NSC LM2703MF-ADJ, LM2703EV, LM2703MFX-ADJ Datasheet

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NSC LM2703MF-ADJ, LM2703EV, LM2703MFX-ADJ Datasheet

April 2003

LM2703

Micropower Step-up DC/DC Converter with 350mA Peak

Current Limit

General Description

The LM2703 is a micropower step-up DC/DC in a small 5-lead SOT-23 package. A current limited, fixed off-time control scheme conserves operating current resulting in high efficiency over a wide range of load conditions. The 21V switch allows for output voltages as high as 20V. The low 400ns off-time permits the use of tiny, low profile inductors and capacitors to minimize footprint and cost in spaceconscious portable applications. The LM2703 is ideal for LCD panels requiring low current and high efficiency as well as white LED applications for cellular phone back-lighting. The LM2703 can drive up to 4 white LEDs from a single Li-Ion battery.

Features

n350mA, 0.7Ω, internal switch

nUses small surface mount components

nAdjustable output voltage up to 20V

n2.2V to 7V input range

nInput undervoltage lockout

n0.01µA shutdown current

nSmall 5-Lead SOT-23 package

Applications

nLCD Bias Supplies

nWhite LED Back-Lighting

nHandheld Devices

nDigital Cameras

nPortable Applications

Typical Application Circuit

20030601

FIGURE 1. Typical 20V Application

Limit Current Peak 350mA with Converter DC/DC up-Step Micropower LM2703

© 2003 National Semiconductor Corporation

DS200306

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LM2703

Connection Diagram

Top View

20030602

SOT23-5

TJmax = 125˚C, θJA = 220˚C/W (Note 2)

Ordering Information

Order Number

Package Type

NSC Package Drawing

Top Mark

Supplied As

 

 

 

 

 

LM2703MF-ADJ

SOT23-5

MA05B

S48B

1000 Units, Tape and Reel

 

 

 

 

 

LM2703MFX-ADJ

SOT23-5

MA05B

S48B

3000 Units, Tape and Reel

 

 

 

 

 

Pin Description/Functions

Pin

 

Name

Function

 

 

 

 

 

1

 

SW

Power Switch input.

 

 

 

 

 

2

 

GND

Ground.

 

 

 

 

 

3

 

FB

Output voltage feedback input.

 

 

 

 

 

4

 

 

Shutdown control input, active low.

 

SHDN

 

5

 

VIN

Analog and Power input.

SW(Pin 1): Switch Pin. This is the drain of the internal NMOS power switch. Minimize the metal trace area connected to this pin to minimize EMI.

GND(Pin 2): Ground Pin. Tie directly to ground plane.

FB(Pin 3): Feedback Pin. Set the output voltage by selecting values for R1 and R2 using:

Connect the ground of the feedback network to an AGND plane which should be tied directly to the GND pin.

SHDN(Pin 4): Shutdown Pin. The shutdown pin is an active low control. Tie this pin above 1.1V to enable the device. Tie this pin below 0.3V to turn off the device.

VIN(Pin 5): Input Supply Pin. Bypass this pin with a capacitor as close to the device as possible.

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Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.

VIN

7.5V

SW Voltage

21V

FB Voltage

2V

 

7.5V

SHDN

Voltage

Maximum Junction Temp. TJ

150ûC

(Note 2)

 

Lead Temperature

 

(Soldering 10 sec.)

300ûC

Vapor Phase

 

(60 sec.)

215ûC

Infrared

 

(15 sec.)

220ûC

ESD Ratings (Note 3)

 

Human Body Model

2kV

Machine Model (Note 4)

200V

Operating Conditions

Junction Temperature

 

(Note 5)

−40ûC to +125ûC

Supply Voltage

2.2V to 7V

SW Voltage Max.

20.5V

Electrical Characteristics

Specifications in standard type face are for TJ = 25ûC and those in boldface type apply over the full Operating Temperature Range (TJ = −40ûC to +125ûC). Unless otherwise specified. VIN =2.2V.

 

Symbol

 

 

Parameter

 

 

 

Conditions

Min

Typ

Max

Units

 

 

 

 

 

 

(Note 5)

(Note 6)

(Note 5)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IQ

 

Device Disabled

 

FB = 1.3V

 

40

70

 

 

 

 

 

Device Enabled

 

FB = 1.2V

 

235

300

µA

 

 

 

 

Shutdown

 

 

 

 

0.01

2.5

 

 

 

 

 

 

SHDN

= 0V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VFB

 

FeedbackTrip Point

 

 

 

 

1.189

1.237

1.269

V

ICL

 

Switch Current Limit

 

 

 

 

275

350

400

mA

 

 

 

 

 

 

 

 

 

 

260

 

400

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IB

 

FB Pin Bias Current

 

FB = 1.23V (Note 7)

 

30

120

nA

VIN

 

Input Voltage Range

 

 

 

 

2.2

 

7.0

V

RDSON

 

Switch RDSON

 

 

 

 

 

0.7

1.6

TOFF

 

Switch Off Time

 

 

 

 

 

400

 

ns

ISD

 

 

 

 

= VIN, TJ = 25ûC

 

0

80

 

 

SHDN

Pin Current

 

SHDN

 

 

 

 

 

 

 

 

 

 

 

15

 

nA

 

 

 

 

 

 

 

SHDN

= VIN, TJ = 125ûC

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

SHDN

= GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IL

 

Switch Leakage Current

 

VSW = 20V

 

0.05

5

µA

UVP

 

Input Undervoltage Lockout

 

ON/OFF Threshold

 

1.8

 

V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VFB

 

Feedback Hysteresis

 

 

 

 

 

8

 

mV

Hysteresis

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.7

0.3

 

 

SHDN

 

 

SHDN

low

 

 

 

 

 

V

Threshold

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.1

 

 

 

SHDN High

 

 

 

 

0.7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

θJA

 

Thermal Resistance

 

 

 

 

 

220

 

ûC/W

Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature.

Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin.

Note 4: ESD susceptibility using the machine model is 150V for SW pin.

Note 5: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% production tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

Note 6: Typical numbers are at 25ûC and represent the most likely norm.

Note 7: Feedback current flows into the pin.

LM2703

3

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LM2703

Typical Performance Characteristics

Enable Current vs VIN

Disable Current vs VIN

(Part Switching)

(Part Not Switching)

20030605

20030606

Efficiency vs Load Current

Efficiency vs Load Current

20030610

20030611

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