INFINEON IPB80N08S2-07, IPP80N08S2-07, IPI80N08S2-07 User Manual

0 (0)
INFINEON IPB80N08S2-07, IPP80N08S2-07, IPI80N08S2-07 User Manual

IPB80N08S2-07

IPB80N08S2-07

IPP80N08S2-07, IPI80N08S2-07

OptiMOS® Power-Transistor

Product Summary

Features

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

V DS

 

75

V

• N-channel - Enhancement mode

 

 

 

 

 

 

 

 

 

R DS(on),max (SMD version)

7.1

 

 

 

 

 

mΩ

• Automotive AEC Q101 qualified

 

 

 

 

 

 

 

 

I D

 

 

 

 

 

 

 

 

80

A

• MSL1 up to 260°C peak reflow

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

• 175°C operating temperature

PG-TO263-3-2

PG-TO220-3-1

PG-TO262-3-1

 

 

 

 

Green package (lead free)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

• Ultra low Rds(on)

 

 

 

 

 

 

 

 

 

 

• 100% Avalanche tested

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Type

Package

 

Ordering Code

 

Marking

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IPB80N08S2-07

PG-TO263-3-2

SP0002-19048

 

2N0807

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IPP80N08S2-07

PG-TO220-3-1

SP0002-19040

 

2N0807

 

 

 

 

 

 

 

 

 

 

 

 

 

IPI80N08S2-07

PG-TO262-3-1

SP0002-19043

 

2N0807

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Maximum ratings, at T j=25 °C, unless otherwise specified

Parameter

Symbol

Conditions

Value

Unit

 

 

 

 

 

Continuous drain current1)

I D

T C=25 °C, V GS=10 V

80

A

 

 

T C=100 °C,

80

 

 

 

V GS=10 V2)

 

 

 

 

 

 

 

 

 

 

Pulsed drain current2)

I D,pulse

T C=25 °C

320

 

Avalanche energy, single pulse2)

E AS

I D=80A

810

mJ

Gate source voltage4)

V GS

 

±20

V

Power dissipation

P tot

T C=25 °C

300

W

Operating and storage temperature

T j, T stg

 

-55 ... +175

°C

IEC climatic category; DIN IEC 68-1

 

 

55/175/56

 

 

 

 

 

 

Rev. 1.0

page 1

2006-03-03

IPB80N08S2-07

IPP80N08S2-07, IPI80N08S2-07

Parameter

Symbol

Conditions

 

Values

 

Unit

 

 

 

 

 

 

 

 

 

 

min.

typ.

max.

 

 

 

 

 

 

 

 

Thermal characteristics2)

 

 

 

 

 

 

 

 

 

 

 

 

 

Thermal resistance, junction - case

R thJC

 

-

-

0.5

K/W

Thermal resistance, junction -

R thJA

 

-

-

62

 

ambient, leaded

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SMD version, device on PCB

R thJA

minimal footprint

-

-

62

 

 

 

6 cm2 cooling area5)

-

-

40

 

Electrical characteristics, at T j=25 °C, unless otherwise specified

 

 

 

 

 

 

 

 

 

 

 

Static characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

Drain-source breakdown voltage

V (BR)DSS

V GS=0 V, I D= 1 mA

75

-

-

V

Gate threshold voltage

V GS(th)

V DS=V GS, I D=250 µA

2.1

3.0

4.0

 

Zero gate voltage drain current

I DSS

V DS=75 V, V GS=0 V,

-

0.01

1

µA

T j=25 °C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

V DS=75 V, V GS=0 V,

-

1

100

 

 

 

T j=125 °C2)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Gate-source leakage current

I GSS

V GS=20 V, V DS=0 V

-

1

100

nA

Drain-source on-state resistance

RDS(on)

V GS=10 V, I D=80 A,

-

5.8

7.4

mΩ

 

 

V GS=10 V, I D=80 A,

-

5.5

7.1

 

 

 

SMD version

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Rev. 1.0

page 2

2006-03-03

IPB80N08S2-07

IPP80N08S2-07, IPI80N08S2-07

Parameter

Symbol

Conditions

 

Values

 

Unit

 

 

 

 

 

 

 

 

 

 

min.

typ.

max.

 

 

 

 

 

 

 

 

Dynamic characteristics2)

 

 

 

 

 

 

Input capacitance

C iss

 

-

4700

-

pF

 

 

V GS=0 V, V DS=25 V,

 

 

 

 

Output capacitance

C oss

-

1260

-

 

f =1 MHz

 

Reverse transfer capacitance

Crss

 

-

580

-

 

Turn-on delay time

t d(on)

 

-

26

-

ns

Rise time

t r

V DD=40 V, V GS=10 V,

-

50

-

 

Turn-off delay time

t d(off)

I D=80 A, R G=2.2 Ω

-

61

-

 

 

 

Fall time

t f

 

-

30

-

 

 

 

 

 

 

 

 

Gate Charge Characteristics2)

 

 

 

 

 

 

Gate to source charge

Q gs

 

-

25

37

nC

Gate to drain charge

Q gd

V DD=60 V, I D=80 A,

-

69

116

 

Gate charge total

Q g

V GS=0 to 10 V

-

144

180

 

 

 

 

 

 

 

 

 

 

Gate plateau voltage

V plateau

 

-

5.4

-

V

Reverse Diode

 

 

 

 

 

 

 

 

 

 

 

 

 

Diode continous forward current2)

I S

T C=25 °C

-

-

80

A

Diode pulse current2)

I S,pulse

-

-

320

 

 

 

Diode forward voltage

V SD

V GS=0 V, I F=80 A,

-

0.9

1.3

V

T j=25 °C

 

 

 

 

 

 

 

 

 

 

 

 

 

Reverse recovery time2)

t rr

V R=40 V, I F=I S,

-

110

140

ns

di F/dt =100 A/µs

 

 

 

 

 

 

 

 

V R=40 V, I F=I S,

 

 

 

 

Reverse recovery charge2)

Q rr

-

470

590

nC

di F/dt =100 A/µs

 

 

 

 

 

 

 

 

 

 

 

 

 

1)Current is limited by bondwire; with an R thJC = 0.5K/W the chip is able to carry 132A at 25°C. For detailed information see Application Note ANPS071E at www.infineon.com/optimos

2)Defined by design. Not subject to production test.

3)See diagram 13.

4)Qualified at -20V and +20V.

5)Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air.

Rev. 1.0

page 3

2006-03-03

Loading...
+ 5 hidden pages