage is as follows;

BATTERY(2.2 V ~ 2.6 V: BATT+) F1 BBC1 (IC1) 10 pin

The Reset signal generates IC1 (54 pin) and 1.8 V.

VBAT

	VDDC (1.2 V)
	Reset (RSTN)
	(IC1_54 pin)
	Start monitor
	(IC1 57pin)
	(CKM/STM)
		BBIC chip initialize
	VBAT
		3.0V
		3.0V
	BATTERY	EEPROM
	2CELL
	GND
	VDDC (1.2V)
		DOUBLER OUT (Charge Pump)
		For all peripherals
		3.0V
	BBIC	LCD

VBAT

4.0V

External Charge Pump

Circuit or IC

3.0V

4.0 output

KEY LED

LCD BACKLIT LED

GND

22

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.8.3.Charge Circuit

Circuit Operation:

When charging the handset on the Base Unit, the charge current is as follows;

DCP(5.5V) F301 R371 R372 D362 CHARGE+(Base) CHARGE+(Handset) R8 Q3 F1 BATTERY+...

Battery...

BATTERYR45 GND CHARGE-(Handset) CHARGE-(Base) GND DC-(GND) In this way, the BBIC on Handset detects the fact that the battery is charged.

The charge current is controlled by switching Q9 of Handset. Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.14).

	Q2
	C27
	R2
R8	R9
CHG +

		Q3
		BATT +
R4 47K	Q4	BATTERY
		2CELL
	R6
	10K	BATT -
CHG -	Q9	R45

	GND
GND
GND	CHG CTRL (32)
		BBIC
R7	CHG DET (34)	IC1
100K

4.8.4.Battery Low/Power Down Detector

Circuit Operation:

“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery. The detected voltage is as follows;

•Battery Low

Battery voltage: V(Batt) 2.35 V ± 50 mV

The BBIC detects this level and "" starts flashing.

•Power Down

Battery voltage: V(Batt) 2.1 V ± 50 mV The BBIC detects this level and power down.

4.8.5.Speakerphone

The hands-free loudspeaker at SP+ and SPis used to generate the ring alarm.

23

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

4.9.Behavior of Electric Power Failure

In case that the power from AC adaptor is lost and lose radio waves, BBIC (IC1) turns Q11 ON since handset presumes that base unit's power is falied.

Base unit detects that power voltage of AC adaptor +5.5V is OFF, then turns Q351 ON.

It's possible to use the units during the power failure, supplying power to VBAT of base unit from battery of handset through Q10, CHG terminal and Q351.

		Handset		Base Unit
			CHG+	Q351	VBAT
BATT+		Power Supply
		at AC failure			+5.5V
		(Q10,Q11,Q12)
BATT_			CHG-		R351
				Power Down
	R45	3
				DET
		BBIC
				(Q352,Q353,Q354)
		IC1
					R352
				PDN_DET
				(pin101-IC501)

4.10. Circuit Operation (Charger Unit)

Charge control is executed at handset side so that the operation when using charger is also controlled by handset. Refer to Circuit Operation (Handset) (P.22)

TP1

J1

TP2

AC Adaptor

The route for this is as follows: DC+pin of J1(+) CHARGE+pad Handset CHARGE-pad DC-pin of J1(-)

24

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

5 Location of Controls and Components

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

6 Installation Instructions

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

7 Operating Instructions

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

25

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

8 Test Mode

8.1.Engineering Mode

8.1.1.Base Unit

Important:

Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.

Make sure the link between Base and Handset before that. Then in case using not original Handset, you need to deregister Handset.

Note: Refer to Registering a Handset to a Base Unit in the Operating Instructions.

{OFF}

Dial keypad

{FLASH}

H/S key operation {CALL WAIT}

This pictured model is KX-TGE230.

H/S LCD

1). Press {MENU}.

2). Select "Settings" using {^}or {V} then press {SELECT} or {>}.

Select "Set tel line" using {^}or{V} then press {SELECT} or {>}.

3). Enter "7", "2", "6", "2", "7", "6", "6", "4".

Note: 7262 7664 = PANA SONI

(see letters printed on dial keys)

4). Select "Write EEP" using {^}or{V} then press {SELECT} or {>}.

5). Enter " ", " ", " ", " " (Address). (*1)

6). Enter " ", " " (New Data). (*1)

Service Mode

Read EEP

Write EEP

BACK SELECT

Set Addr.:

Default Data

CLEAR OK

26

{OFF}

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

7). Press {OK} , a long confirmation beep will be heard.

8). Press to return to standby mode.

After that, turn the base unit power off and then power on.

Note: * "Set tel line" isn't displayed in Cell line only mode.

To return to normal mode, execute the following procedure:

1{MENU} i{#}{1}{5}{7}

2{V}/{^}: Select "off "i{SELECT}

3{OFF}

Frequently Used Items (Base Unit)

ex.)

Set Addr.:

New Data

CLEAR OK

Set Addr.:

_ _ _ _ _ _

BACK

Items	Address	Default Data	New Data		Remarks
C-ID (FSK) sensitivity	06 0B	00	01 (6dB UP)	02 (12dB UP)	When hex changes from"00" to "01" or "02"
					gain increases by 6dB or 12dB.
Frequency	00 07 / 00 08	70/02	-	-	Use these items in a READ-ONLY mode to
					confirm the contents. Careless rewriting may
ID	00 02 ~ 00 06	Given value	-	-
					cause serious damage to the computer system.

Note:

(*1) When you enter the address or New Data, please refer to the table below.

	Desired Number (hex)		Input Keys
	0		0
	1		1
	.		.
	.		.
	.		.
	9		9

Desired Number (hex)	Input Keys
A	[Flash] + 0
B	[Flash] + 1
C	[Flash] + 2
D	[Flash] + 3
E	[Flash] + 4
F	[Flash] + 5

27

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

8.1.2.Handset

Important:

Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.

{OFF}

Dial keypad

H/S key operation	{FLASH}	H/S LCD
	{CALL WAIT}
1). Press {MENU}.

2). Select "Settings" using {^}or{V} then press {SELECT} or {>}.

3). Enter "7", "2", "6", "2", "7", "6", "6", "4".

Note: 7262 7664 = PANA SONI

(see letters printed on dial keys)

4). Select "Write EEP" using{^} or{V} then press {SELECT} or {>}.

5). Enter " ", " ", " ", " " (Address). (*1)

6). Enter " ", " " (New Data). (*1)

7). Press {OK} , a long confirmation beep

will be heard.

8). Press {OFF} to return to standby mode.

Service Mode

Read EEP

Write EEP

BACK SELECT

Set Addr.:

Default Data

CLEAR OK

Set Addr.:

New Data

CLEAR OK

Set Addr.:

_ _ _ _ _ _

BACK

After that, remove and reinsert the batteries. Press the Power button for about 1 second if the power is not turned on.

28

KX-TGE210/KX-TGE212/KX-TGE232/KX-TGE233/KX-TGE234/TGEA20

Frequently Used Items (Handset) ex.)

Items	Address	Default Data	New Data	Possible Adjusted	Possible Adjusted	Remarks
				Value MAX (hex)	Value MIN (hex)
Battery Low	00 12/00 13	00 / 00	-	-	-	(*2)
Frequency	00 07 / 00 08	00 / 01	-	-	-
ID	00 02 ~ 00 06	Given value	-	-	-

Note:

(*1) When you enter the address or New Data, please refer to the table below.

	Desired Number (hex.)		Input Keys
	0		0
	1		1
	.		.
	.		.
	.		.
	9		9

Desired Number (hex.)	Input Keys
A	[Flash] + 0
B	[Flash] + 1
C	[Flash] + 2
D	[Flash] + 3
E	[Flash] + 4
F	[Flash] + 5

(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the handset.

29