IPB80N08S2-07
IPB80N08S2-07
IPP80N08S2-07, IPI80N08S2-07
OptiMOS® Power-Transistor
Product Summary
Features |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
V DS |
|
75 |
V |
||
• N-channel - Enhancement mode |
|
|
|
|
|
|||||
|
|
|
|
R DS(on),max (SMD version) |
7.1 |
|
||||
|
|
|
|
mΩ |
||||||
• Automotive AEC Q101 qualified |
|
|
|
|
||||||
|
|
|
|
I D |
|
|
|
|||
|
|
|
|
|
80 |
A |
||||
• MSL1 up to 260°C peak reflow |
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
||
• 175°C operating temperature |
PG-TO263-3-2 |
PG-TO220-3-1 |
PG-TO262-3-1 |
|
||||||
|
|
|
||||||||
• Green package (lead free) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||
• Ultra low Rds(on) |
|
|
|
|
|
|
|
|
|
|
• 100% Avalanche tested |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Type |
Package |
|
Ordering Code |
|
Marking |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
IPB80N08S2-07 |
PG-TO263-3-2 |
SP0002-19048 |
|
2N0807 |
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
IPP80N08S2-07 |
PG-TO220-3-1 |
SP0002-19040 |
|
2N0807 |
|
|
|
|
||
|
|
|
|
|
|
|
|
|
||
IPI80N08S2-07 |
PG-TO262-3-1 |
SP0002-19043 |
|
2N0807 |
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter |
Symbol |
Conditions |
Value |
Unit |
|
|
|
|
|
Continuous drain current1) |
I D |
T C=25 °C, V GS=10 V |
80 |
A |
|
|
T C=100 °C, |
80 |
|
|
|
V GS=10 V2) |
|
|
|
|
|
|
|
|
|
|
|
|
Pulsed drain current2) |
I D,pulse |
T C=25 °C |
320 |
|
Avalanche energy, single pulse2) |
E AS |
I D=80A |
810 |
mJ |
Gate source voltage4) |
V GS |
|
±20 |
V |
Power dissipation |
P tot |
T C=25 °C |
300 |
W |
Operating and storage temperature |
T j, T stg |
|
-55 ... +175 |
°C |
IEC climatic category; DIN IEC 68-1 |
|
|
55/175/56 |
|
|
|
|
|
|
Rev. 1.0 |
page 1 |
2006-03-03 |
IPB80N08S2-07
IPP80N08S2-07, IPI80N08S2-07
Parameter |
Symbol |
Conditions |
|
Values |
|
Unit |
|
|
|
|
|
|
|
|
|
|
|
|
min. |
typ. |
max. |
|
|
|
|
|
|
|
|
|
|
Thermal characteristics2) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Thermal resistance, junction - case |
R thJC |
|
- |
- |
0.5 |
K/W |
|
Thermal resistance, junction - |
R thJA |
|
- |
- |
62 |
|
|
ambient, leaded |
|
|
|||||
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
SMD version, device on PCB |
R thJA |
minimal footprint |
- |
- |
62 |
|
|
|
|
6 cm2 cooling area5) |
- |
- |
40 |
|
|
Electrical characteristics, at T j=25 °C, unless otherwise specified |
|
|
|
|
|||
|
|
|
|
|
|
|
|
Static characteristics |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Drain-source breakdown voltage |
V (BR)DSS |
V GS=0 V, I D= 1 mA |
75 |
- |
- |
V |
|
Gate threshold voltage |
V GS(th) |
V DS=V GS, I D=250 µA |
2.1 |
3.0 |
4.0 |
|
|
Zero gate voltage drain current |
I DSS |
V DS=75 V, V GS=0 V, |
- |
0.01 |
1 |
µA |
|
T j=25 °C |
|||||||
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
V DS=75 V, V GS=0 V, |
- |
1 |
100 |
|
|
|
|
T j=125 °C2) |
|
||||
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
Gate-source leakage current |
I GSS |
V GS=20 V, V DS=0 V |
- |
1 |
100 |
nA |
|
Drain-source on-state resistance |
RDS(on) |
V GS=10 V, I D=80 A, |
- |
5.8 |
7.4 |
mΩ |
|
|
|
V GS=10 V, I D=80 A, |
- |
5.5 |
7.1 |
|
|
|
|
SMD version |
|
||||
|
|
|
|
|
|
||
|
|
|
|
|
|
|
Rev. 1.0 |
page 2 |
2006-03-03 |
IPB80N08S2-07
IPP80N08S2-07, IPI80N08S2-07
Parameter |
Symbol |
Conditions |
|
Values |
|
Unit |
|
|
|
|
|
|
|
|
|
|
|
|
min. |
typ. |
max. |
|
|
|
|
|
|
|
|
|
|
Dynamic characteristics2) |
|
|
|
|
|
|
|
Input capacitance |
C iss |
|
- |
4700 |
- |
pF |
|
|
|
V GS=0 V, V DS=25 V, |
|
|
|
|
|
Output capacitance |
C oss |
- |
1260 |
- |
|
||
f =1 MHz |
|
||||||
Reverse transfer capacitance |
Crss |
|
- |
580 |
- |
|
|
Turn-on delay time |
t d(on) |
|
- |
26 |
- |
ns |
|
Rise time |
t r |
V DD=40 V, V GS=10 V, |
- |
50 |
- |
|
|
Turn-off delay time |
t d(off) |
I D=80 A, R G=2.2 Ω |
- |
61 |
- |
|
|
|
|
||||||
Fall time |
t f |
|
- |
30 |
- |
|
|
|
|
|
|
|
|
|
|
Gate Charge Characteristics2) |
|
|
|
|
|
|
|
Gate to source charge |
Q gs |
|
- |
25 |
37 |
nC |
|
Gate to drain charge |
Q gd |
V DD=60 V, I D=80 A, |
- |
69 |
116 |
|
|
Gate charge total |
Q g |
V GS=0 to 10 V |
- |
144 |
180 |
|
|
|
|
||||||
|
|
|
|
|
|
|
|
Gate plateau voltage |
V plateau |
|
- |
5.4 |
- |
V |
|
Reverse Diode |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Diode continous forward current2) |
I S |
T C=25 °C |
- |
- |
80 |
A |
|
Diode pulse current2) |
I S,pulse |
- |
- |
320 |
|
||
|
|
||||||
Diode forward voltage |
V SD |
V GS=0 V, I F=80 A, |
- |
0.9 |
1.3 |
V |
|
T j=25 °C |
|||||||
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
Reverse recovery time2) |
t rr |
V R=40 V, I F=I S, |
- |
110 |
140 |
ns |
|
di F/dt =100 A/µs |
|||||||
|
|
|
|
|
|
||
|
|
V R=40 V, I F=I S, |
|
|
|
|
|
Reverse recovery charge2) |
Q rr |
- |
470 |
590 |
nC |
||
di F/dt =100 A/µs |
|||||||
|
|
|
|
|
|
||
|
|
|
|
|
|
|
1)Current is limited by bondwire; with an R thJC = 0.5K/W the chip is able to carry 132A at 25°C. For detailed information see Application Note ANPS071E at www.infineon.com/optimos
2)Defined by design. Not subject to production test.
3)See diagram 13.
4)Qualified at -20V and +20V.
5)Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air.
Rev. 1.0 |
page 3 |
2006-03-03 |